CN206259332U - A kind of chip fixing tool - Google Patents
A kind of chip fixing tool Download PDFInfo
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- CN206259332U CN206259332U CN201621329472.2U CN201621329472U CN206259332U CN 206259332 U CN206259332 U CN 206259332U CN 201621329472 U CN201621329472 U CN 201621329472U CN 206259332 U CN206259332 U CN 206259332U
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- plate
- location
- top board
- base plate
- hole
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Abstract
A kind of chip fixing tool, including base plate and top board, are provided with sliver location-plate and supporting plate between the base plate and the top board；Described base plate one end is provided with some base plate location holes, and the other end of the base plate is provided with some base plate alignment pins；The two ends of the sliver location-plate are provided with some location holes, and the sliver location-plate is provided with some first die bond holes；The two ends of the supporting plate are provided with some supporting plate location holes, and the supporting plate is provided with some with the one-to-one second die bond hole in the first die bond hole site, and the second die bond hole cross-sectional area of the cross-sectional area less than the first die bond hole；One end of the top board is provided with some top board location holes, and the other end of the top board is provided with some top board alignment pins, batch can be carried out to the chip with precise and tiny mechanical structure and is fixed, and sticks blue film or other pad pastings in chip back, facilitates chip to be operated by bonder.
Description
Technical field
The utility model belongs to semiconductor mount technologies field, and in particular to a kind of chip fixing tool.
Background technology
In recent years, MEMS industry developments are rapid, and kind is also very various, and many new product developments out need to be packaged to test
Card, it is in the way of single branch chip cartridges are filled, to entrust to encapsulation enterprise to be packaged checking to have quite a few.MEMS chip is different
In general chip, MEMS chip surface has micro mechanical structure, and touching is forbidden on surface, and this results in MEMS chip without the image of Buddha
Common chip is the same to take full-automatic die bond in encapsulation process.Taking manual die bond cannot ensure the uniformity of product and good again
Rate.
A kind of clamping positioning mechanism of full-automatic bonder (notification number is CN102790142B) of patent, discloses one kind
The surface mount LED support clamping positioning mechanism of the full-automatic bonders of LED.A kind of clamping positioning mechanism of full-automatic bonder,
It is characterized in that：The clamping positioning mechanism includes base plate, side plate, pressing plate, top board, cylinder and limited block, and described side plate is gentle
Cylinder is fixedly mounted on base plate, and mounting of roof plate can be moved up and down on cylinder, and the both sides of pressing plate are respectively and fixedly installed to two pieces of sides
On plate, pressing plate is provided with windowing, and limited block is also equipped with side plate.Its simple structure, with preferably clamping and accurately
The surface mount LED support of positioning and replacing different size has very convenient quick effect.The utility model is automatically
Bonder, it is impossible to ensure when to being operated similar to MEMS chip, the precise and tiny mechanical mechanism of chip is not destroyed.
Utility model content
In order to solve the problems, such as not to be suitable for directly being operated by bonder similar to MEMS chip, the utility model is provided
Following technical scheme：
A kind of chip fixing tool, including base plate and top board；Sliver location-plate is provided between the base plate and the top board
And supporting plate；Described base plate one end is provided with some base plate location holes, and the other end of the base plate is provided with some base plate alignment pins；It is described
The two ends of sliver location-plate are provided with some location holes, and the sliver location-plate is provided with some first die bond holes；The supporting plate
Two ends are provided with some supporting plate location holes, and the supporting plate is provided with some solid with the first die bond hole site one-to-one second
Geode, the cross-sectional area of the cross-sectional area less than the first die bond hole in the second die bond hole；One end of the top board is provided with
Some top board location holes, the other end of the top board is provided with some top board alignment pins；The base plate location hole, base plate positioning
Pin, the top board location hole are identical with the number of the top board alignment pin, and mutually interference fit；The sliver location-plate is determined
Position hole is identical with the number of the supporting plate location hole, and equal to the base plate location hole and the base plate alignment pin number sum,
And simultaneously with the base plate alignment pin and the top board alignment pin interference fit.
Preferably, the base plate, the sliver location-plate, the supporting plate and the top board by the base plate location hole,
The base plate alignment pin, the location-plate location hole, the supporting plate location hole, the top board location hole and the top board alignment pin
It is sequentially connected, the first die bond hole corresponds with the second die bond hole, and shape is connected with the base plate and the top board
Into locating slot, for placing fixed chip.
Preferably, the cross-sectional area in the second die bond hole makes MEMS's less than the cross-sectional area in the first die bond hole
Edge is protected by the supporting plate, prevents the precise and tiny mechanical structure on edge to be destroyed.
Preferably, fastening magnetic sheet is arranged with the top board, the fastening magnetic sheet can be with top board described in while being axle
Attracted each other under magneticaction between 90 ° of rotations, and two fastening magnetic sheets.
The beneficial effects of the utility model are：
(1) chip with precise and tiny mechanical structure can be fixed, and spreads blue film；
(2) simple structure, low manufacture cost；
(3) simple to operate, use cost is low；
(4) batch operation can be carried out to chip, treatment effeciency is improved.
Brief description of the drawings
Accompanying drawing is used for providing being further understood to of the present utility model, and constitutes a part for specification, with this practicality
New embodiment is used to explain the utility model together, does not constitute to limitation of the present utility model.In the accompanying drawings：
Fig. 1 is structural representation of the present utility model,
Fig. 2 is the utility model base arrangement schematic diagram,
Fig. 3 is the utility model sliver positioning plate structure schematic diagram,
Fig. 4 is the utility model support board structure schematic diagram,
Fig. 5 is the utility model top board structure schematic diagram,
Fig. 6 is preferred embodiment schematic diagram of the present utility model,
Fig. 7 is preferred embodiment schematic diagram of the present utility model,
Fig. 8 is preferred embodiment schematic diagram of the present utility model,
Mark in figure for：1st, base plate；11st, base plate location hole；12nd, base plate alignment pin；2nd, sliver location-plate；21st, first
Die bond hole；22nd, location-plate location hole；3rd, supporting plate；31st, the second die bond hole；32nd, supporting plate location hole；4th, top board；41st, top board positioning
Hole；42nd, top board alignment pin；43rd, magnetic sheet is fastened；5th, locating slot.
Specific embodiment
As shown in figs 1 to 6, a kind of chip fixing tool, including base plate 1 and top board 4；It is provided between base plate 1 and top board 4
Sliver location-plate 2 and supporting plate 3；The one end of base plate 1 is provided with some base plate location holes 11, and the other end of base plate 1 is provided with some base plates to be determined
Position pin 12；The two ends of sliver location-plate 2 are provided with some location holes 22, and sliver location-plate 2 is provided with some first die bond holes 21；Support
The two ends of plate 3 are provided with some supporting plate location holes 32, and supporting plate 3 is provided with some and position of the first die bond hole 21 one-to-one second
Die bond hole 31, and the second die bond hole 31 cross-sectional area less than the first die bond hole 21 cross-sectional area；One end of top board 4 is provided with
Some top board location holes 41, the other end of top board 4 is provided with some top board alignment pins 42；First die bond hole 21 and the second die bond hole 31
Correspond, also, the first die bond hole 21 cross-sectional area more than the second die bond hole 31 cross-sectional area, the first die bond hole 21,
The connection of second die bond hole 31, base plate 1 and top board 4 forms locating slot 5；Base plate location hole 11, base plate alignment pin 12, top board location hole
41 is identical with the number of top board alignment pin 42, and mutually interference fit；Sliver location-plate location hole 22 and supporting plate location hole 32
Number it is identical, and equal to base plate location hole 11 and the number sum of base plate alignment pin 12, and simultaneously with base plate alignment pin 12 and top
The interference fit of plate alignment pin 42.
As shown in figs 1 to 6, by taking the operation of MEMS chip as an example, the base plate alignment pin 12 of the one end of base plate 1 was gone here and there into sliver
The location-plate location hole 22 of the one end of location-plate 2, same base plate alignment pin wears the 12 supporting plate location holes 32 for crossing the one end of supporting plate 3, this
When, the first die bond hole 21 is corresponded with the second die bond hole 31 and overlaps, and locating slot 5 is formed between base plate 1, by MEMS chip
It is placed in locating slot 5, is positioned, while the edge of MEMS chip is protected by supporting plate 3, isolates with top board 4；Then top board 1
The top board alignment pin 42 of one end went here and there supporting plate location hole 32, the location-plate of the other end of sliver location-plate 2 of the other end of supporting plate 3 successively
Location hole 22 and the location hole 11 of base plate 1；Then the present apparatus is inverted, removes base plate 1, now the back side of MEMS chip upward, will
On blue film paving and sliver location-plate 2, then the back of chip is to be labeled with blue film, sticks the chip after blue film and can use bonder
Operated.
As shown in figs 1 to 6, by taking the operation of MEMS chip as an example, the base plate alignment pin 12 of the one end of base plate 1 was gone here and there into sliver
The location-plate location hole 22 of the one end of location-plate 2, same base plate alignment pin wears the 12 supporting plate location holes 32 for crossing the one end of supporting plate 3, this
When, the first die bond hole 21 is corresponded with the second die bond hole 31 and overlaps, and locating slot 5 is formed between base plate 1, by MEMS chip
It is placed in locating slot 5, is positioned, while the edge of MEMS chip is protected by supporting plate 3, isolates with top board 4；Then top board 1
The top board alignment pin 42 of one end went here and there supporting plate location hole 32, the location-plate of the other end of sliver location-plate 2 of the other end of supporting plate 3 successively
Location hole 22 and the location hole 11 of base plate 1；Then the present apparatus is inverted, to ensure base plate 1 during being inverted, sliver location-plate 2, support
Tight connection between plate 3 and top board 4, is arranged with fastening magnetic sheet 43, in magneticaction between fastening magnetic sheet 43 on the top plate 4
Under attract each other, in this role, make to be clipped in the company of base plate 1 between fastening magnetic sheet 43, sliver location-plate 2, supporting plate 3 and top board 4
Connect and more fasten, then remove base plate 1, now the back side of MEMS chip upward, by blue film paving with sliver location-plate 2 on, Ran Houxin
The back of piece is to be labeled with blue film, sticks the chip after blue film and can use bonder to be operated.
Preferred embodiment of the present utility model is these are only, the utility model is not limited to, although with reference to preceding
State embodiment to be described in detail the utility model, for a person skilled in the art, it still can be to preceding
State the technical scheme described in each embodiment to modify, or equivalent is carried out to which part technical characteristic.It is all this
Within the spirit and principle of utility model, any modification, equivalent substitution and improvements made etc. should be included in the utility model
Protection domain within.
Claims (5)
1. a kind of chip fixing tool, it is characterised in that including base plate and top board, be provided between the base plate and the top board and split
Piece location-plate and supporting plate；Described base plate one end is provided with some base plate location holes, and the other end of the base plate is provided with some base plates to be determined
Position pin；The two ends of the sliver location-plate are provided with some location holes, and the sliver location-plate is provided with some first die bond holes；Institute
The two ends for stating supporting plate are provided with some supporting plate location holes, and the supporting plate is provided with and some is corresponded with the first die bond hole site
The second die bond hole, the cross-sectional area of the cross-sectional area in the second die bond hole less than the second die bond hole；The top board
One end is provided with some top board location holes, and the other end of the top board is provided with some top board alignment pins；
The base plate location hole, the base plate alignment pin, the top board location hole are identical with the number of the top board alignment pin, and
And mutual interference fit；
The location-plate location hole is identical with the number of the supporting plate location hole, and the location-plate location hole and the supporting plate are fixed
The number in position hole is respectively equal to the base plate location hole and the base plate alignment pin number sum, and positions with the base plate simultaneously
Pin and the top board alignment pin interference fit.
2. a kind of chip fixing tool according to claim 1, it is characterised in that the first die bond hole, described second
Die bond hole, the base plate and the top board connect to form locating slot.
3. a kind of chip fixing tool according to claim 1, it is characterised in that fastening magnetic is arranged with the top board
Plate.
4. a kind of chip fixing tool according to claim 3, it is characterised in that make in magnetic force between the fastening magnetic sheet
Attracted each other under.
5. a kind of chip fixing tool according to claim 3, it is characterised in that the fastening magnetic sheet can be with the top
One side of plate carries out 90 ° of rotations for axle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621329472.2U CN206259332U (en) | 2016-12-06 | 2016-12-06 | A kind of chip fixing tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621329472.2U CN206259332U (en) | 2016-12-06 | 2016-12-06 | A kind of chip fixing tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206259332U true CN206259332U (en) | 2017-06-16 |
Family
ID=59028107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621329472.2U Active CN206259332U (en) | 2016-12-06 | 2016-12-06 | A kind of chip fixing tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206259332U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109712775A (en) * | 2019-01-30 | 2019-05-03 | 深圳市晶磁材料技术有限公司 | The preparation method of wireless charger magnetic conduction sheet |
| CN109830453A (en) * | 2019-03-21 | 2019-05-31 | 深圳中科四合科技有限公司 | A kind of method and apparatus of chip flood tide transfer |
-
2016
- 2016-12-06 CN CN201621329472.2U patent/CN206259332U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109712775A (en) * | 2019-01-30 | 2019-05-03 | 深圳市晶磁材料技术有限公司 | The preparation method of wireless charger magnetic conduction sheet |
| CN109830453A (en) * | 2019-03-21 | 2019-05-31 | 深圳中科四合科技有限公司 | A kind of method and apparatus of chip flood tide transfer |
| CN109830453B (en) * | 2019-03-21 | 2023-10-03 | 深圳中科四合科技有限公司 | Method and device for transferring huge amount of chips |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190430 Address after: 230000 Building 2050, D8, Innovation Industrial Park, 800 Wangjiangxi Road, Hefei High-tech Zone, Anhui Province Patentee after: Hefei Houpu Sensing Technology Co., Ltd. Address before: 230000 No. 260 Jixi Road, Shushan District, Hefei City, Anhui Province Patentee before: Hefei core Intelligent Technology Co., Ltd. |
|
| TR01 | Transfer of patent right |