CN205710898U - The equipment of electron beam assisted plasma sputter flexibility coat copper plate - Google Patents
The equipment of electron beam assisted plasma sputter flexibility coat copper plate Download PDFInfo
- Publication number
- CN205710898U CN205710898U CN201620670169.2U CN201620670169U CN205710898U CN 205710898 U CN205710898 U CN 205710898U CN 201620670169 U CN201620670169 U CN 201620670169U CN 205710898 U CN205710898 U CN 205710898U
- Authority
- CN
- China
- Prior art keywords
- roll
- electron beam
- deflector roll
- control target
- magnetic control
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Physical Vapour Deposition (AREA)
Abstract
This utility model relates to the equipment of electron beam assisted plasma sputter flexibility coat copper plate, including vacuum chamber and be arranged in vacuum chamber dividing plate, multiple electron beam auxiliary device, multipair magnetic control target, base material, for control base material run working line assembly；Let off roll that working line assembly includes setting gradually along base material operating path, the first deflector roll, the first measuring roll, the second deflector roll, water-cooled drum, the 3rd deflector roll, the second measuring roll, the 4th deflector roll, wind-up roll；Multipair magnetic control target is along the circumferential directions of water-cooled drum circumferential surface, and an electron beam auxiliary device is all arranged in the both sides of every pair of magnetic control target；Let off roll, the first deflector roll, the first measuring roll, the second deflector roll, the 3rd deflector roll, the second measuring roll, the 4th deflector roll, wind-up roll are positioned at the top of dividing plate, and electron beam auxiliary device, magnetic control target are positioned at the lower section of dividing plate.This utility model is effectively improved the deposition quality of thin metal layer, significantly promotes thin metal layer and the adhesion of base material, belongs to electronics industry art field.
Description
Technical field
This utility model relates to the electronics industry art field such as flex circuit application, flexible touch screen, particularly relates to electron beam auxiliary
Help the equipment of plasma sputter flexibility coat copper plate.
Background technology
The flexibility coat copper plate that existing electronics industry uses, has employing rubbing method, laminating etc., but is because making
Obtain ultra-thin Copper Foil, and progressively develop into the new preparation method using vacuum sputtering re-plating, i.e. with PI film as base material, utilize
After the method for vacuum sputtering coating plates thin metal layer (Seed Layer) on PI film, then make the thickness of copper on thin metal layer with galvanoplastic
Degree increases.
But after plating thin metal layer by existing vacuum magnetic-control sputtering method, because film adhesion is poor, electroplate at subsequent technique
During, the regional area of sputtering Copper thin film occurs that film layer is aging even peeling phenomenon.Even if not having in electroplating process
Produce film pull-up to fall, but as after making finished product, the peel strength of Copper Foil be unable to reach the use of downstream manufacturers require and
Causing using, reflect the problem of adhesion difference between Seed Layer and base material, cause waste product probability relatively big, quality cannot reach
Mark.
Utility model content
For technical problem present in prior art, the purpose of this utility model is: provide electron beam assisted plasma
The equipment of sputter flexibility coat copper plate, is effectively improved the deposition quality of thin metal layer, significantly promotes thin metal layer and the knot of base material
Make a concerted effort.
In order to achieve the above object, this utility model adopts the following technical scheme that
The equipment of electron beam assisted plasma sputter flexibility coat copper plate, including vacuum chamber and be arranged in vacuum chamber every
Plate, multiple electron beam auxiliary device, multipair magnetic control target, base material, for control base material run working line assembly；Working line
Let off roll that assembly includes setting gradually along base material operating path, the first deflector roll, the first measuring roll, the second deflector roll, water-cooled drum,
3rd deflector roll, the second measuring roll, the 4th deflector roll, wind-up roll；Multipair magnetic control target is along the circumferencial direction cloth of water-cooled drum circumferential surface
Putting, an electron beam auxiliary device is all arranged in the both sides of every pair of magnetic control target；The both sides of water-cooled drum are respectively provided with one piece of dividing plate, unreel
Roller, the first deflector roll, the first measuring roll, the second deflector roll, the 3rd deflector roll, the second measuring roll, the 4th deflector roll, wind-up roll are positioned at dividing plate
Top, electron beam auxiliary device, magnetic control target are positioned at the lower section of dividing plate.On the operating path of base material, electron beam auxiliary device can
Adhesion between film layer and base material is significantly promoted.Upper zone and area below can be isolated to get up by dividing plate.
Further: described magnetic control target is plane magnetic control target or cylinder magnetic control target.
Further: the equipment of electron beam assisted plasma sputter flexibility coat copper plate also includes multiple alternating current power supply, one
Individual alternating current power supply is connected with a pair magnetic control target.
Further: the magnetic field of described magnetic control target is divergence form magnetic field.
Further: let off roll and wind-up roll are symmetricly set in vacuum chamber, the first deflector roll and the 4th deflector roll symmetry set
Putting in vacuum chamber, the first measuring roll and the second measuring roll are symmetricly set in vacuum chamber, and the second deflector roll and the 3rd deflector roll are symmetrical
It is arranged in vacuum chamber.
Further: described base material is Kapton.
Further: described electron beam auxiliary device is hollow cathode electron gun or thermal electron rifle.
Further: described vacuum chamber is rounded or square.
Generally speaking, this utility model has the advantage that
1. this equipment improves the adhesion of copper-clad plate (Copper Foil) and base material so that flexibility coat copper plate peel strength is significantly
Promoting, product quality promotes further.
2. electron beam auxiliary device improves the adhesion of base material and film layer, and product quality promotes further.
3. electronics entrance plasma area launched by electron beam auxiliary device, improves the concentration of plasma；Plasma
In ionic bombardment magnetic control target on target material surface, improve the sputtering raste of target, production efficiency promotes further, reduces product
The manufacturing cost of product.Additionally because the increase of electron concentration, the bombardment intensity of substrate surface is strengthened by the electronics affected by magnetic field,
The energy that particle is deposited is enhanced.
4. this utility model is provided with dividing plate, and upper zone and area below can be isolated to get up by dividing plate.
5. this utility model is provided with the first measuring roll and the second measuring roll so that base material both will not tension also will not mistake
Pine.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Wherein, 1 is wind-up roll, and 2 is let off roll, and 3 is the first deflector roll, and 4 is the first measuring roll, and 5 is dividing plate, and 6 is magnetic control target,
7 is electron beam auxiliary device, and 8 is water-cooled drum, and 9 is the second deflector roll, and 10 is the 3rd deflector roll, and 11 is the second measuring roll, and 12 is the 4th
Deflector roll.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the utility model is described in more detail.
For sake of convenience, hereafter described direction up and down is consistent with the direction up and down of Fig. 1 itself.
Shown in Fig. 1, the equipment of electron beam assisted plasma sputter flexibility coat copper plate, including vacuum chamber and being arranged at
Dividing plate in vacuum chamber, multiple electron beam auxiliary device, multipair magnetic control target, multiple high-frequency ac power, base material, it is used for controlling base
The working line assembly that material runs.Working line assembly includes the let off roll set gradually along base material operating path, first leads
Roller, the first measuring roll, the second deflector roll, water-cooled drum, the 3rd deflector roll, the second measuring roll, the 4th deflector roll, wind-up roll.Multipair magnetic control target
Circumferencial direction along water-cooled drum circumferential surface is evenly arranged, and i.e. every pair magnetic control target is evenly arranged in outside water-cooled drum circumferential surface
On the circular arc of side, one or more electron beam auxiliary device is all arranged in the both sides of every pair of magnetic control target；As it is shown in figure 1, two adjacent
Magnetic control target be referred to as a pair magnetic control target, the side of a pair magnetic control target is disposed with an electron beam auxiliary device, and this is to magnetic control target
Opposite side is also disposed with an electron beam auxiliary device.Every pair of magnetic control target and the circumference table of electron beam auxiliary device distance water-cooled drum
There is suitable distance in face, and the electron beam that electron beam auxiliary device is launched enters into plasma area.One high-frequency ac power is even
Connect a pair magnetic control target, make this two magnetic control target both positive and negative polarities each other to magnetic control target, form electric field and the magnetic field of alternation so that wait from
The scope of daughter increases；Meanwhile, the magnetic field of magnetic control target is divergence form magnetic field (scope that i.e. magnetic field magnetic line covers is wider),
Making the magnetic line of force dissipate open loop, under the effect in alternating electric field and magnetic field, a pair magnetic control target forms the scope of heating region
Bigger.The electron beam that electron beam auxiliary device is launched enters into plasma area, thus strengthens the ionization level of gas molecule, and then
Promote the density of plasma, by the shock of plasma intermediate ion, cause splash-proofing sputtering metal particle to be deposited on base material；And lead to
Cross the shock of electronics in plasma so that the temperature of substrate surface suitably promotes, thus enhance the energy of deposition metallic
Amount, promotes base material adhesion further.By this mechanism, the peel strength of Copper Foil is finally greatly improved.
The both sides (i.e. the left and right sides on water-cooled drum top in Fig. 1) of water-cooled drum are respectively provided with one piece of dividing plate, let off roll, first lead
Roller, the first measuring roll, the second deflector roll, the 3rd deflector roll, the second measuring roll, the 4th deflector roll, wind-up roll are positioned at the top of dividing plate, electronics
Bundle auxiliary device, magnetic control target are positioned at the lower section of dividing plate.Let off roll and wind-up roll are symmetricly set in vacuum chamber, the first deflector roll and
Four deflector rolls are symmetricly set in vacuum chamber, and the first measuring roll and the second measuring roll are symmetricly set in vacuum chamber, the second deflector roll and
3rd deflector roll is symmetricly set in vacuum chamber.Let off roll is arranged in the upper left quarter of vacuum chamber, and wind-up roll is arranged in the right side of vacuum chamber
Top, the first deflector roll is arranged close to the left side at let off roll, and the 4th deflector roll is arranged close to the right side at wind-up roll, the first measuring roll
Being arranged in the lower left of the first deflector roll, the second measuring roll is arranged in the lower right of the 4th deflector roll, and the second deflector roll is arranged in let off roll
With between water-cooled drum, the 3rd deflector roll is arranged between let off roll and wind-up roll.Described direction up and down and the upper bottom left of Fig. 1
Right direction is consistent.Let off roll first releases base material, and the first deflector roll walked around by base material, further around crossing the first measuring roll, further around crossing the second deflector roll,
Be then passed through dividing plate and water-cooled drum between gap thus around enter water-cooled drum, be then passed through dividing plate and water-cooled drum between gap thus around
Go out water-cooled drum, further around cross the 3rd deflector roll, further around cross the second deflector roll, further around cross the second measuring roll, further around cross the 4th deflector roll, finally by
Wind-up roll rolling.Base material againsts the surface of each parts in working line assembly and runs.Working line assembly serve guiding and
Control the effect that base material runs.First measuring roll and the second measuring roll play the effect of tension force detection so that base material both will not mistake
Tightly also will not be the most loose；Base material, dividing plate operates above when, can discharge a certain amount of gas, and dividing plate can play isolation and make
With so that dividing plate area below (i.e. coating film area) keeps more preferable vacuum environment.
Described magnetic control target is plane magnetic control target, cylinder magnetic control target or other magnetic control targets.The magnetic field of described magnetic control target is
Divergence form magnetic field.Described base material is Kapton, i.e. PI film, or other thin film, such as PET film etc..Described electronics
Bundle auxiliary device is hollow cathode electron gun, thermal electron rifle or other electron guns.Plane graph as shown in Figure 1, described
Vacuum chamber is rounded, square or other shapes.This equipment is additionally provided with evacuation unit, and this equipment can also be placed on multiple
In the space of vacuum chamber composition, this equipment includes one or more water-cooled drum.
This equipment improves the adhesion of copper-clad plate (Copper Foil) and base material so that flexibility coat copper plate peel strength significantly carries
Rising, product quality promotes further.The high energy electron that electron beam auxiliary device is launched enhances plasma concentration, and at alternation electricity
Under the effect in field and magnetic field, impact with energetic electrons substrate surface, kinetic energy changes into the temperature of heat energy, base material and metal film layer surface
Promote；Alternating electric field and magnetic field also improve the ionization level of particle, further increase the adhesion of base material and metallic diaphragm, produce
Quality promotes further.Electron beam auxiliary device is launched electronics and is entered plasma area, due to the raising of gas ionization rate, etc.
Plasma levels promotes so that the amount of ions clashing into base material increases, it is achieved that substrate surface activation and ion assistant metal grain
Son is deposited on base material, additionally because the target material surface on ionic bombardment magnetic control target, improves the sputtering raste of target, production efficiency
Can also promote further, therefore further reduces the manufacturing cost of product.
Above-described embodiment is this utility model preferably embodiment, but embodiment of the present utility model is not by above-mentioned
The restriction of embodiment, other any without departing from the change made under spirit of the present utility model and principle, modify, replace
In generation, combine, simplify, all should be the substitute mode of equivalence, within being included in protection domain of the present utility model.
Claims (8)
1. the equipment of electron beam assisted plasma sputter flexibility coat copper plate, it is characterised in that: include vacuum chamber and be arranged at true
Empty indoor dividing plate, multiple electron beam auxiliary device, multipair magnetic control target, base material, for controlling the working line group that base material runs
Part；Let off roll that working line assembly includes setting gradually along base material operating path, the first deflector roll, the first measuring roll, second
Deflector roll, water-cooled drum, the 3rd deflector roll, the second measuring roll, the 4th deflector roll, wind-up roll；Multipair magnetic control target is along water-cooled drum circumferential surface
Circumferential directions, an electron beam auxiliary device is all arranged in the both sides of every pair of magnetic control target；The both sides of water-cooled drum are respectively provided with one
Block dividing plate, let off roll, the first deflector roll, the first measuring roll, the second deflector roll, the 3rd deflector roll, the second measuring roll, the 4th deflector roll, rolling
Roller is positioned at the top of dividing plate, and electron beam auxiliary device, magnetic control target are positioned at the lower section of dividing plate.
2. according to the equipment of the electron beam assisted plasma sputter flexibility coat copper plate described in claim 1, it is characterised in that: described
Magnetic control target be plane magnetic control target or cylinder magnetic control target.
3. according to the equipment of the electron beam assisted plasma sputter flexibility coat copper plate described in claim 1, it is characterised in that: also wrap
Including multiple alternating current power supply, an alternating current power supply is connected with a pair magnetic control target.
4. according to the equipment of the electron beam assisted plasma sputter flexibility coat copper plate described in claim 1, it is characterised in that: described
The magnetic field of magnetic control target is divergence form magnetic field.
5. according to the equipment of the electron beam assisted plasma sputter flexibility coat copper plate described in claim 1, it is characterised in that: unreel
Roller and wind-up roll are symmetricly set in vacuum chamber, and the first deflector roll and the 4th deflector roll are symmetricly set in vacuum chamber, the first measuring roll
Being symmetricly set in vacuum chamber with the second measuring roll, the second deflector roll and the 3rd deflector roll are symmetricly set in vacuum chamber.
6. according to the equipment of the electron beam assisted plasma sputter flexibility coat copper plate described in claim 1, it is characterised in that: described
Base material be Kapton.
7. according to the equipment of the electron beam assisted plasma sputter flexibility coat copper plate described in claim 1, it is characterised in that: described
Electron beam auxiliary device be hollow cathode electron gun or thermal electron rifle.
8. according to the equipment of the electron beam assisted plasma sputter flexibility coat copper plate described in claim 1, it is characterised in that: described
Vacuum chamber rounded or square.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620670169.2U CN205710898U (en) | 2016-06-27 | 2016-06-27 | The equipment of electron beam assisted plasma sputter flexibility coat copper plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620670169.2U CN205710898U (en) | 2016-06-27 | 2016-06-27 | The equipment of electron beam assisted plasma sputter flexibility coat copper plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205710898U true CN205710898U (en) | 2016-11-23 |
Family
ID=57318646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620670169.2U Expired - Fee Related CN205710898U (en) | 2016-06-27 | 2016-06-27 | The equipment of electron beam assisted plasma sputter flexibility coat copper plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205710898U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105986238B (en) * | 2016-06-27 | 2018-10-09 | 广东腾胜真空技术工程有限公司 | The equipment of electron beam assisted plasma sputter flexibility coat copper plate |
| CN109587921A (en) * | 2018-11-16 | 2019-04-05 | 中国科学院合肥物质科学研究院 | A kind of plasma jet generating device coupling high energy electron |
-
2016
- 2016-06-27 CN CN201620670169.2U patent/CN205710898U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105986238B (en) * | 2016-06-27 | 2018-10-09 | 广东腾胜真空技术工程有限公司 | The equipment of electron beam assisted plasma sputter flexibility coat copper plate |
| CN109587921A (en) * | 2018-11-16 | 2019-04-05 | 中国科学院合肥物质科学研究院 | A kind of plasma jet generating device coupling high energy electron |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206956141U (en) | A kind of magnetron sputtering coater | |
| CN106929806B (en) | High-barrier nano inorganic non-metallic film, preparation method thereof and vacuum winding coating equipment | |
| CN205710898U (en) | The equipment of electron beam assisted plasma sputter flexibility coat copper plate | |
| TW201341562A (en) | Sputtering device | |
| CN105986238B (en) | The equipment of electron beam assisted plasma sputter flexibility coat copper plate | |
| CN110106481A (en) | Coating apparatus and Pvd equipment | |
| US20150075981A1 (en) | Rotating magnetron sputtering target and corresponding magnetron sputtering device | |
| CN208293072U (en) | A kind of coating machine that solid arc plasma irrigation source is set | |
| CN201132848Y (en) | Device for depositing high-quality film by arc ion plating | |
| JP2009256711A (en) | Plasma-generating device, film-forming apparatus, and film-forming method | |
| CN204589290U (en) | A kind of arc ions vacuum plating unit bias voltage supplementary unit | |
| CN100591797C (en) | Device for promoting deposit film quality of arc ion plating | |
| CN103184422B (en) | Low-temperature deposition device and process for TCO film | |
| CN205821446U (en) | A kind of low temperature depositing magnetic control sputtering film plating device | |
| CN108456867A (en) | Configure the low temperature depositing equipment of impressed current anode | |
| CN206376000U (en) | A kind of magnetron sputtering apparatus target | |
| CN208717429U (en) | Configure the low temperature depositing equipment of impressed current anode | |
| CN205710902U (en) | Enhancement mode magnetron sputtering coil film coating equipment | |
| CN208649457U (en) | A kind of cathode component, magnetic control sputtering cathode and magnetic control sputtering device | |
| CN207760414U (en) | A kind of coating machine of setting solid arc plasma irrigation source | |
| CN105970181B (en) | Enhanced magnetron sputtering coil film coating device and method | |
| CN203212630U (en) | Low-temperature deposition device for TCO transparent conductive film | |
| CN204455277U (en) | Magnetic control sputtering device | |
| CN201817542U (en) | Ion plating device | |
| CN107044052B (en) | A kind of production equipment and method of two-sided conductive fabric |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161123 Termination date: 20190627 |