CN206247696U - Hot pump in low temp - Google Patents

Hot pump in low temp Download PDF

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Publication number
CN206247696U
CN206247696U CN201621170914.3U CN201621170914U CN206247696U CN 206247696 U CN206247696 U CN 206247696U CN 201621170914 U CN201621170914 U CN 201621170914U CN 206247696 U CN206247696 U CN 206247696U
Authority
CN
China
Prior art keywords
heat pump
grades
pump
evaporator
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201621170914.3U
Other languages
Chinese (zh)
Inventor
姜辉
张进
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanjing University of Aeronautics and Astronautics
Original Assignee
Nanjing University of Aeronautics and Astronautics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanjing University of Aeronautics and Astronautics filed Critical Nanjing University of Aeronautics and Astronautics
Priority to CN201621170914.3U priority Critical patent/CN206247696U/en
Application granted granted Critical
Publication of CN206247696U publication Critical patent/CN206247696U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of hot pump in low temp, one-level heat pump and two grades of heat pumps are mainly contained.Wherein one-level heat pump is made up of fin (1) and semiconductor chilling plate (2), and two grades of heat pumps are made up of evaporator (3), compressor (4), condenser (5) and expansion valve (6).One-level heat pump is, as two grades of auxiliary units of heat pump, to improve the temperature in its evaporator.The design of the hot pump in low temp is simple and easy to apply, has expanded the operating temperature range of conventional heat pump, can be worked in low temperature environment.

Description

Hot pump in low temp
Technical field
The utility model is related to a kind of hot pump in low temp, belongs to field of energy-saving technology.
Background technology
Because low grade heat energy can be converted to utilizable high-grade heat energy by heat pump, it turns into an important section Can technology.Compression ratio in heat pump rises with the decline of environment temperature, and when the temperature of the surroundings is low, excessive compression ratio may Cause system cannot normal work, in addition compression ratio increase also result in heat pump efficiency decline.Therefore, existing heat pump is difficult to Run in low-temperature working environment.
Utility model content
In order to solve the problems, such as that existing heat pump cannot normally run in low temperature environment, the utility model provides a kind of low Warm pump, the operating temperature range of the heat pump is wider, can be in temperature lower ground area's work.
A kind of hot pump in low temp, it is characterised in that:Including one-level heat pump and two grades of heat pumps;Above-mentioned one-level heat pump include fin and The first end of semiconductor chilling plate, wherein semiconductor chilling plate is closely connected with fin;Above-mentioned two grades of heat pumps successively by evaporator, Compressor, condenser and expansion valve composition, second other end of wherein semiconductor chilling plate are connected with the surface of evaporator.
Described hot pump in low temp, it is characterised in that:One-level heat pump and two grades of heat pumps have independent power supply respectively.
When environment temperature is relatively low, two grades of heat pumps cannot normal work when, semiconductor chilling plate is started working.Semiconductor refrigerating Operationally, one end temperature that it is connected with fin is relatively low for piece, and one end temperature being connected with the surface of evaporator is higher, and half Conductor cooling piece forces heat to be shifted from its low-temperature end elder generation temperature end by pyroelectric effect, because two grades of evaporators of heat pump and half The temperature end of conductor cooling piece is connected, and its operating temperature can be higher than environment temperature, and whole two grades of heat pumps can also normal work Make.When environment temperature is higher, one-level heat pump is stopped, and now semiconductor chilling plate is in short-circuit condition, and it is only used as leading One approach of heat.
Brief description of the drawings
Fig. 1 is structural representation of the invention;
Label title in figure;1. fin, 2. conductor cooling piece, 3. evaporator, 4. compressor, 5. condenser, 6. expands Valve.
Specific embodiment
As shown in figure 1, one end of semiconductor chilling plate 2 and fin 1 are closely connected, fin 1 is made of metal.
Two grades of heat pumps include the evaporator 3, compressor 4, condenser 5 and the expansion valve 6 that are sequentially connected with.Evaporator (3), compression Machine 4, condenser 5, expansion valve 6 and heat-transfer working medium therein can directly using the product in conventional heat pump.
When two grades of heat pumps work, evaporator obtains heat to cause that working medium is evaporated, in evaporator from semiconductor chilling plate The steam of generation is led in condenser after being compressed through compressor, and now steam is condensed into liquid and discharges heat, condensed work Matter forms a circulation by being transported to evaporator after expansion valve, so.
When the temperature of the surroundings is low, system starts semiconductor chilling plate, and cooling piece forces heat from ring by pyroelectric effect Border is delivered to evaporator and ensures the temperature of evaporator higher than environment temperature.

Claims (2)

1. a kind of hot pump in low temp, it is characterised in that:
Including one-level heat pump and two grades of heat pumps;
Above-mentioned one-level heat pump includes fin (1) and semiconductor chilling plate (2), the wherein first end and wing of semiconductor chilling plate (2) Piece (1) is closely connected;
Above-mentioned two grades of heat pumps are made up of evaporator (3), compressor (4), condenser (5) and expansion valve (6) successively, wherein semiconductor Second other end and evaporator of cooling piece (2)(3)Surface be connected.
2. hot pump in low temp according to claim 1, it is characterised in that:One-level heat pump and two grades of heat pumps are respectively with independent Power supply.
CN201621170914.3U 2016-10-26 2016-10-26 Hot pump in low temp Expired - Fee Related CN206247696U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201621170914.3U CN206247696U (en) 2016-10-26 2016-10-26 Hot pump in low temp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201621170914.3U CN206247696U (en) 2016-10-26 2016-10-26 Hot pump in low temp

Publications (1)

Publication Number Publication Date
CN206247696U true CN206247696U (en) 2017-06-13

Family

ID=58995807

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201621170914.3U Expired - Fee Related CN206247696U (en) 2016-10-26 2016-10-26 Hot pump in low temp

Country Status (1)

Country Link
CN (1) CN206247696U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110332728A (en) * 2019-07-04 2019-10-15 深圳市瑞沃德生命科技有限公司 A kind of refrigeration system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110332728A (en) * 2019-07-04 2019-10-15 深圳市瑞沃德生命科技有限公司 A kind of refrigeration system

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Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20170613

Termination date: 20181026

CF01 Termination of patent right due to non-payment of annual fee