CN205645867U

CN205645867U - Ruddiness high pressure 8V's LED supporting structure

Info

Publication number: CN205645867U
Application number: CN201620362718.XU
Authority: CN
Inventors: 林启程
Original assignee: YLin Electronics Co Ltd
Current assignee: YLin Electronics Co Ltd; Yonglin Electronics Co Ltd
Priority date: 2016-04-26
Filing date: 2016-04-26
Publication date: 2016-10-12
Anticipated expiration: 2026-04-26

Abstract

The utility model relates to a ruddiness high pressure 8V's LED supporting structure, including the SMD stake body, four corners of SMD stake body inner chamber set up a wafer respectively, three reverse ruddiness wafer and a forward ruddiness wafer promptly, SMD stake body periphery sets up four foot positions, first foot position, second foot position, third foot position, fourth foot position promptly, and first foot position wherein, second foot position, fourth foot position correspond respectively connects the inside reverse ruddiness wafer of SMD stake body, and forward ruddiness wafer is connected to third foot position wherein to form three reverse ruddiness wafer and a forward ruddiness wafer circuit series connection. The utility model discloses beneficial effect does: through the SMD supporting structure, and crystal plate group closes and realizes that single material voltage can arrive 8V, this design can improve the application of ruddiness in high -pressure occasion greatly.

Description

A kind of LED support structure of HONGGUANG high pressure 8V

Technical field

This utility model relates to SMD technology, particularly relates to a kind of for toy product, illuminating product, instruction The LED support structure of the HONGGUANG high pressure 8V in the fields such as product.

Background technology

SMD refers to surface mount device, in the primary stage that electronic circuit board produces, via assembling completely by Manually complete.Surface mount device mainly has rectangle slice component, cylindrical slice component, compound chip Element, abnormity slice component.SMD element mainly has plate transistor and integrated circuit, and integrated circuit wraps again Include SOP, SOJ, PLCC, LCCC, QFP, BGA, CSP, FC, MCM etc..Such as, even Fitting be used for provide machinery with electrical connection/disconnect, by connect plug and socket form, by cable, support, Cabinet or other PCB with PCB couple together, and contact with the actual surface attaching type that connects through of plate.

This case is it is important to note that the supporting structure of current SMD HONGGUANG type also exists a lot of lacking Fall into: 1. the characteristic because of HONGGUANG cannot complete the making of high pressure；The most existing increasing occasion all uses high pressure Product；The most all of red wafer cannot realize high pressure effect at a low price.

Therefore, for the above, need prior art is reasonably improved.

Utility model content

For disadvantages described above, this utility model provides the LED support structure of a kind of HONGGUANG high pressure 8V, makes two The HONGGUANG combination planting opposed polarity realizes high voltage functionality, solves many deficiencies of prior art.

For achieving the above object, this utility model is by the following technical solutions:

The LED support structure of a kind of HONGGUANG high pressure 8V, including SMD stake body, described SMD stake body Four corners of inner chamber are respectively provided with one piece of wafer, i.e. three reverse red wafer and a forward red wafer, Described SMD stake body periphery arranges four foot positions, the i.e. first foot position, crus secunda position, the 3rd foot position, the 4th Foot position, the first foot position therein, crus secunda position, the 4th foot position are connected respectively within SMD stake body Reversely red wafer, the 3rd foot position therein connects forward red wafer, thus it is brilliant to form three reverse HONGGUANG Sheet and a forward red wafer circuit series connection.

Correspondingly, with collet bottom described SMD stake body；Every piece of wafer is fixed glue-line by wafer and is fixed It is connected to SMD stake body inboard.

Having the beneficial effect that of the LED support structure of HONGGUANG high pressure 8V described in the utility model

(1) by SMD supporting structure, and wafer combination realizes single material voltage and can arrive 8V；

(2) this design is greatly improved the HONGGUANG application in high pressure occasion.

Accompanying drawing explanation

Below according to accompanying drawing, this utility model is described in further detail.

Fig. 1 is the LED support structural representation of HONGGUANG high pressure 8V described in this utility model embodiment；

Fig. 2 is the LED support internal wiring series connection signal of HONGGUANG high pressure 8V described in this utility model embodiment Figure.

In figure:

1, SMD stake body；2, wafer fixes glue-line；3, reverse red wafer；4, forward red wafer； 31, the first foot position；32, crus secunda position；33, the 3rd foot position；34, the 4th foot position.

Detailed description of the invention

As shown in Figure 1-2, the LED support structure of the HONGGUANG high pressure 8V described in this utility model embodiment, Including SMD stake body 1, described four corners of SMD stake body 1 inner chamber are respectively provided with one piece of wafer, i.e. Three reverse red wafer 3 and a forward red wafer 4, every piece of wafer fixes glue-line 2 admittedly by wafer Surely being connected to SMD stake body 1 inboard, described SMD stake body 1 periphery arranges four foot positions, and i.e. first Foot position 31, foot position 34, foot position the 33, the 4th, crus secunda position the 32, the 3rd, the first foot position 31, second therein Foot position 34, foot position the 32, the 4th is connected respectively the reverse red wafer 3 of within SMD stake body 1, 3rd foot position 33 therein connects forward red wafer 4, thus forms three reverse red wafer 3 and one The series connection of forward red wafer 4 circuit realizes high pressure 8V.

The above-mentioned description to embodiment is for the ease of those skilled in the art it will be appreciated that and answer Using this case technology, these examples obviously can be made various amendment by person skilled in the art easily, and General Principle described herein is applied in other embodiments without through performing creative labour.Therefore, This case is not limited to above example, and those skilled in the art, according to the announcement of this case, makes for this case Improve and amendment, such as, wafer model, each connects the setting of end, support shape etc., if not generation Beyond the beneficial effect outside this case scope, the most all should be in the protection domain of this case.

Claims

1. a LED support structure of HONGGUANG high pressure 8V, including SMD stake body (1), its feature exists In: four corners of described SMD stake body (1) inner chamber are respectively provided with one piece of wafer, i.e. three reverse HONGGUANG Wafer (3) and a forward red wafer (4), described SMD stake body (1) periphery arranges four foot positions, I.e. first foot position (31), crus secunda position (32), the 3rd foot position (33), the 4th foot position (34), therein First foot position (31), crus secunda position (32), the 4th foot position (34) are connected respectively SMD stake body (1) Internal reverse red wafer (3), the 3rd foot position (33) therein connects forward red wafer (4), from And form three reverse red wafer (3) and connect with forward red wafer (4) circuit.

The LED support structure of HONGGUANG high pressure 8V the most according to claim 1, it is characterised in that: institute State SMD stake body (1) bottom with collet.

The LED support structure of HONGGUANG high pressure 8V the most according to claim 1, it is characterised in that: every Block wafer is fixed glue-line (2) by wafer and is fixedly connected on SMD stake body (1) inboard.