CN206161599U - Piezoelectricity supersound normal probe - Google Patents

Piezoelectricity supersound normal probe Download PDF

Info

Publication number
CN206161599U
CN206161599U CN201620961888.XU CN201620961888U CN206161599U CN 206161599 U CN206161599 U CN 206161599U CN 201620961888 U CN201620961888 U CN 201620961888U CN 206161599 U CN206161599 U CN 206161599U
Authority
CN
China
Prior art keywords
wafer
piezoelectric
ultrasonic
probe
wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201620961888.XU
Other languages
Chinese (zh)
Inventor
陈秋颖
廉国选
吴樵
毛捷
安志武
宋波
闫冉
徐峥
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Institute of Acoustics CAS
Original Assignee
Institute of Acoustics CAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Institute of Acoustics CAS filed Critical Institute of Acoustics CAS
Priority to CN201620961888.XU priority Critical patent/CN206161599U/en
Application granted granted Critical
Publication of CN206161599U publication Critical patent/CN206161599U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Transducers For Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)

Abstract

The utility model relates to a piezoelectricity supersound normal probe, piezoelectricity supersound normal probe comprises compressional wave normal probe and shear wave normal probe, piezoelectricity supersound normal probe includes matching layer (1), piezoelectricity wafer (2), damping piece (3), shell (4) and probe connector (5). The utility model discloses a longitudinal and transverse wave integral type structure on the same ultrasonic probe, can directly be launched and receive the compressional wave signal promptly, also can directly launch and receive the shear wave signal, and wherein, the mode conversion mode that the energy is weak, the clutter is many produces except the shear wave, the two can send out receipts simultaneously, but also receipts are sent out in the timesharing, the frequency of the two can be the same, also can be different, the sound field distribution of compressional wave and shear wave is controllable adjustable to satisfy the special detection demand in different fields. The utility model discloses a longitudinal and transverse wave's integration need not to change longitudinal wave probe and shear wave probe at the in -service use in -process, and the top potbellied is prompt using, simultaneously the utility model discloses has high accuracy and good stability.

Description

Piezoelectric ultrasonic straight probe
Technical Field
The invention relates to ultrasonic nondestructive detection, in particular to an integrated piezoelectric ultrasonic straight probe capable of vertically transmitting and receiving ultrasonic longitudinal waves and ultrasonic transverse waves.
Background
At present, in the field of ultrasonic nondestructive testing, longitudinal waves and transverse waves are the most commonly used test waveforms, and an ultrasonic probe is the core component for transmitting and receiving the test waveforms. The traditional ultrasonic probe can only generate longitudinal waves, or generate transverse waves by means of mode conversion of the longitudinal waves at an interface, and the transverse waves are obliquely incident on the surface of a workpiece. Because the probe can not realize the integration of longitudinal waves and transverse waves, the ultrasonic longitudinal waves and transverse waves can not be vertically transmitted and received under the same coupling condition, and the detection requirements in some fields can not be met.
Disclosure of Invention
The invention aims to solve the problems that the conventional piezoelectric ultrasonic straight probe cannot vertically transmit and receive ultrasonic longitudinal waves and ultrasonic transverse waves under the same coupling condition in the actual use process, cannot realize integration of the longitudinal waves and the ultrasonic transverse waves, and cannot meet the detection requirements of some fields.
In order to achieve the above object, the present invention provides a piezoelectric ultrasonic straight probe, which is characterized in that the piezoelectric ultrasonic straight probe mainly comprises a longitudinal wave straight probe and a transverse wave straight probe, and the longitudinal wave straight probe and the transverse wave straight probe respectively comprise a matching layer, a piezoelectric wafer, a damping block, a housing and a probe connector.
And the matching layer is used for realizing acoustic impedance matching between the ultrasonic straight probe and the workpiece, improving the utilization rate of the sound wave energy radiated by the probe, protecting the piezoelectric wafer and avoiding pollution or damage in the working environment. Two of the key factors that determine the performance of the matching layer are the characteristic acoustic impedance and thickness.
The piezoelectric wafer is attached to the matching layer and used for converting electric energy into sound energy; when the piezoelectric wafer transmits ultrasonic waves, the piezoelectric wafer generates vibration under the excitation of electric pulses and radiates the ultrasonic waves; when the piezoelectric wafer receives ultrasonic waves, when the received ultrasonic waves act on the piezoelectric wafer, deformation caused by forced vibration of the piezoelectric wafer is converted into corresponding electric signals.
The damping block is attached to the piezoelectric wafer and used for absorbing ultrasonic waves emitted by the piezoelectric wafer so as to prevent the excessive noise from interfering with signal acquisition of the piezoelectric ultrasonic straight probe; and the damping function is generated, so that the piezoelectric ultrasonic straight probe stops vibrating as soon as possible after transmitting ultrasonic pulses.
The connector is used for leading out the positive and negative electrodes of the piezoelectric wafer and is used for signal connection between the piezoelectric probe and equipment.
The piezoelectric wafer adopts a longitudinal wave wafer and a transverse wave wafer, the longitudinal wave wafer transmits and receives ultrasonic longitudinal waves, and the transverse wave wafer transmits and receives ultrasonic transverse waves. The longitudinal wave wafer and the transverse wave wafer are combined according to the detection requirement. The positions of the longitudinal wave wafer and the transverse wave wafer combined according to the detection requirement comprise a left-right parallel type, a front-back coaxial type and an embedded inclusion type, and the sound field distribution forms corresponding to the combination forms of the longitudinal wave wafer and the transverse wave wafer are a left-right parallel type sound field, a front-back coaxial type sound field and an embedded inclusion type sound field, but the sound field distribution forms are not limited to the left-right parallel type sound field, the front-back coaxial type sound field and the embedded inclusion type sound field.
The probe can vertically transmit and receive ultrasonic longitudinal waves and ultrasonic transverse waves, controls the sound field distribution of the ultrasonic longitudinal waves and the ultrasonic transverse waves in a detected workpiece as required, and comprises a left-right parallel type, a front-back coaxial type, an embedded containing type and other distribution forms, wherein the longitudinal wave part and the transverse wave part are mutually independent of two channels, can be excited in a time-sharing manner and simultaneously, and meets the unconventional detection requirements of certain special detection fields.
Some of these special fields include the field of stress measurement, where accurate measurement of the longitudinal and transverse acoustic velocities of materials is required. At present, longitudinal wave probes and transverse wave probes are used for measurement respectively, and due to the fact that the probes need to be replaced, coupling effects are different, and large measurement errors are caused. In order to solve similar problems, the invention provides a piezoelectric ultrasonic straight probe which integrates a longitudinal wave probe and a transverse wave probe into a whole.
In addition, in the nonlinear acoustic field, to analyze the nonlinear effect of material defects, wherein a scattering sound field after longitudinal waves and transverse waves act on microcracks of a material, a longitudinal and transverse wave integrated piezoelectric ultrasonic straight probe is needed, especially a front and back coaxial piezoelectric ultrasonic straight probe, which can control excitation time and phase to perform acoustic nonlinear research, thereby further improving accuracy.
The invention has the advantages that the ultrasonic probe is of a longitudinal wave and transverse wave integrated structure, namely, on the same ultrasonic probe, longitudinal wave signals can be transmitted and received, and transverse wave signals can also be directly transmitted and received, wherein, transverse waves are not generated in a mode conversion mode with weak energy and more clutter; the two can be transmitted and received simultaneously or in time-sharing manner; the frequencies of the two can be the same or different; the sound field distribution of longitudinal waves and transverse waves is controllable and adjustable, so that special detection requirements in different fields are met. The invention realizes the integration of longitudinal wave and transverse wave, does not need to replace a longitudinal wave probe and a transverse wave probe in the actual use process, is convenient and fast to use, and has high accuracy and good stability.
Drawings
Fig. 1 is a schematic structural diagram of a piezoelectric ultrasonic straight probe according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a left-right parallel piezoelectric ultrasonic straight probe according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a front-back coaxial piezoelectric ultrasonic straight probe according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of an embedded piezoelectric ultrasonic straight probe according to an embodiment of the present invention.
Detailed Description
The technical solution of the present invention is further described in detail by the accompanying drawings and embodiments.
Fig. 1 is a schematic structural diagram of a piezoelectric ultrasonic straight probe according to an embodiment of the present invention. As shown in fig. 1, the piezoelectric ultrasonic straight probe is composed of a longitudinal wave straight probe and a transverse wave straight probe, wherein the longitudinal wave straight probe and the transverse wave straight probe respectively comprise a matching layer 1, a piezoelectric wafer 2, a damping block 3, a shell 4 and a probe connector 5; wherein,
and the matching layer 1 is used for realizing acoustic impedance matching between the ultrasonic straight probe and a workpiece, improving the utilization rate of sound wave energy radiated by the probe, protecting the piezoelectric wafer and avoiding pollution or damage in a working environment. Two of the key factors that determine the performance of the matching layer are the characteristic acoustic impedance and thickness.
The piezoelectric wafer 2 is attached to the matching layer 1 and used for converting electric energy into sound energy; when the piezoelectric wafer 2 transmits ultrasonic waves, the piezoelectric wafer 2 vibrates under the excitation of electric pulses to radiate the ultrasonic waves; when the piezoelectric wafer 2 receives the ultrasonic wave, when the received ultrasonic wave acts on the piezoelectric wafer 2, the deformation caused by the forced vibration of the piezoelectric wafer 2 is converted into a corresponding electric signal.
The damping block 3 is attached to the piezoelectric wafer 2 and used for absorbing ultrasonic waves emitted by the piezoelectric wafer 2 so as to prevent the excessive noise from interfering with signal acquisition of the piezoelectric ultrasonic straight probe; and the damping function is generated, so that the piezoelectric ultrasonic straight probe stops vibrating as soon as possible after transmitting ultrasonic pulses. In addition, the damping block 3 of the probe does not spread sound waves, only plays a role in absorbing back stray sound waves, reduces noise and improves the signal-to-noise ratio of the probe.
The function of the housing 4 is to protect the internal components and to enclose the core.
The connector 5 can lead out the positive electrode and the negative electrode of the piezoelectric wafer 2 and is used for signal connection between the piezoelectric ultrasonic straight probe and external equipment.
The piezoelectric ultrasonic straight probe can transmit ultrasonic waves and receive the ultrasonic waves. Wherein, transmitting ultrasonic wave: the piezoelectric wafer 2 of the probe is connected with electricity through the connector 5, the piezoelectric wafer 2 generates stretching vibration under the action of electric excitation, the vibration is transmitted to the matching layer 1 and a workpiece according to the inverse piezoelectric effect, namely the ultrasonic wave, and the vibration can be divided into longitudinal wave and transverse wave according to the relation between the vibration direction and the transmission direction.
Receiving ultrasonic waves: the reflected or scattered ultrasonic wave from the inside of the workpiece is transmitted to the matching layer 1 and then transmitted to the surface of the piezoelectric wafer 2, and by utilizing the positive piezoelectric effect, the surface of the piezoelectric wafer 2 generates an electric signal related to the vibration, and then the electric signal enters a circuit system through the connector 5 to be received.
The piezoelectric wafer 2 employs a longitudinal wave wafer and a transverse wave wafer, wherein the transverse wave wafer generates a transverse ultrasonic wave. The longitudinal wave wafer transmits and receives ultrasonic longitudinal waves, and the transverse wave wafer transmits and receives ultrasonic transverse waves. The longitudinal wave wafer and the transverse wave wafer are combined according to the detection requirement.
For a longitudinal wave straight probe, longitudinal waves can be vertically emitted and incident to a tested sample by utilizing the thickness vibration mode of a 1-3 type piezoelectric composite material wafer polarized in the thickness direction. For the transverse wave straight probe, the shear vibration mode of the 2-2 type piezoelectric composite wafer is utilized, the vibration direction of the mode is vertical to the propagation direction of the acoustic wave, and the transverse wave can be directly and vertically incident when the transverse wave straight probe is contacted with a workpiece to be detected. The combination form of the longitudinal wave portion and the transverse wave portion is related to the required sound field distribution inside the workpiece to be detected, and specific implementation forms may include a left-right parallel type, a front-back coaxial type, an embedded inclusion type, and the like. In each distribution form of the ultrasonic probe, the mutual positions of the longitudinal wave wafer and the transverse wave wafer can be interchanged according to needs, and the sound insulation material reduces the vibration crosstalk between the longitudinal wave wafer and the transverse wave wafer. The present invention includes, but is not limited to, the above three combinations. The concrete form is shown in figures 2-4.
Fig. 2 is a schematic structural diagram of a left-right parallel piezoelectric ultrasonic straight probe according to an embodiment of the present invention. As shown in fig. 2, the left-right parallel type piezoelectric ultrasonic straight probe includes: matching layer 1, longitudinal wave wafer 2 ', transverse wave wafer 2', damping block 3, housing 4, sound insulating material 6 and electrode lead 7. In the left-right parallel type piezoelectric ultrasonic straight probe, the structure is that the probe is divided into two parts with a left-right symmetrical structure by a sound insulation material 6, wherein one part is provided with a matching layer 1, a longitudinal wave wafer 2', a damping block 3 and an electrode lead 7 in sequence according to the direction of receiving ultrasonic waves; the matching layer 1, the transverse wave chip 2', the damping block 3, and the electrode lead 7 are placed in this order in the direction of receiving ultrasonic waves in the other part.
The longitudinal wave wafer adopts a 1-3 type piezoelectric composite material wafer, and the transverse wave wafer adopts a 2-2 type piezoelectric composite material wafer, and both can be vertical to the surface of a workpiece to directly transmit and receive longitudinal waves and transverse waves. The working frequencies of the longitudinal wave and the transverse wave can be the same or different. The probe connector is in a left-right parallel mode, and at least has 3 cores, wherein 2 cores are respectively connected with the positive electrodes of the longitudinal wave wafer and the transverse wave wafer, and 1 core is connected with the negative electrodes of the longitudinal wave wafer and the transverse wave wafer.
The left-right parallel type piezoelectric ultrasonic straight probe can transmit ultrasonic waves and receive the ultrasonic waves. The longitudinal wave part and the transverse wave part can respectively realize the transmission and the reception of the longitudinal wave and the transverse wave.
The process of transmitting ultrasonic transverse waves comprises the following steps: the transverse wave wafer 2 'of the probe is connected with electricity through the connector 5, the transverse wave wafer 2' generates shearing vibration under the action of electric excitation, the vibration is transmitted in the matching layer 1 and the workpiece according to the inverse piezoelectric effect, and the ultrasonic transverse wave is obtained because the vibration direction is vertical to the transmission direction. In the same way, the process of transmitting the ultrasonic longitudinal wave comprises the following steps: the longitudinal wave chip 2 'of the probe is connected with electricity through the connector 5, the longitudinal wave chip 2' generates stretching vibration under the action of electric excitation, the vibration is transmitted in the matching layer 1 and the workpiece according to the inverse piezoelectric effect, and the ultrasonic longitudinal wave is obtained because the vibration direction is the same as the transmission direction.
Receiving ultrasonic transverse waves: the reflected or scattered ultrasonic transverse wave from the inside of the workpiece is transmitted to the matching layer 1 and then transmitted to the surface of the transverse wave wafer 2 ", and by utilizing the positive piezoelectric effect, the surface of the transverse wave wafer 2" generates an electric signal related to the vibration, and then the electric signal enters a circuit system through the connector 5 for signal receiving. Similarly, receiving ultrasonic longitudinal waves: the reflected or scattered ultrasonic longitudinal wave from the inside of the workpiece is transmitted to the matching layer 1 and then to the surface of the longitudinal wave chip 2 ', and by utilizing the positive piezoelectric effect, the surface of the longitudinal wave chip 2' generates an electric signal related to the vibration, and then the electric signal enters a circuit system through the connector 5 for signal reception.
The parameters of the matching layer and the damping block of longitudinal and transverse waves can be respectively designed, so that the optimal performance requirements of the longitudinal and transverse waves are respectively met, the middle part is subjected to vibration isolation by using a sound insulation material, the mutual vibration crosstalk is reduced, the integral signal-to-noise ratio is improved, and the shell is uniformly packaged and provided with a connector.
The left and right parallel piezoelectric ultrasonic straight probe can generate parallel longitudinal and transverse wave sound fields, for example, in bolt stress measurement, two sound fields act in a bolt simultaneously or in a time-sharing manner to measure longitudinal and transverse wave sound velocities of the bolt respectively, and the accuracy and reliability of measurement under the same coupling condition can be ensured.
FIG. 3 is a schematic diagram of a front-back coaxial piezoelectric ultrasonic straight probe according to an embodiment of the present invention; as shown in fig. 3, the front-rear coaxial piezoelectric ultrasonic straight probe includes: matching layer 1, longitudinal wave chip 2 ', transverse wave chip 2', damping block 3, housing 4, connector 5 and electrode lead 7. In a front-rear coaxial piezoelectric ultrasonic straight probe, a matching layer 1, a transverse wave wafer 2 ', a matching layer 1, a longitudinal wave wafer 2', a damping block 3, and an electrode lead 7 are placed in this order in the direction of receiving ultrasonic waves.
The front and back coaxial piezoelectric ultrasonic straight probe can transmit ultrasonic waves and receive the ultrasonic waves. The longitudinal wave part and the transverse wave part can respectively realize the transmission and the reception of the longitudinal wave and the transverse wave.
Transmitting ultrasonic transverse waves: the transverse wave wafer 2 'of the probe is connected with electricity through the connector 5, the transverse wave wafer 2' generates shearing vibration under the action of electric excitation, and the vibration is transmitted to the matching layer 1 and the workpiece according to the inverse piezoelectric effect, namely ultrasonic transverse wave. Similarly, transmitting ultrasonic longitudinal waves: the longitudinal wave chip 2 'of the probe is connected with electricity through the connector 5, the longitudinal wave chip 2' generates stretching vibration under the action of electric excitation, and the vibration is transmitted in the matching layer 1 and the workpiece according to the inverse piezoelectric effect, namely, ultrasonic longitudinal wave.
Receiving ultrasonic transverse waves: the reflected or scattered ultrasonic transverse wave from the inside of the workpiece is transmitted to the matching layer 1 and then transmitted to the surface of the transverse wave wafer 2 ", and by utilizing the positive piezoelectric effect, the surface of the transverse wave wafer 2" generates an electric signal related to the vibration, and then the electric signal enters a circuit system through the connector 5 for signal receiving. Similarly, receiving ultrasonic longitudinal waves: the reflected or scattered ultrasonic longitudinal wave from the inside of the workpiece is transmitted to the matching layer 1 and then transmitted to the surface of the longitudinal wave chip 2 ', and by utilizing the positive piezoelectric effect, the surface of the longitudinal wave chip 2' generates an electric signal related to the vibration, and then the electric signal enters a circuit system through the connector 5 for signal receiving.
The wafer distribution of the front and rear coaxial ultrasonic straight probe can be that a longitudinal wave wafer is in front and a transverse wave wafer is behind, or a transverse wave wafer is in front and a longitudinal wave wafer is behind, and the radiated sound field has the coaxial distribution effect in front and rear, so that the acoustic and mechanical properties of the material can be calculated by measuring the sound velocity of the longitudinal and transverse waves of the material, the interaction of the longitudinal and transverse waves in the material can be researched by controlling the excitation time of the longitudinal and transverse waves according to the sound velocity difference of the longitudinal and transverse waves, and the nonlinear acoustic research has research value.
FIG. 4 is a schematic diagram of an embedded piezoelectric ultrasonic straight probe according to an embodiment of the present invention; as shown in fig. 4, the embedded piezoelectric ultrasonic straight probe includes: matching layer 1, longitudinal wave chip 2 ', transverse wave chip 2', damping block 3, housing 4, connector 5, sound insulating material 6 and electrode lead 7. In the embedded contained piezoelectric ultrasonic straight probe, the structure is that a matching layer 1, a transverse wave wafer 2 ', a sound insulation material 6, a longitudinal wave wafer 2', a damping block 3 and an electrode lead 7 are sequentially arranged according to the direction of receiving ultrasonic waves. Wherein a transverse wave wafer 2 ' is arranged at the center of the second layer, longitudinal wave wafers 2 ' are respectively arranged at two sides of the transverse wave wafer 2 ', and two sound insulation materials 6 are respectively arranged between the transverse wave wafer 2 ' and the longitudinal wave wafer 2 '.
The embedded piezoelectric ultrasonic straight probe can transmit ultrasonic waves and receive the ultrasonic waves. The longitudinal wave part and the transverse wave part can respectively realize the transmission and the reception of the longitudinal wave and the transverse wave.
Transmitting ultrasonic transverse waves: the transverse wave wafer 2 'of the probe is connected with electricity through the connector 5, the transverse wave wafer 2' generates shearing vibration under the action of electric excitation, and the vibration is transmitted to the matching layer 1 and the workpiece according to the inverse piezoelectric effect, namely ultrasonic transverse wave. Similarly, transmitting ultrasonic longitudinal waves: the longitudinal wave chip 2 'of the probe is connected with electricity through the connector 5, the longitudinal wave chip 2' generates stretching vibration under the action of electric excitation, and the vibration is transmitted in the matching layer 1 and the workpiece according to the inverse piezoelectric effect, namely, ultrasonic longitudinal wave.
Receiving ultrasonic transverse waves: the reflected or scattered ultrasonic transverse wave from the inside of the workpiece is transmitted to the matching layer 1 and then transmitted to the surface of the transverse wave wafer 2 ", and by utilizing the positive piezoelectric effect, the surface of the transverse wave wafer 2" generates an electric signal related to the vibration, and then the electric signal enters a circuit system through the connector 5 for signal receiving. Similarly, receiving ultrasonic longitudinal waves: the reflected or scattered ultrasonic longitudinal wave from the inside of the workpiece is transmitted to the matching layer 1 and then to the surface of the longitudinal wave chip 2 ', and by utilizing the positive piezoelectric effect, the surface of the longitudinal wave chip 2' generates an electric signal related to the vibration, and then the electric signal enters a circuit system through the connector 5 for signal reception.
The longitudinal wave and transverse wave wafer is embedded, the longitudinal wave wafer is in the center, the transverse wave wafer is on the outer ring, or the transverse wave wafer is in the center and the longitudinal wave wafer is on the outer ring, so that the sound field distribution embedded in the wafer is formed, the longitudinal wave and transverse wave interference is also carried out on a specific detection object, and the application field has research value in nonlinear acoustic research.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are merely exemplary embodiments of the present invention, and are not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims (8)

1. A piezoelectric ultrasonic straight probe comprises a shell (4), and is characterized in that the piezoelectric ultrasonic straight probe mainly comprises a longitudinal wave straight probe and a transverse wave straight probe, wherein the longitudinal wave straight probe and the transverse wave straight probe respectively comprise a matching layer (1), a piezoelectric wafer (2), a damping block (3) and a probe connector (5); wherein,
the matching layer (1) is used for realizing acoustic impedance matching between the ultrasonic straight probe and a workpiece, improving the utilization rate of sound wave energy radiated by the probe and protecting the piezoelectric wafer (2);
the piezoelectric wafer (2) is attached to the matching layer (1) and used for converting electric energy into sound energy; when the piezoelectric wafer (2) transmits ultrasonic waves, the piezoelectric wafer (2) generates vibration under the excitation of electric pulses and radiates the ultrasonic waves; when the piezoelectric wafer (2) receives ultrasonic waves, when the received ultrasonic waves act on the piezoelectric wafer (2), deformation caused by forced vibration of the piezoelectric wafer (2) is converted into corresponding electric signals;
the damping block (3) is attached to the piezoelectric wafer (2) and used for absorbing ultrasonic waves emitted by the piezoelectric wafer (2) so as to prevent the ultrasonic waves from interfering with signal acquisition of the piezoelectric ultrasonic straight probe; generating a damping effect to stop the vibration as soon as possible after the piezoelectric ultrasonic straight probe transmits the ultrasonic pulse;
the connector (5) is used for signal connection between the piezoelectric ultrasonic straight probe and external equipment.
2. The piezoelectric ultrasonic straight probe according to claim 1, wherein the piezoelectric wafer (2) is composed of a longitudinal wave wafer and a transverse wave wafer for generating ultrasonic transverse waves of shear vibration.
3. The piezoelectric ultrasonic direct probe according to claim 2, wherein the shear wave wafer is a transmitting-receiving piezoelectric wafer, the longitudinal wave wafer is a transmitting-receiving wafer, and the positions of the longitudinal wave wafer and the shear wave wafer are combined according to detection requirements.
4. The piezoelectric ultrasonic direct probe according to claim 3, wherein the positions of the longitudinal wave wafer and the transverse wave wafer which are combined according to the detection requirement comprise a left-right parallel type, a front-back coaxial type and an embedded inclusion type.
5. The piezoelectric ultrasonic straight probe according to claim 4, wherein the left-right parallel equation is: the piezoelectric ultrasonic straight probe is divided into two parts of a left-right symmetrical structure by a sound insulation material (6), wherein the matching layer (1), the longitudinal wave wafer (2'), the damping block (3) and the electrode lead (7) are sequentially placed on the first part according to the direction of receiving ultrasonic waves; the second part is provided with the matching layer (1), the transverse wave wafer (2'), the damping block (3) and the electrode lead (7) in sequence according to the direction of receiving ultrasonic waves.
6. The piezoelectric ultrasonic straight probe according to claim 4, wherein the front-back coaxial type is: the piezoelectric ultrasonic straight probe is sequentially provided with the matching layer (1), the transverse wave wafer (2 '), the matching layer (1), the longitudinal wave wafer (2'), the damping block (3) and an electrode lead (7) according to the direction of receiving ultrasonic waves.
7. The piezoelectric ultrasonic direct probe of claim 4, the inline inclusion being of the formula: the piezoelectric ultrasonic straight probe is characterized in that the matching layer (1), the transverse wave wafer (2 '), the sound insulation material (6), the longitudinal wave wafer (2'), the damping block (3) and the electrode lead (7) are sequentially arranged in the direction of receiving ultrasonic waves.
8. The piezoelectric ultrasonic direct probe of claim 4 or 7, the inline inclusion formula being: the transverse wave wafer (2 '), the sound insulating material (6), and the longitudinal wave wafer (2 '), are arranged at the center of the layer of the transverse wave wafer (2 '), the longitudinal wave wafer (2 ') is arranged at two sides of the transverse wave wafer (2 '), and two sound insulating materials (6) are arranged between the transverse wave wafer (2 ') and the longitudinal wave wafer (2 ').
CN201620961888.XU 2016-08-26 2016-08-26 Piezoelectricity supersound normal probe Expired - Fee Related CN206161599U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620961888.XU CN206161599U (en) 2016-08-26 2016-08-26 Piezoelectricity supersound normal probe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620961888.XU CN206161599U (en) 2016-08-26 2016-08-26 Piezoelectricity supersound normal probe

Publications (1)

Publication Number Publication Date
CN206161599U true CN206161599U (en) 2017-05-10

Family

ID=58649691

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201620961888.XU Expired - Fee Related CN206161599U (en) 2016-08-26 2016-08-26 Piezoelectricity supersound normal probe

Country Status (1)

Country Link
CN (1) CN206161599U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106353408A (en) * 2016-08-26 2017-01-25 中国科学院声学研究所 Piezoelectric ultrasonic straight probe
CN107192601A (en) * 2017-05-23 2017-09-22 中国科学院重庆绿色智能技术研究院 The synchronous detecting system of a kind of rock micro-mechanical model and sound mechanics
CN108008017A (en) * 2017-12-05 2018-05-08 董海峰 Deposit detection device in a kind of petroleum pipeline
CN110286158A (en) * 2019-07-17 2019-09-27 西安热工研究院有限公司 A kind of Ultrasonic wave angle probe of adjustable incident angle
CN112098516A (en) * 2020-09-29 2020-12-18 国家电网有限公司 Sensor for ultrasonic detection and signal processing method thereof

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106353408A (en) * 2016-08-26 2017-01-25 中国科学院声学研究所 Piezoelectric ultrasonic straight probe
CN106353408B (en) * 2016-08-26 2023-06-02 中国科学院声学研究所 Piezoelectric ultrasonic straight probe
CN107192601A (en) * 2017-05-23 2017-09-22 中国科学院重庆绿色智能技术研究院 The synchronous detecting system of a kind of rock micro-mechanical model and sound mechanics
CN108008017A (en) * 2017-12-05 2018-05-08 董海峰 Deposit detection device in a kind of petroleum pipeline
CN108008017B (en) * 2017-12-05 2020-09-29 中国特种设备检测研究院 Device for detecting deposits in petroleum pipe
CN110286158A (en) * 2019-07-17 2019-09-27 西安热工研究院有限公司 A kind of Ultrasonic wave angle probe of adjustable incident angle
CN112098516A (en) * 2020-09-29 2020-12-18 国家电网有限公司 Sensor for ultrasonic detection and signal processing method thereof
CN112098516B (en) * 2020-09-29 2022-10-04 国家电网有限公司 Sensor for ultrasonic detection and signal processing method thereof

Similar Documents

Publication Publication Date Title
CN106353408B (en) Piezoelectric ultrasonic straight probe
CN206161599U (en) Piezoelectricity supersound normal probe
US10436767B2 (en) Apparatus and method for non-destructive testing of concrete
CN101701810B (en) Electromagnetic ultrasonic transducer capable of reducing echo of magnet
CN201051092Y (en) A sound and ultrasonic no damage detection device
CN103308012B (en) Concrete pavement thickness detection system and detection method
CN105301114B (en) A kind of acoustic stimulation insertion loss measuring method based on multichannel space-time liftering technology
CN203799002U (en) Data acquisition device for verification testing of partial discharge supersonic reflectoscope
CN101413926A (en) A kind of sound, supersonic damage-free detection method
CN108088913B (en) Piezoelectric ultrasonic guided wave probe for flaw detection of steel rail bottom and flaw detection method thereof
CN105353043A (en) Sheet metal micro-crack time reversal positioning method based on abaqus
CN105223271A (en) Anti-during underwater sound passive material oise insulation factor under a kind of limited space conditions focus on measuring method
Xiao et al. Measurement methods of ultrasonic transducer sensitivity
CN106769711A (en) The focusing distribution of sediment on-line measurement instrument of frequency sweep type ultrasonic
CN103743820B (en) Concrete column quality ultrasonic detection device and method based on global transit time parameter
Santhanam et al. Reflection and transmission of fundamental Lamb wave modes obliquely incident on a crack in a plate
CN202119757U (en) Contact type laser ultrasonic probe device
CN109596210A (en) A kind of sound field measurement of high intensity focused ultrasound method based on sound scattering
CN102279226A (en) Contact-type laser ultrasonic probe device
CN201322741Y (en) System using ultrasonic wave to reconstruct three-dimensional defective shape in column structure
CN203366611U (en) Ultrasonic measurement device used for physics teaching
CN112946077A (en) Carbon fiber composite material surface critical refraction longitudinal wave excitation detection system and method
CN204758547U (en) Semi -circular ultrasonic transducer
CN104990988A (en) Anti-interference ultrasonic probe
CN204789478U (en) Anti -jamming ultrasonic transducer

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20170510

Termination date: 20210826