CN206263145U - A kind of first station structure of chip electronic element mould - Google Patents
A kind of first station structure of chip electronic element mould Download PDFInfo
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- CN206263145U CN206263145U CN201621346051.0U CN201621346051U CN206263145U CN 206263145 U CN206263145 U CN 206263145U CN 201621346051 U CN201621346051 U CN 201621346051U CN 206263145 U CN206263145 U CN 206263145U
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- mould
- electronic element
- chip electronic
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- locating rod
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Abstract
A kind of first station structure of chip electronic element mould, first station structure is included in the molding concave die and shaping roller that the lower mould of mould is set, molding concave die includes symmetrically arranged left locating rod and right locating rod, conveying trough is provided between left locating rod and right locating rod, it is provided with along its length in left locating rod and right locating rod for limiting the seat slot that chip electronic element is moved left and right, shaping roller includes being arranged on the left shaping roller and right shaping roller of molding concave die both sides, the forming convax mould relative with the molding concave die is provided with the upper mould of mould, a left side for forming convax mould, right both sides protrusion and respectively with a left side for chip electronic element, right side pin middle part pre-folds crook alignment, the beneficial effects of the utility model are：The pin of electronic element both sides can be realized carries out substantially vertical bending in the middle part of pin.
Description
Technical field
The utility model is related to chip electronic element mould, especially a kind of chip electronic element mould
The first station structure.
Background technology
Chip electronic element（SMD）Largely used in electronic product, be modern electronic technology development with application most
Substantially the characteristics of, substituted direct insertion electronic watch element（DIP）Trend, chip electronic element is that welding end or pin are produced on
In same plane and suitable for the electronic component of surface-assembled, some electronic components its pin before making is distributed in electronic component
The both sides of body, need on the same plane to be molded the pin bending of both sides during making, wherein have step be need by
The pin of electronic element both sides carries out substantially vertical bending in the middle part of pin.
Utility model content
Task of the present utility model is to provide a kind of first station structure of chip electronic element mould, Neng Goushi
The pin of existing electronic element both sides carries out substantially vertical bending in the middle part of pin.
The utility model is realized by following technical proposals：
A kind of first station structure of chip electronic element mould, the first station structure is included in mould
Molding concave die and shaping roller that lower mould is set, molding concave die include symmetrically arranged left locating rod and right locating rod, left positioning
Conveying trough is provided between bar and right locating rod, is provided with along its length for limiting SMD electricity in left locating rod and right locating rod
The seat slot that subcomponent is moved left and right, shaping roller includes being arranged on the left shaping roller and right shaping roller of molding concave die both sides,
The forming convax mould relative with the molding concave die is provided with the upper mould of mould, the arranged on left and right sides of forming convax mould is protruded and divided
Crook is not pre-folded with the left and right side pin middle part of chip electronic element to align.
Preferably, the seat slot is the relative L-type knot being separately positioned in the left locating rod and the right locating rod
Structure, the inner side of seat slot is engaged with the surface of chip electronic element, the arranged on left and right sides of the outside of seat slot and the forming convax mould
Alignment.
Further, the transmission handgrip for transmitting chip electronic element is provided with the conveying trough.
Preferably, the transmission handgrip is a transmission steel bar, and the transmission steel bar is provided with least three station handgrips, often
The length of individual station handgrip is the length of single station in mould, there is interval between two neighboring station handgrip, each
It is SMD that station handgrip is provided with placement one between continuously arranged finger, two neighboring finger along the length direction of transmission steel bar
Electronic component.
Preferably, the cross section of the transmission steel bar is rectangle, and the short side of rectangle is the width for transmitting steel bar, and side long is transmission
The height of steel bar, the finger is rectangular cross-section or trapezoidal.
Preferably, the structure of each station handgrip is through the continuously arranged U-shaped of the transmission steel bar two side
Groove.
Preferably, each station handgrip includes 18 continuously arranged U-type grooves.
Preferably, the gap length between the two neighboring station handgrip be mould adjacent stations between
Every.
A kind of beneficial effect of the first station structure of chip electronic element mould of the utility model is：Can be real
The pin of existing electronic element both sides carries out substantially vertical bending in the middle part of pin, and can realize batch pile line operation.
The effect of design of the present utility model, concrete structure and generation is described further below with reference to accompanying drawing, with
It is completely understood by the purpose of this utility model, feature and effect.
Brief description of the drawings
Fig. 1 is that a kind of first station structure of chip electronic element mould of the utility model is molded in the first station
Cross section structure schematic diagram afterwards；
Fig. 2 is the knot of transmission handgrip in a kind of first station structure of chip electronic element mould of the utility model
Structure schematic diagram；
Fig. 3 is the structural representation of chip electronic element to be processed；
Fig. 4 is the structural representation of just one-step forming chip electronic element；
Wherein：Mould under 101-, the upper moulds of 102-, the left locating rods of 111-, the right locating rods of 112-, 12- conveying troughs, 13- seat slots,
The left shaping rollers of 141-, the right shaping rollers of 142-, 15- forming convax moulds, 4- transmission steel bar, 41,42,43- station handgrips, 401- hands
Refer to, 402-U type grooves, 51- chip electronic elements to be processed, the first one-step forming chip electronic elements of 52-, 501- component bodies,
502- pins.
Specific embodiment
Below in conjunction with accompanying drawing a kind of first station structure of chip electronic element mould of the utility model is made into
One step is described：
As Figure 1-4, a kind of first station structure of chip electronic element mould, the first station structure includes
In molding concave die and shaping roller that the lower mould 101 of mould is set, molding concave die includes symmetrically arranged left locating rod 111
With right locating rod 112, conveying trough 12, left locating rod 111 and right locating rod are provided between left locating rod 111 and right locating rod 112
It is provided with along its length on 112 for limiting the seat slot 13 that chip electronic element is moved left and right, shaping roller includes being arranged on
The left shaping roller 141 and right shaping roller 142 of molding concave die both sides, are provided with and molding concave die in the upper mould 102 of mould
Relative forming convax mould 15, forming convax mould 15 arranged on left and right sides protrusion and respectively with the left and right side pin of chip electronic element
Middle part pre-folds crook alignment.
During die sinking, the component body 501 of chip electronic element to be processed 51 is carried out in the inside of lower mould 101 by seat slot 13
Left and right positioning, now, the upper mould 102 of the mould downward mould 101 in the presence of system drift is moved, in hanging over mould 102
Forming convax mould 15 simultaneously move down, contact chip electronic element 51 to be processed when, left and right the two of forming convax mould 15
The middle part of pin 502 that chip electronic element to be processed 51 has been withstood in side pre-folds crook, when forming convax mould 15 continues to move down,
The end of pin 502 upward substantially vertical bending in the presence of shaping roller, chip electronic element to be processed 51 is formed just
One-step forming chip electronic element 52, then under the promotion of lower mould spring, running upwards completes the first work to upper mould 102
Position forming action.
Seat slot 13 is the relative L-type structure being separately positioned in left locating rod 111 and right locating rod 112, seat slot 13
Inner side is engaged with the surface of component body 501, and the outside of seat slot 13 is alignd with the arranged on left and right sides of forming convax mould 15.
The transmission handgrip for transmitting chip electronic element is provided with conveying trough 12.
Transmission handgrip is a transmission steel bar 4, and transmission steel bar 4 is provided with three station handgrips（41、42、43）, each station
The length of handgrip is the length of single station in mould, there is interval between two neighboring station handgrip, and each station is grabbed
Hand is provided with one paster of placement between continuously arranged finger 401, two neighboring finger 401 along the length direction of transmission steel bar 4
Formula electronic component, the structure can be defined to the position of chip electronic element, particularly the restriction of fore-and-aft direction, so that
Will not at random and shift position in holding chip electronic element transmit process.
The cross section for transmitting steel bar 4 is rectangle, and the short side of rectangle is the width for transmitting steel bar 4, and side long is transmission steel bar 4
Height, finger 401 is rectangular cross-section or trapezoidal.
The structure of each station handgrip is the continuously arranged U-type groove 402 through transmission steel bar 4 two side.
Each station handgrip includes 18 continuously arranged U-type grooves 402.
Gap length between two neighboring station handgrip is the interval between mould adjacent stations.
The utility model describes some implementation methods and its accompanying drawing in detail, but the utility model is not limited to these embodiments
And its accompanying drawing, the first station structure shape of the chip electronic element mould being especially not limited in accompanying drawing, show in accompanying drawing
What is gone out is the first station structure of chip electronic element mould more attractive in appearance in various shapes, although this shape
Shape is not the claimed technology point of the utility model protection, as long as those of ordinary skill in the art are according to the utility model, no
Pay creative work, it is modified, equivalent, other embodiment and its accompanying drawing obtained from improvement etc., exist
In protection domain of the present utility model.
Claims (8)
1. a kind of first station structure of chip electronic element mould, it is characterised in that the first station structure is included in
Molding concave die and shaping roller that the lower mould of mould is set, molding concave die include symmetrically arranged left locating rod and right positioning
Bar, is provided with conveying trough between left locating rod and right locating rod, be provided with along its length for limiting in left locating rod and right locating rod
The seat slot that chip electronic element processed is moved left and right, shaping roller includes being arranged on left shaping roller and the right side of molding concave die both sides
Shaping roller, the forming convax mould relative with the molding concave die, the arranged on left and right sides of forming convax mould are provided with the upper mould of mould
Protrude and pre-fold crook with the left and right side pin middle part of chip electronic element respectively and align.
2. the first station structure of chip electronic element mould according to claim 1, it is characterised in that the seat
Groove is the relative L-type structure being separately positioned in the left locating rod and the right locating rod, the inner side of seat slot with it is SMD
The surface of electronic component is engaged, and the outside of seat slot is alignd with the arranged on left and right sides of the forming convax mould.
3. the first station structure of chip electronic element mould according to claim 1, it is characterised in that the biography
Send the transmission handgrip being provided with groove for transmitting chip electronic element.
4. the first station structure of chip electronic element mould according to claim 3, it is characterised in that the biography
Dynamic handgrip is a transmission steel bar, and the transmission steel bar is provided with least three station handgrips, and the length of each station handgrip is into
, there is interval in the length of single station in pattern tool, each station handgrip is along transmission steel bar between two neighboring station handgrip
Length direction be provided between continuously arranged finger, two neighboring finger one chip electronic element of placement.
5. the first station structure of chip electronic element mould according to claim 4, it is characterised in that the biography
The cross section of steel bar is sent for rectangle, the short side of rectangle is the width for transmitting steel bar, side long is the height for transmitting steel bar, and the finger is to cut
Face is rectangle or trapezoidal.
6. the first station structure of chip electronic element mould according to claim 4, it is characterised in that described every
The structure of individual station handgrip is the continuously arranged U-type groove through the transmission steel bar two side.
7. the first station structure of chip electronic element mould according to claim 6, it is characterised in that each work
Position handgrip includes 18 continuously arranged U-type grooves.
8. according to the first station structure of any chip electronic element moulds of claim 4-7, it is characterised in that
Gap length between the two neighboring station handgrip is the interval between mould adjacent stations.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621346051.0U CN206263145U (en) | 2016-12-09 | 2016-12-09 | A kind of first station structure of chip electronic element mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621346051.0U CN206263145U (en) | 2016-12-09 | 2016-12-09 | A kind of first station structure of chip electronic element mould |
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| Publication Number | Publication Date |
|---|---|
| CN206263145U true CN206263145U (en) | 2017-06-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621346051.0U Active CN206263145U (en) | 2016-12-09 | 2016-12-09 | A kind of first station structure of chip electronic element mould |
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| Country | Link |
|---|---|
| CN (1) | CN206263145U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107377831A (en) * | 2017-09-05 | 2017-11-24 | 东莞市佳骏电子科技有限公司 | A kind of clicking technique and its die cutting device |
-
2016
- 2016-12-09 CN CN201621346051.0U patent/CN206263145U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107377831A (en) * | 2017-09-05 | 2017-11-24 | 东莞市佳骏电子科技有限公司 | A kind of clicking technique and its die cutting device |
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