CN206247696U - Hot pump in low temp - Google Patents
Hot pump in low temp Download PDFInfo
- Publication number
- CN206247696U CN206247696U CN201621170914.3U CN201621170914U CN206247696U CN 206247696 U CN206247696 U CN 206247696U CN 201621170914 U CN201621170914 U CN 201621170914U CN 206247696 U CN206247696 U CN 206247696U
- Authority
- CN
- China
- Prior art keywords
- heat pump
- grades
- pump
- evaporator
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 13
- 238000001816 cooling Methods 0.000 claims description 5
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Heat-Pump Type And Storage Water Heaters (AREA)
Abstract
The utility model discloses a kind of hot pump in low temp, one-level heat pump and two grades of heat pumps are mainly contained.Wherein one-level heat pump is made up of fin (1) and semiconductor chilling plate (2), and two grades of heat pumps are made up of evaporator (3), compressor (4), condenser (5) and expansion valve (6).One-level heat pump is, as two grades of auxiliary units of heat pump, to improve the temperature in its evaporator.The design of the hot pump in low temp is simple and easy to apply, has expanded the operating temperature range of conventional heat pump, can be worked in low temperature environment.
Description
Technical field
The utility model is related to a kind of hot pump in low temp, belongs to field of energy-saving technology.
Background technology
Because low grade heat energy can be converted to utilizable high-grade heat energy by heat pump, it turns into an important section
Can technology.Compression ratio in heat pump rises with the decline of environment temperature, and when the temperature of the surroundings is low, excessive compression ratio may
Cause system cannot normal work, in addition compression ratio increase also result in heat pump efficiency decline.Therefore, existing heat pump is difficult to
Run in low-temperature working environment.
Utility model content
In order to solve the problems, such as that existing heat pump cannot normally run in low temperature environment, the utility model provides a kind of low
Warm pump, the operating temperature range of the heat pump is wider, can be in temperature lower ground area's work.
A kind of hot pump in low temp, it is characterised in that:Including one-level heat pump and two grades of heat pumps;Above-mentioned one-level heat pump include fin and
The first end of semiconductor chilling plate, wherein semiconductor chilling plate is closely connected with fin;Above-mentioned two grades of heat pumps successively by evaporator,
Compressor, condenser and expansion valve composition, second other end of wherein semiconductor chilling plate are connected with the surface of evaporator.
Described hot pump in low temp, it is characterised in that:One-level heat pump and two grades of heat pumps have independent power supply respectively.
When environment temperature is relatively low, two grades of heat pumps cannot normal work when, semiconductor chilling plate is started working.Semiconductor refrigerating
Operationally, one end temperature that it is connected with fin is relatively low for piece, and one end temperature being connected with the surface of evaporator is higher, and half
Conductor cooling piece forces heat to be shifted from its low-temperature end elder generation temperature end by pyroelectric effect, because two grades of evaporators of heat pump and half
The temperature end of conductor cooling piece is connected, and its operating temperature can be higher than environment temperature, and whole two grades of heat pumps can also normal work
Make.When environment temperature is higher, one-level heat pump is stopped, and now semiconductor chilling plate is in short-circuit condition, and it is only used as leading
One approach of heat.
Brief description of the drawings
Fig. 1 is structural representation of the invention;
Label title in figure;1. fin, 2. conductor cooling piece, 3. evaporator, 4. compressor, 5. condenser, 6. expands
Valve.
Specific embodiment
As shown in figure 1, one end of semiconductor chilling plate 2 and fin 1 are closely connected, fin 1 is made of metal.
Two grades of heat pumps include the evaporator 3, compressor 4, condenser 5 and the expansion valve 6 that are sequentially connected with.Evaporator (3), compression
Machine 4, condenser 5, expansion valve 6 and heat-transfer working medium therein can directly using the product in conventional heat pump.
When two grades of heat pumps work, evaporator obtains heat to cause that working medium is evaporated, in evaporator from semiconductor chilling plate
The steam of generation is led in condenser after being compressed through compressor, and now steam is condensed into liquid and discharges heat, condensed work
Matter forms a circulation by being transported to evaporator after expansion valve, so.
When the temperature of the surroundings is low, system starts semiconductor chilling plate, and cooling piece forces heat from ring by pyroelectric effect
Border is delivered to evaporator and ensures the temperature of evaporator higher than environment temperature.
Claims (2)
1. a kind of hot pump in low temp, it is characterised in that:
Including one-level heat pump and two grades of heat pumps;
Above-mentioned one-level heat pump includes fin (1) and semiconductor chilling plate (2), the wherein first end and wing of semiconductor chilling plate (2)
Piece (1) is closely connected;
Above-mentioned two grades of heat pumps are made up of evaporator (3), compressor (4), condenser (5) and expansion valve (6) successively, wherein semiconductor
Second other end and evaporator of cooling piece (2)(3)Surface be connected.
2. hot pump in low temp according to claim 1, it is characterised in that:One-level heat pump and two grades of heat pumps are respectively with independent
Power supply.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621170914.3U CN206247696U (en) | 2016-10-26 | 2016-10-26 | Hot pump in low temp |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621170914.3U CN206247696U (en) | 2016-10-26 | 2016-10-26 | Hot pump in low temp |
Publications (1)
Publication Number | Publication Date |
---|---|
CN206247696U true CN206247696U (en) | 2017-06-13 |
Family
ID=58995807
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201621170914.3U Expired - Fee Related CN206247696U (en) | 2016-10-26 | 2016-10-26 | Hot pump in low temp |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN206247696U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110332728A (en) * | 2019-07-04 | 2019-10-15 | 深圳市瑞沃德生命科技有限公司 | A kind of refrigeration system |
-
2016
- 2016-10-26 CN CN201621170914.3U patent/CN206247696U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110332728A (en) * | 2019-07-04 | 2019-10-15 | 深圳市瑞沃德生命科技有限公司 | A kind of refrigeration system |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170613 Termination date: 20181026 |
|
CF01 | Termination of patent right due to non-payment of annual fee |