CN205987523U - Multilayer ceramic printed circuit board - Google Patents

Abstract

The utility model provides a ceramic base PCB board that multilayer ceramic printed circuit board includes that at least two cover each other and close, ceramic base PCB board including the ceramic base bottom that is used for heat conduction and/or heat dissipation and electrical insulation, be used for printing the electronic circuit and/or the eutectic crystal material that lays the intermediate level of heat -conducting metal face and have an eutectic melting characteristic forms covers and close the layer, each ceramic base PCB board is two liang of laminating heating in opposite directions, close a layer eutectic melting with the help of covering on it and weld into multilayer ceramic printed circuit board. Covering on printing the electronic circuit and/or laying the heat -conducting metal face is closed the layer and is covered machinery and the electric connection that closes between the realization layer through the eutectic melting, compares in known structure and technology, has improved multilayer ceramic printed circuit board's heat conductivility greatly, the ceramic base bottom has fine heat conductivility and dielectric strength, makes the utility model discloses a multilayer ceramic printed circuit board has the application scenario that fine heat conductivility is fit for high power and high thermal current density.

Description

Multi-layer ceramics printed circuit board

Technical field

This utility model is related to semiconductor circuit package and application, and the high power of more particularly, to Power Electronic Technique is close Multi-layer ceramics printed circuit board and its manufacture method that degree semiconductor circuit arrangement uses, more particularly to high temperature resistant, be applied to The multi-layer ceramics printed circuit board of high heat conduction requirement, high voltage and high power density application and its manufacture method.

Background technology

Prior art is most commonly that the printed circuit support plate of synthetic resin material, such as FR-4 epoxy glass cloth laminated board, Wherein FR-4 is a kind of code name of fire proofing grade, and the representative meaning is that this kind of resin material experiences energy after fired state Enough self-extinguish.Although the FR in FR-4 can be interpreted as FRP, that is, " fiber increases fibre reinforced plastics The breviary literary style of strong plastics ", but it is not title material, but a kind of material rate, therefore at present used by general circuit plate FR-4 grade material just has very many species, but majority is all to add filler and glass fabric institute with epoxy resin The composite worked it out.Epoxy glass cloth laminated board high mechanical strength at high temperature, electric performance stablity under high humility, but Some high currents, high voltage, in the application of high power semi-conductor circuit arrangement, its stability, dielectric strength, thermal coefficient of expansion and Thermal conduction characteristic is still defeated by ceramic base circuit board.Especially in semiconductor circuit application now, because integrated level improves, Bring the demand of high power density, high heat flux, for common base plate for packaging and application substrate, bear high power close Degree, high heat flux are great challenges it is difficult to be competent at.And the thermal expansion difference of carrier plate material and silicon is difficult to arrange in pairs or groups.Multilamellar prints When making, the connection between the printed circuit board of each monolayer realizes machinery connection typically by resin material bonding to circuit board processed Connect, but these resin materials do not possess whole physical features of Power Electronic Technique requirement, heat conductivity is also low simultaneously, The application scenario of high power density is simultaneously inapplicable.

Prior art adopts the printed circuit board of ceramic carrier, the physical and chemical stability of its base ceramic material, has High-fire resistance, high insulation resistance and low thermal coefficient of expansion, especially alumina ceramic-base circuit board adopt in electrically insulative portion Aluminium oxide ceramics fairly close with element silicon material thermal expansion coefficient are so that when carrying out through hole, it is possible to achieve higher join The appearance of the target of line density, therefore ceramic substrate overcomes the shortcoming that synthetic resin tellite is difficult to overcome.

The making of prior art multilayer pottery printed circuit board, generally adopts ceramic batch firing process, first by raw material Ceramics, synthetic resin, organic solvent etc., using spherical destructor hybrid modulation, until mixing liquid forms milk shape Ceramic material；Shape followed by thin slice, allow ceramic forming material be greenbelt, wire is then the powder using tungsten W The slurry agent being mixed with organic carrier is printed on greenbelt, makes distribution；Make use of the workability of ceramic green sheet, can be in greenbelt Interior optional position perforation, imbeds electric conductor through in the hole portion, realizes multiple-plate interlayer conduction；It is then passed through common burning, plating Nickel, the hard solder of pin, a series of step such as gold-plated complete；Last again that the conductor in lamination is dynamic with what pottery synchronization was sintered Make, and complete the Making programme of ceramic base electronic circuit board.In whole processing procedure, most important step is the molding in greenbelt, with And the technology of synchronization sintering；On multi-disc ceramic batch and in through hole, setting refractory metal such as molybdenum Mu and tungsten W makes conductor gold Belong to figure, be sintered together with high-conductive metal copper Cu and become multilayer ceramic circuit board.The burning of described multilayer ceramic circuit board Knot complex process is it is difficult to produce application in enormous quantities, and craft precision difference is it is impossible to do fine circuitry；Refractory metal and the knot of copper Poor with joint efforts, leave reliability hidden danger, and heat conductivity is low.

Explanation of nouns：

Eutectic：Refer to that eutectic solder occurs the phenomenon that eutectic thing fuses at relatively low temperature, eutectic is to be less than The fusion of all the components at a temperature of any one constituent fusing point.Eutectic material directly changes to liquid from solid-state, and without moulding Sexual stage, is the balancing response that a liquid generates two solid-states simultaneously.Its fusion temperature claims eutectic temperature.Eutectic material has Specific freezing point, the fundamental characteristics of eutectic material is：Two kinds of different metals or quasiconductor or nonmetallic can be far below each From melting temperature under in constant weight ratio formed eutectic integrating materials；This is that eutectic material is the most aobvious with other eutectic materials The difference writing.

Eutectic welds：Eutectic welding also known as low-melting alloy welding, be using eutectic principle, make two kinds of different metals or Quasiconductor or nonmetallic formation in constant weight ratio under far below respective melting temperature cool down shape after eutectic Fusion Strain Become co-melting crystal, realize the eutectic bond between two solders side.

For example：The most frequently used eutectic weldering in microelectronic component is that silicon is soldered on gold-plated base or lead frame Go, i.e. " gold-silicon eutectic weldering ".As is generally known, 1063 DEG C of the fusing point of gold, and the fusing point of silicon is higher, is 1414 DEG C.But if press According to weight than the gold combination of the silicon for 2.85% and 97.15%, the eutectic alloy body that fusing point is 363 DEG C just can be formed.Here it is The theoretical basiss of gold silicon eutectic weldering.The welding process of gold-silicon eutectic weldering refers in fixed temperature (higher than 363 DEG C) and necessarily Pressure under, silicon is gently rubbed friction on gold-plated base, wipes the oxide layer of interfacial instability, make contact surface Between melt, form liquid phase by two solid phases.After cooling, when temperature is less than 363 DEG C of gold-silicon eutectic point, formed by liquid phase Granular form be combined with each other into mechanical impurity gold-co-melting crystal of silicon so that silicon is welded on base securely, and Form good low resistance Ohmic contact.

Silicon nitride：Its English is Silicon nitride；Si₃N₄Pottery is a kind of covalent key compound, basic structure Unit is [SiN₄] tetrahedron, silicon atom is located at tetrahedral center, there being four nitrogen-atoms about, is located at four sides respectively Four summits of body, then in the form of every three tetrahedrons share an atom, form continuous and firm in three dimensions Network.A lot of performances of silicon nitride are all attributed to this structure.Si₃N₄Thermal coefficient of expansion is low, thermal conductivity is high, therefore it is heat-resisting Impact is splendid.

Aluminium nitride：Its English is Aluminum nitride, is abbreviated as AIN；Covalently key compound, belongs to hexagonal crystal system, The crystal structure of Pb-Zn deposits type, white or canescence.Aluminium nitride is atomic lattice, belongs to diamond like carbon nitride, highest can be steady Determine to 2200 DEG C.Room temperature strength is high, and intensity is good compared with slow, heat conductivity with the rising decline of temperature, and thermal coefficient of expansion is little, is good Heat shock resistance material.The ability of resist melt metal attack is strong, aluminium nitride or electrical insulator, and dielectric properties are good, are potteries One of preferred material of circuit board.

Aluminium sesquioxide：Namely aluminium oxide, chemical symbol：, pure aluminium oxide is white amorphous powder, custom Claim Alumina, density 3.9-4.0g/cm³, 2050 DEG C of fusing point, 2980 DEG C of boiling point, water insoluble, it is amphoteric oxide, can be dissolved in no In machine acid and alkaline solution, mainly there are α type and two kinds of variants of γ type, industrial can extract from bauxite.In alpha-type aluminum oxide Lattice in, oxonium ion is that six sides are tightly packed, and aluminium ion is symmetrically dispersed in the octahedral coordination center that oxonium ion surrounds, brilliant Lattice can be very big, therefore fusing point, boiling point are very high.Alpha-type aluminum oxide is water insoluble and sour, and industrial also referred to as alumina, is the base of metallic aluminium processed This raw material；It is also used for making various refractory brick, fire-clay crucible, refractory tube, high temperature resistant experimental apparatus；Also can make grinding agent, fire retardant, Inserts etc.；High-purity alpha-type aluminum oxide still produces Alundum, synthetic ruby and sapphire raw material；It is additionally operable to produce The plate base of modern large scale integrated circuit.

Heat conductivity：Characterize the physical quantity of material conducts heat capacity of water, unit is W/m K, it is every that every meter of work watt read in Chinese Open.Its numerical value is unit temperature fall degree in object, that is, during 1 meter of thick material both sides temperature difference 1 Kelvin, in the unit interval The heat being conducted by unit area.

In present specification, indication possesses high thermal conductivity coefficient, refers to that heat conductivity is more than or equal to 2W/m K.

MOS is the abbreviation of English Complementary Metal-Oxide Semiconductor, and Chinese implication is complementation Type metal oxide semiconductor.

MOSFET is the contracting of English Metallic Oxide Semiconductor Field Effect Transistor Write, Chinese implication is mos field effect transistor.

IGBT is the abbreviation of English Insulated Gate Bipolar Transistor, and Chinese implication is that insulated gate is double Bipolar transistor.

CPU is the abbreviation of English Central Processing Unit, and Chinese implication is central processing unit.

GPU is the abbreviation of English Graphic Processing Unit, and Chinese implication is graphic process unit.

MPU is the abbreviation of English Micro Processor Unit, and Chinese implication is microprocessor.

IPM is the abbreviation of English Integrated Power Module, and Chinese implication is integrated power module.

PCB is the abbreviation of English Printed Circuit Board, and Chinese implication is to print or printed circuit board.

LED is the abbreviation of English Light Emitting Diode, and Chinese implication is light emitting diode.

COB is the abbreviation of English Chip On Board, and Chinese implication is chip on board；Chip on board encapsulation is bare chip One of mounting technology, on a printed circuit board, chip and electrically connecting of substrate use wire bonding side for semiconductor chip handing-over attachment Method is realized, and is covered with resin to guarantee reliability.

COB light source：LED plane light source or integrated optical source are encapsulated also known as COB light source by COB；COB light source is mainly transported at present In indoor and outdoor lamp lighting, the such as shot-light of interior, Down lamp, Ceiling light, lamp affixed to the ceiling, daylight lamp and light bar, the street lamp of outdoor, The wall lamp of bulkhead lamp, flood light and current urban landscape, luminescent characters etc..

In the circuit that traditional printed circuit includes and drawing (Pattern):Circuit is the work as conducting between original paper In addition tool, can design big copper face in design as ground connection and bus plane.Circuit and drawing are made simultaneously.New in this practicality Already provided with circuit and drawing (Pattern) on ceramics base PCB plate (100) in type.

The dielectric layer (Dielectric) that traditional printed circuit includes:It is used for keeping the insulation between circuit and each layer Property, it is commonly called as base material；Base material in this utility model is pottery.

The hole (Through hole/via) that traditional printed circuit includes be usually via can make two levels with On circuit turn on each other, larger via is then used as components and parts plug-in unit, in addition has non-conduction hole (nPTH) to be commonly used to As surface mount positioning, during assembling, fixed screw is used；In the embodiment that this utility model is related to, part ceramics base PCB plate On be provided with via, part ceramics base PCB plate can be not provided with via, respectively makes pottery depending in concrete multi-layer ceramics printed circuit board Depending on the concrete condition of porcelain base pcb board.

The anti-solder ink (Solder resistant/Solder Mask) that traditional printed circuit includes:Not complete The copper face in portion will eat part on stannum, the therefore non-region eating stannum, can print material (the usually epoxy that one layer of isolation copper face eats stannum Resin), it is to avoid short circuit between the non-circuit eating stannum.According to different technique, it is divided into green oil, chilli oil, blue oil.In this utility model Anti-solder ink can also be arranged on the ceramics base PCB plate of top layer and the bottom；But arrange in multi-layer ceramics printed circuit board Each ceramics base PCB plate between can't arrange one layer and be fixedly connected for two adjacent ceramic base pcb boards and be used for interlayer print The insulating barrier of circuit isolation processed.In this utility model, it is logical between each ceramics base PCB plate in multi-layer ceramics printed circuit board Being fixedly connected of interlayer is realized in the eutectic melting of hypereutectic laminating material, participates in the laminating laminating layer of eutectic and printed electronics circuit Intermediate layer between can electrically connect.

Traditional printed circuit further relates to be surface-treated (Surface Finish):Because copper face is in general environment, very Easily aoxidize, lead to not stannum (solderability is bad), therefore can be protected on the copper face of stannum to be eaten.The mode of protection has Spray stannum (HASL), changes golden (ENIG), changes silver-colored (Immersion Silver), changes stannum (Immersion Tin), organic solderability preservative (OSP), method respectively has pluses and minuses, is referred to as being surface-treated.The surface of the multi-layer ceramics printed circuit board that this utility model is related to Can be processed using conventional surface processing mode.

Utility model content

The technical problems to be solved in the utility model be to avoid prior art multilayer ceramic circuit board complex manufacturing technology, The low weak point of low precision, heat conductivity and a kind of multi-layer ceramics printed circuit board of high-termal conductivity is proposed.

This utility model is to solve described technical problem to employed technical scheme comprise that a kind of multi-layer ceramics printed circuit board, bag Include at least two pieces mutually laminating ceramics base PCB plates；Each piece of described ceramics base PCB plate include ceramic base bottom, intermediate layer and Laminating layer；Described ceramic base bottom is used for heat conduction and/or radiating and electric insulation；By described ceramic base bottom mutually on the whole Two parallel surfaces are referred to as substrate A face and substrate B face, and described intermediate layer is arranged on described substrate A face, or described centre Layer is arranged on described substrate B face；Described intermediate layer is used for printed electronics circuit and/or lays heat-conducting metal face；Described centre Floor includes printing area for the electronic circuit of printed electronics circuit and/or for laying the lying copper region in heat-conducting metal face, described covers Copper area covers, realizes heat conduction and radiating in intermediate layer large area；Described laminating layer is the eutectic material with eutectic melting characteristic Layer；Another described laminating layer eutectic that described laminating layer is used for another piece of ceramics base PCB plate is laminating and realize conduction of heat or heat Conduction and electrical connection；Described laminating floor includes electronic circuit and prints the laminating floor in area and/or the laminating floor of lying copper region；Described electronic circuit Print the uniform cloth of the laminating floor in area to be overlying on each lines of printed electronics circuit and each node in described electronic circuit printing area；Described cover The uniform cloth of the laminating floor in copper area is overlying on the heat-conducting metal face of described lying copper region；Laminating two-by-two adds described ceramics base PCB plate opposite to each other Heat, completes eutectic welding by described laminating layer thereon, thus the laminating connection of melting of respectively this ceramics base PCB plate is become the number of plies It is at least the multi-layer ceramics printed circuit board of two-layer.

Described respectively this ceramics base PCB plate needs the laminating printed electronics circuit in two opposite intermediate layers and/or heat conduction gold The figure in genus face is in mutually specular, or the figure at least most of printed electronics circuit and/or heat-conducting metal face is in mirror As symmetrical；Described respectively this ceramics base PCB plate needs the laminating printed electronics circuit in two opposite intermediate layers and/or heat-conducting metal When the figure in face is asymmetric, that face opposite with this asymmetric part printed electronics circuit and/or heat-conducting metal face should be blank Ceramic plane, or that face opposite with this asymmetric part printed electronics circuit and/or heat-conducting metal face be the printing of island shape Selective Laser Sintering.

When being provided with described intermediate layer on the substrate A face of described ceramic base bottom and substrate B face, respectively this described intermediate layer On printed electronics circuit and/or heat-conducting metal face electrically connected by the grommet on described ceramic base bottom；Described grommet It has been plated the plated-through hole of metal including the solid metal hole filled by columnar metal thing insertion and/or hole wall.

Described multi-layer ceramics printed circuit board includes three layers of ceramic printed circuit board；Described three layers of ceramic printed circuit board by Middle ceramics base PCB plate is formed with laminating with two pieces of ceramics base PCB plate eutectic meltings of its two sides respectively；The pottery of this centre On the substrate A face of the ceramic base bottom of porcelain base pcb board and it is provided with described intermediate layer on substrate B face, and in described substrate A Described laminating layer is all laid, to adapt to ceramic base described in same on intermediate layer on the intermediate layer in face and described substrate B face The situation of all laminating another piece of ceramics base PCB plates again is distinguished on the substrate A face of pcb board and substrate B face.

Described multi-layer ceramics printed circuit board includes the multi-layer ceramics printed circuit board that the number of plies is more than four layers；This multilamellar is made pottery Porcelain printed circuit board includes at least four pieces ceramics base PCB plates, respectively by respective described laminating layer between this ceramics base PCB plate And with the eutectic melting laminating formation multi-layer ceramics printed circuit board between its opposite described laminating layer；Described multi-layer ceramics print The number of plies of circuit board processed is corresponding with the quantity of described ceramics base PCB plate.

The local function net of printed electronics circuit in area is printed with described electronic circuit in the heat-conducting metal face of described lying copper region Network electrically connects, or the heat-conducting metal face of described lying copper region is printed the printed electronics circuit in area with described electronic circuit and integrally had Electrically connect.

Described electronic circuit prints the isolation area being additionally provided between area and described lying copper region for electric insulation, described isolation Described laminating floor is not provided with area.

Described electronic circuit print area include for high power density part is set high power density part fixed area, use Power electronic circuits area in the control circuit area of setting control circuit with for laying power electronic circuits.

Participating in the eutectic material that the opposite described laminating layer cloth in two sides of eutectic welding covers is Au-Sn gold-tin alloy, Au-Si Gold silicon eutectic material, Au-Ge gold-germanium alloy, Ag-Sn silver-tin alloy, Sn-Bi sn-bi alloy, Sn-In tin-indium alloy or Sn-Pb stannum Any one of metal.

Participate in the opposite described laminating layer in the two sides of eutectic welding, the eutectic material that wherein described in, laminating layer cloth covers is Au-Sn gold-tin alloy, Au-Si gold silicon eutectic material, Au-Ge gold-germanium alloy, Ag-Sn silver-tin alloy, Sn-Bi sn-bi alloy, Sn- Any one in In tin-indium alloy or Sn-Pb leypewter；The eutectic material that wherein another described laminating layer cloth covers is monolayer Golden Au, stannum Sn, silicon Si, silver-colored Ag, germanium Ge, bismuth Bi, indium In, nickel, lithium Li, palladium Pd or aluminum Al；Or this is another described laminating The eutectic material that layer cloth covers is that golden Au, stannum Sn, silicon Si, silver-colored Ag, germanium Ge, bismuth Bi, indium In, nickel, lithium Li, palladium Pd or aluminum Al are all Appoint in material and select two or more the multiple structure that alternately cloth covers.

Participate in the opposite laminating layer described in two in the two sides of eutectic welding, mutually differently, uniformly cloth is covered with monolayer respectively Or alternately cloth covers one of golden Au, stannum Sn, silicon Si, silver-colored Ag, germanium Ge, bismuth Bi, indium In, palladium Pd or lead Pb set of data cellulosic material of multilamellar Kind；Participate in the opposite laminating layer described in two in the two sides of eutectic welding, it is two respectively for melting laminating top layer eutectic material Plant mutually different material；This bi-material described, when eutectic welds, melts laminating formation Au-Sn gold-tin alloy, Au-Si gold Silicon Eutectic Layer, Au-Ge gold-germanium alloy, Ag-Sn silver-tin alloy, Sn-Bi sn-bi alloy, Sn-In tin-indium alloy, and Sn-Pb stannum Any one in metal.

Described Au-Sn gold-tin alloy, by mass percentage, wherein contains golden Au80.0% ± 2.0%, remaining is stannum Sn.

Described Ag-Sn silver-tin alloy, by mass percentage, wherein stanniferous Sn 96.5% ± 2.0%, remaining is silver-colored Ag.

Described Au-Ge gold-germanium alloy, by mass percentage, wherein contains golden Au 88.0% ± 2.0%, remaining is germanium Ge.

Described Au-Si gold silicon eutectic material, by mass percentage, wherein contains golden Au 97.0% ± 2.0%, remaining is silicon Si.

The thickness of described laminating layer is 2 microns to 100 microns.

The thickness of described laminating layer is 3 microns to 20 microns.

The material of described ceramic base bottom, is more than or equal to the high-heat-conductivity ceramic material of 2 W/m K using heat conductivity；System The ceramic material making described ceramic base bottom includes aluminium sesquioxide, aluminium nitride, silicon nitride and beryllium oxide；Described ceramic base bottom Choose any one kind of them or two kinds and two or more combinations for above-mentioned three kinds of materials.

Described in described mutually laminating polylith, the material of the ceramic base bottom of ceramics base PCB plate can be identical；Or described phase The material of the ceramic base bottom of mutually laminating polylith ceramics base PCB plate is different；The variant material used by ceramic base bottom Material selects collocation according to the heat conduction of different layers and insulation requirements.

This utility model is that the technical scheme solving described technical problem employing can also be that a kind of aforenoted multi-layer that is used for is made pottery The method of porcelain printed circuit board comprises the following steps, A1：Electronic circuit in the intermediate layer of described ceramics base PCB plate prints area On each lines of printed electronics circuit and each node, uniform cloth covers eutectic material, and/or the covering of the intermediate layer of described ceramics base PCB plate On the heat-conducting metal face in copper area, uniform cloth covers eutectic material, on each lines of printed electronics circuit and each node in described intermediate layer And/or laminating layer is formed on heat-conducting metal face；Before cloth covers described laminating layer, on the intermediate layer of described ceramics base PCB plate It is provided with the electronic circuit printing area being printed with printed electronics circuit and carry out heat conduction and radiating for the covering of intermediate layer large area Heat-conducting metal face be lying copper region；

A2：The laminating layer of at least two pieces of ceramics base PCB plates is pressed in opposite directions, is jointly heated to the eutectic of eutectic material used Temperature, carries out eutectic and melts laminating and be connected into integrated multi-layer ceramics printed circuit by laminating for the melting of each ceramics base PCB plate Plate；When the quantity of described ceramics base PCB plate is a plurality of, respectively by respective described laminating layer between this ceramics base PCB plate And with the eutectic melting laminating formation multi-layer ceramics printed circuit board between its opposite described laminating layer；Described multi-layer ceramics print The number of plies of circuit board processed is corresponding with the quantity of described ceramics base PCB plate.

Of the present utility model have the technical effect that：1. laminating layer not only realizes multi-layer ceramics printing conveniently by eutectic welding The mechanical attachment of the interlayer of circuit board and electrically connecting, and substantially increase the heat conductivility that electronic circuit prints area；2. intermediate layer Lying copper region and lying copper region on laminating layer further increasing the heat conductivility of multi-layer ceramics printed circuit board；3. pottery The ceramic material that the ceramic base bottom of base pcb board is used is the ceramic material of high heat conduction, have good heat conductivility and Dielectric strength；The multi-layer ceramics printed circuit board that this utility model is related to has superior heat conductivility, is particularly suitable for high power Application scenario with high heat flux.

Brief description

Fig. 1 is that the orthographic projection vertical view of this utility model high-termal conductivity multi-layer ceramics printed circuit board 10 preferred embodiment I is shown It is intended to；In a top view, described intermediate layer 120 and described laminating layer 130 are shown as the same area；

Fig. 2 is the A-A cross-sectional schematic of Fig. 1；

Fig. 3 is the D part close-up schematic view of Fig. 2；

Fig. 4 is the E part close-up schematic view of Fig. 3；

Fig. 5 is decomposing state axonometric projection schematic diagram, in figure section components and the part face of preferred embodiment I shown in Fig. 1 Invisible；

Fig. 6 is substrate B of the I-1 ceramics base PCB plate 221 for making double-layer ceramic printed circuit board shown in Fig. 1 50 The schematic top plan view in face 114；

Fig. 7 is substrate A of the I-1 ceramics base PCB plate 221 for making double-layer ceramic printed circuit board shown in Fig. 1 52 The schematic top plan view in face 112；

Fig. 8 is substrate B of the I-2 ceramics base PCB plate 222 for making double-layer ceramic printed circuit board shown in Fig. 1 52 The schematic top plan view in face 114；

Fig. 9 is substrate A of the I-2 ceramics base PCB plate 222 for making double-layer ceramic printed circuit board shown in Fig. 1 52 The schematic top plan view in face 112；

In the schematic top plan view of Fig. 6 to Fig. 9, described intermediate layer 120 and described laminating layer 130 are shown as the same area； Described electronic circuit is printed the laminating floor in area 138 and is shown as the same area with described electronic circuit printing area 128；Described lying copper region is covered Close layer 135 and be shown as the same area with described lying copper region 125；

Figure 10 is the electronic circuit print of this utility model high-termal conductivity multi-layer ceramics printed circuit board 10 preferred embodiment II The subregion schematic top plan view in area 128 processed；

Figure 11 is the MOSFET full-bridge of this utility model high-termal conductivity multi-layer ceramics printed circuit board 10 preferred embodiment III The basic circuit diagram of module；

Figure 12 is the double-layer ceramic print in the MOSFET full-bridge module application involved by this utility model preferred embodiment III The schematic top plan view in the substrate B face 114 of the ceramic base bottom 110 of the ii I-1 ceramics base PCB plate 231 of circuit board 52 processed；This figure In crystal bonding area be high power density part fixed area 1283, the wire welding area of in figure and pad be control circuit area 1285, in figure Area copper be lying copper region 125；

Figure 13 is the double-layer ceramic print in the MOSFET full-bridge module application involved by this utility model preferred embodiment III The schematic top plan view in the substrate A face 112 of the ceramic base bottom 110 of the ii I-1 ceramics base PCB plate 231 of circuit board 52 processed；

Figure 14 is the double-layer ceramic print in the MOSFET full-bridge module application involved by this utility model preferred embodiment III The schematic top plan view in the substrate A face 112 of the ceramic base bottom 110 of the ii I-2 ceramics base PCB plate 232 of circuit board 52 processed；

Figure 15 is the double-layer ceramic print in the MOSFET full-bridge module application involved by this utility model preferred embodiment III The schematic top plan view in the substrate B face 114 of the ceramic base bottom 110 of the ii I-2 ceramics base PCB plate 232 of circuit board 52 processed；

Figure 16 is the axonometric projection signal that this utility model preferred embodiment IV is multichannel COB-LED light source applications substrate Figure；

Figure 17 is the orthographic projection schematic top plan view that this utility model preferred embodiment IV is four layers of ceramic printed circuit board 54；

Figure 18 is the just throwing in the substrate A face 112 of the IVth -1 ceramics base PCB plate 441 in this utility model preferred embodiment IV Shadow schematic top plan view；

Figure 19 is the just throwing in the substrate B face 114 of the IVth -1 ceramics base PCB plate 441 in this utility model preferred embodiment IV Shadow schematic top plan view；

Figure 20 is the substrate of IV -2 ceramics base PCB plate 442 ceramic base bottom 110 in this utility model preferred embodiment IV The orthographic projection schematic top plan view in A face 112；

Figure 21 is the base of the ceramic base bottom 110 of IV the IVth -2 ceramics base PCB plates 442 in this utility model preferred embodiment The orthographic projection schematic top plan view in bottom B face 114；

Figure 22 is the base of the ceramic base bottom 110 of the IVth -3 ceramics base PCB plate 443 in this utility model preferred embodiment IV The orthographic projection schematic top plan view in bottom A face 112；

Figure 23 is the base of the ceramic base bottom 110 of the IVth -3 ceramics base PCB plate 443 in this utility model preferred embodiment IV The orthographic projection schematic top plan view in bottom B face 114；

Figure 24 is the base of the ceramic base bottom 110 of the IVth -4 ceramics base PCB plate 444 in this utility model preferred embodiment IV The orthographic projection schematic top plan view in bottom A face 112；

Figure 25 is the base of the ceramic base bottom 110 of the IVth -3 ceramics base PCB plate 444 in this utility model preferred embodiment IV The orthographic projection schematic top plan view in bottom B face 114；

Figure 26 is the orthographic projection side-looking that Figure 17 is this utility model preferred embodiment IV is four layers of ceramic printed circuit board 54 Schematic diagram；

Figure 27 is the close-up schematic view on Figure 26 top；

Figure 28 is the close-up schematic view of H part in Figure 27.

The described I-1 ceramics base PCB plate 221 of above-mentioned each in figure indication, I-1 ceramics base PCB plate 222, ii I-1 pottery Porcelain base pcb board 231, ii I-2 ceramics base PCB plate 232, the IVth -1 ceramics base PCB plate 441, the IVth -2 ceramics base PCB plate 442, IVth -3 ceramics base PCB plate 443, the IVth -4 ceramics base PCB plate 444 are ceramics base PCB plate 100 tool in different embodiments Body embodiment, its numbering is only used for identifying, and these numberings do not have the expression of any order and priority；

The die bond region of different LED chips, and the both positive and negative polarity pad of LED is shown in Figure 16 to 18；In Figure 19 extremely Through hole and pad is shown in 23；Show in Figure 19 and treat laminating pad without through hole, the area copper in Figure 19 to 25 is Lying copper region 125.

Specific embodiment

With reference to each accompanying drawing, content of the present utility model is described in further detail.

A kind of multi-layer ceramics printed circuit board 50 with high thermal conductivity coefficient has multiple embodiments.

As shown in Figures 1 to 9 be embodiment I, multi-layer ceramics printed circuit board 50 described in embodiment I is double-deck pottery Porcelain printed circuit board 52, in this embodiment, described I-1 ceramics base PCB plate 221 and I-1 ceramics base PCB plate 222 eutectic Form double-layer ceramic printed circuit board 52 after melting is laminating.

In double-layer ceramic printed circuit board 52 embodiment as shown in Figures 1 to 9, this double-layer ceramic printed circuit board 52 wraps Include two pieces of mutually laminating ceramics base PCB plates 100；Each piece of described ceramics base PCB plate 100 includes ceramic base bottom 110, centre Layer 120 and laminating layer 130；Described ceramic base bottom 110 is used for heat conduction and/or radiating and electric insulation；By described ceramic bases Two mutually parallel on the whole surfaces of layer 110 are referred to as substrate A face 112 and substrate B face 114, and described intermediate layer 120 is arranged On described substrate A face 112, or described intermediate layer 120 is arranged on described substrate B face 114；Described intermediate layer 120 is used for printing Electronic circuit processed and/or laying heat-conducting metal face；Described intermediate layer 120 includes printing for the electronic circuit of printed electronics circuit Area 128 and/or the lying copper region 125 for laying heat-conducting metal face, described lying copper region 125 covers, realizes in intermediate layer large area Heat conduction and radiating；Described laminating layer 130 is the eutectic material layer with eutectic melting characteristic；Described laminating layer 130 is used for another Another described laminating layer 130 eutectic of one piece of ceramics base PCB plate 100 is laminating and realizes conduction of heat；Described laminating layer 130 includes electricity The laminating floor 138 in sub-line road printing area and/or the laminating floor of lying copper region 135；Described electronic circuit is printed the uniform cloth of the laminating floor in area 138 and is covered Print on each lines of printed electronics circuit and each node in area 128 in described electronic circuit；The laminating layer 135 of described lying copper region is uniform Cloth is overlying on the heat-conducting metal face of described lying copper region 125；The laminating heating two-by-two opposite to each other of described ceramics base PCB plate 100, by it On described laminating layer 130 complete eutectic welding, thus respectively this ceramics base PCB plate 100 is melted laminating connection become the number of plies being The multi-layer ceramics printed circuit board 50 of two-layer.

Described laminating layer 130 not only can the very convenient layer realizing multi-layer ceramics printed circuit board 50 by eutectic welding Between couple, and improve electronic circuit print area 128 heat conductivility.Laminating in described lying copper region 125 and lying copper region 125 Layer 130 further improves the heat conductivility of multi-layer ceramics printed circuit board 50.

Certainly the number of plies of multi-layer ceramics printed circuit board 50 may be greater than two other multi-layer ceramics printed circuit boards, such as The multilayer layer pottery printed circuit board of three layers, four layers, five layers and higher number.Often increase by one piece of ceramics base PCB plate 100 just to increase Add one layer.

In certain embodiments, described respectively this ceramics base PCB plate 100 needs the printing electricity in the opposite intermediate layer of laminating two The figure in sub-line road and/or heat-conducting metal face is in mutually specular, or at least most of printed electronics circuit and/or heat conduction The figure of metal covering is in specular；Described respectively this ceramics base PCB plate 100 needs the printing electricity in the opposite intermediate layer of laminating two When the figure in sub-line road and/or heat-conducting metal face is asymmetric, that face opposite with printed electronics circuit and/or heat-conducting metal face should It is blank ceramic plane.

In certain embodiments, the substrate A face 112 of described ceramic base bottom 110 and substrate B face 114 are respectively provided with When stating intermediate layer 120, respectively described ceramic base is passed through in the printed electronics circuit on this described intermediate layer 120 and/or heat-conducting metal face Grommet 118 on bottom 110 electrically connects；Described grommet 118 is included by the reality of columnar metal thing such as metal needle insertion filling Heart grommet and/or hole wall have been plated the plated-through hole of metal.

In certain embodiments, described grommet 118 is used for manufacturing multi-layer ceramics printing in described ceramics base PCB plate 100 Metallized before circuit board 50, cover synthetic multi-layer ceramic printed circuit board 50 two-by-two in each described ceramics base PCB plate 100 Afterwards, because eutectic welding has good mobility, the surface of therefore metallization via also assists in eutectic bond and is formed and is beneficial to lead The Eutectic Layer of heat.Described grommet 118 includes solid metal hole and hollow plated-through hole.Certain solid metal hole Heat conductivility is better than hollow plated-through hole.In the place of part very high thermal conductivity demand, grommet can be designed to reality Heart plated through-hole.The location hole being provided with for installing positioning can also be arranged in addition on described each ceramics base PCB plate 100.

In certain embodiments, the heat-conducting metal face of described lying copper region 125 is printed in area 128 with described electronic circuit and is printed The local function network of electronic circuit electrically connects, or area is printed with described electronic circuit in the heat-conducting metal face of described lying copper region 125 Printed electronics circuit in 128 integrally electrically connects.

In certain embodiments, mutual electric insulation between described ceramic base bottom 110 and described intermediate layer 120.Described Between the heat-conducting metal face of the described lying copper region 125 in intermediate layer 120 and described laminating layer 130, existing electrically connecting also has machinery connection Connect.On each lines of printed electronics circuit in electronic circuit printing area 128 in equally described intermediate layer 120 and each node on laminating When described laminating layer 130, between each lines of printed electronics circuit and each node and described laminating layer 130, existing electrically connecting also has Mechanical attachment.I.e. the uniform cloth of the laminating floor in described electronic circuit printing area 138 overlays on each lines of printed electronics circuit and each node, Described electronic circuit print melt on the laminating floor in area 138 each lines and each node with printed electronics circuit laminating after realization electrically connect And mechanical attachment；The uniform cloth of the laminating layer 135 of described lying copper region overlays on the heat-conducting metal face of described lying copper region 125, described covers copper Realize electrically connecting and mechanical attachment after the laminating floor in area 135 is laminating with the melting of heat-conducting metal face.

In certain embodiments, after two pieces of ceramics base PCB plates 100 melt laminating in opposite directions by respective laminating layer 130 Form the eutectic melting layer after merging；This eutectic melting layer is by each lines of printed electronics circuit on two pieces of ceramics base PCB plates 100 It is simultaneously achieved by eutectic melting with each node and electrically connect and mechanical attachment；Similarly two pieces of ceramics base PCB plates 100 are respective Heat-conducting metal face is simultaneously achieved by eutectic melting and electrically connects and mechanical attachment.

In certain embodiments, each lines of printed electronics circuit of every piece of ceramics base PCB plate 100 and each node and heat conduction gold Whether there is electric connection can carry out flexible according to actual needs between genus face.

In some embodiments, the heat-conducting metal face of described lying copper region 125 and described electronic circuit print the office in area 128 Portion's circuit function network or described electronic circuit are printed area 128 entirety and are electrically connected.I.e. described lying copper region 125 is except heat conduction and radiating Function outside can also possess electric characteristic.For example in certain embodiments, described lying copper region 125 can be printed with electronic circuit Ground net connection in area 128 processed, gives the electric characteristic of described lying copper region 125 ground connection.Electromagnetic compatibility according to electronic circuit Property design requirement, described lying copper region 125 can also print different electrical networks connection in the electronic circuit in area 128 from electronic circuit Connect and realize more preferable circuit realiration effect.In some applications in order to realize the shield effectiveness of circuit, can be by described electric wire The heat-conducting metal face of the electronic circuit in road printing area 128 and described lying copper region 125 electrically connects formation screen layer comprehensively.

In certain embodiments, described electronic circuit is printed and is additionally provided with for electricity between area 128 and described lying copper region 125 The isolation area 127 of insulation, described isolation area 127 is not provided with described laminating layer 130.

In actual applications, electronic circuit print area 128 and lying copper region 125 account for the ratio in whole intermediate layer 120 can root Factually heat conduction demand in border carries out proportioning arrangement, and the main purpose of described lying copper region 125 is for heat conduction, therefore requires in heat conduction In addition to electronic circuit prints area 128 and necessary isolation area 127, remaining interlayer region can all cover shape to high occasion Become large-area copper area 125 to improve heat conductivility.

In certain embodiments, described electronic circuit printing area 128 includes the Gao Gong for arranging high power density part Rate density components fixed area 1283, for arranging the control circuit area 1285 of control circuit and for laying power electronic circuits Power electronic circuits area 1287.

In certain embodiments, when described ceramics base PCB plate 100 be located at multi-layer ceramics printed circuit board 50 top or When the bottom, the external outer surface in its intermediate layer 120 also includes the crystal bonding area for pasted sheet-shaped components and parts.

In certain embodiments, described multi-layer ceramics printed circuit board 50 includes three layers of ceramic printed circuit board；Described three The ceramic printed circuit board of layer is covered with upper and lower two blocks of ceramics base PCB plate 100 eutectics melting respectively by middle ceramics base PCB plate 100 Conjunction forms；It is respectively provided with the substrate A face 112 of the ceramic base bottom 110 of the ceramics base PCB plate 100 of this centre and substrate B face 114 There is the intermediate layer 120 on described intermediate layer 120, and the intermediate layer 120 in described substrate A face 112 and described substrate B face 114 On all lay described laminating layer 130, to adapt to substrate A face 112 and the substrate B face 114 of ceramics base PCB plate 100 described in same The situation of upper difference all laminating another piece of ceramics base PCB plates 100 again.

In certain embodiments, described multi-layer ceramics printed circuit board 50 includes the multi-layer ceramics print that the number of plies is more than four layers Circuit board 50 processed；This multi-layer ceramics printed circuit board 50 includes at least four pieces ceramics base PCB plates 100, respectively this ceramics base PCB plate Laminating formation is melted by respective described laminating layer 130 with the eutectic between its opposite described laminating layer 130 between 100 Multi-layer ceramics printed circuit board 50；The number of plies of described multi-layer ceramics printed circuit board 50 and the quantity of described ceramics base PCB plate 100 Corresponding.

In certain embodiments, participating in the eutectic material that opposite described laminating layer 130 cloth in two sides of eutectic welding covers is Au-Sn gold-tin alloy, Au-Si gold silicon eutectic material, Au-Ge gold-germanium alloy, Ag-Sn silver-tin alloy, Sn-Bi sn-bi alloy, Sn- Any one of In tin-indium alloy or Sn-Pb leypewter.Described eutectic material can also be replaced by other and be had eutectic Characteristic is applied to the other materials of eutectic welding.Various eutectic materials have different being total to according to the component difference of its eutectic material Brilliant temperature；Common eutectic temperature range is at 200 degrees Celsius to 400 degrees Celsius；Also the eutectic temperature having part eutectic material exists 100 degrees Celsius to 200 degrees Celsius；Also the eutectic temperature having part eutectic material is at 400 degrees Celsius to 800 degrees Celsius.Wherein, have , between 300 to 330 degrees Celsius, specific temperature can for the eutectic temperature of part eutectic material as such in Au-Sn gold-tin alloy To be 310 or 320 degrees Celsius.

In certain embodiments, the opposite described laminating layer 130 in the two sides of eutectic welding, laminating layer wherein described in are participated in The eutectic material that 130 cloth cover is Au-Sn gold-tin alloy, Au-Si gold silicon eutectic material, Au-Ge gold-germanium alloy, Ag-Sn silver stannum conjunction Any one in gold, Sn-Bi sn-bi alloy, Sn-In tin-indium alloy or Sn-Pb leypewter；Wherein another described laminating layer The eutectic material that 130 cloth cover be the golden Au of monolayer, stannum Sn, silicon Si, silver-colored Ag, germanium Ge, bismuth Bi, indium In, nickel, lithium Li, palladium Pd or Aluminum Al；Or the eutectic material that this another described laminating layer 130 cloth covers is golden Au, stannum Sn, silicon Si, silver-colored Ag, germanium Ge, bismuth Bi, indium Appoint in In, nickel, lithium Li, palladium Pd or all materials of aluminum Al and select two or more the multiple structure that alternately cloth covers.And, Wherein in the described laminating layer 130 of a participation eutectic fusion weld, the lower section participating in melting laminating solder side can also be all Even be covered with Au-Sn gold-tin alloy, Au-Si gold silicon eutectic material, Au-Ge gold-germanium alloy, Ag-Sn silver-tin alloy, Sn-Bi stannum bismuth close Gold, any one or two or more alternate multiples of Sn-In tin-indium alloy, Sn-Pb leypewter；Melt in another participation eutectic Melt in the described laminating layer 130 of welding, participate in melt laminating solder side lower section can also uniformly be covered with golden Au, stannum Sn, silicon Si, In silver-colored Ag, germanium Ge, bismuth Bi, indium In, nickel, lithium Li, lead Pb, aluminum Al, palladium Pd, these kind of material of aluminum Al appoint select one or two with On multilamellar alternating layer.The single material of above-mentioned participation participation eutectic fusion weld may alternatively be the gold of any one routine Belong to material or semi-conducting material.

In certain embodiments, participate in the opposite laminating layer 130 described in two in the two sides of eutectic welding, divide mutually differently Not uniformly cloth be covered with monolayer or alternately cloth cover golden Au, stannum Sn, silicon Si, silver Ag, germanium Ge, bismuth Bi, indium In, palladium Pd or the lead of multilamellar One of Pb set of data cellulosic material is planted；Participate in the opposite laminating layer 130 described in two in the two sides of eutectic welding, it is laminating respectively for melting Top layer eutectic material be two kinds of mutually different materials；This bi-material described, when eutectic welds, melts laminating formation Au- Sn gold-tin alloy, Au-Si gold silicon eutectic layer, Au-Ge gold-germanium alloy, Ag-Sn silver-tin alloy, Sn-Bi sn-bi alloy, Sn-In stannum Any one in indium alloy, and Sn-Pb leypewter.Participate in two opposite described laminating layers of eutectic fusion weld In 130 laminating solder side：Simultaneously uniformly it is covered with monolayer or alternate multiple golden Au, stannum Sn, silicon Si, silver-colored Ag, germanium Ge, bismuth Bi, indium In, palladium Pd or lead Pb；Another side be uniformly covered with monolayer or alternate multiple golden Au, stannum Sn, silicon Si, silver-colored Ag, germanium Ge, Bismuth Bi, indium In, palladium Pd or lead Pb；Make in the laminating solder side of the described laminating layer 130 of relative two, simultaneously even be covered with A kind material Material, another side is even to be covered with B kind material, described A kind material and described B kind material when eutectic weld, the golden stannum of laminating formation Au-Sn Alloy, Au-Si gold silicon eutectic material, Au-Ge gold-germanium alloy, Ag-Sn silver-tin alloy, Sn-Bi sn-bi alloy, Sn-In stannum indium close Any one in gold, Sn-Pb leypewter.

In some embodiments, in described Au-Sn gold-tin alloy, the mass percent of golden Au is 80.0%, the quality of stannum Sn Percentage ratio is 20.0%.Its eutectic temperature is 280 DEG C, and that is, the fusing point of eutectic welding is 280 DEG C.

In some embodiments, in described Ag-Sn silver-tin alloy, the mass percent of silver-colored Ag is 3.5%, the quality of stannum Sn Percentage ratio is 96.5%.

In some embodiments, in described Au-Ge gold-germanium alloy, the mass percent of golden Au is 88.0%, the quality of germanium Ge Percentage ratio is 12.0%.Its eutectic temperature is 356 DEG C, and that is, the fusing point of eutectic welding is 356 DEG C.

In some embodiments, in described Au-Si gold silicon eutectic material, the mass percent of golden Au is 97.0%, silicon Si's Mass percent is 3.0%.Its eutectic temperature is 370 DEG C, and that is, the fusing point of eutectic welding is 370 DEG C.

Described eutectic material except be previously mentioned Au-Sn gold-tin alloy, Au-Si gold silicon eutectic material, Au-Ge gold germanium close Outside gold, Ag-Sn silver-tin alloy, Sn-Bi sn-bi alloy and Sn-In tin-indium alloy, can also be other, any to possess eutectic special The laminating material of eutectic of property.

Suitable eutectic material can be selected according to the application scenario of different pottery pcb boards and technological design demand. The eutectic material of different eutectic temperatures for example in the application of different temperatures demand, can be selected.

For example preferred Au-Sn gold-tin alloy Au80Sn20 and, Au-Si gold silicon eutectic materials A u97Si3 application when, Using the multi-layer ceramics pcb board of this two kinds of eutectic materials, higher temperature can be tolerated so that the range of application of stack of ceramic plates Expand further, the substrate after such as Au-Si gold silicon eutectic material eutectic can tolerate up to 280 degree of reflow soldering process.

Need and unlike material end face carry out secondary welding or laminating when, can select and secondary welding coated material The co-melting performance of the matter more preferably laminating material of eutectic；The solder Sn-Ag of such as argentiferous is it is easy to end joined with coating argentiferous；Contain Gold, the solder containing indium are easy to contain the end joined of gold with coating.

In certain embodiments, the material of described ceramic base bottom 110, is more than or equal to 2 W/m K's using heat conductivity High-heat-conductivity ceramic material；Make described ceramic base bottom 110 ceramic material include aluminium sesquioxide, aluminium nitride, silicon nitride and Beryllium oxide, described ceramic base bottom 110 is chosen any one kind of them for above-mentioned three kinds of materials or two kinds and two or more mixing materials sintering Pottery.The heat conductivity of the substrate of aluminium sesquioxide or nitridation aluminium material is far above common FR4 epoxy glass fabric lamination Plate and the heat conductivity of other ceramic material ceramic laminates existing；Aluminium sesquioxide or the substrate dielectric strength of nitridation aluminium material Also it is far above the dielectric strength of aluminium base laminate.

In certain embodiments, the ceramic base bottom 110 of ceramics base PCB plate 100 described in described mutually laminating polylith Material can be identical；Or the material of the ceramic base bottom 110 of described mutually laminating polylith ceramics base PCB plate 100 is different； The variant material used by ceramic base bottom 110 selects collocation according to the heat conduction of different layers and insulation requirements.

The thickness of the described laminating layer 130 in above-mentioned multiple embodiment is 2 microns to 100 microns；In common application, The thickness of described laminating layer 130 is preferably provided in 2 microns to 20 microns or 3 microns to 20 microns.

Method for manufacturing aforenoted multi-layer pottery printed circuit board comprises the following steps, A1：In described ceramics base PCB plate On each lines of printed electronics circuit in electronic circuit printing area 128 in 100 intermediate layer 120 and each node, uniformly cloth covers eutectic material Material, and/or on the heat-conducting metal face of the lying copper region 125 in the intermediate layer 120 of described ceramics base PCB plate 100, uniform cloth covers eutectic material Material, forms laminating layer on each lines of printed electronics circuit and each node in described intermediate layer 120 and/or on heat-conducting metal face 130；Before cloth covers described laminating layer 130, the intermediate layer 120 of described ceramics base PCB plate 100 has been provided with being printed with printing The electronic circuit of electronic circuit is printed area 128 and covering for intermediate layer large area and is carried out the heat-conducting metal face of heat conduction and radiating and is Lying copper region 125；

A2：The laminating layer 130 of at least two pieces of ceramics base PCB plates 100 is pressed in opposite directions, is jointly heated to eutectic material used Eutectic temperature, carry out eutectic melting laminating and each ceramics base PCB plate 100 is melted and laminating is connected into integrated multi-layer ceramics Printed circuit board 50；When described ceramics base PCB plate 100 quantity be a plurality of when, respectively between this ceramics base PCB plate 100 by Respective described laminating layer 130 and between its opposite described laminating layer 130 eutectic melting laminating formation multi-layer ceramics print Circuit board 50 processed；The number of plies of described multi-layer ceramics printed circuit board 50 is corresponding with the quantity of described ceramics base PCB plate 100.

In the manufacture method for manufacturing multi-layer ceramics printed circuit board that this utility model is related to, the eutectic being related to welds Temperature range can be between 100 DEG C to 800 DEG C it is also possible between 200 DEG C to 400 DEG C.Generally preferably scope is 300 DEG C between 330 DEG C, specific temperature can be 310 DEG C or 320 DEG C, and such temperature range is compatible with existing PCB technology, fits Close large-scale production, it is to avoid the high temperature in conventional multilayer pottery printed circuit board 50 manufacturing process and complicated technology method.

Multi-layer ceramics printed circuit board 50 good heat conductivity that therefore this utility model is related to, has high heat conductivity And dielectric strength, it is particularly suitable for MOSFET, the encapsulation of IGBT, LED constant power device, be equally suitable for high power CPU/ The encapsulation of MPU/GPU integrated circuit, and the application of integrated power module IPM and photo engine power modules.

It is the circuit theory diagrams of the full-bridge module of a MOSFET as shown in figure 11.The full-bridge module of generally MOSFET is easy Realize, but integrated control section typically requires another piece of independent pcb board and realizes.The present embodiment is due to employing the multilamellar of high heat conduction Ceramic circuit is so that the control circuit of complexity can also be achieved on same ceramic substrate.MOSFET bare crystalline is directly solid It is welded on ceramic circuit board, control circuit and MOSFET integrate；Even if necessary, rectifying part is also integrated in one Rise, be substantially reduced modular volume.Due to high insulation characterisitic and the high heat conduction characteristic of this utility model ceramic circuit, MOSFET leads Hot radiator can be integrated, thus and improving reliability.

A kind of application of the MOSFET full-bridge high current Motor drive module being integrated with control circuit employs as figure Multi-layer ceramics printed circuit board shown in 12 to 15, in the embodiment of this multi-layer ceramics printed circuit board, employs two pieces of potteries Porcelain base pcb board 100：It is ii I-1 ceramics base PCB plate 231 and ii I-2 ceramics base PCB plate 232 respectively, this ii I-1 pottery Base pcb board 231 and ii I-2 ceramics base PCB plate 232 pass through the laminating connection of eutectic and form another one double-layer ceramic printed circuit Plate 52.

As shown in Figure 10, the high power that described electronic circuit printing area 128 is included for arranging high power density part is close Spend part fixed area 1283, be used for arranging the control circuit area 1285 of control circuit and the electric power for arranging power electronic circuits Electronic circuit area 1287.Specifically, as Figure 12 to 15 shown in MOSFET full-bridge high current Motor drive module application in, High power density part fixed area is MOSFET bare crystalline fixed area, power circuit is specially rectifying circuit.It should be noted that In Figure 10, simply to illustrate that the subregion explanation conveniently carrying out, the high power density part fixed area 1283 of reality, control circuit The region division in area 1285 and power electronic circuits area 1287 varies, and needs to be laid out according to actual device feature.

As Figure 16 to 28 show a kind of application substrate of the four-way RGBW COB-LED light source of high power density, In this multi-layer ceramics printed circuit board 50, four pieces of ceramics base PCB plates 100 melt laminating four layers of ceramic printed circuit board 54 of formation；As To shown in 28, described four layers ceramic printed circuit board 54 include four pieces of ceramics base PCB plates 100 to Figure 26, are the IVth -1 pottery respectively Porcelain base pcb board 441, the IVth -2 ceramics base PCB plate 442, the IVth -3 ceramics base PCB plate 443 and the IVth -4 ceramics base PCB plate 444； Described IVth -2 ceramics base PCB plate 442 passes through phase with I-1 ceramics base PCB plate 221 and the IVth -3 ceramics base PCB plate 443 respectively Described laminating layer 130 eutectic answered melts laminating, the IVth -3 ceramics base PCB plate 443 and the IVth -4 ceramics base PCB plate 444 simultaneously Melt the described four layers of ceramic printed circuit board 54 of laminating formation also by described accordingly laminating layer 130 eutectic.

Under normal circumstances, the light source of RGBW is used for light of stage.Because the requirement of low-angle luminous intensity distribution is it is desirable to light-emitting area is tried one's best Little and power density is tried one's best big.Existing way is closely to be mounted on PCB with the paster LED of many RGBW, due to circuit ratio More complicated, need multi-layer sheet could meet requirement.Metal-based circuit board (the MCPCB-metal of existing maturation process high heat conduction Core printed circuit board) dual platen can only be made it is impossible to meet cabling requirement, and also heat conductivity is also only 0.8W/ m·K -3W/m.k；The PCB of the other materials then very low (heat conductivity of heat conductivity<1W/ m K), used in such On light fixture, light source life substantially reduces.

The present embodiment make use of multilayer ceramic circuit board of the present utility model, in 13.5 millimeters × 13.5 millimeters of multilamellar pottery On porcelain substrate, upside-down mounting R, G, B, W tetra- color LED chip is welded in correspondence position respectively admittedly, chip size is for 45mil × 45mil (i.e. 1.14 millimeters × 1.14 millimeters), exiting surface is only 4.73 millimeters × 4.73 millimeters, solves this difficult problem very well.

Figure 16 and 17 is respectively the axonometric projection schematic diagram of application substrate and the vertical view of four-way RGBW COB-LED light source Schematic diagram, visible on figure is integrated with redness, green, blueness and white four kinds of LED chips, each color on an application substrate LED chip to have each both positive and negative polarity pad and respective die bond pad be crystal bonding area.

As shown in Figure 18 is to 25, four pieces of ceramics base PCB plates 100 are provided with complete electronic circuit jointly；Four pieces of potteries Base pcb board 100 preferably, with the AlN ceramic base circuit board of 0.254mm thickness.Four pieces of ceramics base PCB plates 100 are referred to as IVth -1 ceramics base PCB plate 441, the IVth -2 ceramics base PCB plate 442, the IVth -3 ceramics base PCB plate 443 and the IVth -4 ceramic base Pcb board 444；Wherein the IVth -1 ceramics base PCB plate 441, the IVth -2 ceramics base PCB plate 442 and the IVth -3 ceramics base PCB plate 443 On be provided with grommet 118, for electrically connecting between the electronic circuit arranged on each ceramics base PCB plate.Wherein IV -4 ceramics base PCB plate 444 is arranged on the bottom, is not provided with grommet 118 thereon.

As shown in figure 18, on the substrate A face 112 of the wherein the IVth -1 ceramics base PCB plate 441, the intermediate layer 120 of setting includes Both positive and negative polarity pad, LED die bond pad and the electronic circuit for electrically connecting.

It is the substrate B face 114 of the IVth -1 ceramics base PCB plate 441 as shown in figure 19；The the IVth -2 pottery as shown in figs 20 and 21 The Substrate Substrate A face 112 of porcelain base pcb board 442 and substrate B face 114；The the IVth -3 ceramics base PCB plate 443 as depicted in figures 22 and 23 Substrate Substrate A face 112 and substrate B face 114；The Substrate Substrate A face of the IVth -4 ceramics base PCB plate 444 as of fig. 24 112；The intermediate layer 120 being respectively provided with this six faces above-mentioned includes printing area 128 for the electronic circuit of printed electronics circuit, uses Print the lying copper region 125 of area's covering in non-electronic circuit and be used for isolating described electronic circuit printing area 128 and described lying copper region 125 isolation area 127.Lying copper region 125 is sometimes also referred to as area copper, covers copper by large-area, improves heat conduction and radiating Performance.

It is additionally provided with described laminating layer 130, i.e. 130, laminating layer on the intermediate layer 120 in Figure 19 six shown in 24 face On described intermediate layer 120；Described laminating layer 130 is the even eutectic material layer covering.Described each ceramics base PCB plate 100 is two-by-two Between multi-layer ceramics printed circuit board is connected into by laminating for each ceramics base PCB plate 100 by the eutectic welding of laminating layer 130 thereon 50.The material all covering on laminating layer 130 is preferably AuSn80 gold-tin alloy, and preferably thickness is 6 microns；As separately waited face-to-face to cover In the two laminating layers 130 closing, simultaneously for gold-tin alloy layer, then in addition one side can be wellability good single metal such as gold.

The substrate B face 114 of the ceramic base bottom 110 of the IVth -1 ceramics base PCB plate 441 shown in Figure 19 is relatively shown in Figure 20 The substrate A face 112 of the ceramic base bottom 110 of the IVth -2 ceramics base PCB plate 442 carry out laminating, realize two by laminating layer 130 Laminating connection between ceramics base PCB plate.

Similarly, the substrate B face 114 of the ceramic base bottom 110 of the IVth -2 ceramics base PCB plate 442 shown in Figure 21 is relative The substrate A face 112 of the ceramic base bottom 110 of the IVth -3 ceramics base PCB plate 443 shown in Figure 22 carries out laminating, by laminating layer The 130 laminating connections realizing the IVth -2 ceramics base PCB plate 442 and the IVth -3 ceramics base PCB plate 443.

Similarly, the substrate B face 114 of the ceramic base bottom 110 of the IVth -3 ceramics base PCB plate 443 shown in Figure 23 is relative The substrate A face 112 of the ceramic base bottom 110 of the IVth -4 ceramics base PCB plate 444 shown in Figure 24 carries out laminating, by laminating layer The 130 laminating connections realizing the IVth -3 ceramics base PCB plate 443 and the IVth -4 ceramics base PCB plate 444.

In the making of above-mentioned four layers of ceramic printed circuit board 54, can will be laggard for four pieces of ceramics base PCB plate 100 one step press Row eutectic welds；First two pieces of ceramics base PCB plates 100 can also be melt into double-layer ceramic printed circuit board two-by-two；To make again The two pieces of double-layer ceramic printed circuit board meltings obtaining are laminating or use by the insertion location hole on each ceramics base PCB plate 100 Metal rivet riveted couples and obtains four layers of ceramic printed circuit board 54.

In the making of above-mentioned three layers of ceramic printed circuit board 54, can will be laggard for three pieces of ceramics base PCB plate 100 one step press Row eutectic welds；First two pieces of ceramics base PCB plates 100 can also be melt into double-layer ceramic printed circuit board two-by-two；To so make Make to obtain double-layer ceramic printed circuit board remelted laminating or obtain three with one piece of ceramics base PCB plate 100 of metal rivet riveted The ceramic printed circuit board of layer.

As shown in figure 25, the substrate B face 114 of ceramic base bottom 110 of the IVth -4 ceramics base PCB plate 444 is only provided with Print the lying copper region 125 that area covers for non-electronic circuit, large area is covered copper to improve heat conduction and the heat dispersion of substrate, also may be used It is welded with being simultaneously used for light source fixation.Described lying copper region 125 is used as light source and installs stationary plane, and surface treatment with simple process can be Antioxidation copper or copper plating nickel gold；Certainly described lying copper region 125 can also all be covered with the laminating layer for eutectic fusion weld 130, realize the laminating connection of eutectic of same miscellaneous part after eutectic melting.

In practical application, by location hole or other positioning modes, each ceramics base PCB plate is corresponding partly accurate Really overlap together, be heated up to 300-320 DEG C and heat reach Au-Sn80 eutectic temperature, the laminating layer of each ceramics base PCB plate Between 130, each ceramics base PCB plate is welded into the multilayer ceramic circuit board of one by eutectic melting.Thick 2 ounces of this circuit copper, The heat conductivity 170W/ m K of aluminium nitride ceramics, gold-tin alloy heat conductivity 57W/ m K, count not covering of trace clearance in Close part, theoretical heat conductivity>120W/ m K, the heat conductivity of significantly larger than other multilayer circuit boards.

In this utility model, in described " laminating " one word other documents in the prior art also referred to as " being combined "；Institute State in " connection " one word other documents in the prior art and be also sometimes used as " connection ", but " connection " in present specification Intended scope refer not only to " connection ", part occasion also have " joint " the meaning.

In this utility model, laminating layer not only easily realizes the layer of multi-layer ceramics printed circuit board by eutectic welding Between couple, and improve electronic circuit print area heat conductivility；Laminating layer in the lying copper region in intermediate layer and lying copper region enters The heat conductivility that improve multi-layer ceramics printed circuit board of one step；The ceramic material of the ceramic base bottom of ceramics base PCB plate is The mixture of any one or more in aluminium sesquioxide, aluminium nitride, silicon nitride and beryllium oxide, has good heat conductivility And dielectric strength.Laminating floor in electronic circuit printing area and lying copper region, while realizing interlayer connection, substantially increases many The heat conductivility of the ceramic printed circuit board of layer；Ceramic base bottom has good heat conductivility and dielectric strength so that this practicality New multi-layer ceramics printed circuit board has fine heat conductivility, the application scenario of suitable high power and high heat flux.

The foregoing is only embodiment of the present utility model, not thereby limit the scope of the claims of the present utility model, every The equivalent structure made using utility model description and accompanying drawing content or equivalent flow conversion, or directly or indirectly it is used in it The technical field of his correlation, is all included in the same manner in scope of patent protection of the present utility model.

Claims (10)

1. a kind of multi-layer ceramics printed circuit board (50), including at least two pieces of mutually laminating ceramics base PCB plates (100)；Each Ceramics base PCB plate described in block (100) includes ceramic base bottom (110) and laminating layer (130)；Described ceramic base bottom (110) and It is additionally provided with intermediate layer (120) between described laminating layer (130)；

Described ceramic base bottom (110) is used for heat conduction and/or radiating and electric insulation；By described ceramic base bottom (110) mutually Two parallel surfaces are referred to as substrate A face (112) and substrate B face (114) on the whole, and described intermediate layer (120) is arranged on On described substrate A face (112), or described intermediate layer (120) are arranged on described substrate B face (114)；

Described intermediate layer (120) is used for printed electronics circuit and/or lays heat-conducting metal face；Described intermediate layer (120) includes using Electronic circuit in printed electronics circuit prints area (128) and/or the lying copper region (125) for laying heat-conducting metal face, described Lying copper region (125) covers, realizes heat conduction and radiating in intermediate layer large area；

Described laminating layer (130) is the eutectic material layer with eutectic melting characteristic；Described laminating layer (130) is used for another piece Another described laminating layer (130) the eutectic melting of ceramics base PCB plate (100) is laminating and realizes conduction of heat or conduction of heat and is electrically connected Connect；Described laminating floor (130) includes electronic circuit and prints the laminating floor in area (138) and/or the laminating floor of lying copper region (135)；Described electricity Uniformly cloth is overlying on each lines of printed electronics circuit that described electronic circuit prints area (128) in the laminating floor in sub-line road printing area (138) On each node；Uniformly cloth is overlying on the heat-conducting metal face of described lying copper region (125) the laminating layer (135) of described lying copper region；

The laminating heating two-by-two opposite to each other of described ceramics base PCB plate (100), completes eutectic by described laminating layer (130) thereon Fusion weld, thus respectively the multi-layer ceramics print that the number of plies is at least two-layer will be become this ceramics base PCB plate (100) melting laminating connection Circuit board (50) processed.

2. multi-layer ceramics printed circuit board according to claim 1 it is characterised in that

Described respectively this ceramics base PCB plate (100) needs the laminating printed electronics circuit in two opposite intermediate layers and/or heat conduction gold The figure in genus face is in mutually specular, or the figure at least most of printed electronics circuit and/or heat-conducting metal face is in mirror As symmetrical；

Described respectively this ceramics base PCB plate (100) needs the laminating printed electronics circuit in two opposite intermediate layers and/or heat conduction gold When the figure in genus face is asymmetric, that face opposite with this asymmetric part printed electronics circuit and/or heat-conducting metal face should be empty White ceramic plane, or that face opposite with this asymmetric part printed electronics circuit and/or heat-conducting metal face be the print of island shape Selective Laser Sintering processed.

3. multi-layer ceramics printed circuit board according to claim 1 it is characterised in that

It is provided with described intermediate layer (120) on the substrate A face (112) of described ceramic base bottom (110) and substrate B face (114) When, respectively described ceramic base bottom (110) is passed through in the printed electronics circuit on this described intermediate layer (120) and/or heat-conducting metal face On grommet (118) electrically connect；Described grommet (118) include by columnar metal thing insertion filling solid metal hole and/or Hole wall has been plated the plated-through hole of metal.

4. multi-layer ceramics printed circuit board according to claim 1 it is characterised in that

Described multi-layer ceramics printed circuit board (50) includes three layers of ceramic printed circuit board；Described three layers of ceramic printed circuit board by Middle ceramics base PCB plate (100) is laminating with two pieces of ceramics base PCB plate (100) eutectic meltings of its two sides respectively to be formed；

The substrate A face (112) of the ceramic base bottom (110) of the ceramics base PCB plate (100) of this centre is above and on substrate B face (114) It is provided with described intermediate layer (120), and go up and described substrate B face in the intermediate layer (120) of described substrate A face (112) (114) all lay described laminating layer (130) on intermediate layer (120), to adapt to ceramics base PCB plate described in same (100) Situation of all laminating another piece of ceramics base PCB plates (100) again is distinguished on substrate A face (112) and on substrate B face (114).

5. multi-layer ceramics printed circuit board according to claim 1 it is characterised in that

It is four layers and its above multi-layer ceramics printed circuit board (50) that described multi-layer ceramics printed circuit board (50) includes the number of plies； This multi-layer ceramics printed circuit board (50) includes at least four pieces ceramics base PCB plates (100), respectively this ceramics base PCB plate (100) it Between by respective described laminating layer (130) and between its opposite described laminating layer (130) eutectic melt laminating formation Multi-layer ceramics printed circuit board (50)；The number of plies of described multi-layer ceramics printed circuit board (50) and described ceramics base PCB plate (100) Quantity correspond to.

6. multi-layer ceramics printed circuit board according to claim 1 it is characterised in that

The local of printed electronics circuit in area (128) is printed with described electronic circuit in the heat-conducting metal face of described lying copper region (125) Functional network electrically connects, or the printing in area (128) is printed with described electronic circuit in the heat-conducting metal face of described lying copper region (125) Electronic circuit integrally electrically connects.

7. multi-layer ceramics printed circuit board according to claim 1 it is characterised in that

Described electronic circuit prints the isolation area being additionally provided between area (128) and described lying copper region (125) for electric insulation (127), described isolation area (127) is not provided with described laminating layer (130).

8. multi-layer ceramics printed circuit board according to claim 1 it is characterised in that

Described electronic circuit is printed area (128) and is included the high power density part fixed area for arranging high power density part (1283), it is used for arranging the control circuit area (1285) of control circuit and the power electronic circuits for laying power electronic circuits Area (1287).

9. multi-layer ceramics printed circuit board according to claim 1 it is characterised in that

The thickness of described laminating layer (130) is 2 microns to 100 microns.

10. multi-layer ceramics printed circuit board according to claim 1 it is characterised in that

The thickness of described laminating layer (130) is 3 microns to 20 microns.