CN206106022U - Bamboo chip hot press unit - Google Patents

Bamboo chip hot press unit Download PDF

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Publication number
CN206106022U
CN206106022U CN201621041750.4U CN201621041750U CN206106022U CN 206106022 U CN206106022 U CN 206106022U CN 201621041750 U CN201621041750 U CN 201621041750U CN 206106022 U CN206106022 U CN 206106022U
Authority
CN
China
Prior art keywords
bamboo chip
support
clamp plate
net
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201621041750.4U
Other languages
Chinese (zh)
Inventor
胡超
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anhui Fuqiang Bamboo Industry Co Ltd
Original Assignee
Anhui Fuqiang Bamboo Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anhui Fuqiang Bamboo Industry Co Ltd filed Critical Anhui Fuqiang Bamboo Industry Co Ltd
Priority to CN201621041750.4U priority Critical patent/CN206106022U/en
Application granted granted Critical
Publication of CN206106022U publication Critical patent/CN206106022U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model relates to a bamboo chip hot press unit belongs to bamboo chip processing technology field. Hot press unit is provided with the support, the support fixed connection be in in the backup pad, be provided with the clamp plate on the support, the clamp plate with be provided with the connecting rod that can stretch out and draw back from top to bottom between the support, be provided with a plurality of heating resistor silks on the clamp plate, the bottom of clamp plate is provided with the net that conducts heat, the side of clamp plate is provided with temperature -detecting device, also be provided with a plurality of heating resistor silks in the backup pad, be provided with the net that conducts heat on the heating resistor silk, be provided with infrared distance measuring sensor on the connecting rod. The utility model discloses an useful part is: place the bamboo chip and conduct heat on the net, then utilize the heating resistor silk to send the heat to to conduct heat on the net, then send the heat to bamboo chip through the net that conducts heat, become when softer when the bamboo chip, be in the same place a plurality of bamboo chips pressure through the clamp plate, the utility model discloses simple structure, convenient operation, the cost is lower.

Description

A kind of bamboo chip hot-press arrangement
Technical field:
The utility model is related to a kind of bamboo chip hot-press arrangement, belongs to bamboo chip processing technique field.
Background technology:
With expanding economy, increasing bamboo product has been come in the middle of the life of people, bamboo product before production, Needs get out suitable bamboo chip, and the comparison that bamboo chip has is thick, and some ratios are relatively thin, so the bamboo chip in order to obtain suitable thickness, Jing Often multiple bamboo chips can be fixed together with glue, formation needs the bamboo chip of thickness, not easy to operate with the hydropexic method of glue, and Glue has certain smell, causes have certain harmfulness to human body with bamboo product made by this bamboo chip, so industry It is middle to need a kind of new bamboo chip hot-press arrangement, to solve industry in problems faced.
The content of the invention:
Technical problem to be solved in the utility model is:A kind of bamboo chip hot-press arrangement is provided, to solve industry in face Problem.
In order to solve above-mentioned technical problem, the utility model is achieved through the following technical solutions:A kind of bamboo chip hot pressing Device, is provided with base, and the base is connected with each other by multiple crossbeams and column and is formed, and on the base gripper shoe is provided with.
Hot-press arrangement is provided with the gripper shoe, the hot-press arrangement is provided with support, and the support is fixedly connected on In the gripper shoe, on the support pressing plate is provided with.
The connecting rod that can be stretched up and down is provided between the pressing plate and the support, is provided with the pressing plate multiple Resistive heater, the bottom of the pressing plate is provided with heat transfer meshes.
The heat transfer meshes link together with the resistive heater, and the side of the pressing plate is provided with temperature detection dress Put.
Multiple resistive heaters are also equipped with the gripper shoe, heat transfer meshes are provided with the resistive heater, it is described Infrared distance sensor is provided with connecting rod.
Preferably, the quantity of the connecting rod is three.
Preferably, being provided with control device on the right side of the base.
Compared with prior art, usefulness of the present utility model is:Bamboo chip is placed on heat transfer meshes, is then utilized and is added Hot water radiation wire is delivered heat on heat transfer meshes, then delivers heat to bamboo chip by heat transfer meshes, when bamboo chip becomes softer, Multiple bamboo chips are forced together by pressing plate, the utility model simple structure, easy to operate, cost is relatively low.
Description of the drawings:
The utility model is further illustrated below in conjunction with the accompanying drawings.
Fig. 1 is structural representation of the present utility model.
In figure:1st, base;101st, crossbeam;102nd, column;2nd, gripper shoe;3rd, hot-press arrangement;310th, support;320th, pressing plate; 330th, connecting rod;340th, resistive heater;350th, heat transfer meshes;360th, temperature-detecting device;370th, infrared distance sensor;4th, control Device processed.
Specific embodiment:
Below in conjunction with the accompanying drawings and specific embodiment is described in detail to the utility model:One kind according to Fig. 1 Bamboo chip hot-press arrangement, is provided with base 1, and the base 1 is connected with each other and is formed by multiple crossbeams 101 and column 102, the base Gripper shoe 2 is provided with 1.
Hot-press arrangement 3 is provided with the gripper shoe 2, the hot-press arrangement 3 is provided with support 310, and the support 310 is consolidated Surely it is connected in the gripper shoe 2, pressing plate 320 is provided with the support 310.
The connecting rod 330 that can be stretched up and down, the pressing plate 320 are provided between the pressing plate 320 and the support 310 On be provided with multiple resistive heaters 340.
The bottom of the pressing plate 320 is provided with heat transfer meshes 350, and the heat transfer meshes 350 are connected with the resistive heater 340 Together, the side of the pressing plate 320 is provided with temperature-detecting device 360.
Multiple resistive heaters 340 are also equipped with the gripper shoe 2, heat transfer is provided with the resistive heater 340 Net 350, is provided with infrared distance sensor 370 in the connecting rod 330.
The quantity of the connecting rod 330 is three.
The right side of the base 1 is provided with control device 4.
When using, first according to the situation of actual bamboo chip, the depth of bamboo chip fusion, and the temperature needed during fusion are calculated Degree, is then placed into bamboo chip in gripper shoe 2, and by the starting device of control device 4, at this moment resistive heater 340 will start Heating, the heat that resistive heater 340 is produced sends heat transfer meshes 350 to, while delivering heat to bamboo by heat transfer meshes 350 Piece, the temperature and the time of heating according to setting, bamboo chip heating is softened, and is then pressed in multi-disc bamboo chip by pressing plate 320 Together, last cooling shaping, while strictly monitoring the dropping distance of connecting rod 330 by infrared distance sensor 370.
It is emphasized that:The above is only preferred embodiment of the present utility model, not the utility model is appointed What pro forma restriction, every any simple modification above example made according to technical spirit of the present utility model, etc. With change and modification, still fall within the range of technical solutions of the utility model.

Claims (3)

1. a kind of bamboo chip hot-press arrangement, it is characterised in that:Be provided with base (1), the base (1) by multiple crossbeams (101) and Column (102) is connected with each other and forms, and gripper shoe (2) is provided with the base (1), and on the gripper shoe (2) hot pressing is provided with Device (3), the hot-press arrangement (3) is provided with support (310), and the support (310) is fixedly connected on the gripper shoe (2) On, pressing plate (320) is provided with the support (310), being provided between the pressing plate (320) and the support (310) can be with Up and down flexible connecting rod (330), is provided with multiple resistive heaters (340), the pressing plate (320) on the pressing plate (320) Bottom be provided with heat transfer meshes (350), the heat transfer meshes (350) link together with the resistive heater (340), the pressure The side of plate (320) is provided with temperature-detecting device (360), and on the gripper shoe (2) multiple resistive heaters are also equipped with (340), heat transfer meshes (350) are provided with the resistive heater (340), on the connecting rod (330) infrared distance measurement is provided with Sensor (370).
2. bamboo chip hot-press arrangement according to claim 1, it is characterised in that:The quantity of the connecting rod (330) is three.
3. bamboo chip hot-press arrangement according to claim 1, it is characterised in that:Control is provided with the right side of the base (1) Device (4).
CN201621041750.4U 2016-08-29 2016-08-29 Bamboo chip hot press unit Expired - Fee Related CN206106022U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201621041750.4U CN206106022U (en) 2016-08-29 2016-08-29 Bamboo chip hot press unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201621041750.4U CN206106022U (en) 2016-08-29 2016-08-29 Bamboo chip hot press unit

Publications (1)

Publication Number Publication Date
CN206106022U true CN206106022U (en) 2017-04-19

Family

ID=58519633

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201621041750.4U Expired - Fee Related CN206106022U (en) 2016-08-29 2016-08-29 Bamboo chip hot press unit

Country Status (1)

Country Link
CN (1) CN206106022U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107775751A (en) * 2016-08-29 2018-03-09 安徽富强竹业有限公司 A kind of bamboo chip hot-press arrangement

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107775751A (en) * 2016-08-29 2018-03-09 安徽富强竹业有限公司 A kind of bamboo chip hot-press arrangement

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Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of utility model: A kind of bamboo chip hot-press arrangement

Effective date of registration: 20180403

Granted publication date: 20170419

Pledgee: Anhui Mount Holyoke rural commercial bank Limited by Share Ltd

Pledgor: ANHUI FUQIANG BAMBOO INDUSTRY CO., LTD.

Registration number: 2018340000098

PE01 Entry into force of the registration of the contract for pledge of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20170419

Termination date: 20190829

CF01 Termination of patent right due to non-payment of annual fee