CN205620907U - 2. 5U little server of high density - Google Patents
2. 5U little server of high density Download PDFInfo
- Publication number
- CN205620907U CN205620907U CN201620330422.XU CN201620330422U CN205620907U CN 205620907 U CN205620907 U CN 205620907U CN 201620330422 U CN201620330422 U CN 201620330422U CN 205620907 U CN205620907 U CN 205620907U
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- China
- Prior art keywords
- module
- server node
- cabinet
- server
- high density
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- Expired - Fee Related
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The utility model provides a 2.5U little server of high density, the load simulator comprises a case, the casing height of machine case is 2.5U, server node modules, power module, radiator fan module, quick -witted case backplate and power supply patch board are drawn together to the machine case and bag, server node modules includes the back server node modules who is located the preceding server node modules of quick -witted case front side and is located quick -witted case rear side, preceding server node modules, back server node modules respectively with machine case backplate is connected, power module with power supply patch board connects, power supply patch board, radiator fan module respectively with machine case backplate is connected, server node modules includes 25 server nodes. The technical scheme of the utility model realize 25 nodes at 2.5U machine incasement, and all node serve wares, radiator fan module and power module can both the hot plugs, have improved case space utilization ratio and power module conversion efficiency, have higher price / performance ratio.
Description
Technical field
This utility model relates to computer server field, particularly relates to a kind of 2.5U high density microserver.
Background technology
Having now a lot of highdensity server, such as 2U4,2U6,3U12 on the market, it realizes 4 node servers, 6 node servers in the cabinet of 2U height, realizes 12 node servers in the cabinet of 3U height.Main purpose is to realize more node in same chassis space.But these high density servers that existing manufacturer server is released, although improve the utilization rate of cabinet, but the utilization rate in space is again without not；And power supply conversion efficiency stack loss is big, energy-saving effect is poor.
Utility model content
For above technical problem, this utility model provides a kind of 2.5U high density microserver, in the height of 2.5U cabinet, it is achieved 25 server nodes.So in same cabinet, allow the lifting that server node density is bigger；And these server master boards share same group of power module, this design substantially increases space availability ratio and power module conversion efficiency；And these 25 server nodes support hot plugs.
To this, the technical scheme that this utility model is used is:
A kind of 2.5U high density microserver, including cabinet, the body height of cabinet is 2.5U, described cabinet includes the front server node module that server node module, power module, heat radiation fan module, case back plate and Power conversion board, described server node module include being positioned on front side of cabinet and the rear server node module being positioned on rear side of cabinet；Described front server node module, rear server node module are connected with described case back plate respectively, and described power module is connected with described Power conversion board, and described Power conversion board, heat radiation fan module are connected with described case back plate respectively；Described case back plate, heat radiation fan module are between described front server node module, rear server node module, and described power module is positioned at the rear side of described cabinet；Described server node module includes 25 server nodes, and described server node is erected in cabinet inside.
Use this technical scheme, described power module is at the rear portion of cabinet, it is used for powering to Servers-all node and radiator fan module, described power module is due to length limitation, can not directly contact with backboard, use and be connected with backboard by Power conversion board, so, power module is first delivered to all signals on Power conversion board, then Power conversion board interconnects with backboard, on the basis of AC powers, it is given to all node servers power, is then dispelled the heat to cabinet inside Servers-all node by radiator fan module；The signal of power module is all delivered on case back plate simultaneously, thus with node server communication；Server node, radiator fan module is used to be connected with described case back plate, it is achieved server node and the hot plug of radiator fan module, it is simple to safeguard；Meanwhile, power module is connected with backboard by Power conversion board, also achieves the hot plug of power module, it is simple to safeguard.Described case back plate, heat radiation fan module, between described front server node module, rear server node module, take full advantage of air channel isolation, preferably realize heat radiation.
As further improvement of the utility model, described front server node module includes that 14 hot plug server nodes, described rear server node module include 11 hot plug server nodes.
As further improvement of the utility model, each server node includes server master board, storage dish and Signals Transfer Board, and described server master board is connected with storage dish, Signals Transfer Board respectively, and described Signals Transfer Board is connected with described case back plate.Use this technical scheme, after node server internal components is all assembled, be inserted directly into inside cabinet, by carrying out power taking with backboard, and and the equipment such as power supply communicated by backboard, convenient and simple, be conducive to improving density.
As further improvement of the utility model, described storage dish includes the hard disk of 2 3.5 inches or the hard disk of 4 2.5 inches.
As further improvement of the utility model, described Power conversion board is two, is respectively positioned at the left Power conversion board on the left of cabinet and is positioned at the right Power conversion board on the right side of cabinet；Described power module is two, is respectively positioned at the left power module on the left of cabinet and is positioned at the right power module on the right side of cabinet；Described left power module is connected with left Power conversion board, and described right power module is connected with right Power conversion board；Described left Power conversion board, right Power conversion board are connected with case back plate respectively.
As further improvement of the utility model, described heat radiation fan module includes 4 fans.
As further improvement of the utility model, described heat radiation fan module is connected with case back plate by golden finger.Use this technical scheme, it is achieved radiator fan module is carried out hot plug, maintains easily.
As further improvement of the utility model, the size of described fan is 80mm*38mm.
As further improvement of the utility model, a width of 430 ~ 435mm of described cabinet, a height of 110mm, the degree of depth is 845 ~ 855mm.Use this technical scheme, it is achieved that the high density storage of 2.5U cabinet.
As further improvement of the utility model, inside described power module, it is provided with power supply heat sinking fan.Use this technical scheme, take full advantage of air channel isolation, preferably realize heat radiation.
Compared with prior art, the beneficial effects of the utility model are:
First, use the technical solution of the utility model, it is achieved that the high density storage of 2.5U cabinet, it is achieved 25 node servers.
Second, using 25 server nodes to be connected with case back plate respectively, case back plate and left and right two Power conversion boards are connected to left and right two power modules, substantially increase space availability ratio and power module conversion efficiency, power supply conversion efficiency stack loss is little, good energy-conserving effect.
3rd, use the technical solution of the utility model, be connected with case back plate by radiator fan module, server node, it is achieved that server node and the hot plug of radiator fan module, it is simple to safeguard；Meanwhile, power module is connected with backboard by Power conversion board, also achieves the hot plug of power module, it is simple to safeguard；Traditional server before Xiang Dui, it is achieved that untethered, has greatly improved in terms of workability, maintainability, reduces cost.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of embodiment of this utility model.
Fig. 2 is the mounted structural representation of a kind of embodiment of this utility model.
Detailed description of the invention
Below in conjunction with the accompanying drawings, preferably embodiment of the present utility model is described in further detail.
Embodiment 1
As depicted in figs. 1 and 2, a kind of 2.5U high density microserver, including cabinet 1, the body height of cabinet 1 is 2.5U, described cabinet 1 includes the front server node module 21 that server node module 2, power module 3, heat radiation fan module 4, case back plate 5 and Power conversion board 6, described server node module 2 include being positioned on front side of cabinet 1 and the rear server node module 22 being positioned on rear side of cabinet 1；Described front server node module 21, rear server node module 22 are connected with described case back plate 5 respectively, and described power module 3 is connected with described Power conversion board 6, and described Power conversion board 6, heat radiation fan module 4 are connected with described case back plate 5 respectively；Described case back plate 5, heat radiation fan module 4 are between described front server node module 21, rear server node module 22, and described power module 3 is positioned at the rear side of described cabinet 1；Described server node module 2 includes 25 server nodes 7, and described server node 7 is drawer-type structure, and what described server node 7 was erect arranges the inside with described cabinet 1.Described front server node module 21 includes that 14 hot plug server nodes 7, described rear server node module 22 include 11 hot plug server nodes 7.Each server node 7 includes server master board, storage dish and Signals Transfer Board, and described server master board is connected with storage dish, Signals Transfer Board respectively, and described Signals Transfer Board is connected with described case back plate 5.
Described Power conversion board 6 is two, is respectively positioned at the left Power conversion board 61 on the left of cabinet 1 and is positioned at the right Power conversion board 62 on the right side of cabinet 1；Described power module 3 is two, is respectively positioned at the left power module 31 on the left of cabinet 1 and is positioned at the right power module 32 on the right side of cabinet 1；Described left power module 31 is connected with left Power conversion board 61, and described right power module 32 is connected with right Power conversion board 62；Described left Power conversion board 61, right Power conversion board 62 are connected with case back plate 5 respectively.Described power module 3 configures in 1+1 redundant power module inside cabinet 1.Described heat radiation fan module 4 includes four fans.The size of described fan is 80mm*38mm.The described a width of 433mm of cabinet 1, a height of 110mm, the degree of depth is 850mm.
The detailed description of the invention of the above is better embodiment of the present utility model; not limit with this and of the present utility model be embodied as scope; scope of the present utility model includes being not limited to this detailed description of the invention, and the equivalence change that all shapes according to this utility model, structure are made is all in protection domain of the present utility model.
Claims (9)
1. a 2.5U high density microserver, including cabinet, the body height of described cabinet is 2.5U, it is characterized in that: described cabinet includes the front server node module that server node module, power module, heat radiation fan module, case back plate and Power conversion board, described server node module include being positioned on front side of cabinet and the rear server node module being positioned on rear side of cabinet；Described front server node module, rear server node module are connected with described case back plate respectively, and described power module is connected with described Power conversion board, and described Power conversion board, heat radiation fan module are connected with described case back plate respectively；Described case back plate, heat radiation fan module are between described front server node module, rear server node module, and described power module is positioned at the rear side of described cabinet；Described server node module includes 25 server nodes, and described server node is erected in cabinet inside.
2.5U high density microserver the most according to claim 1, it is characterised in that: described front server node module includes that 14 hot plug server nodes, described rear server node module include 11 hot plug server nodes.
2.5U high density microserver the most according to claim 2, it is characterized in that: each server node includes server master board, storage dish and Signals Transfer Board, described server master board is connected with storage dish, Signals Transfer Board respectively, and described Signals Transfer Board is connected with described case back plate.
2.5U high density microserver the most according to claim 3, it is characterised in that: described storage dish includes the hard disk of 2 3.5 inches or the hard disk of 4 2.5 inches.
2.5U high density microserver the most according to claim 1, it is characterised in that: described Power conversion board is two, is respectively positioned at the left Power conversion board on the left of cabinet and is positioned at the right Power conversion board on the right side of cabinet；Described power module is two, is respectively positioned at the left power module on the left of cabinet and is positioned at the right power module on the right side of cabinet；Described left power module is connected with left Power conversion board, and described right power module is connected with right Power conversion board；Described left Power conversion board, right Power conversion board are connected with case back plate respectively.
6. according to the 2.5U high density microserver described in claim 1 ~ 5 any one, it is characterised in that: described heat radiation fan module includes 4 fans.
2.5U high density microserver the most according to claim 6, it is characterised in that: the size of described fan is 80mm*38mm.
8. according to the 2.5U high density microserver described in claim 1 ~ 5 any one, it is characterised in that: a width of 430 ~ 435mm of described cabinet, a height of 110mm, the degree of depth is 845 ~ 855mm.
9. according to the 2.5U high density microserver described in claim 1 ~ 5 any one, it is characterised in that: it is provided with power supply heat sinking fan inside described power module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620330422.XU CN205620907U (en) | 2016-04-19 | 2016-04-19 | 2. 5U little server of high density |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620330422.XU CN205620907U (en) | 2016-04-19 | 2016-04-19 | 2. 5U little server of high density |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205620907U true CN205620907U (en) | 2016-10-05 |
Family
ID=57026934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620330422.XU Expired - Fee Related CN205620907U (en) | 2016-04-19 | 2016-04-19 | 2. 5U little server of high density |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205620907U (en) |
-
2016
- 2016-04-19 CN CN201620330422.XU patent/CN205620907U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161005 Termination date: 20170419 |