CN206022417U - 一种高亮度led贴片支架 - Google Patents

一种高亮度led贴片支架 Download PDF

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Publication number
CN206022417U
CN206022417U CN201620831698.6U CN201620831698U CN206022417U CN 206022417 U CN206022417 U CN 206022417U CN 201620831698 U CN201620831698 U CN 201620831698U CN 206022417 U CN206022417 U CN 206022417U
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cup
reflector
rim
wall
reflecting surface
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Expired - Fee Related
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CN201620831698.6U
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Inventor
刘伟
唐书洋
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Jiangxi Asia central electronic Polytron Technologies Inc
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JIANGXI YAZHONG ELECTRONIC TECHNOLOGY Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors

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  • Led Device Packages (AREA)

Abstract

本实用新型公开一种高亮度LED贴片支架,该支架包括反射杯及支架基座,反射杯包括杯口、杯壁、杯底;杯底和杯壁为反射面,反射杯成型于支架基座上,杯壁从杯口到杯底依次分为斜度反射面、杯底台阶段;LED芯片通过金线连接正负极导电发光,焊线区指金线与基座相连接区域;基座固晶区向杯口面拉伸0.35毫米,抬高固晶位置。本实用新型的优点在于:通过大角度设计,以及提高芯片安装位置;芯片发光由低折射率硅胶导出后转入高折射率胶水透镜,实现出光均匀,减少漫反射,出光损失小,使芯片发光使用率由目前的90%左右提高6个基点达到96%以上,光通量通过封装阶段新型点胶工艺,较现有的贴片支架亮度提高10%以上。

Description

一种高亮度LED贴片支架
技术领域
本实用新型涉及LED照明,尤其是一种高亮度LED贴片支架。
背景技术
随着LED照明技术的日益成熟与发展,LED已经成为一种新型光源,广泛应用于各个领域。目前LED支架由于发光角度小,芯片安装位置低,光线反射到杯壁进行折射,会产生光线交叉现象,光损失严重,导致封装后产品发光率较低,芯片利用率严重不足。这与传统的支架结构有关,如角度偏小,反射杯深度太深。
发明内容
本实用新型的目的在于提供一种高亮度LED贴片支架,该支架通过大角度设计,以及提高芯片安装位置。
本实用新型的技术方案为:一种高亮度LED贴片支架,该支架包括反射杯及支架基座,反射杯包括杯口、杯壁、杯底;杯底和杯壁为反射面,反射杯成型于支架基座上,杯壁从杯口到杯底依次分为斜度反射面、杯底台阶段;杯口长宽尺寸为5.0*3.09毫米,反射面段深度为0.3毫米;杯底台阶段为反射面底部往杯中心折拐所形成,杯底台阶段宽度为0.1毫米,深度为0.1毫米;反射杯角度150度,反射杯角度指斜度发射面从杯口到杯底台阶段的纵向剖切所形成的夹角;反射杯深度为0.4毫米,反射杯深度指从杯口到杯底的垂直距离;基座分为正极固晶区域,负极焊线区域。LED芯片通过金线连接正负极导电发光,固金区指LED芯片放置区域,焊线区指金线与基座相连接区域;基座固晶区向杯口面拉伸0.35毫米,抬高固晶位置。
本实用新型的优点在于:通过大角度设计,以及提高芯片安装位置,得到接近于180度发光角度;封装工艺方面,首先底层使用低折射率硅胶,并使用半球状点胶工艺,待硅胶凝固后,再使用高折射率胶水封装外层,同样使用半球状点胶工艺,待胶水凝固后相当于在灯珠上加了一个二次透镜,芯片发光由低折射率硅胶导出后转入高折射率胶水透镜,实现出光均匀,减少漫反射,出光损失小,使芯片发光使用率由目前的90%左右提高6个基点达到96%以上,光通量通过封装阶段新型点胶工艺,较现有的贴片支架亮度提高10%以上。
附图说明
图1为本实用新型一种高亮度LED贴片支架立体图;
图2为本实用新型一种高亮度LED贴片支架结构示意图。
图中:1-杯口;2-杯壁反射面;3-反射杯;4-杯底台阶段;5-焊线区;6-LED芯片;7-固晶区;8-杯底;9-金线;10-负极引脚;11-正极引脚;12-基座;H1-杯壁反射面深度;H2-反射杯深度;H3-杯底台阶段深度;H4-固金区拉伸高度。
具体实施方式
一种高亮度LED贴片支架,包括反射杯3和基座12。反射杯3包括杯口1、杯壁反射面2、杯底台阶段4、杯底8。基座包括焊线区5、固晶区7、负极引脚10、正极引脚11,反射杯成型于基座12上。杯壁8从杯口1到杯底8依次为杯壁反射面2、杯底台阶段4。杯壁反射面深度H1为0.3毫米,杯底台阶段为0.1毫米。反射杯角度H5为150度,反射杯角度指杯壁反射面2从杯口1到杯底8的纵剖面上形成的夹角。固晶区拉伸高度H4为0.35毫米。反射杯深度H2为0.4毫米,反射杯深度H2指杯口1到焊线区8的垂直距离。LED芯片6通过金线9于焊线区5相连,由正极引脚11和负极引脚10导入电流,实现LED芯片6发光作业。

Claims (4)

1.一种高亮度LED贴片支架,其特征在于:该支架包括反射杯及支架基座,反射杯包括杯口、杯壁、杯底;杯底和杯壁为反射面,反射杯成型于支架基座上,杯壁从杯口到杯底依次分为斜度反射面、杯底台阶段;杯底台阶段为反射面底部往杯中心折拐所形成,基座分为正极固晶区域,负极焊线区域;LED芯片通过金线连接正负极导电发光,固金区指LED芯片放置区域,焊线区指金线与基座相连接区域;基座固晶区向杯口面拉伸0.35毫米,抬高固晶位置。
2.根据权利要求1所述一种高亮度LED贴片支架,其特征在于:杯口长宽尺寸为5.0*3.09毫米,反射面段深度为0.3毫米。
3.根据权利要求1所述一种高亮度LED贴片支架,其特征在于:杯底台阶段宽度为0.1毫米,深度为0.1毫米。
4.根据权利要求1所述一种高亮度LED贴片支架,其特征在于:反射杯角度150度;反射杯深度为0.4毫米。
CN201620831698.6U 2016-08-03 2016-08-03 一种高亮度led贴片支架 Expired - Fee Related CN206022417U (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106098902A (zh) * 2016-08-03 2016-11-09 江西亚中电子科技有限公司 一种高亮度led贴片支架

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106098902A (zh) * 2016-08-03 2016-11-09 江西亚中电子科技有限公司 一种高亮度led贴片支架

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Address after: 330800 Yichun Province, new century Industrial Park, the city of Victoria Road, Jiangxi

Patentee after: Jiangxi Asia central electronic Polytron Technologies Inc

Address before: 330800 Yichun Province, new century Industrial Park, the city of Victoria Road, Jiangxi

Patentee before: Jiangxi Yazhong Electronic Technology Co., Ltd.

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Granted publication date: 20170315

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