CN205584624U - Flexible panel's circuit board - Google Patents
Flexible panel's circuit board Download PDFInfo
- Publication number
- CN205584624U CN205584624U CN201620185689.4U CN201620185689U CN205584624U CN 205584624 U CN205584624 U CN 205584624U CN 201620185689 U CN201620185689 U CN 201620185689U CN 205584624 U CN205584624 U CN 205584624U
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- flexible
- circuit board
- flexible panel
- base plate
- panel
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Abstract
The utility model discloses a flexible panel's circuit board, a serial communication port, including flexible panel and flexible circuit board, the flexible circuit board is located between the two -layer flexible panel to with outer circuit connection, the flexible circuit board includes soft base plate and disposes the circuit layer in the sputter metal pattern of soft base plate upper surface, the material of sputter metal pattern circuit layer is a copper. The utility model provides a flexible panel's circuit board adopts the regional design of softness circuit, can depend on flexible panel on people's limbs, reaches ergonomic's effect. In addition, the conducting material copper that utilization ratio ITO transparent electrode is low -priced relatively carries out the sputter, has high impact resistance nature and low overall resistance's performance, therefore has high visibility and cost competitiveness.
Description
Technical field
This utility model belongs to touch screen applied technical field, is specifically related to the circuit board of a kind of flexible panel.
Background technology
Touch panel of cell phone is typically made up of flexible circuit board and thin film functional sheet two parts, after flexible circuit board machines, needs and thin film functional sheet carries out heating pressurizing attaching, be processed into touch panel of cell phone.This touch panel of cell phone has the disadvantage that flexible circuit board cannot oneself be processed, and supplier need to be looked for customize processing, the time that outsourcing customization processing and logistics are consumed, extend life cycle of the product.After thin film functional sheet machines, thin film functional sheet and flexible circuit board exactitude position need to be fitted through hot press high temperature hot pressing, often produce during laminating off normal, break, break, the bad phenomenon such as glue of overflowing.
Along with the development of online game industry, more and more game manufacturers start to develop various types of online game.At present, communication way between online game player is mainly inputted by word and phonetic entry, wherein, word input is talking mode main between current game player, input through keyboard and handwriting input two ways can be divided into, wherein can support wired connection and wireless connections respectively for keyboard and handwriting input.Handwriting input uses handwriting pad mostly, one type of handwriting pad is electromagnetic type handwriting pad, be be energized by wired circuit below handwriting pad after, electromagnetic field is formed in the range of certain space, carrying out induction band has the position of nib of coil to be operated, user can carry out writing of smoothness with it, and feel is also fine, draws very useful.The deep development played along with body-sensing technology and body-sensing class and application, increasing game developer enters into come in the middle of the ranks of exploitation body-sensing class game, the game of body-sensing class is exactly brand-new human-computer interaction and game control mode with the feature of traditional game maximum, i.e. by the equipment of body-sensing, to reach the purpose of man-machine interaction.The feature of this mode is that user can not meet demand away from computer, TV or keyboard, traditional electromagnetic type handwriting pad, it is necessary to seek a kind of handwriting pad adapting to carry out inputting whenever and wherever possible to meet the needs of body-sensing class game player.
Flexible circuit board (Flexible Circuit Board) now is widely used on electronic product, and has multiple connection gasket (Pad) to be electrically connected with and to assemble multiple electronic components and chip (Chip).Flexible circuit board generally manufactures via following methods.First, cover on the surface of cabtyre sheet material with photoresistance.Then, by photoresistance exposure and development, to form patterning photoresist layer, wherein patterning photoresist layer has multiple opening manifesting the soft plate surface of SI semi-insulation.Then, chemical plating (Chemical plating can be described as again electroless-plating, Electroplating) and plating are sequentially carried out, to form one layer of circuit layer on cabtyre sheet material.Afterwards, it is etched and stripping, to remove patterning photoresist layer.But, after being etched, the electroplated metal layer that partially patterned photoresist layer may be remained covers, and causes being difficult to remove patterning photoresist layer from cabtyre sheet material, to such an extent as to after stripping, still has patterning photoresist layer residual.Additionally, the electroplated metal layer covered on the patterning photoresist layer of residual likely can make adjacent two cabling short circuits (Short) of circuit layer, the qualification rate of flexible circuit board is caused to decline.Owing to traditional ITO (90% Indium sesquioxide .) film design need to can be only achieved preferably electric conductivity at higher temperature plated film, being unfavorable for the use of flexible substrate, and Indium sesquioxide. price is high, it is also crucial for how reducing usage amount.Additionally, the material such as fine aluminium and fine silver is mostly used in terms of traditional electrode with wire, required film wire and membrane electrode is formed by the mode such as sputter or silk screen printing, but fine silver and pure aluminum material weatherability are poor, in use easily because of the raw electron transfer of delivery in hot weather, during life-time service, thin film is easily generated abnormal projection or broken string, causes the service life reduction of assembly.
Summary of the invention
The purpose of this utility model is the product in order to simplify prior art, replaces ITO with copper, by direct for copper sputter on flexible base plate, makes flexible PCB.
In order to realize object above, this utility model is achieved through the following technical solutions:
A kind of circuit board of flexible panel, including flexible panel and flexible PCB, described flexible PCB is between two sheets of flexible panel, and it is connected with external circuit, described flexible PCB includes flexible base plate and is configured at the jet-plating metallization patterned circuit layer of flexible base plate upper surface, and the material of described jet-plating metallization patterned circuit layer is copper.
Further, described flexible panel is respectively provided with layer of plastic film up and down, plays protection internal circuit and the effect of panel.
Further, base material used by described flexible panel is PET(polyethylene terephthalate) thin film, base material used by the flexible base plate of described flexible PCB is PI(polyimides), PC(Merlon), PMMA(polymethyl methacrylate), COC(cyclic olefine copolymer) or TCA(Triafol T).
Further, described jet-plating metallization patterned circuit layer is distributed netted copper conductor, and the width of described copper conductor is less than 1-4 micron, each copper conductor spaced 50-100 micron.
Further, the thickness of described flexible base plate is 15-250 micron, preferably 25-75 micron.
Further, the thickness of described jet-plating metallization patterned circuit layer is 0.03-1.5 micron, preferably 0.05-0.5 micron.
The circuit board of this utility model flexible panel uses the design of flexible circuit region, can be attached on the limbs of people by flexible panel, reach the effect of ergonomics.It addition, use the conductive material copper more relatively inexpensive than ito transparent electrode to carry out sputter, there is high impact properties and the performance of low all-in resistance, thus there is high visibility and cost competitiveness.
Accompanying drawing explanation
Fig. 1 is the structural representation of the circuit board of this utility model flexible panel.
Wherein, 1. flexible PCB, 2. flexible panel, 3. plastic sheeting.
Detailed description of the invention
In order to make those skilled in the art be more fully understood that the technical solution of the utility model, with detailed description of the invention, this utility model is described in further detail below in conjunction with the accompanying drawings.
See Fig. 1, the circuit board of flexible panel of the present utility model, including flexible panel 2 and flexible PCB 1, described flexible PCB 1 is between two sheets of flexible panel 2, and it is connected with external circuit, described flexible PCB 1 includes flexible base plate and is configured at the jet-plating metallization patterned circuit layer of flexible base plate upper surface, and the material of described jet-plating metallization patterned circuit layer is copper.Described flexible panel about 2 is respectively provided with layer of plastic film 3, plays protection internal circuit and the effect of panel.Base material used by described flexible panel is PET(polyethylene terephthalate) thin film, base material used by the flexible base plate of described flexible PCB is PI(polyimides), PC(Merlon), PMMA(polymethyl methacrylate), COC(cyclic olefine copolymer) or TCA(Triafol T).Described jet-plating metallization patterned circuit layer is distributed netted copper conductor, and the width of described copper conductor is less than 1-4 micron, each copper conductor spaced 50-100 micron.The thickness of described flexible base plate is 15-250 micron.The thickness of described jet-plating metallization patterned circuit layer is 0.03-1.5 micron.
Embodiment 1
The circuit board of above-mentioned flexible panel, wherein base material used by the flexible base plate of flexible PCB is PI, and thickness is 15 microns, and the thickness of described jet-plating metallization patterned circuit layer is 0.03 micron, in described jet-plating metallization patterned circuit layer, the width of copper conductor is 1 micron, spaced 50 microns of each copper conductor.
Embodiment 2
The circuit board of above-mentioned flexible panel, wherein base material used by the flexible base plate of flexible PCB is PC, and thickness is 250 microns, and the thickness of described jet-plating metallization patterned circuit layer is 1.5 microns, in described jet-plating metallization patterned circuit layer, the width of copper conductor is 4 microns, spaced 100 microns of each copper conductor.
Embodiment 3
The circuit board of above-mentioned flexible panel, wherein base material used by the flexible base plate of flexible PCB is PMMA, thickness is 120 microns, the thickness of described jet-plating metallization patterned circuit layer is 0.7 micron, in described jet-plating metallization patterned circuit layer, the width of copper conductor is 2.5 microns, spaced 75 microns of each copper conductor.
Embodiment 4
The circuit board of above-mentioned flexible panel, wherein base material used by the flexible base plate of flexible PCB is COC, and thickness is 75 microns, and the thickness of described jet-plating metallization patterned circuit layer is 1.0 microns, in described jet-plating metallization patterned circuit layer, the width of copper conductor is 2 microns, spaced 60 microns of each copper conductor.
Embodiment 5
The circuit board of above-mentioned flexible panel, wherein base material used by the flexible base plate of flexible PCB is TCA, and thickness is 25 microns, and the thickness of described jet-plating metallization patterned circuit layer is 0.05 micron, in described jet-plating metallization patterned circuit layer, the width of copper conductor is 3 microns, spaced 80 microns of each copper conductor.
Embodiment 6
The circuit board of the flexible panel of the above embodiments 2, difference is that substrate layer used by the flexible base plate of described flexible PCB is TCA, and thickness is 50 microns, and the thickness of described jet-plating metallization patterned circuit layer is 0.5 micron.
Embodiment 7
The circuit board of the flexible panel of the above embodiments 3, difference is that substrate layer used by the flexible base plate of described flexible PCB is PI, and thickness is 40 microns, and the thickness of described jet-plating metallization patterned circuit layer is 0.05 micron.
Embodiment 8
The circuit board of the flexible panel of the above embodiments 3, difference is that the flexible base plate thickness of described flexible PCB is 70 microns, described jet-plating metallization patterned circuit layer thickness is 0.25 micron, and in described jet-plating metallization patterned circuit layer, each copper conductor is spaced is 80 microns.
It is last it should be noted that, embodiment of above is only in order to illustrate that the technical solution of the utility model is not intended to limit.It should be understood by a person of ordinary skill in the art that detailed description of the invention of the present utility model can be modified or portion of techniques feature is carried out equivalent；Without deviating from the spirit of technical solutions of the utility model, it all should be contained in the middle of the technical scheme scope that this utility model is claimed.
Claims (8)
1. the circuit board of a flexible panel, it is characterized in that, including flexible panel (2) and flexible PCB (1), described flexible PCB is between two sheets of flexible panel, and it is connected with external circuit, described flexible PCB includes flexible base plate and is configured at the jet-plating metallization patterned circuit layer of flexible base plate upper surface, and the material of described jet-plating metallization patterned circuit layer is copper.
The circuit board of flexible panel the most according to claim 1, it is characterised in that described flexible panel is respectively provided with layer of plastic film (3) up and down.
The circuit board of flexible panel the most according to claim 1, it is characterised in that base material used by described flexible panel is PET film, base material used by the flexible base plate of described flexible PCB is PI, PC, PMMA, COC or TCA.
The circuit board of flexible panel the most according to claim 1, it is characterised in that described jet-plating metallization patterned circuit layer is distributed netted copper conductor, the width of described copper conductor is less than 1-4 micron, each copper conductor spaced 50-100 micron.
The circuit board of flexible panel the most according to claim 1, it is characterised in that the thickness of described flexible base plate is 15-250 micron.
The circuit board of flexible panel the most according to claim 1, it is characterised in that the thickness of described flexible base plate is 25-75 micron.
The circuit board of flexible panel the most according to claim 1, it is characterised in that the thickness of described jet-plating metallization patterned circuit layer is 0.03-1.5 micron.
The circuit board of flexible panel the most according to claim 1, it is characterised in that the thickness of described jet-plating metallization patterned circuit layer is 0.05-0.5 micron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620185689.4U CN205584624U (en) | 2016-03-11 | 2016-03-11 | Flexible panel's circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620185689.4U CN205584624U (en) | 2016-03-11 | 2016-03-11 | Flexible panel's circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205584624U true CN205584624U (en) | 2016-09-14 |
Family
ID=56868458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620185689.4U Active CN205584624U (en) | 2016-03-11 | 2016-03-11 | Flexible panel's circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205584624U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107791617A (en) * | 2017-10-27 | 2018-03-13 | 苏州欣天新精密机械有限公司 | A kind of low-dielectric loss copper-clad plate and its preparation technology |
-
2016
- 2016-03-11 CN CN201620185689.4U patent/CN205584624U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107791617A (en) * | 2017-10-27 | 2018-03-13 | 苏州欣天新精密机械有限公司 | A kind of low-dielectric loss copper-clad plate and its preparation technology |
| CN107791617B (en) * | 2017-10-27 | 2020-08-04 | 苏州欣天新精密机械有限公司 | Preparation process of low-dielectric-loss copper-clad plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200604 Address after: Room 460, 4th floor, Transportation Bureau building, No. 95, Yingbin Avenue, Huadu District, Guangzhou, Guangdong Province Patentee after: Gagu Technology Co.,Ltd. Address before: 200031 Shanghai city Xuhui District No. 1720 middle Huaihai Road, villa Zhonglian building E Co-patentee before: HWATIN TECHNOLOGY GROUP Co.,Ltd. Patentee before: SHANGHAI WANYIN SAFETY AND ENVIRONMENTAL PROTECTION TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210421 Address after: 201100 room 206, building 6, No. 3669, Jindu Road, Minhang District, Shanghai Patentee after: Shanghai Huayan safety and Environmental Protection Technology Co.,Ltd. Address before: 510800 room 460, 4th floor, Transportation Bureau building, No. 95, Yingbin Avenue, Huadu District, Guangzhou City, Guangdong Province Patentee before: Gagu Technology Co.,Ltd. |
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| TR01 | Transfer of patent right |