CN205680671U - Heat radiating fin structure Ultrathin surface-mount rectifier bridge device - Google Patents
Heat radiating fin structure Ultrathin surface-mount rectifier bridge device Download PDFInfo
- Publication number
- CN205680671U CN205680671U CN201620237385.8U CN201620237385U CN205680671U CN 205680671 U CN205680671 U CN 205680671U CN 201620237385 U CN201620237385 U CN 201620237385U CN 205680671 U CN205680671 U CN 205680671U
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- China
- Prior art keywords
- backlight unit
- diode chip
- bonding jumper
- epoxy packages
- metal substrate
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/40137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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Abstract
This utility model one heat radiating fin structure Ultrathin surface-mount rectifier bridge device, including: first, second, third, fourth diode chip for backlight unit, the first bonding jumper and the second bonding jumper being coated with by epoxy packages body；A connecting piece two ends are connected across between the negative pole end of the second diode chip for backlight unit and the positive terminal of the first diode chip for backlight unit by scolding tin, and second connects between negative pole end and the positive terminal of the 4th diode chip for backlight unit that sheet two ends are connected across the 3rd diode chip for backlight unit by scolding tin；First bonding jumper is positioned at one end of epoxy packages body and electrically connects in the middle part of a connecting piece, and the second bonding jumper is positioned at one end of epoxy packages body and is connected electrical connection in the middle part of sheet with second；First bonding jumper, the second bonding jumper each other end all extend respectively as the first ac input end and the second ac input end from epoxy packages body side.This utility model takes full advantage of the heat-sinking capability of pcb board self, and this product is heat radiating fin structure, and the instantaneous heat-sinking capability of product is good, and forward surge capacity is strong.
Description
Technical field
This utility model relates to a kind of rectified semiconductor device, particularly relates to a kind of heat radiating fin structure Ultrathin surface-mount
Rectifier bridge device.
Background technology
The bridge architecture that commutator is made up of four commutation diodes, it utilizes the unilateal conduction characteristic of diode
Alternating current is carried out rectification, owing to the utilization ratio inputting positive sine wave is doubled than ripple rectification by bridge rectifier, is to two
The one of pole pipe halfwave rectifier significantly improves, therefore is widely used in alternating current and is converted in galvanic circuit.
Existing similar bridge heap product is primarily present following drawback: product thickness size is relatively big, and thickness limit is generally at 1.4mm
Above；Product is without heat radiating fin structure, it is impossible to make full use of the heat-sinking capability of PCB；The instantaneous heat-sinking capability of product is poor, forward wave
Gush ability relatively low；Existing product production technology is outmoded, high to manual work degree of dependence.Existing product there are the following problems point:
(1) product thickness is big, it is impossible to adapt to the demand of client production miniaturized intelligentization day by day design；(2) product heat-sinking capability is relatively
Difference, is unfavorable for the energy-saving design of client production；(3) the instantaneous heat-sinking capability of existing encapsulating products is poor, forward surge capacity
Relatively low；(4) existing product production technology is outmoded, high to manual work degree of dependence.
Summary of the invention
This utility model purpose is to provide a kind of heat radiating fin structure Ultrathin surface-mount rectifier bridge device, this ultrathin type table
Face attachment rectifier bridge device, less than 1.2mm, takes full advantage of the heat-sinking capability of pcb board self, and this product is heat radiating fin structure, produces
The instantaneous heat-sinking capability of product is good, and forward surge capacity is strong.
For reaching above-mentioned purpose, the technical solution adopted in the utility model is: a kind of heat radiating fin structure ultrathin type surface patch
Dress rectifier bridge device, including: first, second, third, fourth diode chip for backlight unit that is coated with by epoxy packages body, the first bonding jumper
With the second bonding jumper；
Second, third diode chip for backlight unit described is installed on the first metal substrate upper surface and is positioned on the left of epoxy packages body,
Described first, the 4th diode chip for backlight unit is installed on the second metal substrate upper surface and is positioned on the right side of epoxy packages body, described second,
The 3rd respective positive terminal of diode chip for backlight unit and the electrical connection of the first metal substrate upper surface, described first, the 4th diode chip for backlight unit
Respective negative pole end and the electrical connection of the second metal substrate upper surface；
A connecting piece two ends are connected across the negative pole end of the second diode chip for backlight unit and the first diode chip for backlight unit by scolding tin
Between positive terminal, second connects sheet two ends is connected across negative pole end and the 4th diode chip for backlight unit of the 3rd diode chip for backlight unit by scolding tin
Positive terminal between；
Described first bonding jumper and the second bonding jumper be positioned in the middle of epoxy packages body and second, third diode chip for backlight unit with
The first, between the 4th diode chip for backlight unit, the first bonding jumper is positioned at one end of epoxy packages body and is electrically connected in the middle part of a connecting piece
Connecing, the second bonding jumper is positioned at one end of epoxy packages body and is connected electrical connection in the middle part of sheet with second；
First bonding jumper, the second bonding jumper each other end all extend from epoxy packages body side to be handed over respectively as first
Stream input and the second ac input end, the first metal substrate, the second metal substrate be positioned at one end of the external side of epoxy packages from
Extend in epoxy packages body respectively as direct current negative pole end and direct-flow positive pole end；Described first metal substrate, the second Metal Substrate
The respective lower surface of sheet exposes in epoxy packages body.
In technique scheme, further improved plan is as follows:
1., in such scheme, the thickness of described epoxy packages body is less than 1.4mm, typically smaller than 1.2mm.
2. in such scheme, described first bonding jumper, the second bonding jumper, the first metal substrate and the second Metal Substrate sheet material
Matter is copper, and the part surface exposing epoxy packages body is all plated with tin layers.
Owing to technique scheme is used, this utility model compared with prior art has following advantages and an effect:
This utility model heat radiating fin structure Ultrathin surface-mount rectifier bridge device, relative existing product thickness generally exists
More than 1.4mm, its this product thickness is thin within 1.2mm；Secondly, this utility model is heat radiating fin structure, takes full advantage of PCB
The heat-sinking capability of plate self, this product is heat radiating fin structure, and the instantaneous heat-sinking capability of product is good, and forward surge capacity is strong；Again, from
Decrease the dependence to manual work in technological design to greatest extent, improve man efficiency at double.
Accompanying drawing explanation
Accompanying drawing 1 is existing rectifier bridge device structural representation；
What accompanying drawing 2 was accompanying drawing 1 looks up structural representation；
Accompanying drawing 3 is this utility model Ultrathin surface-mount rectifier bridge device structural representation；
Accompanying drawing 4 is the backsight structural representation of accompanying drawing 4；
What accompanying drawing 5 was accompanying drawing 3 looks up structural representation；
Accompanying drawing 6 is this utility model Ultrathin surface-mount rectifier bridge device perspective view.
In the figures above: 1, epoxy packages body；2, the first diode chip for backlight unit；3, the second diode chip for backlight unit；4, the three or two pole
Die；5, the 4th diode chip for backlight unit；6, the first metal substrate；7, the second metal substrate；8, a connecting piece；9, second connects
Sheet；10, the first bonding jumper；11, the second bonding jumper.
Detailed description of the invention
Below in conjunction with the accompanying drawings and this utility model is further described by embodiment:
Embodiment 1: a kind of heat radiating fin structure Ultrathin surface-mount rectifier bridge device, including: it is coated with by epoxy packages body 1
First, second, third, fourth diode chip for backlight unit the 2,3,4,5, first bonding jumper and the second bonding jumper；
Second, third diode chip for backlight unit 3,4 described is installed on the first metal substrate 6 upper surface and is positioned at epoxy packages body 1
Left side, described first, the 4th diode chip for backlight unit 2,5 is installed on the second metal substrate 7 upper surface and is positioned at epoxy packages body 1 right side
Side, second, third respective positive terminal of diode chip for backlight unit 3,4 described and the electrical connection of the first metal substrate 6 upper surface, described the
One, the 4th respective negative pole end of diode chip for backlight unit 2,5 and the electrical connection of the second metal substrate 7 upper surface；
A connecting piece 8 two ends are connected across negative pole end and first diode chip for backlight unit 2 of the second diode chip for backlight unit 3 by scolding tin
Positive terminal between, second connects sheet 9 two ends is connected across negative pole end and the 4th diode of the 3rd diode chip for backlight unit 4 by scolding tin
Between the positive terminal of chip 5；
Described first bonding jumper and the second bonding jumper are positioned in the middle of epoxy packages body 1 and at second, third diode chip for backlight unit
3,4 and the first, the 4th between diode chip for backlight unit 2,5, and the first bonding jumper is positioned at one end and a connecting piece of epoxy packages body 1
Middle part electrical connection, the second bonding jumper is positioned at one end of epoxy packages body 1 and is connected electrical connection in the middle part of sheet with second；
The first respective other end of bonding jumper the 10, second bonding jumper 11 all extend from epoxy packages body 1 side respectively as
First ac input end and the second ac input end, first metal substrate the 6, second metal substrate 7 is positioned at outside epoxy packages body 1
One end extend in epoxy packages body 1 respectively as direct current negative pole end and direct-flow positive pole end；Described first metal substrate 6,
The second respective lower surface of metal substrate 7 exposes in epoxy packages body 1.
The thickness of above-mentioned epoxy packages body 1 is less than 1.4mm, typically smaller than 1.2mm.
Embodiment 2: a kind of heat radiating fin structure Ultrathin surface-mount rectifier bridge device, including: it is coated with by epoxy packages body 1
First, second, third, fourth diode chip for backlight unit the 2,3,4,5, first bonding jumper and the second bonding jumper；
Second, third diode chip for backlight unit 3,4 described is installed on the first metal substrate 6 upper surface and is positioned at epoxy packages body 1
Left side, described first, the 4th diode chip for backlight unit 2,5 is installed on the second metal substrate 7 upper surface and is positioned at epoxy packages body 1 right side
Side, second, third respective positive terminal of diode chip for backlight unit 3,4 described and the electrical connection of the first metal substrate 6 upper surface, described the
One, the 4th respective negative pole end of diode chip for backlight unit 2,5 and the electrical connection of the second metal substrate 7 upper surface；
A connecting piece 8 two ends are connected across negative pole end and first diode chip for backlight unit 2 of the second diode chip for backlight unit 3 by scolding tin
Positive terminal between, second connects sheet 9 two ends is connected across negative pole end and the 4th diode of the 3rd diode chip for backlight unit 4 by scolding tin
Between the positive terminal of chip 5；
Described first bonding jumper and the second bonding jumper are positioned in the middle of epoxy packages body 1 and at second, third diode chip for backlight unit
3,4 and the first, the 4th between diode chip for backlight unit 2,5, and the first bonding jumper is positioned at one end and a connecting piece of epoxy packages body 1
Middle part electrical connection, the second bonding jumper is positioned at one end of epoxy packages body 1 and is connected electrical connection in the middle part of sheet with second；
The first respective other end of bonding jumper the 10, second bonding jumper 11 all extend from epoxy packages body 1 side respectively as
First ac input end and the second ac input end, first metal substrate the 6, second metal substrate 7 is positioned at outside epoxy packages body 1
One end extend in epoxy packages body 1 respectively as direct current negative pole end and direct-flow positive pole end；Described first metal substrate 6,
The second respective lower surface of metal substrate 7 exposes in epoxy packages body 1.
Above-mentioned first bonding jumper the 10, second bonding jumper the 11, first metal substrate 6 and the second metal substrate 7 material are copper,
And the part surface exposing epoxy packages body is all plated with tin layers.
When using above-mentioned heat radiating fin structure Ultrathin surface-mount rectifier bridge device, relative existing product thickness generally exists
More than 1.4mm, its this product thickness is thin within 1.2mm；Secondly, this utility model is heat radiating fin structure, takes full advantage of PCB
The heat-sinking capability of plate self, this product is heat radiating fin structure, and the instantaneous heat-sinking capability of product is good, and forward surge capacity is strong；Again, from
Decrease the dependence to manual work in technological design to greatest extent, improve man efficiency at double.
Above-described embodiment only for technology of the present utility model design and feature are described, its object is to allow and is familiar with technique
Personage will appreciate that content of the present utility model and implement according to this, protection domain of the present utility model can not be limited with this.
All according to this utility model spirit made equivalence change or modify, all should contain protection domain of the present utility model it
In.
Claims (3)
1. a heat radiating fin structure Ultrathin surface-mount rectifier bridge device, it is characterised in that: including: by epoxy packages body (1)
First, second, third, fourth diode chip for backlight unit (2,3,4,5), the first bonding jumper and second bonding jumper of cladding；
Second, third diode chip for backlight unit described (3,4) is installed on the first metal substrate (6) upper surface and is positioned at epoxy packages body
(1) left side, described first, the 4th diode chip for backlight unit (2,5) is installed on the second metal substrate (7) upper surface and is positioned at epoxy packages
Body (1) right side, second, third diode chip for backlight unit described (3,4) respective positive terminal and the first metal substrate (6) upper surface are electrically connected
Connect, described first, the 4th diode chip for backlight unit (2,5) respective negative pole end and the electrical connection of the second metal substrate (7) upper surface；
A connecting piece (8) two ends are connected across negative pole end and first diode chip for backlight unit of the second diode chip for backlight unit (3) by scolding tin
(2), between positive terminal, second connects sheet (9) two ends is connected across the negative pole end and the of the 3rd diode chip for backlight unit (4) by scolding tin
Between the positive terminal of four diode chip for backlight unit (5)；
Described first bonding jumper and the second bonding jumper be positioned in the middle of epoxy packages body (1) and second, third diode chip for backlight unit (3,
4) and between the first, the 4th diode chip for backlight unit (2,5), the first bonding jumper is positioned at one end of epoxy packages body (1) with first even
The electrical connection of contact pin (8) middle part, the second bonding jumper is positioned at one end of epoxy packages body (1) and is connected with second in the middle part of sheet (9) and is electrically connected
Connect；
First bonding jumper (10), the second bonding jumper (11) each other end all extends from epoxy packages body (1) side to be made respectively
Being the first ac input end and the second ac input end, the first metal substrate (6), the second metal substrate (7) are positioned at epoxy packages
The one end in body (1) outside is extended respectively as direct current negative pole end and direct-flow positive pole end in epoxy packages body (1)；Described first
Metal substrate (6), the second metal substrate (7) respective lower surface expose in epoxy packages body (1).
Heat radiating fin structure Ultrathin surface-mount rectifier bridge device the most according to claim 1, it is characterised in that: described ring
The thickness of oxygen packaging body (1) is less than 1.4mm, typically smaller than 1.2mm.
Heat radiating fin structure Ultrathin surface-mount rectifier bridge device the most according to claim 1, it is characterised in that: described
One bonding jumper (10), the second bonding jumper (11), the first metal substrate (6) and the second metal substrate (7) material are copper, and expose
The part surface of epoxy packages body is all plated with tin layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620237385.8U CN205680671U (en) | 2016-03-25 | 2016-03-25 | Heat radiating fin structure Ultrathin surface-mount rectifier bridge device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620237385.8U CN205680671U (en) | 2016-03-25 | 2016-03-25 | Heat radiating fin structure Ultrathin surface-mount rectifier bridge device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205680671U true CN205680671U (en) | 2016-11-09 |
Family
ID=57437922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620237385.8U Active CN205680671U (en) | 2016-03-25 | 2016-03-25 | Heat radiating fin structure Ultrathin surface-mount rectifier bridge device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205680671U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106449537A (en) * | 2016-03-25 | 2017-02-22 | 苏州固锝电子股份有限公司 | Heat-radiation-fin-structured ultrathin surface-mounted rectifier bridge device |
| CN109509723A (en) * | 2017-09-15 | 2019-03-22 | 无锡华润华晶微电子有限公司 | A kind of encapsulating structure and terminal box |
-
2016
- 2016-03-25 CN CN201620237385.8U patent/CN205680671U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106449537A (en) * | 2016-03-25 | 2017-02-22 | 苏州固锝电子股份有限公司 | Heat-radiation-fin-structured ultrathin surface-mounted rectifier bridge device |
| CN109509723A (en) * | 2017-09-15 | 2019-03-22 | 无锡华润华晶微电子有限公司 | A kind of encapsulating structure and terminal box |
| CN109509723B (en) * | 2017-09-15 | 2024-07-23 | 无锡华润华晶微电子有限公司 | Packaging structure and junction box |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |