CN205755035U - A kind of soft and hard combined printing circuit board - Google Patents
A kind of soft and hard combined printing circuit board Download PDFInfo
- Publication number
- CN205755035U CN205755035U CN201620462920.XU CN201620462920U CN205755035U CN 205755035 U CN205755035 U CN 205755035U CN 201620462920 U CN201620462920 U CN 201620462920U CN 205755035 U CN205755035 U CN 205755035U
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- layer
- rigid substrate
- soft
- base plate
- flexible base
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Abstract
The utility model discloses a kind of soft and hard combined printing circuit board, including flexible base plate, the both sides up and down of described flexible base plate are provided with soft board coverlay, the two ends, left and right, outside of described soft board coverlay are provided with and combine glue-line, the outside of described combination glue-line is provided with rigid substrate, the conducting window of indent it is provided with between described rigid substrate and flexible base plate, the copper face of described conducting window is provided with cementing coating, rigid substrate is provided with the metal cementing layer corresponding with cementing coating, some radiating grooves are offered on described rigid substrate, the outside of flexible base plate and rigid substrate is provided with electromagnetic shielding film, oriented film is included on described electromagnetic shielding film, metal film layer, conduction adhesive layer and release protective layer, described oriented film, metal film layer, conduction adhesive layer and release protective layer set gradually from top to bottom.This utility model simple in construction, easy to use, low cost, service life is long, and application prospect is good.
Description
Technical field
This utility model relates to wiring board techniques field, specifically a kind of soft and hard combined printing circuit board.
Background technology
The birth of FPC Yu PCB and development, expedited the emergence of this new product of Rigid Flex.Therefore, flexible and hard combined circuit board is exactly flexible circuit board and rigid wiring board in fact, through operations such as pressings, combines by related process requirement.It is thin that flexible and hard combined circuit board has thickness, lightweight, and volume is little, and three dimensions can the advantage such as free bend, flexible, folding.Just because of it, there is above-described premium properties, so it can be pushed further into the miniaturization of electronic product, lightness, slimming and mobilism development.Flexible and hard combined circuit board is mainly used in the various electronic fields such as mobile phone, battery of mobile phone, talk back equipment, notebook computer, computer periphery, PDA, CD-ROM, VCD, DVD, magnetic head, printer, facsimile machine, photocopier, photographing unit, develop along with electronic product is inclined to portable, ultra-thin direction, requirement to the wiring of wiring board unit are is more and more higher, the wiring board combined especially for soft or hard.The live width and the adjacent wires spacing that such as cause circuit single wire are more and more less, so that the heat on wiring board is increasingly difficult to distribute, thus affect the service life of wiring board.
Utility model content
The purpose of this utility model is to provide a kind of simple in construction, soft and hard combined printing circuit board easy to use, with the problem solving to propose in above-mentioned background technology.
For achieving the above object, the following technical scheme of this utility model offer:
A kind of soft and hard combined printing circuit board, including flexible base plate, the both sides up and down of described flexible base plate are provided with soft board coverlay, the two ends, left and right, outside of described soft board coverlay are provided with and combine glue-line, the outside of described combination glue-line is provided with rigid substrate, the conducting window of indent it is provided with between described rigid substrate and flexible base plate, the copper face of described conducting window is provided with cementing coating, rigid substrate is provided with the metal cementing layer corresponding with cementing coating, some radiating grooves are offered on described rigid substrate, the outside of flexible base plate and rigid substrate is provided with electromagnetic shielding film, oriented film is included on described electromagnetic shielding film, metal film layer, conduction adhesive layer and release protective layer, described oriented film, metal film layer, conduction adhesive layer and release protective layer set gradually from top to bottom.
As further program of the utility model: described metal cementing layer and cementing coating dissolve each other and forms conductting layer structure.
As this utility model further scheme: the metal forming that described metal film layer is copper or aluminum is made.
Compared with prior art, the beneficial effects of the utility model are: offer radiating groove, are effectively distributed by the heat on hard wire plate by radiating groove, improve the service life of wiring board.Electromagnetic shielding film includes oriented film layer, metal film layer, conduction adhesive layer and release protective layer；Metal film layer can use sputtering vacuum process to be formed, it would however also be possible to employ the more preferable metal forming of effectiveness；Oriented film layer can use commercial high molecular polymer thin layer, can also be by coating macromolecular solution and through heat cure formation, can also be formed by hot melt curtain coating mode for high molecular polymer, hot strength may be up to more than 120MPa, and pliability is good, the high offset of Rigid Flex can be well adapted for, and having good conduction property, conducting resistance is below 300 milliohms, and effectiveness is good, can reach more than 50db, commercial introduction application prospect is good.Posting on soft board coverlay and combine glue-line, thus be greatly improved the adhesion of rigid-flex, prevent layering from departing from, compared with traditional employing fibre resin prepreg, thickness is thinner；Soft board is offered conducting window, and make clinkering coating, on hardboard, plating or chemistry plate out metal clinkering layer, conductting layer is formed by adding hot pressing or ultrasound wave heat welded, not only enormously simplify processing technology, and cost is relatively low, and the conductting layer reliability formed is more preferably, the rigid-flexible circuit board flatness made is good, also add the region that design can connect up.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the structural representation of electromagnetic shielding film.
Detailed description of the invention
Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is clearly and completely described, it is clear that described embodiment is only a part of embodiment of this utility model rather than whole embodiments.Based on the embodiment in this utility model, the every other embodiment that those of ordinary skill in the art are obtained under not making creative work premise, broadly fall into the scope of this utility model protection.
Refer to Fig. 1 and Fig. 2, in this utility model embodiment, a kind of soft and hard combined printing circuit board, including flexible base plate 1, the both sides up and down of described flexible base plate 1 are provided with soft board coverlay 2, the two ends, left and right, outside of described soft board coverlay 2 are provided with and combine glue-line 3, the outside of described combination glue-line 3 is provided with rigid substrate 4, the conducting window 5 of indent it is provided with between described rigid substrate 4 and flexible base plate 1, the copper face of described conducting window 5 is provided with cementing coating, rigid substrate 4 is provided with the metal cementing layer corresponding with cementing coating, described metal cementing layer and cementing coating dissolve each other and form conductting layer structure.Posting on soft board coverlay 2 and combine glue-line 3, thus be greatly improved the adhesion of rigid-flex, prevent layering from departing from, compared with traditional employing fibre resin prepreg, thickness is thinner；Soft board is offered conducting window 5, and make clinkering coating, on hardboard, plating or chemistry plate out metal clinkering layer, conductting layer is formed by adding hot pressing or ultrasound wave heat welded, not only enormously simplify processing technology, and cost is relatively low, and the conductting layer reliability formed is more preferably, the rigid-flexible circuit board flatness made is good, also add the region that design can connect up.
Some radiating grooves 6 are offered on described rigid substrate 1; effectively the heat on hard wire plate is distributed by radiating groove 6; improve the service life of wiring board; the outside of flexible base plate 1 and rigid substrate 4 is provided with electromagnetic shielding film 7; oriented film 8, metal film layer 9, conduction adhesive layer 10 and release protective layer 11 is included on described electromagnetic shielding film 7; described oriented film 8, metal film layer 9, conduction adhesive layer 10 and release protective layer 11 set gradually from top to bottom, the metal forming that described metal film layer 9 is copper or aluminum is made.Metal film layer 9 can use sputtering vacuum process to be formed, it would however also be possible to employ the more preferable metal forming of effectiveness；Oriented film layer 8 can use commercial high molecular polymer thin layer, can also be by coating macromolecular solution and through heat cure formation, can also be formed by hot melt curtain coating mode for high molecular polymer, hot strength may be up to more than 120MPa, and pliability is good, the high offset of Rigid Flex can be well adapted for, and having good conduction property, conducting resistance is below 300 milliohms, and effectiveness is good, can reach more than 50db, commercial introduction application prospect is good.
It is obvious to a person skilled in the art that this utility model is not limited to the details of above-mentioned one exemplary embodiment, and in the case of without departing substantially from spirit or essential attributes of the present utility model, it is possible to realize this utility model in other specific forms.Therefore, no matter from the point of view of which point, embodiment all should be regarded as exemplary, and be nonrestrictive, scope of the present utility model is limited by claims rather than described above, it is intended that all changes fallen in the implication of equivalency and scope of claim included in this utility model.Should not be considered as limiting involved claim by any reference in claim.
In addition, it is to be understood that, although this specification is been described by according to embodiment, but the most each embodiment only comprises an independent technical scheme, this narrating mode of description is only for clarity sake, description should can also be formed, through appropriately combined, other embodiments that it will be appreciated by those skilled in the art that as an entirety, the technical scheme in each embodiment by those skilled in the art.
Claims (3)
- null1. a soft and hard combined printing circuit board，Including flexible base plate (1)，It is characterized in that，The both sides up and down of described flexible base plate (1) are provided with soft board coverlay (2)，The two ends, left and right, outside of described soft board coverlay (2) are provided with and combine glue-line (3)，The outside of described combination glue-line (3) is provided with rigid substrate (4)，The conducting window (5) of indent it is provided with between described rigid substrate (4) and flexible base plate (1)，The copper face of described conducting window (5) is provided with cementing coating，Rigid substrate (4) is provided with the metal cementing layer corresponding with cementing coating，Some radiating grooves (6) are offered on described rigid substrate (1)，The outside of flexible base plate (1) and rigid substrate (4) is provided with electromagnetic shielding film (7)，Oriented film (8) is included on described electromagnetic shielding film (7)、Metal film layer (9)、Conduction adhesive layer (10) and release protective layer (11)，Described oriented film (8)、Metal film layer (9)、Conduction adhesive layer (10) and release protective layer (11) set gradually from top to bottom.
- A kind of soft and hard combined printing circuit board the most according to claim 1, it is characterised in that described metal cementing layer and cementing coating dissolve each other and forms conductting layer structure.
- A kind of soft and hard combined printing circuit board the most according to claim 1, it is characterised in that the metal forming that described metal film layer (9) is copper or aluminum is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620462920.XU CN205755035U (en) | 2016-05-20 | 2016-05-20 | A kind of soft and hard combined printing circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620462920.XU CN205755035U (en) | 2016-05-20 | 2016-05-20 | A kind of soft and hard combined printing circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205755035U true CN205755035U (en) | 2016-11-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620462920.XU Expired - Fee Related CN205755035U (en) | 2016-05-20 | 2016-05-20 | A kind of soft and hard combined printing circuit board |
Country Status (1)
| Country | Link |
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| CN (1) | CN205755035U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107241853A (en) * | 2017-06-29 | 2017-10-10 | 广州兴森快捷电路科技有限公司 | A kind of shield type rigid-flex combined board and its manufacture method |
| CN109688730A (en) * | 2019-02-02 | 2019-04-26 | 维沃移动通信有限公司 | A kind of production method and Rigid Flex of Rigid Flex |
| CN111194142A (en) * | 2018-11-14 | 2020-05-22 | 三星电机株式会社 | Printed circuit board and method for manufacturing the same |
| CN114698225A (en) * | 2020-12-31 | 2022-07-01 | 深南电路股份有限公司 | Battery protection plate, manufacturing method thereof and electronic device |
-
2016
- 2016-05-20 CN CN201620462920.XU patent/CN205755035U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107241853A (en) * | 2017-06-29 | 2017-10-10 | 广州兴森快捷电路科技有限公司 | A kind of shield type rigid-flex combined board and its manufacture method |
| CN111194142A (en) * | 2018-11-14 | 2020-05-22 | 三星电机株式会社 | Printed circuit board and method for manufacturing the same |
| CN109688730A (en) * | 2019-02-02 | 2019-04-26 | 维沃移动通信有限公司 | A kind of production method and Rigid Flex of Rigid Flex |
| CN114698225A (en) * | 2020-12-31 | 2022-07-01 | 深南电路股份有限公司 | Battery protection plate, manufacturing method thereof and electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161130 Termination date: 20170520 |