CN205944136U - LED filament light source - Google Patents
LED filament light source Download PDFInfo
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- CN205944136U CN205944136U CN201620892698.7U CN201620892698U CN205944136U CN 205944136 U CN205944136 U CN 205944136U CN 201620892698 U CN201620892698 U CN 201620892698U CN 205944136 U CN205944136 U CN 205944136U
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Abstract
The utility model discloses a LED filament light source, including LED filament base plate, fix the LED chip on LED filament base plate, LED filament base plate includes first base plate and second base plate, be equipped with the flexible circuit board between first base plate and the second base plate, flexible circuit board and first base plate and the 2nd base plate electrically connected, the glazed diffuse layer of LED off -chip cladding, be equipped with the fluorescence glue film on the light scattering layer, owing to be equipped with the light scattering layer between LED chip and fluorescence glue film, thereby will shine the light of fluorescence glue film carries out the diffusion treatment, thereby prevent that the concentrated phenomenon of fluorescence glue film marginal ray from appearing, improve a light evenness, can prevent also simultaneously that the heat from concentrating the phenomenon that fluorescence glue film glue splits appears and appears, prolonged service life.
Description
Technical field
The utility model is related to a kind of LED packaged light source, especially a kind of LED filament light source.
Background technology
Existing LED filament light source is typically fixed with LED chip on substrate and then is externally provided with fluorescent adhesive layer in LED chip
Realize luminous, in recent years with the extensive application of LED filament light source, all-round filament light sources are arisen at the historic moment, Chinese Patent Application No.
CN201420571390.3, publication date is on March 18th, 2015, it discloses a kind of LED filament, including transparent substrate, base
The top surface of plate is provided with layer of fluorescent powder layer, and phosphor powder layer is provided with LED chip, and phosphor powder layer is provided with one layer of fluorescent adhesive layer, institute
State fluorescent adhesive layer parcel LED chip, by using transparency carrier and be provided with the transparent substrate phosphor powder layer realize all-round all
Even luminous, but the light that sends of this kind of all-round luminous LED filament structure LED chip concentrate at the edge of fluorescent adhesive layer thus
Cause fluorescent adhesive layer edge that hot spot occurs, thus affecting light-out effect.In addition, the heat of above-mentioned LED filament is essentially from two
Point, the heat that a part produces for LED chip itself, the light excitated fluorescent powder that another part sends for LED chip, by fluorescent material
Produced heat.And the phosphor powder layer due to above-mentioned LED filament and LED chip are close together, therefore, easily cause heat
The phenomenon concentrated, easily crack or aging phenomenon in fluorescent adhesive layer.
Content of the invention
The purpose of this utility model is to provide a kind of LED filament light source, using structure of the present utility model, can effectively carry
High light-emitting uniformity, reduces the phenomenon that heat is concentrated, increases the service life.
For reaching above-mentioned purpose, the utility model provides a kind of LED filament light source, including LED filament substrate, is fixed on
LED chip on LED filament substrate, LED filament substrate includes first substrate and second substrate, first substrate and second substrate
Between be provided with flexible PCB, flexible PCB is electrically connected with first substrate and second substrate, LED chip be coated with light diffusion
Layer, light diffusion layer is provided with fluorescent adhesive layer.
Due to being provided with light diffusion layer between LED chip and fluorescent adhesive layer, thus the light irradiating fluorescent adhesive layer is expanded
Dissipating and process, thus preventing fluorescent adhesive layer rim ray concentration phenomenon from occurring, improving the uniformity light；Meanwhile, new in this practicality
In type, isolated by light diffusion layer between fluorescent adhesive layer and LED chip, LED chip can effectively be isolated by light diffusion layer and produce
Raw heat and the heat of fluorescent adhesive layer generation, reduce the phenomenon that heat is concentrated, and effectively reduce and fluorescence because of heat concentration
The phenomenon that glue-line glue splits occurs, and extends service life.And it is provided between first substrate and second substrate and can fold
Flexible PCB, thus only need to carry out folding by flexible PCB can achieve all-round luminous, flexible PCB is in expansion shape
During state, at grade can be simple to first substrate and second substrate die bond, manufacturing process.
Further, described light diffusion layer includes hyaline membrane, and hyaline membrane is provided with diffusion bisque, is provided with using hyaline membrane
Diffusion bisque is thus facilitate the formation of light diffusion layer.
Further, the area of first substrate and second substrate area equation, so as to first substrate and second substrate energy
Completely overlapped, really realize all-round luminous.
Further, one end of flexible PCB is located on a surface of first substrate, and the other end of flexible PCB sets
On a surface of second substrate, can be completely overlapped so as to first substrate and second substrate, really realize all-round luminous.
Further, another surface of first substrate is provided with the first die bond region, and another surface of the second metal substrate sets
The second die bond region, the first die bond region and the second die bond region is had to be provided with LED chip, flexible PCB is in folded state
When, first substrate is overlapped with second substrate, and the first die bond region is arranged with the second die bond region, outwardly due to the first base
Die bond region on plate and second substrate is arranged outwardly, so as to facilitate die bond when flexible PCB is in deployed condition,
Flexible PCB is in during folded state and carries out all-round lighting.
Further, described fluorescent adhesive layer includes the first fluorescent adhesive layer and the second fluorescent adhesive layer；In first die bond region
Light diffusion layer be externally provided with the first fluorescent adhesive layer, the light diffusion layer in the second die bond region is externally provided with the second fluorescent adhesive layer, first
Fluorescent adhesive layer on substrate and second substrate is provided separately, and can be convenient for the folding of flexible PCB.
Further, LED chip and LED filament substrate are coated with light diffusion layer, and light diffusion layer is wrapped with fluorescent glue
Layer, so can make the light that LED chip sends excite the fluorescent adhesive layer positioned at LED-baseplate side to light, thus really realizing 360
Degree is luminous.
Brief description
Fig. 1 is the structural representation when flexible PCB launches for the LED filament light source of embodiment 1.
Fig. 2 is the structural representation when flexible PCB folds for the LED filament light source of embodiment 1.
Fig. 3 is the structural representation being fixed with the LED filament substrate of LED chip when flexible PCB launches.
Fig. 4 is the structural representation being fixed with the LED filament substrate of LED chip when flexible PCB folds.
Fig. 5 is a kind of structural representation of the LED filament light source of embodiment 2.
Fig. 6 is another kind of structural representation of the LED filament light source of embodiment 2.
Specific embodiment
With reference to the accompanying drawings and detailed description the utility model is further elaborated.
Embodiment 1.
As depicted in figs. 1 and 2, a kind of LED filament light source, including LED filament substrate 1, is fixed on LED filament substrate 1
LED chip 2, LED chip 2 is coated with light diffusion layer 4, and light diffusion layer 4 is provided with fluorescent adhesive layer 3, in the present embodiment, described
Light diffusion layer 4 includes hyaline membrane and the diffusion bisque being located on hyaline membrane, is provided with adhesive linkage below hyaline membrane（In figure does not illustrate
Come）, by adhesive linkage, light diffusion layer 4 is fixed on substrate, or diffusion bisque can also be located in hyaline membrane；In addition light diffusion
Layer 4 can be spread powder and fluorescent material mixed layer.Fluorescent adhesive layer includes the first fluorescent adhesive layer 31 and the second fluorescent adhesive layer 32.
As shown in Figure 3 and Figure 4, LED filament substrate 1 includes first substrate 11 and second substrate 12, first substrate 11 and
It is provided with flexible PCB 13, flexible PCB 13 is electrically connected with first substrate 11 and second substrate 12 between two substrates 12, first
The area of substrate 11 and second substrate 12 area equation, can be completely overlapped so as to first substrate 11 and second substrate 12,
Really realize all-round luminous.First substrate and second substrate can be ceramic substrate or metal substrate, so on the one hand increase
Area of dissipation, another aspect thermal conductivity factor is also high, therefore, and good heat dissipation, the larger light source of power can be made.
One end of flexible PCB 13 is connected on a surface of first substrate 11, and the other end of flexible PCB 13 is located at
On one surface of second substrate 12, after first substrate 11 and second substrate 12 overlap, flexible PCB 13 overlaps, from
And first substrate 11 and second substrate 12 energy can be allowed completely overlapped, really realize all-round luminous, and, flexible PCB 13
Big with the connection area of first substrate 11 and second substrate 12, thus improve bonding strength.Can also be in first substrate 11
One side is connected with one end of flexible PCB 13, and the one side of second substrate 12 is connected with the other end of flexible PCB 13,
So first substrate 11 and second substrate 12 can directly be superimposed.Simultaneously for the ease of steady between first substrate 11 and second substrate 12
Surely it is superimposed, draw-in groove can be provided with a surface of first substrate 11（In figure is not illustrated out）, second substrate 12 and first
On substrate 11, groove position is correspondingly provided with by snap fit, so by snap fit and draw-in groove after first substrate 11 and second substrate 12 superposition
Match thus the fixation that conveniently realizes between first substrate and second substrate, the structure of snap fit and draw-in groove is existing conventional
Snap fit and notch, here no longer describes in detail.
Another surface of first substrate 11 is provided with the first die bond region 111, and another surface of second substrate 12 is provided with second
Die bond region 121, the first die bond region 111 and the second die bond region 121 are provided with LED chip 2, and flexible PCB 13 is in folding
During overlapping state, first substrate 11 is overlapped with second substrate 12, and the first die bond region 111 and the second die bond region 121 court
Outer setting, in the utility model, described setting outwardly refers to the first die bond region and the second die bond region with respect to first
Faying surface after substrate and second substrate overlap is oppositely arranged.In particular by along the length direction of flexible PCB 13 or width
Degree direction doubling realizes flexible PCB 13 and is in folded state, if first substrate 11 and second substrate 12 are alongst
It is respectively arranged at two ends with positive pole and the negative pole of external circuit, and the length direction of first substrate 11 and second substrate 12 and flexible circuit
The length direction of plate 13 is on same straight line, if the length direction along flexible PCB 13 carries out doubling, flexible circuit
Plate 13 is in the two ends that the positive pole of the external circuit of LED filament light source and negative pole during folded state are located at LED filament substrate respectively；
If the width along flexible PCB 13 carries out doubling, flexible PCB 13 is in LED filament light source during folded state
The positive pole of external circuit and negative pole respectively be located at LED filament substrate same one end, be so easy to line.
In the present embodiment, light diffusion layer 4 is divided into the first light diffusion layer 41 and the second light diffusion layer 42, the first light expands
Scattered layer 41 is located on the LED chip in the first die bond region 111, and the second light diffusion layer 42 is located in the second die bond region 121
On LED chip.It is externally provided with the first fluorescent adhesive layer 31 in the first light diffusion layer 41, be externally provided with the second fluorescence in the second light diffusion layer 42
Glue-line 32, the top surface area of the top surface area of the first fluorescent adhesive layer 31 and the second fluorescent adhesive layer 32 is equal, first substrate 11 and
Fluorescent adhesive layer on two substrates 12 is provided separately.
Due to being provided with light diffusion layer 4 between LED chip 2 and fluorescent adhesive layer 3, thus the light irradiating fluorescent adhesive layer 3 is entered
Row DIFFUSION TREATMENT, thus preventing fluorescent adhesive layer 3 rim ray concentration phenomenon from occurring, improves light-emitting uniformity, in the utility model
In, isolated by light diffusion layer 4 between fluorescent adhesive layer 3 and LED chip 2, LED chip 2 can effectively be isolated by light diffusion layer 4
The heat of generation and the heat of fluorescent adhesive layer 3 generation, the phenomenon that minimizing heat is concentrated, effective reduction is glimmering because of heat concentration appearance
The phenomenon that light glue-line glue splits occurs, and extends service life.And it is provided with permissible between first substrate 11 and second substrate 12
The flexible PCB 3 folding, thus only need to carry out folding by flexible PCB 3 can achieve all-round luminous, flexible PCB 13
It is in deployed condition so that first substrate 11 and second substrate 12 and flexible PCB 13 are in same plane, thus only
Die bond need to be carried out on the same surface of first substrate 11 and second substrate 12, substrate two sides need not be carried out and carry out die bond, thus subtracting
The complexity of little die bond technique.LED filament substrate 1 is formed using first substrate 11 and second substrate 12, on the one hand increases scattered
Hot area, another aspect thermal conductivity factor is also high, therefore, and good heat dissipation, the larger light source of power can be made.
Embodiment 2.
As shown in Figures 3 to 5, a kind of LED filament light source, including LED filament substrate 1, is fixed on LED filament substrate 1
LED chip 2, LED chip 2 and LED filament substrate 1 be coated with light diffusion layer 4, and light diffusion layer 4 is provided with fluorescent adhesive layer 3,
Light diffusion layer 4 is spread powder and fluorescent material mixed layer or hyaline membrane is provided with diffusion bisque, is provided with viscous below hyaline membrane
Connect layer（In figure is not illustrated out）, by adhesive linkage, light diffusion layer 4 is fixed on substrate.
As shown in Figures 3 to 5, LED filament substrate 1 includes first substrate 11 and second substrate 12, first substrate 11 and
It is provided with flexible PCB 13, flexible PCB 13 is electrically connected with first substrate 11 and second substrate 12 between two substrates 12, first
The area of substrate 11 and second substrate 12 area equation, can be completely overlapped so as to first substrate 11 and second substrate 12,
Really realize all-round luminous.First substrate and second substrate can be ceramic substrate or metal substrate, so on the one hand increase
Area of dissipation, another aspect thermal conductivity factor is also high, therefore, and good heat dissipation, the larger light source of power can be made.
One end of flexible PCB 13 is connected on a surface of first substrate 11, and the other end of flexible PCB 13 is located at
On one surface of second substrate 12, after first substrate 11 and second substrate 12 overlap, flexible PCB 13 overlaps, from
And first substrate 11 and second substrate 12 energy can be allowed completely overlapped, really realize all-round luminous, and, flexible PCB 13
Big with the connection area of first substrate 11 and second substrate 12, thus improve bonding strength.Can also be in first substrate 11
One side is connected with one end of flexible PCB 13, and the one side of second substrate 12 is connected with the other end of flexible PCB 13,
So first substrate 11 and second substrate 12 can directly be superimposed.Simultaneously for the ease of steady between first substrate 11 and second substrate 12
Surely it is superimposed, draw-in groove can be provided with a surface of first substrate 11（In figure is not illustrated out）, second substrate 12 and first
On substrate 11, groove position is correspondingly provided with by snap fit, so by snap fit and draw-in groove after first substrate 11 and second substrate 12 superposition
Match thus the fixation that conveniently realizes between first substrate and second substrate, the structure of snap fit and draw-in groove is existing conventional
Snap fit and notch, here no longer describes in detail.
Another surface of first substrate 11 is provided with the first die bond region 111, and another surface of second substrate 12 is provided with second
Die bond region 121, the first die bond region 111 and the second die bond region 121 are provided with LED chip 2, as shown in figure 4, flexible circuit
When plate 13 is in folded state, first substrate 11 is overlapped with second substrate 12, and the first die bond region 111 and the second die bond
Region 121 is arranged outwardly, and in the utility model, described setting outwardly refers to the first die bond region and the second die bond region phase
Faying surface after first substrate and second substrate overlap is oppositely arranged.In particular by the length along flexible PCB 13
Direction or width doubling are realized flexible PCB 13 and are in folded state, if first substrate 11 and second substrate 12 are along length
Degree direction the positive pole and the negative pole that are respectively arranged at two ends with external circuit, and the length direction of first substrate 11 and second substrate 12 with
The length direction of flexible PCB 13 is on same straight line, if the length direction along flexible PCB 13 carries out doubling,
Flexible PCB 13 is in the positive pole of the external circuit of LED filament light source and negative pole during folded state and is located at LED filament base respectively
The two ends of plate；If the width along flexible PCB 13 carries out doubling, flexible PCB 13 is in LED during folded state
The positive pole of the external circuit of filament light sources and negative pole, respectively positioned at same one end of LED filament substrate, are so easy to line.
The LED-baseplate of fixing LED chip is provided with light diffusion layer 4 and fluorescent adhesive layer 3, as shown in figure 5, LED mercerising
The section in source is square, as shown in fig. 6, the section of LED filament light source is circle, light diffusion layer 4 coats LED chip 2 and LED
Silk substrate 1, thus the light that the LED chip 2 being located at edge sends excites the fluorescent adhesive layer 3 positioned at LED filament substrate 1 side concurrent
Light, thus really realize 360 degree light.
Due to being provided with light diffusion layer 4 between LED chip 2 and fluorescent adhesive layer 3, thus the light irradiating fluorescent adhesive layer 3 is entered
Row DIFFUSION TREATMENT, thus preventing fluorescent adhesive layer 3 rim ray concentration phenomenon from occurring, improves light-emitting uniformity, in the utility model
In, isolated by light diffusion layer 4 between fluorescent adhesive layer 3 and LED chip 2, LED chip 2 can effectively be isolated by light diffusion layer 4
The heat of generation and the heat of fluorescent adhesive layer 3 generation, the phenomenon that minimizing heat is concentrated, effective reduction is glimmering because of heat concentration appearance
The phenomenon that light glue-line glue splits occurs, and extends service life.And it is provided with permissible between first substrate 11 and second substrate 12
The flexible PCB 3 folding, thus only need to carry out folding by flexible PCB 3 can achieve all-round luminous, and adopts substrate, section
About cost, flexible PCB 13 is in deployed condition so that at first substrate 11 and second substrate 12 and flexible PCB 13
In same plane, thus only die bond need to be carried out on the same surface of first substrate 11 and second substrate 12, substrate need not be carried out
Two sides carries out die bond, thus reducing the complexity of die bond technique.
Claims (8)
1. a kind of LED filament light source, including LED filament substrate, the LED chip that is fixed on LED filament substrate, its feature exists
In：LED filament substrate includes first substrate and second substrate, is provided with flexible PCB between first substrate and second substrate, soft
Property circuit board is electrically connected with first substrate and second substrate, and LED chip is coated with light diffusion layer, and light diffusion layer is provided with fluorescence
Glue-line.
2. LED filament light source according to claim 1 it is characterised in that：Described light diffusion layer includes hyaline membrane, hyaline membrane
It is provided with diffusion bisque.
3. LED filament light source according to claim 1 it is characterised in that：The area of first substrate and second substrate area
Equal.
4. LED filament light source according to claim 1 it is characterised in that：One end of flexible PCB is located at first substrate
A surface on, the other end of flexible PCB is located on a surface of second substrate.
5. LED filament light source according to claim 4 it is characterised in that：It is solid that another surface of first substrate is provided with first
Crystalline region domain, another surface of second substrate is provided with the second die bond region, and the first die bond region and the second die bond region are provided with LED
Chip, when flexible PCB is in folded state, first substrate is overlapped with second substrate, and the first die bond region and second
Die bond region is arranged outwardly.
6. LED filament light source according to claim 5 it is characterised in that：Described fluorescent adhesive layer includes the first fluorescent glue
Layer and the second fluorescent adhesive layer；Light diffusion layer in first die bond region is externally provided with the first fluorescent adhesive layer, in the second die bond region
Light diffusion layer is externally provided with the second fluorescent adhesive layer.
7. LED filament light source according to claim 6 it is characterised in that：The top surface area of the first fluorescent adhesive layer and second
The area equation of fluorescent adhesive layer top surface.
8. LED filament light source according to claim 1 it is characterised in that：LED chip and LED filament substrate are coated with
Light diffusion layer, light diffusion layer is wrapped with fluorescent adhesive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620892698.7U CN205944136U (en) | 2016-08-17 | 2016-08-17 | LED filament light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620892698.7U CN205944136U (en) | 2016-08-17 | 2016-08-17 | LED filament light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205944136U true CN205944136U (en) | 2017-02-08 |
Family
ID=57919060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620892698.7U Active CN205944136U (en) | 2016-08-17 | 2016-08-17 | LED filament light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205944136U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108039402A (en) * | 2017-12-19 | 2018-05-15 | 深圳市瑞丰光电子股份有限公司 | LED filament substrate, LED encapsulation structure and LED lamp |
| CN112219059A (en) * | 2018-05-29 | 2021-01-12 | 昕诺飞控股有限公司 | Lighting module facilitating color mixing |
| CN113915541A (en) * | 2021-09-24 | 2022-01-11 | 深圳市兰谱芯科技有限公司 | Bulb and lamp string composed of same |
-
2016
- 2016-08-17 CN CN201620892698.7U patent/CN205944136U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108039402A (en) * | 2017-12-19 | 2018-05-15 | 深圳市瑞丰光电子股份有限公司 | LED filament substrate, LED encapsulation structure and LED lamp |
| CN108039402B (en) * | 2017-12-19 | 2019-12-27 | 深圳市瑞丰光电子股份有限公司 | LED filament substrate, LED packaging structure and LED lamp |
| CN112219059A (en) * | 2018-05-29 | 2021-01-12 | 昕诺飞控股有限公司 | Lighting module facilitating color mixing |
| CN113915541A (en) * | 2021-09-24 | 2022-01-11 | 深圳市兰谱芯科技有限公司 | Bulb and lamp string composed of same |
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| GR01 | Patent grant |