CN206245636U - Heat dissipation type high composite plate for building with battenboard - Google Patents
Heat dissipation type high composite plate for building with battenboard Download PDFInfo
- Publication number
- CN206245636U CN206245636U CN201621134679.4U CN201621134679U CN206245636U CN 206245636 U CN206245636 U CN 206245636U CN 201621134679 U CN201621134679 U CN 201621134679U CN 206245636 U CN206245636 U CN 206245636U
- Authority
- CN
- China
- Prior art keywords
- composite plate
- heat
- building
- glass epoxy
- type high
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 55
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 20
- 239000004593 Epoxy Substances 0.000 claims abstract description 26
- 239000011521 glass Substances 0.000 claims abstract description 26
- 239000000919 ceramic Substances 0.000 claims abstract description 25
- 239000010410 layer Substances 0.000 claims description 20
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 9
- 229920003986 novolac Polymers 0.000 claims description 7
- 238000005260 corrosion Methods 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 239000012792 core layer Substances 0.000 claims description 3
- 239000000565 sealant Substances 0.000 claims description 2
- 229910052573 porcelain Inorganic materials 0.000 claims 2
- 238000005452 bending Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 4
- 239000000126 substance Substances 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 16
- 239000000463 material Substances 0.000 description 9
- 208000037656 Respiratory Sounds Diseases 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920002748 Basalt fiber Polymers 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Abstract
The utility model provides a kind of heat dissipation type high with battenboard composite plate for building, including composite plate upper strata, composite plate lower floor and sandwiched heat-conducting layer between, the composite plate lower floor is glass epoxy, the composite plate upper strata is ceramic wafer, upper core flaggy is equipped between the glass epoxy and the heat-conducting layer, lower core flaggy is equipped between the ceramic wafer and the heat-conducting layer；The heat-conducting layer has each extended over multiple heat conduction tributaries to the ceramic wafer and the glass epoxy, the heat conduction tributary is extended through in the upper core flaggy and the lower core flaggy, to protrude from the ceramic wafer and the glass epoxy, and forms projection with the surface of the glass epoxy in the ceramic wafer.The utility model can further enhance the coefficient of heat transfer of composite plate, high with bending strength, rupture strength is good, quality is light, chemical resistance is strong, it is easy to process the advantages of.
Description
Technical field
The utility model is related to a kind of composite plate, especially a kind of heat dissipation type high with battenboard composite plate for building.
Background technology
In whole building engineering, indoor composite board occupies extremely important status, and building composite board is kind class
Most fast, evolution of various, the update cycle maximum class material of the most active, development potentiality.Development and section with society
The raising of skill level, traditional composite plate field is also weeded out the old and bring forth the new constantly, imparts the various New functions of composite plate.
Wherein, to ensure enough use intensities, the heat sinking function of prior art composite plate is not mostly high, it is impossible to meet such as computer room right
Composite plate cooling requirements environment higher is used, and easily causes the potential safety hazard of fire, and the security of the lives and property for giving people is caused
Threaten.
The content of the invention
Weak point present in regarding to the issue above, the utility model offer is a kind of can to further enhance composite plate
Coefficient of heat transfer, it is high with bending strength, rupture strength is good, quality is light, chemical resistance is strong, it is easy to process the advantages of with sandwich
The heat dissipation type high composite plate for building of plate.
To achieve the above object, the utility model provides a kind of heat dissipation type high with battenboard composite plate for building, bag
Composite plate upper strata, composite plate lower floor and sandwiched heat-conducting layer (5) between are included, the composite plate lower floor is glass epoxy
(6), the composite plate upper strata is ceramic wafer (2), and upper folder is equipped between the glass epoxy (6) and the heat-conducting layer (5)
Core layer (7), is equipped with lower core flaggy (8) between the ceramic wafer (2) and the heat-conducting layer (5)；
The heat-conducting layer (5) has each extended over multiple heat conduction tributaries to the ceramic wafer (2) with the glass epoxy (6)
(51), the heat conduction tributary (51) is extended through in the upper core flaggy (7) and the lower core flaggy (8), to protrude from
The ceramic wafer (2) and the glass epoxy (6), and form convex with the surface of the glass epoxy (6) in the ceramic wafer (2)
Rise (52).
The above-mentioned composite plate for building of the heat dissipation type high with battenboard, wherein, the upper core flaggy (7) is by from up to
Under the noise deadener (3) that sets gradually constituted with novolac resin layer (4).
The above-mentioned composite plate for building of the heat dissipation type high with battenboard, wherein, the lower core flaggy (8) is by from up to
Under the novolac resin layer (4) that sets gradually constituted with noise deadener (3).
The above-mentioned composite plate for building of the heat dissipation type high with battenboard, wherein, the noise deadener (3) is sealed by acetic acid
Agent is made.
The above-mentioned composite plate for building of the heat dissipation type high with battenboard, wherein, the section of the heat conduction tributary (51) is
Circle, a diameter of 1.2~2.4mm of the heat conduction tributary (51).
The above-mentioned composite plate for building of the heat dissipation type high with battenboard, wherein, the top surface of the ceramic wafer (2) with
The lower surface of the glass epoxy (6) is respectively equipped with architectural surface (1).
The above-mentioned composite plate for building of the heat dissipation type high with battenboard, wherein, on the surface of the architectural surface (1) also
It is equipped with anti-corrosion enamelled coating (9).
Compared with prior art, the utility model has advantages below：
Heat conduction tributary can further enhance the coefficient of heat transfer of composite plate so that heat is directly derived by heat conduction tributary,
Play a part of drainage, reduce because the isolation on composite plate lower floor and composite plate upper strata influences, and also heat conduction can be reduced
The usage amount of material, can further reduces cost；
Composite plate upper strata is made of ceramic wafer material, high with bending strength, huge running into the characteristics of rupture strength is good
During big external impacts, it is possible to create crackle, but will not fall off, be adapted to protection internal building material；
Composite plate upper strata is made of glass epoxy, has the advantages that quality is light, chemical resistance is strong, easy to process, this kind
Composite building structure, layering is reasonable, it is easy to construction, is adapted to wide popularization and application.
Brief description of the drawings
Fig. 1 is side view of the present utility model；
Fig. 2 is the side view of the embodiment of Fig. 1.
Main Reference Numerals are described as follows：
1- architectural surfaces；2- ceramic wafers；3- noise deadeners；4- novolac resin layers；5- heat-conducting layers；51- heat conduction tributary；52-
It is raised；6- glass epoxies；7- upper core flaggies；8- lower core flaggies；9- anti-corrosion enamelled coatings
Specific embodiment
As shown in Figures 1 and 2, the utility model provides a kind of heat dissipation type high with battenboard composite plate for building, bag
Include architectural surface 1, composite plate upper strata, composite plate lower floor and sandwiched heat-conducting layer 5 between.
Architectural surface 1 is laid on the top surface of ceramic wafer 2 and the lower surface of glass epoxy 6 respectively.
In the present embodiment, composite plate lower floor is glass epoxy 6, and composite plate upper strata is ceramic wafer 2.
Wherein, continuous basalt fiber and carbon fibre material are added in ceramic wafer.Due to the bending resistance of ceramic wafer material
Intensity is high, and rupture strength is good, when huge external impacts are run into, it is possible to create crackle, but will not fall off, and is adapted to protection inside and builds
Build material.
Glass epoxy is composited by for glass fibre with resin material.Glass epoxy is matrix by resin material, is added
Glass fibre, has the advantages that quality is light, chemical resistance is strong, easy to process, this kind of composite building structure, and layering is reasonable, it is easy to
Construction, is adapted to wide popularization and application.
In addition, the outer surface in architectural surface 1 is also equipped with anti-corrosion enamelled coating 9.Have architectural surface by anti-corrosion enamelled coating
There is superpower corrosion resistance.
Upper core flaggy 7 is equipped between glass epoxy 6 and heat-conducting layer 5, is laid between ceramic wafer 2 and heat-conducting layer 5
There is lower core flaggy 8.
The surface of heat-conducting layer 5 has each extended over multiple heat conduction tributaries 51 to the surface of ceramic wafer 2 and glass epoxy 6.
Heat conduction tributary 51 is extended through in upper core flaggy 7 and lower core flaggy 8, to protrude from ceramic wafer 2 and fiberglass
Plate 6, and form raised 52 on the surface of ceramic wafer 2 and glass epoxy 6.
Wherein, the section in heat conduction tributary 51 is circle, a diameter of 1.2~2.4mm in heat conduction tributary 51.
In the present embodiment, through the multiple heat conduction tributaries 51 in upper core flaggy 7 with through in lower core flaggy 8
Multiple heat conduction tributaries 51 in alternating expression arrange.
Heat conduction tributary can further enhance the coefficient of heat transfer of composite plate so that heat is directly derived by heat conduction tributary,
Play a part of drainage, reduce because the isolation on composite plate lower floor and composite plate upper strata influences, and also heat conduction can be reduced
The usage amount of material, can further reduces cost.
Upper core flaggy 7 is made up of the noise deadener 3 for setting gradually from top to bottom with novolac resin layer 4.Lower core flaggy 8
It is made up of the novolac resin layer 4 and noise deadener 3 that set gradually from top to bottom.
Wherein, noise deadener 3 is made up of acetic acid sealant.
Preferred embodiment of the present utility model is the foregoing is only, is merely illustrative for invention, and it is unrestricted
Property.Those skilled in the art understanding, many changes can be carried out in the spirit and scope that invention claim is limited to it,
Modification, in addition it is equivalent, but fall within protection domain of the present utility model.
Claims (7)
1. a kind of heat dissipation type high with battenboard composite plate for building, including composite plate upper strata, composite plate lower floor and it is folded in
Therebetween heat-conducting layer (5), it is characterised in that the composite plate lower floor is glass epoxy (6), the composite plate upper strata is pottery
Porcelain plate (2), is equipped with upper core flaggy (7), in the ceramic wafer between the glass epoxy (6) and the heat-conducting layer (5)
(2) lower core flaggy (8) is equipped between the heat-conducting layer (5)；
The heat-conducting layer (5) has each extended over multiple heat conduction tributaries (51) to the ceramic wafer (2) and the glass epoxy (6),
The heat conduction tributary (51) is extended through in the upper core flaggy (7) and the lower core flaggy (8), to protrude from the pottery
Porcelain plate (2) and the glass epoxy (6), and form projection with the surface of the glass epoxy (6) in the ceramic wafer (2)
(52)。
2. the heat dissipation type high with battenboard according to claim 1 composite plate for building, it is characterised in that the upper folder
Core layer (7) is made up of the noise deadener (3) for setting gradually from top to bottom with novolac resin layer (4).
3. the heat dissipation type high with battenboard according to claim 1 composite plate for building, it is characterised in that the lower folder
Core layer (8) is made up of the novolac resin layer (4) for setting gradually from top to bottom with noise deadener (3).
4. the composite plate for building of the heat dissipation type high with battenboard according to Claims 2 or 3, it is characterised in that described
Noise deadener (3) is made up of acetic acid sealant.
5. the heat dissipation type high with battenboard according to claim 4 composite plate for building, it is characterised in that the heat conduction
The section in tributary (51) is circle, a diameter of 1.2~2.4mm of the heat conduction tributary (51).
6. the heat dissipation type high with battenboard according to claim 1 composite plate for building, it is characterised in that the ceramics
The top surface of plate (2) is respectively equipped with architectural surface (1) with the lower surface of the glass epoxy (6).
7. the heat dissipation type high with battenboard according to claim 6 composite plate for building, it is characterised in that in the dress
The surface of finish coat (1) is also equipped with anti-corrosion enamelled coating (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621134679.4U CN206245636U (en) | 2016-10-19 | 2016-10-19 | Heat dissipation type high composite plate for building with battenboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621134679.4U CN206245636U (en) | 2016-10-19 | 2016-10-19 | Heat dissipation type high composite plate for building with battenboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206245636U true CN206245636U (en) | 2017-06-13 |
Family
ID=58996279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621134679.4U Expired - Fee Related CN206245636U (en) | 2016-10-19 | 2016-10-19 | Heat dissipation type high composite plate for building with battenboard |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206245636U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108516809A (en) * | 2018-04-16 | 2018-09-11 | 广东金意陶陶瓷集团有限公司 | A kind of energy-saving electrothermic ceramic tile and production method |
-
2016
- 2016-10-19 CN CN201621134679.4U patent/CN206245636U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108516809A (en) * | 2018-04-16 | 2018-09-11 | 广东金意陶陶瓷集团有限公司 | A kind of energy-saving electrothermic ceramic tile and production method |
| CN108516809B (en) * | 2018-04-16 | 2020-08-04 | 广东金意陶陶瓷集团有限公司 | Energy-saving electric heating ceramic tile and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170613 |