CN205819979U - A kind of silicon chip conveying arrangement - Google Patents
A kind of silicon chip conveying arrangement Download PDFInfo
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- CN205819979U CN205819979U CN201620569710.0U CN201620569710U CN205819979U CN 205819979 U CN205819979 U CN 205819979U CN 201620569710 U CN201620569710 U CN 201620569710U CN 205819979 U CN205819979 U CN 205819979U
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- silicon chip
- conveying arrangement
- chip conveying
- inner chamber
- hard shell
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Abstract
This application discloses a kind of silicon chip conveying arrangement, including: with the waterproof hard shell of silicon chip mating shapes, described waterproof hard shell includes base and the top cover that detachable-type sealed connects；In the inner chamber of described waterproof hard shell relative to two sides be respectively arranged with the first clamp groove component and the second clamp groove component for blocking described silicon chip that shape is identical；Described inner chamber is filled with the liquid that described silicon chip is formed buffering.The above-mentioned silicon chip conveying arrangement that the application provides, it is possible to avoid transportation because of the damage of the silicon chip surface caused that rubs mutually, and reduce in silicon chip transportation because rocking crushing of causing, prevent wafer contamination simultaneously.
Description
Technical field
This utility model belongs to photovoltaic products manufacturing technology field, particularly relates to a kind of silicon chip conveying arrangement.
Background technology
Silicon chip used in photovoltaic art, it will usually link prepared by experience phosphorus expansion process, Passivation Treatment and battery, and this
A little links all can increase the structure of easy damaged on the surface of silicon chip.Existing silicon chip manner of packing uses foam plastics to be fixed,
Silicon chip can not be accomplished the most motionless in box, and these treated silicon chips are during transport, and silicon chip easily slides, and makes
Become the easily injured surface structure of the phase mutual friction between silicon chip, cause the decline of battery performance.It addition, the silicon wafer thickness of photovoltaic
Typically between 170um to 200um, belong to friable material, therefore transportation is relatively easily generated broken, causes damage, and
Transportation can cause the oxidation etc. of silicon chip to pollute for a long time.
Utility model content
For solving the problems referred to above, this utility model provides a kind of silicon chip conveying arrangement, it is possible to avoid transportation because of mutually
Rub the damage of the silicon chip surface caused mutually, and reduces in silicon chip transportation because rocking cause broken, prevents silicon chip simultaneously
Pollute.
A kind of silicon chip conveying arrangement that this utility model provides, including:
With the waterproof hard shell of silicon chip mating shapes, described waterproof hard shell includes what detachable-type sealed connected
Base and top cover；
In the inner chamber of described waterproof hard shell relative to two sides be respectively arranged with shape identical for card residence
State the first clamp groove component and second clamp groove component of silicon chip；
Described inner chamber is filled with the liquid that described silicon chip is formed buffering.
Preferably, in above-mentioned silicon chip conveying arrangement, described top cover is provided with liquid injection port and air vent.
Preferably, in above-mentioned silicon chip conveying arrangement, described first clamp groove component and described second clamp groove component are firmly
Matter sponge clamp groove component.
Preferably, in above-mentioned silicon chip conveying arrangement, described waterproof hard shell is POM rigid plastic shell, PC hard
Cabinet or PS rigid plastic shell.
Preferably, in above-mentioned silicon chip conveying arrangement, described inner chamber is rectangular shape, and the length of described inner chamber compares institute
State the big 0.1mm to 2.0mm of width of silicon chip.
Preferably, in above-mentioned silicon chip conveying arrangement, the big 0.1mm of the width of silicon chip described in the aspect ratio of described inner chamber is extremely
2.0mm。
Preferably, in above-mentioned silicon chip conveying arrangement, the axial gross thickness of silicon chip described in the width ratio of described inner chamber is big
0.1cm to 3.0cm.
Preferably, in above-mentioned silicon chip conveying arrangement, the lower surface of the top cover of described waterproof hard shell is provided with convex
Groove, the upper surface of the base of described waterproof hard shell is provided with the Baltimore groove matched with described convex slot.
Preferably, in above-mentioned silicon chip conveying arrangement, described liquid injection port is provided with the first screw lid or first mute
Second screw lid or the second mute lid are installed in lid, and described air vent.
Preferably, in above-mentioned silicon chip conveying arrangement, between described convex slot and described Baltimore groove, it is additionally provided with sealing gasket
Sheet.
By foregoing description, the above-mentioned silicon chip conveying arrangement that this utility model provides, owing to including: with silicon chip shape
The waterproof hard shell matched, described waterproof hard shell includes base and the top cover that detachable-type sealed connects；Described anti-
In the inner chamber of water hard shell relative to two sides be respectively arranged with shape identical for block described silicon chip first card
Channel parts and the second clamp groove component, therefore, it is possible to prevent silicon chip from moving at random, and be filled with described silicon chip in described inner chamber
Form the liquid of buffering, therefore, it is possible to avoid the contact between silicon chip, friction each other will not be produced, in transportation
Rock also function to buffering effect, reduce because acutely rocking the fragment caused such that it is able to avoid transportation because rubbing mutually
Wipe the damage of silicon chip surface caused, and reduce in silicon chip transportation because rocking crushing of causing, prevent wafer contamination simultaneously.
Accompanying drawing explanation
In order to be illustrated more clearly that this utility model embodiment or technical scheme of the prior art, below will be to embodiment
Or the required accompanying drawing used is briefly described in description of the prior art, it should be apparent that, the accompanying drawing in describing below is only
It is embodiment of the present utility model, for those of ordinary skill in the art, on the premise of not paying creative work, also
Other accompanying drawing can be obtained according to the accompanying drawing provided.
The horizontal profile top view of the first silicon chip conveying arrangement that Fig. 1 provides for the embodiment of the present application；
The sectional elevation side view of the first silicon chip conveying arrangement that Fig. 2 provides for the embodiment of the present application.
Detailed description of the invention
Core concept of the present utility model is to provide a kind of silicon chip conveying arrangement, it is possible to avoid transportation because rubbing mutually
Wipe the damage of silicon chip surface caused, and reduce in silicon chip transportation because rocking crushing of causing, prevent wafer contamination simultaneously.
Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of this utility model rather than whole
Embodiment.Based on the embodiment in this utility model, those of ordinary skill in the art are not under making creative work premise
The every other embodiment obtained, broadly falls into the scope of this utility model protection.
As depicted in figs. 1 and 2, Fig. 1 is the embodiment of the present application to the first silicon chip conveying arrangement that the embodiment of the present application provides
The horizontal profile top view of the first the silicon chip conveying arrangement provided, the first silicon chip fortune that Fig. 2 provides for the embodiment of the present application
The sectional elevation side view of defeated device.This silicon chip conveying arrangement includes:
With the waterproof hard shell 1 of silicon chip mating shapes, the shell of existing material, described waterproof hard can be used
Shell includes base 101 and the top cover 102 that detachable-type sealed connects, say, that when base 101 and top cover 102 are connected to
The when of together, it is possible to achieve seal, prevent the liquid of inside from flowing out, also can prevent the air in the external world from entering enclosure and cause
Pollution to silicon chip, and based on this design, needs are dismantled when, lower bottom base 101 can be unloaded, it is also possible to unload top cover
102, this makes it possible to conveniently dismantle and draining, improve work efficiency；
In the inner chamber of described waterproof hard shell 1 relative to two sides be respectively arranged with shape identical for card residence
Stating the first clamp groove component 2 and the second clamp groove component 3 of silicon chip, this is done relative to silicon chip conveying arrangement of the prior art
One improvement, illustrates as a example by square silicon wafer transports, and utilizes described first clamp groove component 2 and the second clamp groove component 3 respectively
After blocking relative two limit of square silicon wafer, silicon chip just can be fixed on position motionless, in transportation, the most not
Can produce significantly rock because of extraneous vibrations, thus avoid the friction between silicon chip, prevent silicon chip from abrading；
Being filled with the liquid 4 that described silicon chip is formed buffering in described inner chamber, this is also relative to silicon of the prior art
The improvement that sheet conveying arrangement is done, this liquid can be deionized water, between silicon chip in infiltration after this liquid,
Owing to liquid has flow behavior, when outer bound pair device produces and acutely rocks, liquid can flow freely, thus offset the external world
Rock the active force that silicon chip is produced, be unlikely to as silicon chip is in close contact generation friction or fragment in the prior art, this
Scheme is prevented from transportation acutely rocking and causes die crack, is possible to prevent long-time transportation silicon chip by oxygen simultaneously
The generation of the pollutions such as change.
By foregoing description, the above-mentioned silicon chip conveying arrangement that the embodiment of the present application provides, owing to including: with silicon chip shape
The waterproof hard shell that shape matches, described waterproof hard shell includes base and the top cover that detachable-type sealed connects；Described
In the inner chamber of waterproof hard shell relative to two sides be respectively arranged with shape identical for blocking the first of described silicon chip
Clamp groove component and the second clamp groove component, therefore, it is possible to prevent silicon chip from moving at random, and be filled with described silicon in described inner chamber
Sheet forms the liquid of buffering, therefore, it is possible to avoid the contact between silicon chip, will not produce friction each other, to transportation
In rock the effect also functioning to buffering, reduce because of acutely rocking the fragment caused such that it is able to avoid transportation because of mutual
The damage of silicon chip surface that friction causes, and reduce in silicon chip transportation because rocking cause broken, prevent silicon chip dirt simultaneously
Dye.
The second silicon chip conveying arrangement that the embodiment of the present application provides, is the basis at the first silicon chip conveying arrangement above-mentioned
On, also include following technical characteristic:
Liquid injection port and air vent it is provided with on described top cover.Inject liquid from described liquid injection port, open simultaneously
Air vent, it is to avoid internal pressure is excessive causes liquid to inject discontented problem, typically when operation, injects after load good seal
Liquid, utilizes described liquid again to seal silicon chip.
The third silicon chip conveying arrangement that the embodiment of the present application provides, is the basis at the first silicon chip conveying arrangement above-mentioned
On, also include following technical characteristic:
Described first clamp groove component and described second clamp groove component are hard foam clamp groove component.It should be noted that
The material that this hard foam clamp groove component is used is conventional material, and procurement cost is low, and enough meets need functionally
Ask, both there is certain stability, it is ensured that silicon chip can maintain static, there is again certain pliability, it is ensured that will not be to silicon chip
Cause the damage on surface, it addition, impurity will not be introduced to silicon chip, it is ensured that the clean characteristic of silicon chip.
The 4th kind of silicon chip conveying arrangement that the embodiment of the present application provides, is the basis at the first silicon chip conveying arrangement above-mentioned
On, also include following technical characteristic:
Described waterproof hard shell is POM rigid plastic shell, PC rigid plastic shell or PS rigid plastic shell.This
A little preferably materials are common stable rigid plastics material, have both had enough intensity, will not be at deformation caused by external forces, to keep away
Exempt from silicon chip fragment, it may have water-proof function, it is to avoid liquid therein oozes out.
The 5th kind of silicon chip conveying arrangement that the embodiment of the present application provides, be above-mentioned the first to the 4th kind of silicon chip transport dress
On the basis of putting any one, also include following technical characteristic:
Described inner chamber is rectangular shape, and the length 0.1mm to 2.0mm bigger than the width of described silicon chip of described inner chamber.
Difference in this size ensures have certain space when inserting silicon chip, be unlikely to silicon chip because of when inserting slightly deviation and produce
Fragment.
The 6th kind of silicon chip conveying arrangement that the embodiment of the present application provides, is the basis at above-mentioned 5th kind of silicon chip conveying arrangement
On, also include following technical characteristic:
The big 0.1mm to 2.0mm of the width of silicon chip described in the aspect ratio of described inner chamber.Difference in this size also for
Ensure insert silicon chip time there is certain space, be unlikely to silicon chip because of insert time slightly deviation and produce fragment.
The 7th kind of silicon chip conveying arrangement that the embodiment of the present application provides, is the basis at above-mentioned 6th kind of silicon chip conveying arrangement
On, also include following technical characteristic:
The big 0.1cm to 3.0cm of axial gross thickness of silicon chip described in the width ratio of described inner chamber.Try through silicon chip mechanical strength
It is about 3cm that checking obtains the maximum deflection deformation distance of 170um-190um thickness silicon chip, therefore, for preventing silicon chip in fortune
Carry the Bending Deformation that the vibrations of box endogenous cause of ill produce to rupture, arrange the width of carrier box inner chamber cannot be greater than silicon chip stack axial width+
3cm。
The 8th kind of silicon chip conveying arrangement that the embodiment of the present application provides, be above-mentioned the first to the 4th kind of silicon chip transport dress
On the basis of any one put, also include following technical characteristic:
The lower surface of the top cover of described waterproof hard shell is provided with convex slot, the base of described waterproof hard shell upper
Surface configuration has the Baltimore groove matched with described convex slot.Joining up and down sealing, upper and lower covers edge increases clinching so that it is close
Envelope, sealing grade only needs transportation water-tight, reaches common beverages box seal standard.
The 9th kind of silicon chip conveying arrangement that the embodiment of the present application provides, is the basis at above-mentioned the second silicon chip conveying arrangement
On, also include following technical characteristic:
First screw lid or the first mute lid are installed on described liquid injection port, and are provided with second on described air vent
Screw lid or the second mute lid.Liquid injection port and air vent can be formed and seal by the lid utilizing these kinds, prevents liquid
Body spills and enters with gas.
The tenth kind of silicon chip conveying arrangement that the embodiment of the present application provides, is the basis at above-mentioned 9th kind of silicon chip conveying arrangement
On, also include following technical characteristic:
It is additionally provided with gasket seal between described convex slot and described Baltimore groove, so can improve the close of device further
Envelope characteristic.
Top cover in use, is first removed, then by silicon chip along the first clamp groove component by above-mentioned silicon chip conveying arrangement with base
Insert with the second clamp groove component, then mounting seat, inject liquid, top cover is finally installed, it is achieved seal.
In sum, the silicon chip conveying arrangement that the embodiment of the present application provides uses two ends fixed multi-disc means of transportation, disappears
Except the generation of silicon chip transportation friction, the Bending Deformation that also can prevent silicon chip from producing in the vibrations of carrier box endogenous cause of ill ruptures, and
Use the shockproof mode of liquid to buffer, it is possible to effectively to stop the effect of oxygen element, play antidetonation and antioxidation two aspect effect.
Described above to the disclosed embodiments, makes professional and technical personnel in the field be capable of or uses this practicality new
Type.Multiple amendment to these embodiments will be apparent from for those skilled in the art, is determined herein
The General Principle of justice can realize in the case of without departing from spirit or scope of the present utility model in other embodiments.Cause
This, this utility model is not intended to be limited to the embodiments shown herein, and is to fit to and principles disclosed herein
The widest scope consistent with features of novelty.
Claims (10)
1. a silicon chip conveying arrangement, it is characterised in that including:
With the waterproof hard shell of silicon chip mating shapes, described waterproof hard shell includes the base that detachable-type sealed connects
And top cover；
In the inner chamber of described waterproof hard shell relative to two sides be respectively arranged with shape identical for blocking described silicon
First clamp groove component of sheet and the second clamp groove component；
Described inner chamber is filled with the liquid that described silicon chip is formed buffering.
Silicon chip conveying arrangement the most according to claim 1, it is characterised in that be provided with on described top cover liquid injection port and
Air vent.
Silicon chip conveying arrangement the most according to claim 1, it is characterised in that described first clamp groove component and described second card
Channel parts is hard foam clamp groove component.
Silicon chip conveying arrangement the most according to claim 1, it is characterised in that described waterproof hard shell is that POM hard is moulded
Material shell, PC rigid plastic shell or PS rigid plastic shell.
5. according to the silicon chip conveying arrangement described in any one of claim 1-4, it is characterised in that described inner chamber is cuboid
Shape, and the length 0.1mm to 2.0mm bigger than the width of described silicon chip of described inner chamber.
Silicon chip conveying arrangement the most according to claim 5, it is characterised in that the width of silicon chip described in the aspect ratio of described inner chamber
Spend big 0.1mm to 2.0mm.
Silicon chip conveying arrangement the most according to claim 6, it is characterised in that the axle of silicon chip described in the width ratio of described inner chamber
To the big 0.1cm to 3.0cm of gross thickness.
8. according to the silicon chip conveying arrangement described in any one of claim 1-4, it is characterised in that the top of described waterproof hard shell
The lower surface of lid is provided with convex slot, and the upper surface of the base of described waterproof hard shell is provided with and matches with described convex slot
Baltimore groove.
Silicon chip conveying arrangement the most according to claim 2, it is characterised in that be provided with the first spiral shell on described liquid injection port
Spiral cover or the first mute lid, and the second screw lid or the second mute lid are installed on described air vent.
Silicon chip conveying arrangement the most according to claim 8, it is characterised in that between described convex slot and described Baltimore groove
It is additionally provided with gasket seal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620569710.0U CN205819979U (en) | 2016-06-14 | 2016-06-14 | A kind of silicon chip conveying arrangement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620569710.0U CN205819979U (en) | 2016-06-14 | 2016-06-14 | A kind of silicon chip conveying arrangement |
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| Publication Number | Publication Date |
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| CN205819979U true CN205819979U (en) | 2016-12-21 |
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| CN201620569710.0U Active CN205819979U (en) | 2016-06-14 | 2016-06-14 | A kind of silicon chip conveying arrangement |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105857916A (en) * | 2016-06-14 | 2016-08-17 | 晶科能源有限公司 | Silicon wafer transporting device |
-
2016
- 2016-06-14 CN CN201620569710.0U patent/CN205819979U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105857916A (en) * | 2016-06-14 | 2016-08-17 | 晶科能源有限公司 | Silicon wafer transporting device |
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