CN206178553U

CN206178553U - Electronic equipment

Info

Publication number: CN206178553U
Application number: CN201621039180.5U
Authority: CN
Inventors: D·韦格曼; O·罗斯; E·S·乔尔; H·艾斯梅里; B·德格纳; 亀井生吹
Original assignee: Apple Inc
Current assignee: Apple Inc
Priority date: 2015-09-04
Filing date: 2016-09-05
Publication date: 2017-05-17
Anticipated expiration: 2026-09-05
Also published as: AU2018201067A1; JP6273332B2; US10579097B2; TWI670582B; TWI618309B; KR101890935B1; JP2017126316A; KR20170129589A; CN206963227U; AU2018201067B2; KR102408795B1; AU2016225784A1; TW201812505A; US9977460B2; EP3139449A3; US20170205847A1; US20170068276A1; JP2018092637A; KR20180095482A; EP3139449A2

Abstract

The utility model relates to electronic equipment. This electronic equipment includes: the equipment shell that has the surface, settled in surface department and the contact that has first end and second terminal is regional, this contact region have arranged between first end and second end and with surface a plurality of contacts of parallel and level roughly, and the alignment component in the shell, the component that should align includes first magnet and the second magnet of being settled on the opposite side in contact region, the regional first terminal quilt in the neighbouring contact of first magnet is settled and the regional second end in the neighbouring contact of second magnet is settled.

Description

Electronic equipment

Technical field

The disclosure relates generally to electronic equipment.

Background technology

Existing many different types of electronic equipments, including laptop computer, tablet PC, smart phone and other Electronic equipment.These equipment can be with one or more auxiliary devices (for example, keyboard, game console, clockwork radio etc.) Cooperative work is extending the ability and function of main electronic equipment or host electronic equipment.For this purpose, can in host electronic equipment and Connection is set up between auxiliary electronic equipment.

Can be with following the various conventional of the such as predetermined format of USB 2.0, USB 3.0, live wire and the like etc Physical connector sets up connection, or the agreement of such as bluetooth, WiFi or the like can be used wirelessly to set up connection.At some In example, physics, wired connection can be conducive to Change Power and exchange data.

Wired being connected in equipment needs a certain amount of space.As an example, USB socket adapter is generally in main equipment Outer surface need the surface region of a certain amount and the volume of a certain amount needed in main equipment for pin connector May be inserted into the cavity and the associated contact for socket connector and circuit of socket connector therein.Physical connection Device is also possible to become the potential aesthetic appearance corroded and originate and may impair to a certain extent equipment.

Utility model content

Embodiment of the disclosure is related to electronic equipment, such as host electronic equipment, it include highly corrosion resistant, needs it is a small amount of Space and artistic physical connector.Some embodiments provide and touched including substantially concordant with the outer surface of electronic equipment The external physical adapter of point.Outer surface can be it is flat or can be bending and contact outer surface can include with The profile of the outline of outer surface.In certain embodiments, for example in shell by made by metal or another conductive material In embodiment, non electrically conductive material can surround the contact in adapter to set each contact with other contacts and with electronics Standby housing electric insulation.

According to an aspect of this disclosure, there is provided a kind of electronic equipment, it is characterised in that the electronic equipment includes： Device housings with outer surface；It is positioned in the outer surface and the contact regions with first end and second end Domain, the contact region has and is disposed between the first end and the second end and with the outer surface substantially Concordant multiple contacts；In the alignment member of the inside the shell, the alignment member includes being positioned in the contact region The first Magnet and the second Magnet on opposite side, first Magnet is placed adjacent to the first end of the contact region And second Magnet is placed adjacent to the second end of the contact region.

According to a kind of embodiment, conductive material that the device housings are included in the contact region and including wearing Cross the opening that the conductive material is formed；The electronic equipment also includes being placed insulator in said opening, described exhausted A contact of the edge body in the plurality of contact is so as to by the contact and the device housings electrical isolation.

According to a kind of embodiment, conductive material that the device housings are included in the contact region and it is included in The multiple openings formed through the conductive material corresponding with the plurality of contact in quantity；Each in the plurality of contact Contact is placed in an opening in said opening in the plurality of opening；And the electronic equipment also includes being pacified The insulator in each opening in the plurality of opening is put, the insulator is formed in said opening around the contact Ring is so as to by the contact and the device housings electrical isolation.

According to a kind of embodiment, the appearance of each contact in the outer surface and the plurality of contact of the shell The outer surface of each dead ring in face and dead ring combines to form continuous smooth surface.

According to a kind of embodiment, between each dead ring in the outer surface and multiple dead rings of the shell Without gap between dead ring without gap and in each contact and around it.

According to a kind of embodiment, the device housings have the outer surface of bending, and institute in the contact region State each contact in multiple contacts and there is the curvature corresponding with the curvature of the outer surface of the bending at outer contact surface.

According to a kind of embodiment, the insulator in each opening in the plurality of opening is positioned in by plastics Formed.

According to a kind of embodiment, the plurality of contact is included in the multiple circular contacts being separated from each other in single row.

According to a kind of embodiment, the device housings form cavity and the electronic equipment also to be included being positioned in institute State battery in cavity, processor and computer-readable memory.

According to a kind of embodiment, the electronic equipment also include being coupled to the transparent cover glass of the shell with And the neighbouring cover glass is positioned in the display in the cavity.

According to a kind of embodiment, the display includes touch screen.

According to a kind of embodiment, the electronic equipment includes tablet PC.

According to a kind of embodiment, the alignment member includes the Magnet being positioned on the opposite side of the contact region The first array and the second array, the first array of the Magnet is placed simultaneously adjacent to the first end of the contact region And the second array of the Magnet is placed adjacent to the second end of the contact region.

According to a kind of embodiment, described each contact in the plurality of contact is from the contact around each contact The outer surface in region is recessed 0.5 millimeter or less than 0.5 millimeter.

According to another aspect of the present disclosure, there is provided a kind of electronic equipment, it is characterised in that the electronic equipment includes： The device housings of cavity are formed, the device housings have outer surface；The processor and computer being positioned in the cavity Readable memory；It is coupled to the transparent cover glass of the shell；The neighbouring cover glass is positioned in the cavity Interior display；It is positioned in the inside the shell and is operably coupled to the electricity of the processor and the display Pond；The outer surface and the contact region with first end and second end are positioned in, the contact region has： (1) the multiple circular contacts being separated from each other in single row between the first end and the second end are described more Each circular contact in individual circular contact be positioned in through device housings formed opening in and with contact regions The flush with outer surface of the device housings in domain or recessed little from the outer surface of the device housings in contact region In one millimeter of outer surface；(2) insulator being positioned in each opening in the plurality of opening, the insulator is in institute State in opening and form ring so as to the contact be isolated with the device housings around the contact；Wherein described shell it is described The outer surface of the outer surface and multiple insulator rings of outer surface and the plurality of circular contact combines continuous to be formed Smooth surface；In the alignment member of the inside the shell, the alignment member includes being positioned in the opposite side of the contact region On Magnet the first array and the second array, the first end of the first array of the Magnet adjacent to the contact region It is placed and the second array of the Magnet is placed adjacent to the second end of the contact region.

It is that the device housings are somewhat rectangular in shape and including four side tables according to a kind of embodiment Face, four side surfaces are around transparent cover glass and from being limited by the transparent cover glass at least in part The upper surface of the electronic equipment extends to back surfaces, and each side surface in four side surfaces has the appearance of bending Face；And the contact region is positioned in the part of the bending of in the side surface side surface.

According to another aspect of the disclosure, there is provided a kind of electronic equipment, it is characterised in that the electronic equipment bag Include：Device housings with outer surface；It is positioned in the outer surface and the contact with first end and second end Region, the contact region have be disposed between the first end and the second end and big with the outer surface Cause at least one concordant contact；In the alignment member of the inside the shell, the alignment member is included in the device housings It is positioned in the contact region or adjacent at least one Magnet of the contact region.

According to a kind of embodiment, conductive material that the device housings are included in the contact region and including wearing Cross the opening that the conductive material is formed；The electronic equipment also includes being placed insulator in said opening, described exhausted Edge body surround at least one contact so as at least one contact be isolated with the device housings.

According to a kind of embodiment, the outer surface and institute of the outer surface of the shell and at least one contact The outer surface for stating insulator combines to form continuous smooth surface.

According to a kind of embodiment, the device housings are with the outer surface for bending and described in the contact region At least one contact has the curvature corresponding with the curvature of the outer surface of the bending at outer contact surface.

In certain embodiments, adapter itself is not provided for coordinating with the corresponding adapter of auxiliary electronic equipment Alignment.Instead, the alignment member of such as Magnet or magnet array etc can be integrated in adapter.Alignment member with it is attached Category electronic equipment in corresponding alignment member cooperation so that the contact in host electronic equipment during cooperation event with it is attached Contact in electronic equipment is suitably alignd, so that the contact that the signal of telecommunication can pass through to coordinate is passed between the two devices Pass.

In certain embodiments, there is provided a kind of electronic equipment, it includes with outer surface and is positioned in outer surface Contact region device housings.Contact region has first end and second end and substantially concordant by cloth with outer surface Put the multiple contacts between first end and second end.Electronic equipment is additionally included in the alignment member of inside the shell, the alignment Component includes the first Magnet and the second Magnet being positioned on the opposite side of contact region, wherein the first Magnet adjacent contacts area The first end in domain is placed, and the second end in the second Magnet adjacent contacts region is placed.

In certain embodiments, part of the device housings in contact can be made up of conductive material, wherein outside equipment Shell is positioned in one or more of openings including multiple contacts.One or more insulators can also surround multiple contacts It is placed in the opening and by multiple contacts and device housings electric insulation.In certain embodiments, this one or more it is exhausted Edge body includes quantitatively equal with the plurality of contact multiple dead rings.

In certain embodiments, the outer surface of device housings and the outer surface of one or more contacts and one or more The outer surface of insulator can be with reference to the continuous smooth surface of formation.And in certain embodiments, in the outer surface of housing Without gap and each insulator in one or more insulators between, each contact in one or more contacts Without gap and each insulator in one or more insulators between.In certain embodiments, set in contact region Each contact during standby shell can have the outer surface of bending and multiple contacts has and bending at outer contact surface The corresponding curvature of the curvature of outer surface.

In certain embodiments, included according to the electronic equipment of the disclosure：Device housings with outer surface；It is positioned in Outer surface and the contact region with first end and second end, the contact region have be positioned in first end and Between second end and at least one contact substantially concordant with outer surface；And in the alignment member of inside the shell, it includes Be positioned in device housings in contact region or adjacent contacts region at least one Magnet.

In other embodiments, included according to the electronic equipment of the disclosure：Form the device housings of cavity；It is positioned in Processor and computer-readable memorizer in cavity；With the transparent cover glass of shell coupling；Neighbouring cover glass quilt The display being placed in cavity；And be positioned in inside the shell and be operably coupled to the electricity of processor and display Pond.Electronic equipment can also include the contact region of the outer surface for being positioned in device housings, and the contact region has first End and second end.Multiple circular contacts can be separated from each other between first end and second end in single row, And each circular contact in multiple circular contacts be positioned in through device housings formed opening in and with The flush with outer surface of the device housings in contact region or it is less than from the outer surface of the device housings in contact region is recessed One millimeter of outer surface.Dead ring can be positioned in each opening in multiple openings, and the dead ring surround in the opening Contact and by contact from device housings isolate, in device housings the outer surface of the outer surface of housing and multiple circular contacts with And the outer surface of multiple dead rings can be with reference to the continuous smooth surface of formation.Electronic equipment is additionally may included in inside the shell Alignment member, the alignment member includes the first array of the Magnet being positioned on the opposite side of contact region and the second of Magnet The first end in the first array adjacent contacts region of array, wherein Magnet be placed and Magnet the second array adjacent contacts The second end in region is placed.

After checking figure below and describing in detail, other systems, method, the feature and advantage of embodiment are for this Art personnel will be apparent or will become obvious.All such additional systems, method, feature and Advantage is intended to be included in this specification and the utility model content is intended in the range of embodiment and is intended to receive Claims are protected.

Description of the drawings

Fig. 1 shows the electronic system of the one embodiment according to the disclosure；

Fig. 2 is the isometric view of the simplification of the host electronic equipment illustrated in Fig. 1 according to some embodiments of the present disclosure；

Fig. 3 shows the contact structure in device housings according to some embodiments of the present disclosure；

Fig. 4 is the list in the contact structure illustrated in the Fig. 3 cut open according to the A-A ' along the line of some embodiments of the present disclosure The sectional view of the simplification of only contact；

Fig. 5 be according to some embodiments of the present disclosure be attached to including can with Fig. 3 and Fig. 4 in illustrate touch The isometric view of the simplification of the auxiliary electronic equipment of the keyboard of the lid of multiple contacts of point respective outer side edges；

Fig. 6 is the perspective view of the simplification of the contact structure according to some embodiments of the present disclosure；

Fig. 7 is the side sectional view of the simplification of the contact structure illustrated in Fig. 6 according to some embodiments of the present disclosure；

The decomposition of all parts of the attachment members illustrated in Fig. 2 that Fig. 8 shows according to some embodiments of the present disclosure View；

Fig. 9 shows the sectional view of the attachment members illustrated in Fig. 2 and Fig. 8 of the dotted line C-C ' illustrated through in Fig. 8；

Figure 10 shows the side view of the auxiliary device illustrated in the Fig. 5 coupled with the electronic equipment illustrated in Fig. 2, wherein Auxiliary device uses keyboard components in the construction for folding with permission electronic equipment；

Figure 11-13 shows the zoomed-in view with the part shown in dotted line D of Figure 10, the wherein attachment members of auxiliary device In being positioned in the holding member of auxiliary device；

Figure 14 shows the contact of Fig. 4；

Figure 15 shows the plastic insulation of the contact for Fig. 4；

Figure 16-18 shows the method for assembling contact structure in the electronic device according to one embodiment of the disclosure；

Figure 19 is the list in the contact structure illustrated in the Fig. 3 cut open according to the A ' A ' along the line of another embodiment of the present disclosure The sectional view of the simplification of only contact；

Figure 20 shows the contact of Figure 19；

Figure 21 shows the contact of Figure 20 in plastic insulation of the one embodiment according to the disclosure；

Figure 22 shows the contact structure after the assembling in the electronic device of the one embodiment according to the disclosure；

Figure 23 is the list in the contact structure illustrated in the Fig. 3 cut open according to the A ' A ' along the line of another embodiment of the present disclosure The sectional view of the simplification of only contact；

Figure 24 shows the contact of Figure 23；

Figure 25 shows the contact of Figure 24 in plastic insulation of the one embodiment according to the disclosure；

Figure 26 shows the contact structure after the assembling in the electronic device of the one embodiment according to the disclosure；

Figure 27 shows the contact according to another embodiment of the present disclosure；

Figure 28 shows the contact of Figure 27 in plastic insulation of the one embodiment according to the disclosure；

Figure 29-34 shows the method for assembling contact structure in the electronic device according to one embodiment of the disclosure；

Figure 35 shows the contact structure in device housings of the one embodiment according to the disclosure；

Figure 36 shows that being integrated into for the one embodiment according to the disclosure is independent in the contact structure of Figure 35 Contact section side view；

Figure 37 shows that being integrated into for the one embodiment according to the disclosure is another in the contact structure of Figure 35 The side view of the section of individual single contact；

Figure 38 shows a part for the contact structure of the one embodiment according to the disclosure；

Figure 39 is the decomposition view of the contact structure of the one embodiment according to the disclosure；

The method that Figure 40-43 shows the part that contact structure is manufactured according to one embodiment of the disclosure；

Figure 44-47 shows another kind of method for the part that contact structure is manufactured according to one embodiment of the disclosure； And

The method that Figure 48-52 shows the part that contact structure is manufactured according to one embodiment of the disclosure.

It will be appreciated by persons skilled in the art that and be understood by, according to common practice, those listed above and under Each feature for the accompanying drawing that text is discussed is not necessarily drawn to scale, and each component of accompanying drawing and the size of element can be increased Add deduct few to be shown more clearly that embodiment of the disclosure described herein.

Specific embodiment

Cross-reference to related applications

This application claims following priority application rights and interests：In the Application No. 62/215,688 of the submission on the 8th of September in 2015 U.S. Provisional Patent Application (attorney P29152USP1)；In the Application No. 62/ of the submission on the 8th of September in 2015 215,714 U.S. Provisional Patent Application (attorney P25821USP1)；The application submitted on November 11st, 2015 Number for 62/254,033 U.S. Provisional Patent Application (attorney P25821USP2)；In the submission on the 8th of September in 2015 The U.S. Provisional Patent Application (attorney P28445USP1) of Application No. 62/215,592；And in September 4 in 2015 The U.S. Provisional Patent Application (attorney P27443USP1) of the Application No. 62/214,671 that day submits to；These applications In each application complete disclosure be expressly incorporated herein by way of reference.

Now with detailed reference to the exemplary embodiments of the disclosure being shown in the drawings.Although describe in detail this enough A little embodiments are so that those skilled in the art can put into practice described embodiment, it will be appreciated that these examples are not to limit Property.Conversely, the disclosure is intended to cover alternative, modification if being included in the spirit and scope of described embodiment And equivalent.It should be understood that in the case of the spirit and scope without departing from described embodiment, it is possible to use other realities Apply example and change can be made.

Following disclosure is related to the host electronic equipment for being used together with auxiliary electronic equipment.Host electronic equipment can be wrapped Include highly corrosion resistant, need a small amount of space and artistic physical connector.In certain embodiments, host electronic equipment can With the outer surface of the external physical adapter for including there are one or more contacts, one or more contacts and host electronic equipment Concordantly or from the outer surface slight depression of host electronic equipment.The outer surface of host electronic equipment can be flat or can be curved The outer surface of bent and contact can include the profile with the outline of the outer surface of host electronic equipment.In some embodiments In, such as in shell embodiment by made by metal or another conductive material, non electrically conductive material can surround adapter In contact with by each contact and other contacts and housing electric insulation with electronic equipment.

Fig. 1 shows the electronic system 100 according to some embodiments of the present disclosure.System 100 includes host electronic equipment 110, host electronic equipment 110 may be connected to auxiliary electronic equipment 120 in order to share between auxiliary device and main equipment Data, electric power or both have concurrently.Specifically, one or more contacts 112 on main equipment 110 can be by such as line Cable connector 130 is electrically connected to one or more contacts 122 on auxiliary device 120.Other in the disclosure are implemented In example, it is possible to use the adapter different from wire and cable connector 130 by the contact 112 on main equipment 110 directly and electrically Be connected to contact 122 on auxiliary device 120.In the other embodiment of the disclosure, can include supporting the He of main equipment 110 One or more optical feelers of one or more optics connections between auxiliary device 120.

For the ease of straight between the contact 122 on the contact 112 and auxiliary electronic equipment 120 on host electronic equipment 110 Connect in succession, contact 112 can be the part of the surface-mount connector being integrated in main equipment 110, wherein contact is located at and sets Standby 110 outer surface and either concordant with the shell of equipment 110 or relative to equipment 110 shell is recessed limited Amount.It is illustrated in following accompanying drawing including some examples of the surface-mount connector of contact 112 and is hereinafter begged for By.

Fig. 2 is the isometric view of the simplification of the electronic equipment 200 according to some embodiments of the present disclosure.Electronic equipment 200 It can be a kind of electronic equipment in many different types of electronic equipment as the host electronic equipment 110 illustrated in Fig. 1 Represent.In certain embodiments, electronic equipment 200 is mobile communication equipment, such as smart phone.Enforcement shown in figure 2 In example, electronic equipment 200 is tablet computing device.Electronic equipment 200 can be with difference in terms of shape and size.Additionally, electronics Equipment 200 can include shell 202, and shell 202 forms cavity and is designed to seal and protect the equipment 200 in cavity Each internal part, battery, one or more processors, one or more computer-readable memories, wave point etc.. In certain embodiments, shell 202 is formed by metal, such as aluminum or other conductive materials.

Electronic equipment 200 can also include the display assembly 204 for being designed to that vision content is presented.In some embodiments In, display assembly 204 includes touch-sensitive layer, and touch-sensitive layer is designed to receive touch input and according to touch input being generated to The order of electronic equipment 200.Additionally, in certain embodiments, display assembly 204 includes being designed to be based on and display group The Capacitance Coupled of part 204 is generating the capacitive touch photosensitive layer of input.The exterior cover sheets 206 being made of clear material can be covered Display assembly 204 and shell 202 can be attached to so as to cover display and by shell with binding agent or other modes The cavity of formation.Cover glass can be made up and be sometimes referred to as to exterior cover sheets 206 of glass or similar material.At some In embodiment, electronic equipment 200 can also include that being designed to detection is applied to display assembly 204 and/or exterior cover sheets The force detection sensor (not shown) of the size of 206 power.

Electronic equipment 200 can include one or more load buttons of such as button 208 etc, this one or more it is defeated Enter the corresponding input of order that button is designed to receive with arrive electronic equipment (for example, to illustrate on display assembly 204 to change Vision content).Additionally, in certain embodiments, electronic equipment 200 includes being designed to receive the electric power from another equipment And/or the socket connector 210 of data.For example, the electric power from power supply (not shown) can be supplied to by adapter 210 Equipment 200 so as to for the internal part of electronic equipment 200 power and/or to be placed in electronic equipment 200 in one or more electricity Source (not shown) is powered.Socket connector 210 can include cavity, and the contact of socket connector is located in the cavity.

In addition to adapter 210, electronic equipment 200 can also include the outer surface for being located at equipment 200 in contact regions One or more electrical contacts 212 in domain 211.Electrical contact is designed to and (shows in Figure 5 with such as auxiliary device 500 Go out) etc the related corresponding contact of auxiliary device be electrically coupled to.Contact 212 can allow electronic equipment 200 and attached set Electrical communication between standby 500, as contact 112 can allow the electrical communication between equipment 110 and 120.For example, at some In embodiment, contact 212 can include one or more data for being possibly realized the data exchange between equipment 200 and 500 Contact.Contact 212 can also include auxiliary device is provided electric power to electronic equipment 200 or enable auxiliary device One or more power contactors of electric power are drawn from equipment 200 and/or earthing contact.

Contact 212 can be substantially concordant with the outer surface of housing 202.I.e., in certain embodiments, contact 212 be not Formed in exposed opening or other kinds of cavity in housing 202, the exposed opening or other kinds of cavity are usual It is required by the such as socket connector of adapter 210 etc, and is otherwise probably coming for dust or other debris accumulations Source.Alternatively, contact 212 is the part of the continuous outer surface of apparatus casing 202 so that with closed when AN connector And compare contact during in housing 202 and be less noticeable, this can be conducive to the aesthetic appearance of electronic equipment 200.Such as this Used in text, when the outer surface of contact and the surface of shell of surrounding concordant (for example, in identical plane) and work as Recessed such as 1 millimeter or less than 1 millimeter from the surface of the shell body 202 around contact of the outer surface of each single contact 212 Etc limited amount when, contact 212 can be referred to as the outer surface " substantially concordant " with housing 202.In other embodiment In, 212 recessed 0.5 millimeters of contact or less than 0.5 millimeter, and in other embodiments, shell body surface of the contact 212 from surrounding Face is recessed 0.25 millimeter or less than 0.25 millimeter.When contact is substantially concordant with the outer surface around housing 202, contact and Shell body can be with reference to so that have continuous smooth in housing outer surface between the part of contact and the outer surface of contact Transition.

Be not disposed between that alignment can be provided coordinating with contact 212 for corresponding adapter due to contact 212 and It is connected electrically in the cavity of the housing 202 of contact 212 or in other exposed openings of housing 202, therefore in some enforcements Electronic equipment 200 includes alignment member in order to adapter cooperation in example.In some specific embodiments, alignment member can be with First array 214 and alignment magnetic of the alignment Magnet being placed on the opposite side of contact region 211 including the side wall along shell 202 Second array 216 of ferrum.Each array in first array 214 and the second array 216 of Magnet can include some Magnet, this A little Magnet there is magnetic polarity to arrange with as explained below by the respective array magnetic of the Magnet in array and auxiliary electronic equipment Property ground coupling.The magnetic circuit formed by multiple magnetic couplings can allow electronic equipment 200 with all auxiliary devices as shown in Figure 5 500 etc auxiliary electronic equipment is magnetically coupled and by the contact alignment of contact 212 and auxiliary electronic equipment.In other realities In applying example, alignment member can include less or more Magnet or magnetic part or other kinds of alignment structures.

Fig. 3 shows the contact region 300 in device housings in accordance with an embodiment of the present disclosure.Contact region 300 can be with It is the contact region 211 illustrated in such as Fig. 2.In this example, contact region 300 (is marked including three single contacts 312 It is designated as contact 312a, 312b and 312c), each contact in three single contacts is located at surrounding's appearance of device housings 310 It is at face and substantially concordant with the circumferential outer surface of device housings 310.However, embodiment of the disclosure be not restricted to it is any specific The contact of quantity, and other embodiment can include in the contact region 300 fewer of more than three contacts.In contact 312 Each contact can be similar or equivalent with contact 212, while device housings 310 can be the housing of such as electronic equipment 200 202.In certain embodiments, device housings 310 can be made up of metal or similar conductive material, in this case absolutely Edge ring 320 can be between each contact 312 and device housings 310 around the external margin of each single contact 312.Insulation Ring 320 can be made up of plastics or another non electrically conductive material and can be by contact 312 and the electrical isolation of device housings 310. In these and other embodiments of the disclosure, contact 312 and dead ring 320 can be big with the circumferential surface of device housings 310 Cause concordant.These surfaces can be bending, and they can be generally flat or they can have other profiles.One In a little embodiments, the outer surface and surrounding dead ring 320 of contact 312 can be with reference to so that when contact and dead ring are recessed limited Amount when, the outer surface of contact, dead ring and apparatus casing is all combined so that formed can be in the region of contact and/or dead ring The continuous smooth outer surface being slightly recessed, so as to as shown in Figure 3 in contact region formed three recesses side by side.

Fig. 4 shows the cross sectional side view of a part for the contact region 300 of A ' A ' along the line in figure 3.In this example, Show contact structure 400.Contact structure 400 includes being positioned in the opening in device housings 310 and filling the opening Single contact 312 (for example, in the 312a-312c of contact).Plastic insulation ring 320 is located at outside contact 312 and equipment Around contact between shell 310.Plastic hoop 320 is close to device housings 310 and contact 312 so that will not between these three parts Form gap.Additionally, it is apparent that the outer surface of contact structure 400 is substantially in figure from shell 310 from Fig. 4 The part at top place to dead ring 320 above partly, to contact 312, to below dead ring 320 partly and to shell Continuous, (for the touch of user) smooth and curved surface of 310 parts at the bottom of figure.

As also illustrated that in Fig. 4, flexible PCB 420 may be coupled to contact 312, and support 410 can be used to touch Point 312 is secured in place in device housings 310.In each embodiment of the disclosure, various binding agents can be used for this A little structures are secured in place.Specifically, adhesive layer 430 can be used to for contact 312 to be fixed to plastic insulation 320.Bonding Layer 430 may be utilized for for plastic insulation 320 being fixed to device housings 310.Additionally, adhesive layer 430 can be used for by Support 410 is secured in place in device housings 310.

The further detail below of contact structure 400 and the enforcement according to the disclosure are discussed hereinafter with reference to Figure 14-52 The contact that can be integrated in host electronic equipment of the replacement contact structure 400 of example and the example of contact structure.However, turning To before those additional details and example, with reference to Fig. 5, it shows the generation as the auxiliary electronic equipment 120 illustrated in Fig. 1 The isometric view of the embodiment of the electronic equipment of table.Therefore, electronic equipment 500 may be connected to host electronic equipment, such as Fig. 1 In the host electronic equipment 110 that illustrates or the host electronic equipment 200 illustrated in Fig. 2.Auxiliary device 500 includes being coupled with keyboard group The lid 502 of part 504.Lid 502 can be formulated in size can be with auxiliary device to be superimposed (overlay) and covering with shape 500 electronic equipments being used together, such as equipment 110 or equipment 200.In certain embodiments, lid 502 includes multiple portions Point, these parts are also referred to as panel (panel) or section (segment).For example, as shown in figure 5, lid 502 can be wrapped Include first paragraph 506, second segment 508 and the 3rd section 510.Each section in first paragraph 506, second segment 508 and the 3rd section 510 can be with It is moveable or rotatable with regard to remaining section.In this respect, lid 502 can be referred to as folding lid.This Outward, as shown in figure 5, the 3rd section 510 can be elevated with regard to first paragraph 506 and second segment 508 or raise so that when keyboard group When part 504 is folded on first paragraph 506 and second segment 508, keyboard components 504 are generally coplines with regard to the 3rd section 510 Or it is concordant.

Each section in first paragraph, second segment and the 3rd section can be covered or be superimposed by tissue layer 512, such as microfibre or The display assembly of the host electronic equipment that surface enhanced will not also be designed to be operated with it to accessory board 500 simultaneously is provided (display 204 for for example, illustrating in Fig. 2) hurtful generally any material.Each section in these sections can also be wrapped Include the rigid panel formed by the material of such as glass fibre etc being placed under tissue layer 512.Additionally, described before Section can be folded to limit lid 502 folding construction (configuration), fold construction in accessory board Being designed to the electronic equipment of collaboration can be positioned in support upwards in the position of (propped-up).

Lid 502 can also include attachment members 514, and attachment members 514 are designed to receive and fix host electronic equipment (such as host electronic equipment 110 or host electronic equipment 200) and auxiliary device 500.Attachment members 514 can include some Magnet or Magnet array (not shown in Figure 5), if during these Magnet or magnet array can be aligned to be placed on host electronic equipment Dry Magnet is magnetically coupled to auxiliary device 500 by the host electronic equipment being attached to.Additionally, auxiliary device 500 can be wrapped Include one or more electrical contacts in attached contact structure 515, one or more electrical contacts be designed to such as The electrical couplings of electrical contact 312 of the host electronic equipment of main equipment 110 or 200 etc.Electrically touching in general contact structure 515 The quantity of point will be equal to the quantity of the contact that auxiliary device 500 is manufactured in the corresponding contact region 300 matched with it. In some embodiments, such as shown in figure 5, attached contact structure 515 includes aliging simultaneously with contact 312a, 312b, 312c respectively And can be respectively electrically coupled to three contacts 516a, 516b, 516c of contact 312a, 312b, 312c.However, the disclosure The embodiment any certain amount of contact that is not limited in attached contact structure 515, and can wrap in various embodiments Include more or less than three contacts.At least enter one with reference to the attached contact structure 515 of Fig. 6 and Fig. 7 discussion hereinafter in this application Step details.

Attachment members 514 can be coupled by exterior layer 518 or outer layer with lid 502, and the outer layer 518 or exterior layer are along lid The outer surface of son 502 extends and is wrapped in around attachment members 514 to limit the top surface or upper table of attachment members 514 Face.In certain embodiments, outer layer 518 include allowing attachment members 514 and lid 502 some it is flexible it is polymer matrix, Low modulus elastomer material.Additionally, outer layer 518 can include the mixture of polyurethane and coal tar and can form various face Color.In addition, form the material of outer layer 518 and can also include the relatively high bonding force to miscellaneous part and can also be wear-resisting 's.In this respect, outer layer 518 can include relatively high coefficient of friction, and the relatively high coefficient of friction can be in electronic equipment The movement of electronic equipment is limited when engaging with attachment members 514.In order to reduce coefficient of friction, attachment members 514 can include ring Around the ground floor 522 and the second layer 524 of electrical contact.Ground floor 522 and the second layer 524 can be included relative to attachment members 514 relatively low coefficient of friction, the relatively low coefficient of friction can in order to the alignment between electronic equipment and attachment members 514 and Coupling.

Keyboard components 504 can be included according to the key 526 being arranged in the commonly known QWERTY layout of art of keypads.So And, in other embodiments, according to language or dialect, key 526 can include different constructions.Keyboard components 504 can include Receive the printed circuit board (PCB) (not shown) of key 526.Keyboard components 504 can also include holding member 528, holding member 528 across The top surface 530 of keyboard components 504 is placed and prominent from top surface 530.Holding member 528 can be designed as When lid 502 is in the specific construction for folding, at least a portion of attachment members 514 or attachment members 514 is received.Keep Component 528 can provide the mechanical stopping piece of the electronic equipment fixed for attachment members 514 and by attachment members 514.

As shown in figure 5, holding member 528 includes the ring-shaped structure projected from top surface 530.However, in other enforcements In example, holding member 528 includes two or more the discontinuous components for the mechanical stopping piece described before providing.At it In his embodiment, top surface 530 is additionally included in the groove in the position in holding member 528 or " paddy ", and the groove or " paddy " will be attached A part for connection member 514 is placed in top surface below 530.Holding member 528 can also include being designed to and attachment structure The magnet array that Magnet in part 514 is magnetically coupled, the magnet array is combined with mechanical stopping piece to be attached with further restriction The movement of component 514.The further detail below of attachment members 514 is discussed below with reference to Fig. 8-9.

Referring now to Fig. 6, Fig. 6 is the perspective of the simplification of the attached contact structure 515 according to some embodiments of the present disclosure Figure.As shown in fig. 6, contact structure 515 can include contact housing 605 (also showing that in the figure 7), contact housing 605 includes lift High part 610.The part 610 raised can be positioned in opening for the device housings of all shells as shown in Figure 7 620 etc In mouthful and through the opening extension of the device housings, device housings can be the parts of the housing of auxiliary device or can be Such as outer surface of attachment members 514.Attached contact structure 515 also includes three single contact 516a, 516b and 516c, this Each contact in three contacts can be made up of metal or another conductive material.The part 610 raised of contact structure can be with Including the independent opening for each contact in single contact 516a, 516b and 516c.

In the case that contact 516a-516c can be the large volume in the electronic equipment accommodated by shell 620 is not consumed Allow contact structure 515 that the contact of unobtrusively (low-profile) of contact is provided for adapter.In various embodiments, touch Point 516a-516c can be the contact of spring biasing.For example, contact 516a-516c can be by spring, elastic arm or other elasticity Configuration biases may return to their home position so that once they can be pushed away or press and be released.Spring biasing Contact a certain amount of compliance can be provided together with the contact in corresponding connectors, so as to aid in multiple contact 516a- The corresponding contacts of the second adapter on second equipment of the contact 312a-312c of 516c and such as host electronic equipment 200 etc Between formed electrical connection.

Fig. 7 is the contact structure according to some embodiments of the present disclosure of the dotted line B-B ' section on plane illustrated along Fig. 6 The side view cutaway drawing of 515 simplification.Contact structure 515 may be located in the auxiliary electronic equipment with housing or shell 620.Such as Upper described, the part 610 raised of the lid 210 of contact structure 515 may be located in the opening in device housings 620.Contact The contact housing 605 of structure 515 can support respectively with the contact 516a of contact part 622a, 622b and 622c, 516b, 516c (opening 548 for for example, illustrating in Fig. 8).These contact parts 622a-622c can respectively be attached to elastic lever arm 624a, 624b and 624c.Each elastic arm can terminate in second end and can include barb, and the barb can be inserted into To in the recess or groove in contact housing 605.Specifically, elastic lever arm 624a can include barb 626a, elastic lever arm 624b can include barb 626b, and elasticity lever arm 624c can include barb 626c.In certain embodiments, central contact can There is the contact housing 605 being insert molded around it and barb 626b can not needed.

During assembly, including contact part 622b central contact can pass through connector shell 605 bottom in Opening is inserted into.Need not more (structures), contact portion 622b can be pushed deeply in connector shell 605.At some In example, contact structures 622b can be pulled under the top surface of the part 610 raised.At this moment (hypothesis) if contacted Part 622b lateral shifts, contact portion 622b may not be exposed from the opening of it in contact housing 605.Therefore, bottom Portion's stopping part 630 may be located at the lower section of contact portion 622b.Bottom stop part 630 can limit contact portion 622b can With bulged-in depth, so as to prevent the possible damage to contact structure 515.In other embodiments, central contact can be with With the contact housing 605 being insert molded around it and bottom stop part 630 can not be needed.

Referring now to Fig. 8, it shows dividing for all parts of the attachment members 514 according to some embodiments of the present disclosure Diagrammatic view.For example, attachment members 514 can include the first array 532 of Magnet and the second array 534 of Magnet.In some realities In applying example, the first array 532 and the second array 534 include some Magnet (such as neodymium magnetic aligned together before assembly Ferrum).In the embodiment that figure 8 illustrates, the first array 532 and the second array 534 formed by the combination of non-magnetizable material and It was magnetized before the assembling of attachment members 514.First array 532 and the second array 534 can be placed on video camera/sensing Device assembly (not shown) lower section and according between electrical contact 516a-516c and electronic equipment (not shown) it is desired alignment come Align with magnetizator (not shown).This allows the magnetization of the customization of the magnetic alignment for improving electronic equipment.

Fig. 8 also show the first array 532 with some magnetized areas and the second array 534.For example, the first array 532 the second magnetized areas 538 that can include the first magnetized area 536 and neighbouring first magnetized area 536.Magnetized area may be used also With including different magnetic regions or various sizes of magnetic regions.As it is known to the person skilled in the art, Magnet is typically wrapped Include magnetic polarity arrangement, magnetic polarity arrangement have towards " north " pole or the arctic and the pole of court " south " or the region in the South Pole and The magnetic field line extended in the direction from the arctic to the South Pole.In addition, those skilled in the art are further appreciated that, the arctic of Magnet can To be magnetically attracted the South Pole of Magnet, and two arctic or two South Pole can magnetically repel each other.In this respect, The neighbouring magnetic regions of the first array 532 and the second array 534 can include being designed to produce magnetic in the opposite direction The magnetic polarity arrangement of field wire.For example, as shown in figure 8, the first magnetized area 536 includes the magnetic field line of middle extension in a first direction (shown in dotted line), the magnetic field line indicates that there is top surface north polarity and relative with top surface lower surface (not show Go out) there is southern polarity.On the contrary, the second magnetized area 538 is included in the magnetic extended in the second direction contrary with first direction Field wire (shown in dotted line), the magnetic field line indicates that top surface has southern polarity and the lower surface relative with top surface (not shown) has north polarity.This pattern can be the representative of the magnetized area of the first array and the second array.Additionally, at it In his embodiment, the pattern is inverted such that the first magnetized area 536 and the second magnetized area 538 are included in and show with Fig. 8 Magnetic field line in the contrary direction of those magnetic field lines for going out.In addition, the first magnetized area 536 can be than the second magnetized area 538 is little.Similarly, but addedly, can in the magnet array 214 and 216 of equipment 200 using magnetic polarity arrangement in order to Attachment members to the Magnet of equipment 200 is coupled.

In addition, as shown in figure 8, electrical contact structure 515 can be placed on flexible circuit assembly 535, and magnetic shunt 537 lower sections that can be placed in the first array 532 and the second array 534.It is magnetically attracted to the first array 532 and the second array 534 magnetic shunt 537 can be formed by the metal including mild steel.Magnetic shunt 537 can be with towards such as electronic equipment In the host electronic equipment that the attachment members of the magnet array 214 and 216 etc in 200 are fixed to the upper auxiliary device 500 The magnetic direction of the first array and the second array is changed in the direction of Magnet.Attachment members 514 can also include guard block 540, Guard block 540 is included comprising stainless metal level (not shown).External coating 542 can cover metal level and be provided with U.S. The modification of sense.In certain embodiments, external coating 542 includes the light thermoplasticity (" PTP ") comprising polyurethane and thermoplastic Material.

Attachment members 514 can also include or receive some additional components.For example, conductive fabric 544 be designed to by The adapter (not shown) of keyboard components 504 (figure 5 illustrates) is sent to from the signal of telecommunication of electronic equipment, otherwise or. Conductive fabric 544 can be wrapped in around the guard block 540 with the coupling of flexible circuit assembly 535, and conductive fabric 544 can With with contact structure 515 in single electrical contact 516 in one or more contacts (that is, in contact 516a-516c Individual or multiple contacts) electrical couplings.In certain embodiments, conductive fabric 544 be all it is conductive (conductive fabric 544 it is each Place is all conductive).In the embodiment that figure 8 illustrates, conductive fabric 544 includes conductive region 546, and conductive region 546 is wrapped Include three electrically independent signal traces (not shown) of each contact being electrically coupled in the 516a-516c of contact.Outer layer 518 Can be coated with being combined to limit the top of attachment members around attachment members 514 and with ground floor 522 and the second layer 524 Surface.As illustrated, outer layer 518 can include allowing the electrical contact coupling of each single electrical contact 516 and electronic equipment The opening 548 for connecing.

Fig. 9 show the dotted line C-C ' illustrated through in Fig. 8 and assemble together with all parts illustrated in Fig. 8 it is attached The sectional view of connection member 514.As illustrated, be usually U-shaped by the circular metal level 552 of external coating 542, but according to attachment The desired shape of component 514 can be with difference.In addition, outer layer 518 and conductive fabric 544 are typically wrapped in guard block 540 weeks Enclose, wherein outer layer 518 prolongs in the top of (either the first array 532 for illustrating in Fig. 8 or the second array 534) Magnet 554 Stretch, and conductive fabric 544 extends between Magnet 554 and magnetic shunt below Magnet 554.In addition, conductive fabric 544 can Covered with decorated layer 556, decorative layer 556 further provides protection cap to conductive fabric 544.Decorative layer 556 can include PTP。

In addition, decorative layer 556 can adhesively be fixed with the upper part of attachment members 514.For example, in the He of decorative layer 556 Adhesive layer 558 between external coating 542 can only along sub-fraction (fewer than half) extension of external coating 542.This allows attachment Component is easier mobile with clockwise and/or counter-clockwise (as shown in arrow 560).Although in addition, be not specifically illustrated, It is shown in Fig. 9 and described several components can be adhesively fixed together.

Referring now to Figure 10, it show lean against on surface 1000 (for example, desktop) and with electronic equipment 200 coupling The side view of auxiliary device 500.As shown in figure 5, auxiliary device 500 is made in the construction for folding with permission electronic equipment 200 With keyboard components 504.In the construction for folding, lid 502 is couple to keyboard components by the attachment members 514 of auxiliary device 500 504 part of holding member 128.Meanwhile, attachment members 514 also auxiliary device 500 is couple to into host electronic equipment 200 so that Contact region 300 in main equipment 200 coordinates and is electrically connected with the contact structure 515 in auxiliary device 500.As schemed Show, the construction of folding can include being folded to form the first paragraph 506, second of the triangular support for electronic equipment 200 Section 508 and the 3rd section 510.Additionally, electronic equipment 200 can be against the 3rd section 510.

In the construction that figure 10 illustrates, keyboard components 504 are used as input equipment to be generated to electronic equipment 300 input or order and change electronic equipment 200 display module 204 (figure 2 illustrates) vision content (if being shown as Dry oblique line).This is partly because folding together with lid 502 of illustrating in the view of amplification and through leading that lid extends Electric fabric 544.

Although not shown in Fig. 10, one or more magnet arrays are placed in the holding member of keyboard components 504 528 lower section, and when attachment members 514 are positioned in or are almost placed in holding member 528, this one or more Magnet array is coupled with the Magnet in first array 532 and the second array 534 of attachment members 514.In this regard, the first array 532 With each Magnet in the second array 534 can include magnetic polarity arrange with holding member 528 under one or more magnetic Magnet coupling in ferrum array (not shown).This allows holding member 528 fixed attachment members 514 and and attachment members simultaneously The electronic equipment 300 of 514 couplings.In certain embodiments, in one or more magnet arrays under holding member 528 The sum of Magnet is equal to the sum of the Magnet in the first array 532 and the second array 534.

In order to be shown more clearly that magnetic couplings related to attachment members 514 and holding member 528 and electronic equipment 200, with reference to Figure 11, it shows the portion through the attachment members 514 and holding member 528 for including alignment Magnet as discussed Divide in the Figure 10 for cutting open with the partial sectional view of the amplification of the part shown in dotted line D.As shown in figure 11, attachment members 514 are pacified Put in holding member 528 and holding member is reserved as the mechanical stopping piece of attachment members 514 and is used.In addition, such as Shown in figure, attachment members 514 can include Magnet 554, and Magnet 554 can be and the first array 214 that can be respectively Magnet Second array 216 (figure 2 illustrates) part Magnet 1102 coupling Magnet the first array 532 or Magnet second The part of array 534 (figure 8 illustrates).Magnetic field line is as shown in the dotted line with arrow.Magnet 554 in attachment members 514 Can with the magnetic couplings of Magnet 1104, Magnet 1104 is the part of the magnet array in keyboard components 504.The magnetic couplings can With holding member 528 attachment members 514 and electronic equipment 200 are maintained in stable position jointly.

As discussed above, when in the position of the folding that auxiliary device figure 10 illustrates so that attachment members 514 When suitably aliging with holding member 528 and fixing in holding member 528, each contact 516 can be used to electrically Be couple to the respective contact 212 of part as main equipment 200.The order of connection illustrates in Figure 12 and Figure 13, Figure 12 The partial sectional view amplified with the identical of the Figure 10 illustrated in every chart diagram 11 in Figure 13 is still through a pair of cooperations Contact, contact 212 (from electronic equipment 200) and contact 516 are (for example, from the contact 516a-516c of auxiliary device 500 In a contact), rather than through alignment Magnet.Specifically, Figure 12 is depicted and separated with contact 516 in contact 212 And therefore the host electronic equipment 200 in the position for not yet coordinating with contact 516.As shown in figure 12, contact 516 is in attachment members Somewhat project on 514 outer surface 1202.

As shown in figure 13, will set when electronic equipment 200 is moved closer to attachment members 514 and Magnet 1102 and 554 When drawing in attachment members 200 for 200, contact 516 is changed into physically and electrically being connected to contact 212.Contact 516 is attached Therefore pushed to elastic lever arm (lever arm in the lever arm 624a-624c discussed referring for example to Fig. 7) and by contact 212 Until close its fully mated position of equipment 200, complete at this (as shown in arrow 1302) in the shell 620 of attachment members The outer surface 1204 of equipment 200 and the outer surface 1202 of attachment members 514 existence at separating surface 1205 in the position of cooperation Reason contact.

Our attention is turned to into the details of contact 212, with reference to Figure 14, it shows the example as contact 212 The embodiment of the contact 312 illustrated in Fig. 4.As shown in figure 14, contact 312 can include the contact exposed from front end face 1404 Part 1402.Contact 312 can also have the back angled portion 1406 that may be coupled to flexible PCB 320.Contact 312 can lead to Cross machining, forging, printing, etching, punching press or otherwise formed.In the other embodiment of the disclosure, contact 312 can To be formed by deep draw process.

Figure 15 shows the plastic insulation 1500 of the one embodiment according to the disclosure.In this example, plastic insulation Body 1500 includes limiting the ring 320 (also showing that in figure 3) for receiving the opening 1502 of contact 312.Afterwards surface 1504 can be with With adhesive coverage and contact 312 can be engaged to plastic insulation 120 at these positions.

Figure 16-18 shows the method for assembling one group of contact according to one embodiment of the disclosure.In figure 16, according to this Disclosed one embodiment, if dry contact 312 can be engaged with flexible PCB 420.Contact on flexible PCB 420 can To be attached to the rear part 1406 of contact 312 by welding, laser welding, electric welding or electric resistance welding or by additive method. In this illustration, flexible PCB 420 can have three parts, and each part is connected to the angled of contact 312 Part 1406.Diode 1610 may be connected to flexible circuit board trace and device housings 310 in flexible PCB 420 Protected with providing ESD (static discharge) between (figure 4 illustrates).In this illustration, as shown in the figure flexible PCB 420 can There is provided bigger flexible for the rear part 1406 that flexible PCB 420 is attached to contact 312 to be divided into three parts Property.Contact 312 can align with the opening 1502 in plastic insulation 1500.

In fig. 17, the cylinder (as illustrated in Figure 16) of the contact 312 including in plastic insulation 1500 can be with equipment Opening 1702 in shell 310 aligns.Plastic insulation 1500 can be glued in place.In figure 18, support 1810 can be It is glued in recess 1802 in device housings 310 in place.

In each embodiment of the disclosure, the different piece of these contact structures and other contact structures can be by various Material is formed.For example, support 1810 and plastic insulation 1500 can be formed by same or different material, such as plastics, LPS or other nonconducting or conductive materials.Contact 312 can be formed by non-corrosive material, such as gold, gold plated copper, gold-plated Nickel, golden nickel alloy and other materials.

In each embodiment of the disclosure, the different piece of these contact structures and other contact structures can be with various Mode is formed.For example, support 1810 and plastic insulation 1500 can use injection moulding or other molding, print or other Technology is formed.Contact 312 can be machined, punching press, casting, forging, printing or formed in a different manner, such as pass through Using deep draw process.Plastic insulation 1500 can be formed around contact 312 using injection moulding.

Figure 19 shows the cross sectional side view of another contact structure 1900 of the contact structure that can be used for Fig. 3.At this In example, contact 1912 may be located in the opening in device housings 310.Plastic insulation 1920 may be located at contact 1912 And device housings 310 between and the outer surface of contact structure 1900 can be substantially connecting across shell, dead ring and contact Continuous, (for the touch of user) smooth and curved surface.Flexible PCB 1920 can connect at rear part 1914 It is connected to contact 1912.Selectable support (not shown) can be used to be secured in place contact 1912 in device housings 310, But in the other embodiment of the disclosure, contact 1912 and insulator 1920 can be glued in place or otherwise fix In place.In each embodiment of the disclosure, various binding agents can be used to be secured in place these structures.Specifically, Adhesive layer can be used to for contact 1912 to be fixed to plastic insulation 1920.Adhesive layer may be utilized for plastic insulation 1920 are fixed to device housings 310.In addition, adhesive layer can be used to fix selectable support in device housings 310 In place.Support member 1910 can provide mechanical support for flexible PCB 1920.Support member 1910 can include ESD diode (as it is following in fig. 22 shown in).

Figure 20 shows the contact structure of Figure 19.In this example, power can be applied in rear surface 2002 and sentence in depth Contact 1912 is formed in punching course.As it was previously stated, contact 1912 can include the rear corner fittings that can coordinate with flexible PCB 1914.In the other embodiment of the disclosure, contact 1912 can be by machining, forging, printing, etching, punching press or with it He is formed mode.

Figure 21 shows the contact of Figure 20 in plastic insulation 2100 of the one embodiment according to the disclosure.At this In example, plastic insulation 2100 can have the opening 2122 for receiving contact 1912.Back contact part 1914 can be from Annular insulator 2120 extends.

Figure 22 shows the contact structure after the assembling according to one embodiment of the disclosure.According to a reality of the disclosure Example is applied, if the (not shown) of dry contact 1912 in insulator 2120 can coordinate with flexible PCB 420.Flexible PCB 420 On contact can be attached to contact 1912 by welding, laser welding, spot welding or electric resistance welding or by additive method Part 1914 (as shown in Figure 19) afterwards.In this example, flexible PCB 420 can have three parts, and each part connects It is connected to the rear part 1914 of contact 1912.Diode 1610 may be connected to the flexible PCB mark in flexible PCB 420 Protected with providing ESD between line and device housings 310.In this example, as shown in the figure flexible PCB 420 can be divided into three Individual part for the rear part 1914 that flexible PCB 420 is attached to contact 1912 so that provide greater flexibility.

Figure 23 shows the cross sectional side view of another contact structure 2300 of the contact structure for being used as Fig. 3.At this In example, contact 2312 may be located in the opening in device housings 310.Plastic insulation 2320 may be located at the He of contact 2312 Between device housings 310, and this it appears that the outer surface of contact structure 2300 can be across shell, insulation from Figure 23 Ring and substantially continuous, (for the touch of user) smooth and curved surface of contact.Bridgeware 2315 can be Afterwards flexible PCB 2320 is connected to into contact 2312 at part 2314.Selectable support (not shown) can be used to touch Point 2312 is secured in place in device housings 310, but in the other embodiment of the disclosure, contact 2312 and insulator 2320 Can be glued in place or be otherwise secured to position.In each embodiment of the disclosure, various binding agents can by with In these structures are secured in place.Specifically, adhesive layer can be used to for contact 2312 to be fixed to plastic insulation 2320. Adhesive layer may be utilized for for plastic insulation 2320 being fixed to device housings 310.In addition, adhesive layer can be used for can The support of selection is secured in place in device housings 310.Support member 2310 can provide mechanical support for flexible PCB 2320. Support member 2310 can include ESD diode (as it is following in fig. 26 shown in).

Figure 24 shows the contact structure of Figure 23.In this example, power can be applied in surface 2402 and sentence in deep-draw Contact 2312 is formed during pressure.As it was previously stated, contact 2312 can include the rear corner fittings that can coordinate with flexible PCB 2314.In the other embodiment of the disclosure, contact 2312 can be by machining, forging, printing, etching, punching press or with it He is formed mode.

Figure 25 shows the contact of Figure 24 in plastic insulation 2500 of the one embodiment according to the disclosure.At this In example, plastic insulation 2500 can have the opening 2522 for receiving contact 2312.Back contact part 2314 can be from Insulator 2500 extends.

Figure 26 shows the contact structure after the assembling according to one embodiment of the disclosure.According to a reality of the disclosure Example is applied, if the (not shown) of dry contact 2312 in insulator 2520 can coordinate with flexible PCB 2320.Flexible PCB Contact on 2320 can be attached to contact by welding, laser welding, spot welding or electric resistance welding or by additive method 2312 rear part 2314 (as shown in Figure 23).Diode 1610 may be connected to the flexibility in flexible PCB 2320 Protected with providing ESD between board traces and device housings 310.In this example, flexible PCB can be along contact 2312 The back side laterally connected up flexible PCB 420 be attached to the motility of bridgeware 2315 to increase.

Figure 27 shows another contact of the one embodiment according to the disclosure.Contact 2712 can be included from front end face The contact portion exposed in 2713.Contact 2712 can also have the back angled portion 2714 that may be coupled to flexible PCB 320. Contact 2712 can pass through machining, forging, printing, etching, punching press or otherwise be formed.Other in the disclosure are implemented In example, contact 2712 can be formed by deep draw process.

Figure 28 shows the contact of Figure 27 in plastic insulation of the one embodiment according to the disclosure.In the example In, plastic insulation 2820 can have the opening 2822 for receiving contact 2712.The (not shown) of back contact part 2714 can To extend from insulator 2820.

The method that Figure 29-34 shows another contact structure of making of the one embodiment according to the disclosure.In Figure 29, Multiple contacts 2712 can be stamped in the end of carrier 2910.Each contact 2712 can include part angled below 2714.Contact can be grit blasted and electroplate.In fig. 30, the part 2911 of carrier 2910 can be separated and be placed on false load On body 3000 so that contact 2712 can have when being placed in device housings with them that the mutual relation having is identical Special mutual relation.In Figure 31, plastic insulation 2820 can be formed around contact 2712.The disclosure other In embodiment, plastic insulation 2820 can in a separate step be formed and is then placed over around contact 2712. In these and other embodiments of the disclosure, as the replacement of a plastic insulation 2820, three plastic insulations or three Insulator can be used, around a contact of each insulator in contact 2712.Plastic insulation 2820 can be by It is gluing or be otherwise fixed to contact 2712.False carrier 30 as one kind 00 can be removed.

In Figure 32, flexible PCB 320 for example can be attached to what is be at an angle of behind contact 2712 by welding Part 2714.Plastic insulation 2820 can make contact 2712 insulate.In fig. 33, contact 2712 can with device housings 310 in Opening 3302 align.Plastic insulation part 2820 can be arranged in the recess 3304 in device housings 310 be adapted to and Can be glued in place.In Figure 34, support can be placed in the recess 3304 of device housings 310 behind contact 2712 So that contact 2712 to be secured in place.Support 3410 can be glued in place further contact 2712 to be fixed to into device housings 310。

Figure 35 shows the contact region 3500 in the device housings according to one embodiment of the disclosure.In the example In, contact region 3500 is included in three contacts 3512 at the surface of device housings 3530.Formed by plastic insulation 3520 Dead ring can surround contact 3512 outward flange and may be located between contact 3512 and device housings 3530.Such as Figure 35 It is shown, contact 3512 and can substantially be put down with the circumferential surface of device housings 3530 by the dead ring that plastic insulation 3520 is formed Together.These surfaces can be bending, and they can be generally flat, or they can have other profiles, and touch Point, dead ring and circumferential outer surface can be integrated into the continuous smooth of equipment therein with reference to form contact region 3500 Outer surface.

Figure 36 shows the cross sectional side view of the contact structure of the contact structure for being used as Figure 35.Equally, contact 3512 may be located in the opening in device housings 3530.Plastic insulation 3520 may be located at contact 3512 and device housings Between 3530.The surface of contact 3512 and the surface of plastic insulation 3520 can substantially put down with the surface of device housings 3530 Together.These surfaces can be bending, it is generally flat or they can have other profiles.Silicone gasket or other sealings 3610 may be located between plastic insulation 3520 and device housings 3530.Silicone gasket 3610 can prevent liquid, steam or Chip is entered in electronic equipment.Contact 3512 can include being soldered or being otherwise attach to flexible PCB The contact portion 3513 of the trace on 3620.The film or binding agent 3630 of thermal activation can be used for flexible PCB 3620 It is fixed to plastic insulation 3520.Contact 3512 can also include that (contact portion 3513 can be in tongue 3515 to tongue 3515 A tongue) and handle 3514.Support 3640 may be located at behind flexible PCB 3620 and can be by contact 3512 It is held in place in device housings 3530.

In each embodiment of the disclosure, the surface of the contact in contact structure is with the surface of the equipment of receiving contact extremely It is few substantially concordantly possibly desired.But the size of all parts of the connector construction each there is the system that is associated with Make tolerance.The accumulation of these tolerances can cause the surface of one or more contacts neat with the uneven surface of equipment.Therefore, this public affairs The embodiment opened can adopt pad or other adjustment members to take into account the error that these tolerances can be generated.Below Shown in the drawings of an example.

Figure 37 shows the cross sectional side view of another contact structure of the contact structure for being used as Figure 35.Equally, touch Point 3512 may be located in the opening in device housings 3530.Plastic insulation 3520 may be located at contact 3512 and device housings Between 3530.The surface of contact 3512 and the surface of plastic insulation 3520 can be substantially concordant with the surface of device housings 3530 Or relative to the recessed limited amount in surface of device housings 3530.The surface of contact 3512, the surface of plastic insulation 3520 With the surface of device housings 3530 can be bending, it is generally flat or they can have other profiles.Silicone gasket Or other sealings 3610 may be located between plastic insulation 3520 and device housings 3530.Silicone gasket 3610 can prevent liquid Body, steam or chip are entered in electronic equipment.Contact 3512 can include being soldered or being otherwise attach to soft The contact portion 3513 of the trace on property circuit board 3620.The film or binding agent 3630 of thermal activation can be used for flexible electrical Road plate 3620 is fixed to plastic insulation 3520.Contact 3512 can also include that (contact portion 3513 can be convex to tongue 3515 A tongue in tongue 3515) and handle 3514.Support 3640 may be located at behind flexible PCB 3620 and can be by Contact 3512 is held in place in device housings 3530.

Equally, the surface of the surface of contact 3512 and plastic insulation 3520 is substantially concordant with the surface of device housings 3530 It is possibly desired.But the size of all parts of the connector construction each there is the manufacturing tolerance that is associated with.This The accumulation of a little tolerances can cause the surface of one or more contacts 3512 not concordant with the surface 3530 of equipment.Therefore, this public affairs The embodiment opened can adopt pad 3710.Pad 3710 can be selected from various sizes of one group of pad.Pad The size of 3710 accumulated tolerances can with the sizes for being chosen so as to compensate different parts in the connector construction so that The surface on the surface and plastic insulation 3520 that obtain contact 3512 can be substantially concordant with the surface of device housings 3530.

Figure 38 shows a part for the contact structure of the one embodiment according to the disclosure.The contact structure part can be with If including by the circular dry contact 3512 of plastic insulation 3520.

Figure 39 is the decomposition view of the contact structure of the one embodiment according to the disclosure.Contact 3512 (shows in Figure 38 Go out) plastic insulation 3520 is may be accommodated in, and may be located in the opening in device housings 3530.Silicone gasket or Other sealings 3610 may be located between plastic insulation 3520 and device housings 3530.Silicone gasket 3610 can prevent liquid Body, steam or chip are entered in electronic equipment.Contact 3512 can include being soldered or being otherwise attach to soft The contact portion 3513 (figure 28 illustrates) of the trace on property circuit board 3620.The film or binding agent (not shown) of thermal activation Can be used to for flexible PCB 3620 to be fixed to plastic insulation 3520.Support or cover 3640 may be located at flexible PCB 3620 can be held in place below and in device housings 3530 contact 3512.It is exhausted that pad 3710 can be placed on plastics Between edge body 3520 and device housings 3530.Pad 3710 can be selected from various sizes of one group of pad.Pad The size of 3710 accumulated tolerances can with the sizes for being chosen so as to compensate different parts in the connector construction so that The surface on the surface and plastic insulation 3520 that obtain contact 3512 can be substantially concordant with the surface of device housings 3530.

Can be formed in various manners including these contact structure parts of contact 3512 and plastic insulation 3520. Example is shown in figure below.

The method that Figure 40-43 shows a part for the manufacture contact structure of the one embodiment according to the disclosure.In figure In 40, contact 3512 can be cast.Casting process can be left in place tongue 3515 and handle 3514.Contact 3512 can be with Formed in the end of carrier 4000.Carrier 4000 can include opening 4010.In Figure 41, carrier 4100 can be provided. Opening 4110 with the edge raised can be stamped in carrier 4100.In Figure 42, carrier 4000 can be fixed to Carrier 4100.Specifically, the edge raised of opening 4110 can be placed in the opening 4010 of carrier 4000.In Figure 43 In, plastic insulation 3520 can be formed around contact 3512.In the other embodiment of the disclosure, plastic insulation 3520 can be formed and be glued or be otherwise fixedly secured to contact 3512 in other positions.Carrier structure can be by Remove while leaving the (not shown) of handle 3514.

Figure 44-47 shows the another kind side of a part for the manufacture contact structure of the one embodiment according to the disclosure Method.In Figure 44, contact 3512 can be cut (turned) or machining.In Figure 45, carrier 4500 can be stamped.Carry Body 4500 can include blade 4510.In figures 4-6 can, contact 3512 can be attached to the blade 4510 of carrier 4500.In Figure 47 In, plastic insulation 3520 can be formed around contact 3512.In the other embodiment of the disclosure, plastic insulation 3520 Can be formed in other positions and and then contact 3512 can be fixed to using binding agent or other technologies.Carrier 4500 can The (not shown) of handle 3514 is left with same being removed simultaneously.

Figure 48-52 shows the another kind side of a part for the manufacture contact structure of the one embodiment according to the disclosure Method.In Figure 48, contact 3512 and first vector 4700 can be cut or machine, forge or otherwise be formed. In Figure 49, Second support 4900 can be stamped or otherwise be formed.Second support 4900 can include blade 4910. In Figure 50, contact 3512 can be attached to Second support by spot welding, laser welding or electric resistance welding or other technologies 4900 blade 4910.In Figure 51, first vector 4700 can be separated, and contact 3512 can with polished, sandblasting and Plating.In Figure 52, plastic insulation 3520 can use external mold (overmold) or other processes shape around contact 3512 Into.In the other embodiment of the disclosure, plastic insulation 3520 can be formed in other positions and may then pass through and make Contact 3512 is fixed to binding agent or other technologies.Carrier 4900 can be removed while leaving handle 3514 and (not show Go out).

Embodiment of the disclosure can provide corrosion resistant contact.These contacts can include top board to match in contact week The color of the device housings for enclosing.The thickness of the top board can between 0.25 to 1.0 microns, between 0.5 to 1.0 microns, Between 0.5 to 0.85 micron, between 0.75 to 0.85 micron, or it can have another thickness.In the exposed of contact At surface, Gold plated Layer can be in the lower section of top board.In the other parts of contact, top board can be omitted and Gold plated Layer can be with It is ground floor.The thickness of this layer can be between 0.01 to 0.5 micron or between 0.05 and 0.1 micron, or it can be with With another thickness.Layers of copper of the thickness in 1.0,2.0,3.0 or 4.0 microns of scope can be used.Selectable palladium layers can To be used in the top of layers of copper.The layer can have between 0.15 and 2.0 micron, between 1.0 and 1.5 microns, 1.0 And the thickness between 2.0 microns, or it can have another thickness.Selectable stannum layers of copper can be between layer gold and layers of copper Used in contact can be soldered to the region of flexible PCB.The thickness of the selectable stannum layers of copper can be 4,5 and 6 Between micron, such as thickness is between 4 and 6 microns or between 5 and 6 microns, but it can have the reality with the disclosure Apply other consistent thickness of example.Another embodiment of the present disclosure can include thickness 1.0,2.0,1.0-2.0,2.0-3.0, The basic unit of the copper in 3.0 or 4.0 micrometer ranges.Palladium layers can be used in the top of layers of copper.The layer can have in 0.15 He Thickness between 2.0 microns, between 1.0 and 1.5 microns, between 1.0 and 2.0 microns, or it can have another thickness.Gold Flash can be placed on the layer.This can be subsequently top board to match the color of the device housings around contact.The top The thickness of plate can be between 0.25 to 1.0 microns, between 0.5 to 1.0 microns, between 0.5 to 0.85 micron, 0.75 to 0.85 Between micron, or it can have another thickness.The other parts of contact can have layers of copper, at 0.1,0.2 or 0.3 micron In the range of relatively thin palladium layers can be used, be followed by golden flash.

In each embodiment of the disclosure, the different piece of these contact structures and other contact structures can be by various Material is formed.For example, support 3640 and plastic insulation 1720 can be formed by same or different material, such as plastics, LPS or other nonconducting or conductive materials.Contact 1712 can be formed by non-corrosive material, such as gold, gold plated copper, gold-plated Nickel, golden nickel alloy and other materials.In addition, in each embodiment of the disclosure, these contact structures and other contact structures Different piece can be formed in various manners.For example, support 3640 and plastic insulation 3520 can use injection moulding Or other molding, printing or other technologies are formed.Contact 3512 can be machined, punching press, casting, forging, printing or Formed in a different manner.Plastic insulation 3520 can be formed around contact 3512 using injection moulding or other technologies.

Description above has used for illustrative purposes particular term to provide the deep reason to described embodiment Solution.However, those skilled in the art will be apparent that, the described embodiment of practice does not need concrete details. Therefore, the description before specific embodiments described herein is in order at the purpose of illustration and description and is given.They are simultaneously It is not intended to be limited to disclosed accurate form in detail or by embodiment.For those skilled in the art will be aobvious and easy See, in view of teachings above many modifications and variations are possible.

Claims

1. a kind of electronic equipment, it is characterised in that the electronic equipment includes：

Device housings with outer surface；

The outer surface and the contact region with first end and second end are positioned in, the contact region has It is disposed in multiple contacts between the first end and the second end and substantially concordant with the outer surface；

In the alignment member of the inside the shell, the alignment member includes being positioned in the on the opposite side of the contact region One Magnet and the second Magnet, first Magnet is placed and described second adjacent to the first end of the contact region Magnet is placed adjacent to the second end of the contact region.

2. electronic equipment as claimed in claim 1, it is characterised in that：

The device housings are included in the conductive material in the contact region and including being formed through the conductive material Opening；

The electronic equipment also includes being placed insulator in said opening, and the insulator ring is in the plurality of contact A contact so as to by the contact and the device housings electrical isolation.

3. electronic equipment as claimed in claim 1, it is characterised in that：

The device housings be included in the conductive material in the contact region and including quantitatively with the plurality of contact The corresponding multiple openings formed through the conductive material；

Each contact in the plurality of contact is placed in an opening in said opening in the plurality of opening；With And

The electronic equipment also includes the insulator in each opening being positioned in the plurality of opening, and the insulator exists In the opening ring is formed so as to by the contact and the device housings electrical isolation around the contact.

4. electronic equipment as claimed in claim 3, it is characterised in that the outer surface of the shell and the plurality of touch The outer surface of each dead ring in the outer surface and dead ring of each contact in point combines to form continuous smooth table Face.

5. electronic equipment as claimed in claim 3, it is characterised in that in the outer surface and multiple dead rings of the shell In each dead ring between without between gap and the dead ring in each contact and around it without gap.

6. electronic equipment as claimed in claim 1, it is characterised in that the device housings have curved in the contact region Bent outer surface, and each contact in the plurality of contact has and the outer surface of the bending at outer contact surface The corresponding curvature of curvature.

7. electronic equipment as claimed in claim 3, it is characterised in that be positioned in each opening in the plurality of opening The insulator formed by plastics.

8. the electronic equipment as described in any one claim in claim 1-7, it is characterised in that the plurality of contact It is included in the multiple circular contacts being separated from each other in single row.

9. the electronic equipment as described in any one claim in claim 1-7, it is characterised in that the device housings Form cavity and the electronic equipment also includes that the battery, processor and the computer-readable that are positioned in the cavity are stored Device.

10. electronic equipment as claimed in claim 9, it is characterised in that the electronic equipment also includes being coupled to described outer The transparent cover glass of shell and the neighbouring cover glass are positioned in the display in the cavity.

11. electronic equipments as claimed in claim 10, it is characterised in that the display includes touch screen.

12. electronic equipments as claimed in claim 11, it is characterised in that the electronic equipment includes tablet PC.

13. electronic equipments as described in any one claim in claim 1-7, it is characterised in that the alignment structure Part includes being positioned in first array and the second array of Magnet on the opposite side of the contact region, and the first of the Magnet Array be placed adjacent to the first end of the contact region and the Magnet the second array adjacent to the contact regions The second end in domain is placed.

14. electronic equipments as described in any one claim in claim 3-7, it is characterised in that the plurality of to touch Described each contact in point 0.5 millimeter or is less than from the outer surface of the contact region around each contact is recessed 0.5 millimeter.

15. a kind of electronic equipment, it is characterised in that the electronic equipment includes：

The device housings of cavity are formed, the device housings have outer surface；

The processor and computer-readable memory being positioned in the cavity；

It is coupled to the transparent cover glass of the shell；

The neighbouring cover glass is positioned in the display in the cavity；

It is positioned in the inside the shell and is operably coupled to the battery of the processor and the display；

It is positioned in the outer surface and the contact region with first end and second end, the contact region tool Have：(1) the multiple circular contacts being separated from each other in single row between the first end and the second end, it is described Each circular contact in multiple circular contacts be positioned in through device housings formed opening in and with contact The flush with outer surface of the device housings in region or recessed from the outer surface of the device housings in contact region Outer surface less than one millimeter；(2) insulator being positioned in each opening in the plurality of opening, the insulator exists In the opening ring is formed so as to the contact be isolated with the device housings around the contact；The institute of wherein described shell State outer surface and the outer surface of the plurality of circular contact and the outer surface of multiple insulator rings combines to be formed continuously Smooth surface；

In the alignment member of the inside the shell, the alignment member includes the magnetic being positioned on the opposite side of the contact region First array and the second array of ferrum, the first array of the Magnet is placed adjacent to the first end of the contact region And the second array of the Magnet is placed adjacent to the second end of the contact region.

16. electronic equipments as claimed in claim 15, it is characterised in that：

That the device housings are somewhat rectangular in shape and including four side surfaces, four side surfaces are around saturating Bright cover glass and the upper surface from the electronic equipment for being limited by the transparent cover glass at least in part prolongs Back surfaces are reached, each side surface in four side surfaces has the outer surface of bending；And

The contact region is positioned in the part of the bending of in the side surface side surface.

17. a kind of electronic equipment, it is characterised in that the electronic equipment includes：

Device housings with outer surface；

The outer surface and the contact region with first end and second end are positioned in, the contact region has It is disposed at least one contact between the first end and the second end and substantially concordant with the outer surface；

In the alignment member of the inside the shell, the alignment member is included in the device housings and is positioned in the contact regions In domain or adjacent at least one Magnet of the contact region.

18. electronic equipments as claimed in claim 17, it is characterised in that：

The electronic equipment also includes being placed insulator in said opening, and the insulator ring is touched around described at least one Put so as at least one contact be isolated with the device housings.

19. electronic equipments as claimed in claim 18, it is characterised in that the outer surface of the shell and it is described at least The outer surface of the outer surface of one contact and the insulator combines to form continuous smooth surface.

20. electronic equipments as claimed in claim 19, it is characterised in that the device housings have in the contact region The outer surface of bending and at least one contact have the curvature phase with the outer surface of the bending at outer contact surface Corresponding curvature.