CN205969542U - Sapphire crystal bar cutting device - Google Patents
Sapphire crystal bar cutting device Download PDFInfo
- Publication number
- CN205969542U CN205969542U CN201620951650.9U CN201620951650U CN205969542U CN 205969542 U CN205969542 U CN 205969542U CN 201620951650 U CN201620951650 U CN 201620951650U CN 205969542 U CN205969542 U CN 205969542U
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- Prior art keywords
- cutter sweep
- push rod
- inroller
- stretches push
- cutting device
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model discloses a sapphire crystal bar cutting device, including cutting device body and grinding device, control panel is installed to the top of cutting device body, the pay -off platform is installed to one side of control panel, and the top of pay -off platform installs the drawing -inroller, the frame is installed to one side of pay -off platform, the motor is installed to the opposite side of frame, and the motor passes through V area and is connected with first flexible push rod transmission. The utility model discloses an install the drawing -inroller of several H shape structure, and pass through the cooperation work of drawing -inroller to reach mesh stable and autoloading, this cutting device is on original basis, and the sapphire crystal bar after accomplishing cutter cutting passes through a grinding device's below, and the direct grinding device of process earlier polishes, delivers to the discharge gate again and carries out processing on next step, has improved the off -the -shelf quality of sapphire crystal bar, saves the time of consumeing later stage material burnishing and polishing.
Description
Technical field
This utility model is related to LED Sapphire Substrate technical field of processing equipment, specially a kind of sapphire ingot cutting
Device.
Background technology
At present, the epitaxial layer of GaN base material and device mainly grows on a sapphire substrate.Sapphire Substrate has many
Advantage：First, the production technology maturation of Sapphire Substrate, device quality are preferable；Secondly, sapphire stability very well, can
It is used in higher temperature growth processes；Finally, sapphire high mechanical strength is it is easy to processing and cleaning.Therefore, most of techniques one
As all using sapphire as substrate.
But in place of existing sapphire ingot cutter sweep has some shortcomings in use, its great majority is
Artificial loading artificial push feed simultaneously, this feeding method not only inefficiency, and operate randomness larger due to artificial,
It is easy to produce larger error or even damage sapphire ingot.
Utility model content
The purpose of this utility model is to provide a kind of sapphire ingot cutter sweep, to solve to carry in above-mentioned background technology
The random larger problem of artificial operation going out.
For achieving the above object, this utility model provides following technical scheme：A kind of sapphire ingot cutter sweep, including
Cutter sweep body and sanding apparatus, the top of described cutter sweep body is provided with control panel, and the one of described control panel
Side is provided with feeding table, and the top of feeding table is provided with drawing-inroller, and organic frame, described frame are installed in the side of described feeding table
Opposite side motor is installed, and motor by V band be in transmission connection with the first stretches push rod, described first stretches push rod another
Side is provided with cutting knife, and the top of cutting knife is provided with protection cap, and the lower section of described first stretches push rod is provided with second and flexible pushes away
Bar, described sanding apparatus are arranged on the opposite side of the second stretches push rod, and the side of described cutter sweep body is provided with discharging opening.
Preferably, described drawing-inroller is H-shaped shape and structure.
Preferably, the bottom of described cutter sweep body is provided with supporting leg.
Preferably, described first stretches push rod is rotated with cutter sweep body by connecting rod and is connected.
Compared with prior art, the beneficial effects of the utility model are：A kind of this sapphire ingot cutter sweep, first,
By being provided with the drawing-inroller of several H-shaped shape and structures, and by the cooperating of drawing-inroller, thus reaching stable and automatically sending
The purpose of material, more conventional artificial feeding is more efficient, avoids the random larger problem of artificial feeding simultaneously；Secondly, should
On the basis of original, the sapphire ingot after the completion of cutting knife is cut passes through the lower section of sanding apparatus to cutter sweep, directly
First pass through the polishing of sanding apparatus, then deliver to the processing that discharging opening carries out next step, which not only improves sapphire ingot finished product
Quality moreover it is possible to save to the time spent by later stage material sanding and polishing, improve the efficiency of work.
Brief description
Fig. 1 is structural representation of the present utility model；
Fig. 2 is side view of the present utility model；
Fig. 3 is drawing-inroller structural representation of the present utility model.
In figure：1- cutter sweep body；2- feeding table；3- control panel；4- drawing-inroller；5- cutting knife；6- protection cap；7- electricity
Machine；8- first stretches push rod；9- frame；10- sanding apparatus；11- second stretches push rod；12- discharging opening；13- supporting leg；14-V
Band；15- connecting rod.
Specific embodiment
Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is carried out
Clearly and completely description is it is clear that described embodiment is only a part of embodiment of this utility model rather than whole
Embodiment.Based on the embodiment in this utility model, those of ordinary skill in the art are not under the premise of making creative work
The every other embodiment being obtained, broadly falls into the scope of this utility model protection.
Refer to Fig. 1-3, a kind of embodiment that this utility model provides：A kind of sapphire ingot cutter sweep, including cutting
Cut device body 1 and sanding apparatus 10, the top of cutter sweep body 1 is provided with control panel 3, the side peace of control panel 3
Equipped with feeding table 2, and the top of feeding table 2 is provided with drawing-inroller 4, and organic frame 9 is installed in the side of feeding table 2, frame 9 another
Side is provided with motor 7, and motor 7 is in transmission connection with the first stretches push rod 8 by V band 14, the opposite side peace of the first stretches push rod 8
Equipped with cutting knife 5, and the top of cutting knife 5 is provided with protection cap 6, and the lower section of the first stretches push rod 8 is provided with the second stretches push rod 11,
Sanding apparatus 10 are arranged on the opposite side of the second stretches push rod 11, and the side of cutter sweep body 1 is provided with discharging opening 12, feeding
Wheel 4 is H-shaped shape and structure, and the bottom of cutter sweep body 1 is provided with supporting leg 13, and the first stretches push rod 8 passes through connecting rod 15
Rotate with cutter sweep body 1 and be connected.
Operation principle：During the work of this utility model sapphire ingot cutter sweep, joined by the drawing-inroller 4 on feeding table 2
Close work and sapphire ingot is pushed to the lower section of cutting knife 5, start motor 7 and drive cutting knife 5 to rotate, adjust the according to job requirement
One stretches push rod 8 is delivered under sanding apparatus 10 reaching the requirement lateral attitude of cutting knife, the sapphire ingot after the completion of cutting
Side, by adjusting the second stretches push rod 11 so that sanding apparatus 10 reach appropriate lateral attitude, the finished product after the completion of polishing by
Discharging opening 12 is sent.
It is obvious to a person skilled in the art that this utility model is not limited to the details of above-mentioned one exemplary embodiment, and
And in the case of without departing substantially from spirit or essential attributes of the present utility model, this practicality can be realized in other specific forms new
Type.Therefore, no matter from the point of view of which point, embodiment all should be regarded as exemplary, and be nonrestrictive, this practicality is new
The scope of type is limited by claims rather than described above, it is intended that the containing of equivalency that will fall in claim
All changes in justice and scope are included in this utility model.Any reference in claim should not be considered as limiting
Involved claim.
Claims (4)
1. a kind of sapphire ingot cutter sweep, including cutter sweep body（1）And sanding apparatus（10）It is characterised in that：Institute
State cutter sweep body（1）Top control panel is installed（3）, described control panel（3）Side feeding table is installed
（2）, and feeding table（2）Top drawing-inroller is installed（4）, described feeding table（2）Side install organic frame（9）, described machine
Frame（9）Opposite side motor is installed（7）, and motor（7）Carried by V（14）With the first stretches push rod（8）It is in transmission connection, described
First stretches push rod（8）Opposite side cutting knife is installed（5）, and cutting knife（5）Top protection cap is installed（6）, described first
Stretches push rod（8）Lower section the second stretches push rod is installed（11）, described sanding apparatus（10）It is arranged on the second stretches push rod
（11）Opposite side, described cutter sweep body（1）Side discharging opening is installed（12）.
2. a kind of sapphire ingot cutter sweep according to claim 1 it is characterised in that：Described drawing-inroller（4）For H-shaped
Shape and structure.
3. a kind of sapphire ingot cutter sweep according to claim 1 it is characterised in that：Described cutter sweep body
（1）Bottom supporting leg is installed（13）.
4. a kind of sapphire ingot cutter sweep according to claim 1 it is characterised in that：Described first stretches push rod
（8）By connecting rod（15）With cutter sweep body（1）Rotate and connect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620951650.9U CN205969542U (en) | 2016-08-27 | 2016-08-27 | Sapphire crystal bar cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620951650.9U CN205969542U (en) | 2016-08-27 | 2016-08-27 | Sapphire crystal bar cutting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205969542U true CN205969542U (en) | 2017-02-22 |
Family
ID=58036430
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620951650.9U Active CN205969542U (en) | 2016-08-27 | 2016-08-27 | Sapphire crystal bar cutting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205969542U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108527695A (en) * | 2018-04-10 | 2018-09-14 | 绍兴文理学院 | A kind of photovoltaic silicon plate precise machining device |
| CN108995060A (en) * | 2018-07-26 | 2018-12-14 | 合肥米弘智能科技有限公司 | A kind of semiconductor integrated circuit wafer fabrication lines and its production and processing method |
| CN108995061A (en) * | 2018-07-26 | 2018-12-14 | 合肥米弘智能科技有限公司 | A kind of semiconductor chip donor wafer system of processing and its processing technology |
-
2016
- 2016-08-27 CN CN201620951650.9U patent/CN205969542U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108527695A (en) * | 2018-04-10 | 2018-09-14 | 绍兴文理学院 | A kind of photovoltaic silicon plate precise machining device |
| CN108995060A (en) * | 2018-07-26 | 2018-12-14 | 合肥米弘智能科技有限公司 | A kind of semiconductor integrated circuit wafer fabrication lines and its production and processing method |
| CN108995061A (en) * | 2018-07-26 | 2018-12-14 | 合肥米弘智能科技有限公司 | A kind of semiconductor chip donor wafer system of processing and its processing technology |
| CN108995060B (en) * | 2018-07-26 | 2020-09-18 | 温州怡沃机械科技有限公司 | Semiconductor integrated circuit wafer processing production line and production processing method thereof |
| CN108995061B (en) * | 2018-07-26 | 2020-09-29 | 河北光森电子科技有限公司 | Semiconductor chip wafer raw material processing system and processing technology thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |