CN205983523U - Multi -functional financial IC -card - Google Patents
Multi -functional financial IC -card Download PDFInfo
- Publication number
- CN205983523U CN205983523U CN201620589545.5U CN201620589545U CN205983523U CN 205983523 U CN205983523 U CN 205983523U CN 201620589545 U CN201620589545 U CN 201620589545U CN 205983523 U CN205983523 U CN 205983523U
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- CN
- China
- Prior art keywords
- card
- financial
- chip
- layer
- card chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007639 printing Methods 0.000 claims abstract description 8
- 238000004891 communication Methods 0.000 claims description 9
- 230000003993 interaction Effects 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 239000002390 adhesive tape Substances 0.000 claims description 2
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 230000005611 electricity Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 101150095744 tin-9.1 gene Proteins 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
The utility model discloses a multi -functional financial IC -card, including financial IC -card chip (1) and by the lower supreme lower printing layer (2) that sets gradually, down card base layer (3), go up card base layer (4) and last printing layer, upward be equipped with the recess that is used for placing financial IC -card chip on the card base layer, finance IC -card chip (1) encapsulates and sets up behind the carrier band in the recess, be equipped with the IC -card contact on financial IC -card chip (1), still be equipped with between card base layer (3) and the last card base layer (4) down circuit sheet layer (5), circuit sheet layer (5) including the circuit board, is equipped with electronic components (6) that are used for realizing corresponding card function that are used for setting up as required on the circuit board, electronic components (6) are connected with financial IC -card chip (1). Realize the diversification of IC -card function through multi -functional financial IC -card, better satisfied the application demand.
Description
Technical field
This utility model is related to technical field of intelligent card and in particular to a kind of Multifunctional financial IC-card.
Background technology
With the rise of Internet of Things, the variation of product function is also gradually risen, and bank card turned from former magnetic stripe form
Changing to present logic encryption card is CPU card, and CPU card has obtained larger guarantee from safety.But it is as the emerging of Internet of Things
Rise, a lot of online tradings have more functional requirements, the design of existing simple employing paper antenna welding chip to bank card
Mode can not meet the diversified demand of bank card functionality.
Utility model content
For the demand of defect present in prior art and practical application, the purpose of this utility model is to provide one kind
Multifunctional financial IC-card, by this IC-card, can realize the demand of financial IC card functional diversities according to actual needs.
For achieving the above object, the technical solution adopted in the utility model is as follows：
A kind of Multifunctional financial IC-card, the lower printing layer setting gradually including financial IC card chip and from the bottom to top, lower card
Shang Ka basic unit of basic unit and upper printing layer, described Shang Ka basic unit is provided with the groove for placing financial IC card chip, described finance
IC card chip is arranged on after being packaged in carrier band in described groove, and financial IC card chip is provided with IC-card contact；Described Xia Ka basic unit
It is additionally provided with pcb layer and Shang Ka basic unit between, described pcb layer includes wiring board, wiring board is provided with for as needed
The electronic devices and components for realizing corresponding card function of setting, described electronic devices and components are connected with financial IC card chip.
Further, a kind of Multifunctional financial IC-card as above, with described IC-card contact position phase on described wiring board
It is provided with corresponding position and IC-card contact number identical pad, described IC-card contact is connected one to one with pad.
Further, a kind of Multifunctional financial IC-card as above, is additionally provided between described pcb layer and Shang Ka basic unit
Rubberised layer, described rubberised layer is covered in the region on wiring board in addition to described pad, is formed between described pad and rubberised layer
Hole in be filled with conducting medium, described IC-card contact is connected with pad by described conducting medium.
Further, a kind of Multifunctional financial IC-card as above, described conducting medium includes conducting resinl or scolding tin.
Further, a kind of Multifunctional financial IC-card as above, bonding in the described carrier band one side relative with rubberised layer
There is double faced adhesive tape.
Further, a kind of Multifunctional financial IC-card as above, the thickness of described rubberised layer is not less than and sets on wiring board
The height of the electronic devices and components put.
Further, a kind of Multifunctional financial IC-card as above, described financial IC card chip is Contact Type Ic Card chip
Or double-interface card chip.
Further, a kind of Multifunctional financial IC-card as above, described electronic devices and components are including Bluetooth communication mould
Block and battery, described battery is connected with bluetooth communication and financial IC card chip respectively.
Further, a kind of Multifunctional financial IC-card as above, described IC-card is additionally provided with and described financial IC card core
The human-computer interaction module that piece connects, described electronic devices and components include battery, and described battery is connected with human-computer interaction module.
The beneficial effects of the utility model are：Multifunctional financial IC-card provided by the utility model, by wiring board
Improve paper antenna, can need the electronic devices and components of IC-card application are arranged on this wiring board according to practical application, thus real
Show the variation of IC-card function；Additionally, by the rubberised layer set up, both can in the circuit board electronic devices and components receive larger
Implement during bending to protect the planarization it is ensured that when being laminated, turn avoid the difference in height between electronic devices and components and carrier band, facilitate
The machine-shaping of IC-card.
Brief description
Fig. 1 is a kind of sectional view of Multifunctional financial IC-card in this utility model specific embodiment；
Fig. 2 is the top view of rubberised layer in this utility model specific embodiment；
Fig. 3 is position view when carrier band is crimped with rubberised layer in this utility model specific embodiment.
Specific embodiment
This utility model is described in further detail with specific embodiment with reference to Figure of description.
Fig. 1 shows a kind of structural representation of the Multifunctional financial IC-card providing in this utility model specific embodiment
Figure, this Multifunctional financial include financial IC card chip 1 (i.e. bank card chip) and the lower printing layer 2 setting gradually from the bottom to top,
Xia Ka basic unit 3, Shang Ka basic unit 4 and upper printing layer (not shown), described Shang Ka basic unit 4 is provided with for placing financial IC card
The groove of chip 1, described financial IC card chip 1 is arranged in described groove after being packaged in carrier band, and financial IC card chip 1 is provided with
IC-card contact, wherein, is additionally provided with pcb layer 5, described pcb layer 5 includes between described Xia Ka basic unit 3 and Shang Ka basic unit 4
Wiring board, wiring board is provided with for being arranged as required to the electronic devices and components 6 for realizing corresponding card function, described electricity
Sub- components and parts 6 are connected with financial IC card chip 1.
Above-mentioned Multifunctional financial IC-card provided in present embodiment, the function general except having existing bank card
Outward, by increasing pcb layer 5, the electronic devices and components 6 for realizing required function can be arranged in the circuit board.Wherein, electricity
Sub- components and parts 6 can be arranged according to needed for practical application, for example, described electronic devices and components 6 can include bluetooth communication and
Battery, battery is connected with bluetooth communication and financial IC card chip 1 respectively, (includes bluetooth by setting up bluetooth communication
Chip, Bluetooth antenna and required peripheral circuit etc.), battery is bluetooth communication and financial IC card chip provides power supply,
Multifunctional financial IC-card can carry out bluetooth communication with other terminal units and realize data interaction, complete transaction and the IC-card of correlation
Application is downloaded.Again for example, described financial IC card is also provided with the human-computer interaction module being connected with described financial IC card chip 1
(as display screen, button etc.), described electronic devices and components 6 can include battery and some other is used for realizing financial IC card chip 1
The capacitance resistance ware being connected with human-computer interaction module, battery is connected with human-computer interaction module, for providing electricity for human-computer interaction module
Source, when being traded by financial IC card and exterior terminal, financial IC card chip 1 can control and leads to related transaction data
Cross display screen and be shown to user, user can also arrange button and transaction data be confirmed or the operation such as is cancelled.
In present embodiment, described financial IC card chip includes but is not limited to Contact Type Ic Card chip or double-interface card core
Piece, described Xia Ka basic unit 3 and Shang Ka basic unit 4 include but is not limited to layer of PVC, and described wiring board includes but is not limited to pcb board.
In order to realize the connection of financial IC card chip 1 and electronic devices and components 6 on wiring board, with described IC on described wiring board
It is provided with the corresponding position of card contact position and IC-card contact number identical pad, a pair of described IC-card contact and pad 1
Should connect.
In actual production, because meeting increases chip or other electronic devices and components on described wiring board, result in line
The height of the electronic devices and components on the plate of road can increase that (in practical application, it is left that the height of highest devices/chips has reached 0.5mm
Right), but the conventional thickness using the financial IC card chip after carrier tape package only has 0.2mm, if now directly will be packaged
Financial IC card chip be directly connected to wiring board, may result in and there is larger depression at financial IC card chip on IC-card, be not inconsistent
Close the requirement of IC-card standard.
In order to solve the above problems, in present embodiment, between described pcb layer 5 and Shang Ka basic unit 4, it is additionally provided with gluing
Layer 7, described rubberised layer 7 is covered in the region in addition to described pad on wiring board, is formed between described pad and rubberised layer 7
It is filled with conducting medium 9, described IC-card contact is connected with pad by described conducting medium 9 in hole 8.Wherein, described rubberised layer 7
Thickness be not less than wiring board on setting electronic devices and components 6 height.As shown in Fig. 2 in figure white square region is electronics
Components and parts 6 region, in actual production, the surface in order to keep whole rubberised layer 7 smooths, and this region also can be covered by glue,
I.e. in Fig. 2, the region in addition to hole 8 all can be gummed, the hole that the pad that hole 8 is on wiring board and rubberised layer 7 are formed, and leads to
Cross and fill the conducting medium such as conducting resinl or scolding tin 9 in hole 8 it is achieved that stablizing between IC-card contact and circuit pads is electrically connected
Connect, and avoid the above-mentioned problem occurring being recessed.
It should be noted that the shape in described hole 8 includes but is not limited to the circle shown in Fig. 2.On financial IC card chip 1
It can also be eight that the number of IC-card contact can be six, corresponding, and the number in pad and hole 8 can also be six or eight
Individual, the number in the hole shown in Fig. 1 is six, and the number in the hole 8 shown in Fig. 2 is eight.
In order to increase the adhesion strength of carrier band and rubberised layer 7, the carrier band one side relative with rubberised layer 7 is bonded with two-sided
Glue, can pass through the crimping the carrier band being packaged with financial IC card chip 1 with rubberised layer 7 of hot pressing.As shown in figure 3, being financial IC
After the core of the card piece 1 is packaged in carrier band, the connection signal of carrier band and rubberised layer 7 and IC-card contact and the hole 8 being filled with conducting medium 9
Figure.
Obviously, those skilled in the art can carry out various changes and modification without deviating from this practicality to this utility model
New spirit and scope.So, if of the present utility model these modification and modification belong to this utility model claim and
Within the scope of its equivalent technology, then this utility model is also intended to comprise these changes and modification.
Claims (9)
1. a kind of Multifunctional financial IC-card, the lower printing layer (2) setting gradually including financial IC card chip (1) and from the bottom to top,
Xia Ka basic unit (3), Shang Ka basic unit (4) and upper printing layer, described Shang Ka basic unit is provided with for placing the recessed of financial IC card chip
Groove, described financial IC card chip (1) is arranged in described groove after being packaged in carrier band, and financial IC card chip (1) is provided with IC-card
Contact；It is characterized in that：
It is additionally provided with pcb layer (5), described pcb layer (5) includes circuit between described Xia Ka basic unit (3) and Shang Ka basic unit (4)
Plate, wiring board is provided with for being arranged as required to the electronic devices and components (6) for realizing corresponding card function, described electronics
Components and parts (6) are connected with financial IC card chip (1).
2. a kind of Multifunctional financial IC-card according to claim 1 it is characterised in that：With described IC-card on described wiring board
It is provided with the corresponding position of contact position and IC-card contact number identical pad, described IC-card contact is corresponded with pad
Connect.
3. a kind of Multifunctional financial IC-card according to claim 2 it is characterised in that：Described pcb layer (5) and upper card
It is additionally provided with rubberised layer (7), described rubberised layer (7) is covered in the region in addition to described pad on wiring board, institute between basic unit (4)
State in the hole (8) being formed between pad and rubberised layer (7) and be filled with conducting medium (9), described IC-card contact is by described conduction
Medium (9) is connected with pad.
4. a kind of Multifunctional financial IC-card according to claim 3 it is characterised in that：Described conducting medium (9) includes leading
Electric glue or scolding tin.
5. a kind of Multifunctional financial IC-card according to claim 3 it is characterised in that：Described carrier band and rubberised layer (7) phase
To one side on be bonded with double faced adhesive tape.
6. a kind of Multifunctional financial IC-card according to claim 3 it is characterised in that：The thickness of described rubberised layer (7) is not
Height less than the electronic devices and components (6) of setting on wiring board.
7. a kind of Multifunctional financial IC-card according to claim 1 it is characterised in that：Described financial IC card chip (1) is
Contact Type Ic Card chip or double-interface card chip.
8. a kind of Multifunctional financial IC-card according to one of claim 1 to 7 it is characterised in that：Described electronic devices and components
(6) bluetooth communication and battery are included, described battery is connected with bluetooth communication and financial IC card chip respectively.
9. a kind of Multifunctional financial IC-card according to one of claim 1 to 7 it is characterised in that：Also set on described IC-card
There is the human-computer interaction module being connected with described financial IC card chip (1), described electronic devices and components (6) include battery, described battery
It is connected with human-computer interaction module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620589545.5U CN205983523U (en) | 2016-06-16 | 2016-06-16 | Multi -functional financial IC -card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620589545.5U CN205983523U (en) | 2016-06-16 | 2016-06-16 | Multi -functional financial IC -card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205983523U true CN205983523U (en) | 2017-02-22 |
Family
ID=58022069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620589545.5U Expired - Fee Related CN205983523U (en) | 2016-06-16 | 2016-06-16 | Multi -functional financial IC -card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205983523U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109034789A (en) * | 2017-06-08 | 2018-12-18 | 鸿骅科技股份有限公司 | Method for online payment, computer program product and mobile payment card thereof |
-
2016
- 2016-06-16 CN CN201620589545.5U patent/CN205983523U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109034789A (en) * | 2017-06-08 | 2018-12-18 | 鸿骅科技股份有限公司 | Method for online payment, computer program product and mobile payment card thereof |
| CN109034789B (en) * | 2017-06-08 | 2022-02-15 | 鸿骅科技股份有限公司 | Method for online payment, computer program product and mobile payment card thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 100102 Beijing city Chaoyang District Wangjing Lize Park No. 101 Qiming International Building 7 Patentee after: BEIJING WATCHDATA Co.,Ltd. Address before: 100102 Beijing city Chaoyang District Wangjing Lize Park No. 101 Qiming International Building 7 Patentee before: BEIJING WATCH DATA SYSTEM Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170222 |