CN206005028U - Steel mesh - Google Patents

Steel mesh Download PDF

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Publication number
CN206005028U
CN206005028U CN201620781876.9U CN201620781876U CN206005028U CN 206005028 U CN206005028 U CN 206005028U CN 201620781876 U CN201620781876 U CN 201620781876U CN 206005028 U CN206005028 U CN 206005028U
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CN
China
Prior art keywords
steel mesh
board
mouth
board connector
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201620781876.9U
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Chinese (zh)
Inventor
曾永聪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Tinno Wireless Technology Co Ltd
Original Assignee
Shenzhen Tinno Wireless Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Tinno Wireless Technology Co Ltd filed Critical Shenzhen Tinno Wireless Technology Co Ltd
Priority to CN201620781876.9U priority Critical patent/CN206005028U/en
Application granted granted Critical
Publication of CN206005028U publication Critical patent/CN206005028U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The application is related to parts package technique field, more particularly, to a kind of steel mesh, described steel mesh includes for the Part I corresponding with the welding position on printed circuit board and is used for the Part II corresponding with the non-solder position on printed circuit board, steel mesh mouth is opened up on described Part I, described Part II is solid platy structure.Do not open steel mesh mouth on this Part II so that tin cream is not easy to flow to the position not needing welding electronic component, would not lead to the problem that losing efficacy occur in electronic devices and components yet.Therefore, this steel mesh can improve the reliability of electronic devices and components.

Description

Steel mesh
Technical field
The application is related to parts package technique field, more particularly, to a kind of steel mesh.
Background technology
With scientific and technical continuous development, the range of electronic devices and components is also increasingly wider, and electronic devices and components Packaging technology has also obtained more and more widely paying close attention to.
In the packaging technology of electronic devices and components the more commonly used one kind be SMT (Surface Mounted Technology, Surface installation technique), this technique is that one kind will no pin or short leg surface-assembled components and parts (abbreviation sheet component) be installed On the surface of the surface of printed circuit board (Printed Circuit Board, PCB) or other substrate, by Reflow Soldering or The circuit load technology of the methods such as immersed solder welding assembly in addition.When being embodied as this technique, generally mount on a printed circuit board Copper Foil, as pad, then coats tin cream on Copper Foil, by tin cream, electronic devices and components is electrically connected and secured on printed circuit On plate.In this course, the tin cream of accurate quantity can be transferred at the accurate location on printed circuit board by steel mesh, with this Help tin cream deposition.
However, the structural modification of same type component is generally smaller, therefore when processing this type component, generally by steel Net is set to same steel mesh, and the steel mesh mouth that this steel mesh opens up can take into account all structures of same type component.Using this steel During net, in all of steel mesh mouth, all there is tin cream, these tin creams can flow to do not need weld position at so that electronics unit device Losing efficacy easily occurs in part, and the reliability ultimately resulting in electronic devices and components is low.
Utility model content
This application provides a kind of steel mesh, to improve the reliability of electronic devices and components.
This application provides a kind of steel mesh, for processing board to board connector, described steel mesh include for printed circuit The corresponding Part I in welding position on plate and for corresponding with the non-solder position on printed circuit board second Point, described Part I opens up steel mesh mouth, described Part II is solid platy structure.
Preferably, described Part I is used for and the board to board connector signal pin welding position phase on printed circuit board Corresponding.
Preferably, the overall size of described steel mesh mouth is less than the overall size of board to board connector signal pin.
Preferably, the quantity of described steel mesh mouth is multiple, and the quantity of described steel mesh mouth and board to board connector signal pipe The quantity of foot is equal.
Preferably, described Part I be used for printed circuit board on board to board connector signal pin welding position and Board to board connector fixing pin welding position is corresponding.
Preferably, described steel mesh mouth is included for first steel mesh mouth corresponding with board to board connector signal pin, and For the second steel mesh mouth corresponding with board to board connector fixing pin, the overall size of described first steel mesh mouth is less than plate pair The overall size of connector for substrate signal pin.
Preferably, the overall size of described second steel mesh mouth is less than the overall size of board to board connector fixing pin.
Preferably, the quantity of described first steel mesh mouth is multiple, and the quantity of described first steel mesh mouth is connected to plate with plate The quantity of device signal pin is equal.
Preferably, the quantity of described second steel mesh mouth is multiple, and the quantity of described second steel mesh mouth is connected to plate with plate The quantity of device fixing pin is equal.
The technical scheme that the application provides can reach following beneficial effect:
Steel mesh provided herein by with the corresponding Part II in non-solder position of printed circuit board be set to solid Platy structure is not that is to say, that open steel mesh mouth on this Part II so that tin cream is not easy to flow to does not need welding electronics unit The position of device, also would not lead to the problem that losing efficacy occur in electronic devices and components.Therefore, this steel mesh can improve electronic devices and components Reliability.
It should be appreciated that above general description and detailed description hereinafter are only exemplary, can not be limited this Application.
Brief description
The structural representation of the steel mesh that Fig. 1 is provided by the embodiment of the present application;
The structural representation of another kind of steel mesh that Fig. 2 is provided by the embodiment of the present application;
Fig. 3 is a kind of structural representation of board to board connector;
Fig. 4 is the structural representation of another kind of board to board connector;
Fig. 5 is a kind of structural representation of pad.
Reference:
10- Part I;
100- steel mesh mouth;
100a- the first steel mesh mouth;
100b- the second steel mesh mouth;
20- Part II;
30- signal pin;
40- fixing pin;
50- first pad;
60- second pad.
Accompanying drawing herein is merged in description and constitutes the part of this specification, shows the enforcement meeting the application Example, and be used for explaining the principle of the application together with description.
Specific embodiment
Below by specific embodiment and combine accompanying drawing the application is described in further detail.
With reference to Fig. 1, the embodiment of the present application provides a kind of steel mesh, this steel mesh include for printed circuit board on welding The corresponding Part I in position 10 and for the Part II 20 corresponding with the non-solder position on printed circuit board, first Steel mesh mouth 100 is opened up on part 10, Part II is solid platy structure.
Welding position on printed circuit board refers to need the position of welding electronic component on printed circuit board, and first Part 10 is used at tin cream movement to this position, in order to welding electronic component;Non-solder position on printed circuit board Refer to the position of welding electronic component is not needed on printed circuit board.
Above-mentioned steel mesh will be set to solid platy structure with the corresponding Part II in non-solder position 20 of printed circuit board, That is, not opening steel mesh mouth on this Part II 20 so that tin cream is not easy to flow to does not need welding electronic component Position, also would not lead to the problem that losing efficacy occur in electronic devices and components.Therefore, this steel mesh can improve the reliability of electronic devices and components Property.
The steel mesh that the embodiment of the present application provides can apply in the welding procedure of multiple electronic devices and components, specifically, should Steel mesh can apply in the welding procedure of board to board connector as shown in Figure 3 and Figure 4, and now, this steel mesh still includes using In the Part I 10 corresponding with the welding position on printed circuit board and for and printed circuit board on non-solder position Corresponding Part II 20, Part I 10 opens up steel mesh mouth 100, and Part II 20 is solid platy structure.
Due to multiple parts being provided with board to board connector, but combine practical situation, most board to board connectors Welding procedure relates generally to the welding of signal pin 30.Therefore, above-mentioned Part I 10 can be used for and the plate on printed circuit board Corresponding to connector for substrate signal pin welding position, this board to board connector signal pin welding position refers to printing electricity It is used on the plate of road welding the position of the signal pin 30 of board to board connector.This kind of structure makes the steel that the embodiment of the present application provides Net can apply to weld the signal pin 30 of board to board connector.
Size generally ratio in view of the corresponding pad of above-mentioned board to board connector is larger, therefore in order to prevent welded plate pair During connector for substrate, flow to the tin cream on pad excessively it is necessary to make the overall size of steel mesh mouth 100 be less than board to board connector The overall size of signal pin (i.e. the signal pin 30 of board to board connector).Overall size herein refers to the chi of outline Very little, such as, when steel mesh mouth 100 and signal pin 30 are all using rectangular configuration, what this overall size referred to is exactly length and width. Further, the quantity of this steel mesh mouth 100 is multiple, and the number of the quantity of steel mesh mouth 100 and board to board connector signal pin Amount is equal, completes the movement of more tin creams after the mobile steel mesh of single with this, then improves the assembling effect of board to board connector Rate.
Welding due to there being some board to board connectors can be related to the welding of signal pin and fixing pin simultaneously, therefore Above-mentioned Part I 10 is used for and the board to board connector signal pin welding position on printed circuit board and board to board connector Fixing pin welding position is corresponding.This board to board connector fixing pin welding position, refers to be used on printed circuit board The position of the fixing pin 40 of welding board to board connector.By this kind of structure it is possible to process board to board connector simultaneously Signal pin 30 and fixing pin 40, improve the packaging efficiency of board to board connector then to a greater degree.
Specifically, as shown in Fig. 2 aforementioned steel mesh mouth 100 can be included for corresponding with board to board connector signal pin The first steel mesh mouth 100a, and for and board to board connector fixing pin (i.e. the fixing pin 40 of board to board connector) phase Corresponding second steel mesh mouth 100b.Further, the overall size of this first steel mesh mouth 100a is less than board to board connector signal The overall size of pin, prevents the tin cream flowing on pad by the first steel mesh mouth 100a excessive with this.In the same manner, the second steel mesh The overall size of mouth 100b is less than the overall size of board to board connector fixing pin.
In a kind of embodiment, the quantity of the first steel mesh mouth 100a is multiple, and the quantity of this first steel mesh mouth 100a and plate Equal to the quantity of connector for substrate signal pin, the corresponding welding position of each signal pin is moved in single process with this simultaneously The tin cream at place, to lift the packaging efficiency of board to board connector.In the same manner, the quantity of the second steel mesh mouth 100b can also be arranged For multiple, and the quantity of the second steel mesh mouth 100b is equal with the quantity of board to board connector fixing pin.
Foregoing embodiments provide the steel mesh being only used for the signal pin 30 welding board to board connector, and also providing can For welding the signal pin 30 of board to board connector and the steel mesh of fixing pin 40 simultaneously, the steel mesh of these different structures is in tool Body has replaceability during using.Therefore, it is possible to according to plate pair after the specification of board to board connector changes The situation of change of the signal pin 30 in connector for substrate and fixing pin 40 flexibly selects corresponding steel mesh.
And pad then can adopt the pad of unified structure, its structure can be as shown in figure 5, consider all size The structure change of board to board connector after the structure of pad is set, this pad may include the first pad 50 and the second pad 60, the first pad 50 is used for welding signal pin 30, and the second pad 60 is used for being welded and fixed pin, meets all size with this The welding requirements of board to board connector.Pad is set to unified structure, can be managed in order to butt welding disk.
The foregoing is only the preferred embodiment of the application, be not limited to the application, for the skill of this area For art personnel, the application can have various modifications and variations.All within spirit herein and principle, made any repair Change, equivalent, improvement etc., should be included within the protection domain of the application.

Claims (9)

1. a kind of steel mesh, for process board to board connector it is characterised in that described steel mesh include for printed circuit board The corresponding Part I in welding position and for the Part II corresponding with the non-solder position on printed circuit board, institute State and steel mesh mouth is opened up on Part I, described Part II is solid platy structure.
2. steel mesh according to claim 1 is it is characterised in that described Part I is used for and the plate pair on printed circuit board Connector for substrate signal pin welding position is corresponding.
3. steel mesh according to claim 1 is it is characterised in that the overall size of described steel mesh mouth is less than board to board connector The overall size of signal pin.
4. the steel mesh according to Claims 2 or 3 is it is characterised in that the quantity of described steel mesh mouth is multiple, and described steel mesh The quantity of mouth is equal with the quantity of board to board connector signal pin.
5. steel mesh according to claim 1 is it is characterised in that described Part I is used for and the plate pair on printed circuit board Connector for substrate signal pin welding position is corresponding with board to board connector fixing pin welding position.
6. steel mesh according to claim 5 it is characterised in that described steel mesh mouth include for board to board connector signal The corresponding first steel mesh mouth of pin, and for the second steel mesh mouth corresponding with board to board connector fixing pin, described the The overall size of one steel mesh mouth is less than the overall size of board to board connector signal pin.
7. steel mesh according to claim 6 is it is characterised in that the overall size of described second steel mesh mouth is less than plate to plate even Connect the overall size of device fixing pin.
8. steel mesh according to claim 6 is it is characterised in that the quantity of described first steel mesh mouth is multiple, and described the The quantity of one steel mesh mouth is equal with the quantity of board to board connector signal pin.
9. the steel mesh according to any one of claim 6-8 is it is characterised in that the quantity of described second steel mesh mouth is many Individual, and the quantity of described second steel mesh mouth is equal with the quantity of board to board connector fixing pin.
CN201620781876.9U 2016-07-22 2016-07-22 Steel mesh Expired - Fee Related CN206005028U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620781876.9U CN206005028U (en) 2016-07-22 2016-07-22 Steel mesh

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620781876.9U CN206005028U (en) 2016-07-22 2016-07-22 Steel mesh

Publications (1)

Publication Number Publication Date
CN206005028U true CN206005028U (en) 2017-03-08

Family

ID=58200926

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201620781876.9U Expired - Fee Related CN206005028U (en) 2016-07-22 2016-07-22 Steel mesh

Country Status (1)

Country Link
CN (1) CN206005028U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106028678A (en) * 2016-07-22 2016-10-12 深圳天珑无线科技有限公司 Steel mesh

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106028678A (en) * 2016-07-22 2016-10-12 深圳天珑无线科技有限公司 Steel mesh

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20170308

Termination date: 20170722

CF01 Termination of patent right due to non-payment of annual fee