CN205789806U

CN205789806U - The thermal element structure of circuit breaker release

Info

Publication number: CN205789806U
Application number: CN201620532424.7U
Authority: CN
Inventors: 唐维春; 王炯华; 顾建青
Original assignee: Changshu Switchgear Manufacturing Co Ltd
Current assignee: Changshu Switchgear Manufacturing Co Ltd
Priority date: 2016-06-02
Filing date: 2016-06-02
Publication date: 2016-12-07
Anticipated expiration: 2026-06-02

Abstract

The thermal element structure of a kind of circuit breaker release, belongs to breaker of plastic casing technical field.Including the thermal element body and the bimetal leaf of detection heat that produce heat when flowing through electric current, thermal element body electrically connects with chopper return conductors, the bimetal leaf root of bimetal leaf is connected with the thermal element body root of thermal element body, and described bimetal leaf root is connected for bonding connection with described thermal element body root.Avoid in prior art and cause the impact of the acting characteristic on bimetal leaf because using welding, riveting or threaded mechanical connection manner；The flexible selectivity requirement in actual production process can be met；Due to bonding connection have good can corrective, thus the batch loss that the welding being avoided that in prior art, riveting mistake cause, be possible not only to prevent the wasting of resources, embody economy；Be conducive to the qualification rate of concordance and the Characteristics Detection improving assembling.

Description

The thermal element structure of circuit breaker release

Technical field

This utility model belongs to breaker of plastic casing technical field, is specifically related to the thermal element structure of a kind of circuit breaker release.

Background technology

As is known in the industry, chopper is the switching device that a kind of not only can close, carry and cut-off the electric current under normal loop but also can close, carry and cut-off electric current under abnormal loop condition within the time of regulation.The major function of electrical apparatus release is: the period internal trigger tripgear of regulation after the overcurrent rated current scope beyond chopper and use and automatically cut off faulty circuit, dangerous to avoid damaging even initiation fire with electric line and relevant device.

In the structural system of the thermal element of circuit breaker release, why the application of bimetal leaf relatively has typicality, it is because utilizing its intrinsic heated bending (also referred to as " deformation ") and produces thrust (such as triggering the physical characteristic that electrical apparatus release is threaded off) and carry out the difference that the caloric value of discriminating cut-out faulty circuit is different from the caloric value of normal circuit, and this physical characteristic based on bimetal leaf, under conditions of respective circuit breakers product standard allows, change the serial relation of bimetal leaf and chopper return conductors, the protection requirement to different protection features can be met.

Aforesaid thermal element structure includes thermal element body and bimetal leaf (also referred to as " bimetallic element ", as follows), thermal element body and aforesaid chopper return conductors electrical ties, bimetal leaf and this mates of thermal element.The coupled structure of bimetal leaf and thermal element body mainly has three kinds: one to be direct-heating type structure；Two is indirect heating type structure；Three is compound-heating structure.In aforesaid three kinds of structures, coordinating of bimetal leaf and thermal element body commonly used is welded, riveting and threaded in any one.

The thermal element structure chart of the circuit breaker release that Fig. 1 show in prior art, including the thermal element body 1 and the bimetal leaf 2 of detection heat that produce heat when flowing through electric current, the base portion (bottom shown in Fig. 1) of bimetal leaf 2 and thermal element body 1 realizes physical connection (being i.e. mechanically connected) with aforementioned chopper return conductors 3 three by welding manner, specifically, the bimetal leaf root 21 of bimetal leaf 2 side towards thermal element body 1 and thermal element body root 11 solid welding of thermal element body 1, and the bimetal leaf electricity root 21 of bimetal leaf 2 is towards side and chopper return conductors 3 solid welding of chopper return conductors 3.Although the thermal element structure of the circuit breaker release of this form disclosure satisfy that the functional requirement that applicant is mentioned above, but owing to have employed welding, thus there is following shortcoming: one, due in welding process bimetallic sector-meeting because of welding time shock heating and produce certain change in physical properties, even there is differential annealing situation, thus the acting characteristic of bimetal leaf is produced impact；They are two years old, owing to thermal element body 1, bimetal leaf 2 and chopper return conductors 3 three show as permanent connection, thus once mistake weldering occur or being unsatisfactory for the situation that welding quality requires, then process only as scrap because (dismemberent) cannot be dismantled, on the one hand cause the wasting of resources, on the other hand increase manufacturing cost；They are three years old; owing to the quality of welding is relevant to parts properties of materials; it is to reach protection feature needed for chopper with the form of variation combination to require due to the specification of thermal element body 1 and bimetal leaf 2 again; therefore the quality of welding quality can affect product quality equally; they are four years old; owing to have employed welding, thus not only efficiency is low, and needs to consume the auxiliary material (solder) of welding.

The thermal element structure chart of the another form of circuit breaker release that Fig. 2 show in prior art, including thermal element body 1 and bimetal leaf 2, the bimetal leaf root 21 of bimetal leaf 2 is riveted with thermal element body 1 by rivet 211.This structure can avoid the quality fluctuation of shock heating initiation electrical apparatus release when welding for the welding that Fig. 1 uses, but there is following shortcoming: one, when using rivet 211 to rivet, rivet 211, bimetal leaf 2 and thermal element body 1 can produce riveting pressure, specifically, at riveting location, rivet 211 can produce bigger local pressure to bimetal leaf 2；Thus affect the action effect of the heated bending deformation of bimetal leaf 2；They are two years old, owing to thermal element body 1, bimetal leaf 2 etc. are affected by crudy, thus the planarization at riveting position produces difference, and then bimetal leaf 2 is after staking easily around riveting fulcrum bending, thus affect circuit breaker characteristic detection concordance fluctuation, say, that affect accuracy of detection；Its three, equally exist aforementioned welding second point shortcoming.

Now analyze in the way of bimetal leaf uses heating indirectly with thermal element body: the physical connection reliability perspectives between part is analyzed: welding optimum, riveting is taken second place, threaded worst.From processes angle analysis: spiral marking connection efficiency optimization, riveting is taken second place, and welds worst.Analyze from part efficiency of assembling: threaded to relate to operation minimum, but joint efficiency is low and is difficult to ensure that with quality of connection (bond strength) concordance, weld and compare high with the parts efficiency of assembling after riveting, but once rivet, weld generation mistake, faulty part and the loss that causes is big.Additionally use the residual stress that all can there is processing in the bimetal element after the processing of these three connected mode; residual stress records due to bad measurement; so the concordance of the overload protection characteristics inspection of chopper can produce diversity; add product adjustment, amount of testing; unfavorable to production efficiency undoubtedly, in a disguised form add production cost.

It addition, chopper is in the design process, calculate the diversity bigger with physical presence owing to heat generation characteristic being designed.And transship long delay protection exactly make use of the protection feature of electric current-heat realize protection.The different current specification protected according to chopper, the bimetal leaf of the thermal element and different size that generally require different resistivity carry out coupling realize characteristic protection.This just need to do substantial amounts of different tests, in order to verifies which bi-material coupling of employing is only rational situation.According to riveting or the mode of welding, this undoubtedly can problem on generation efficiency.During conventional batch produces, if material is wrong, causes bimetal piece to rivet with thermal element body and weld generation mispairing it is possible to scrap in batch.Further, owing to the processing in riveting, welding process makes bimetal leaf there occurs deformation, causing into platform examination and test of products qualification rate low, such problem not only causes part loss to have an effect on normal production.

Can be seen in the technical information of thermal element structure in disclosed Chinese patent literature, as CN204905192U recommendation has " the Thermal protection mechanism of a kind of chopper ", thermal element body and bimetal leaf have employed riveting (description the 0019th to 0022 section)；And for example CN20405524U is provided with " thermal element assembly ", its technical scheme includes: thermal element body, thermal element body include fixture and movable part, fixture is hinged with movable part, and thermal element body abuts with bimetal leaf, and movable part is connected with bimetal leaf sliding.It is technically characterized in that: make that bimetal leaf is hinged with movable part all the time in BENDING PROCESS to be contacted, by movable part, the heat of thermal element body is passed to bimetal leaf, high to reduce the temperature ladder between thermal element body and bimetal leaf, improve the reliability of acting characteristic.From this patent specification content, owing to movable part and bimetal leaf, thermal element body form the relation of mutually hinged assembling, thus for engineering significance, there is between movable part and bimetal leaf the anxiety of jam between jam and movable part and thermal element body in this version.

For above-mentioned prior art, it is necessary to rational modification in addition, make useful design for this applicant and defined technical scheme described below.

Summary of the invention

Task of the present utility model is to provide one not only can ensure overload long delay protection characteristic but also can simplify structure, and meets Automated assembly and hand assembled requirement simultaneously and use the thermal element structure of the most selective circuit breaker release embodied in production process.

Task of the present utility model is performed by, a kind of thermal element structure of circuit breaker release, including the thermal element body and the bimetal leaf of detection heat that produce heat when flowing through electric current, thermal element body electrically connects with chopper return conductors, the bimetal leaf root of bimetal leaf is connected with the thermal element body root of thermal element body, and described bimetal leaf root is connected for bonding connection with described thermal element body root.

In a specific embodiment of the present utility model, the bimetal leaf root of described bimetal leaf passes through conductive adhesion layer and the described thermal element body root side bonding connection towards bimetal leaf towards the side of described thermal element body.

In another specific embodiment of the present utility model, described conductive adhesion layer is high temperature resistant conductive bond oxidant layer.

In another specific embodiment of the present utility model, described high temperature resistant conductive bond oxidant layer is graphite conductive adhesive, silver conductive adhesive or Signa Gel.

One of technique effect of technical scheme that this utility model provides, due to the bonding connection that on-mechanical connects that has been connected by by bimetal leaf base portion with thermal element body base, thus avoid in prior art and cause the impact of the acting characteristic on bimetal leaf because using welding, riveting or threaded mechanical connection manner；Two, owing to bonding connection is for Automated assembly and the strong adaptability of hand assembled, thus the flexible selectivity requirement in actual production process can be met；Four, due to bonding connection have good can corrective, thus the batch loss that the welding being avoided that in prior art, riveting mistake cause, be possible not only to prevent the wasting of resources, and economy can be embodied；Five, be conducive to improving the qualification rate of concordance and the Characteristics Detection of assembling.

Accompanying drawing explanation

Fig. 1 is the thermal element structure chart of the circuit breaker release in prior art.

Fig. 2 is the thermal element structure chart of the another form of circuit breaker release in prior art.

Fig. 3 is the enforcement illustration of the thermal element structure of this utility model circuit breaker release.

Detailed description of the invention

Embodiment 1:

Refer to Fig. 3, show that the thermal element body 1 producing heat when flowing through electric current of the thermal element structural system belonging to circuit breaker release and a bimetal leaf 2(of detection heat also can claim bimetallic element, as follows), thermal element body 1 electrically connects with the chopper return conductors 3 shown in Fig. 3, the bimetal leaf root 21(bimetal leaf root 21 of bimetal leaf 2 can be regarded as bottom or the lower end of bimetal leaf 2, as follows) can be regarded as bottom or the lower end of thermal element body 1 with the thermal element body root 11(thermal element body root 11 of thermal element body 1, as follows) it is connected.

As the technical essential of the technical scheme that this utility model provides, in the present embodiment, the connected mode being connected with aforementioned thermal element body root 11 by aforementioned bimetal leaf root 21 uses bonding connection.Specifically, also can claim conductive bond oxidant layer towards the side of thermal element 1 by conductive adhesion layer 4(by the bimetal leaf root 21 of bimetal leaf 2) with thermal element body root 11 towards the side bonding connection of bimetal leaf 2.

When actual assembling, first conductive adhesion layer 4 is attached to the bimetal leaf root 21 side towards thermal element body 1, first conductive adhesion layer 4 can also be attached to the thermal element body root 11 side towards bimetal leaf 2, again bimetal leaf root 21 is reclined with thermal element body root 11, so that the side in opposite directions of bimetal leaf root 21 and thermal element body root 11 realizes electrical connection, connect owing to this connection belongs to on-mechanical, thus relative to the welding of prior art, for riveting, will not produce between bimetal leaf 2 and thermal element body 1 and combine stress, electrical apparatus release will not be produced and manufacture deformation, both manufacturing cost can have been reduced, manufacture efficiency can be improved again.

In the present embodiment, aforesaid conductive adhesion layer 4 is high temperature resistant conductive bond oxidant layer, and preferably employs graphite conductive adhesive and serve as high temperature resistant conductive bond oxidant layer.

Embodiment 2:

Only using high temperature resistant conductive bond oxidant layer instead silver conductive adhesive, remaining is all with the description to embodiment 1.

Embodiment 3:

Only using high temperature resistant conductive bond oxidant layer instead Signa Gel, remaining is all with the description to embodiment 1.

In sum, the technical scheme that this utility model provides compensate for the shortcoming in prior art, completes invention task, has cashed the technique effect referred in applicant's superincumbent technique effect hurdle faithfully.

Claims

1.A kind of The thermal element structure of circuit breaker release, including the thermal element body (1) and the bimetal leaf (2) of detection heat that produce heat when flowing through electric current, thermal element body (1) electrically connects with chopper return conductors (3), the bimetal leaf root (21) of bimetal leaf (2) is connected with thermal element body root (11) of thermal element body (1), it is characterised in that described bimetal leaf root (21) is connected for bonding connection with described thermal element body root (11).

2.According to claim 1 The thermal element structure of circuit breaker release, it is characterised in that The bimetal leaf root (21) of described bimetal leaf (2) passes through conductive adhesion layer (4) and described thermal element body root (11) the side bonding connection towards bimetal leaf (2) towards the side of described thermal element body (1).

3.According to claim 2 The thermal element structure of circuit breaker release, it is characterised in that Described conductive adhesion layer (4) is high temperature resistant conductive bond oxidant layer.

4.According to claim 3 The thermal element structure of circuit breaker release, it is characterised in that Described high temperature resistant conductive bond oxidant layer is graphite conductive adhesive, silver conductive adhesive or Signa Gel。