CN205553431U - Heatable laminated glass structure - Google Patents
Heatable laminated glass structure Download PDFInfo
- Publication number
- CN205553431U CN205553431U CN201620201841.3U CN201620201841U CN205553431U CN 205553431 U CN205553431 U CN 205553431U CN 201620201841 U CN201620201841 U CN 201620201841U CN 205553431 U CN205553431 U CN 205553431U
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- substrate
- heatable
- glyglass
- conductive
- transparent conductive
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- 239000005340 laminated glass Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 claims abstract description 111
- 239000011521 glass Substances 0.000 claims abstract description 66
- 239000004020 conductor Substances 0.000 claims description 15
- 230000007423 decrease Effects 0.000 claims description 10
- 239000003292 glue Substances 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 230000015556 catabolic process Effects 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims 2
- 239000010410 layer Substances 0.000 abstract description 40
- 230000000694 effects Effects 0.000 abstract description 20
- 230000003247 decreasing effect Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 5
- 238000009826 distribution Methods 0.000 abstract description 3
- 239000012790 adhesive layer Substances 0.000 abstract 2
- 238000005516 engineering process Methods 0.000 description 7
- 239000003595 mist Substances 0.000 description 7
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- -1 polyethylene Polymers 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000005485 electric heating Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- 238000000137 annealing Methods 0.000 description 3
- 239000002041 carbon nanotube Substances 0.000 description 3
- 229910021393 carbon nanotube Inorganic materials 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 238000000265 homogenisation Methods 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- GKWLILHTTGWKLQ-UHFFFAOYSA-N 2,3-dihydrothieno[3,4-b][1,4]dioxine Chemical compound O1CCOC2=CSC=C21 GKWLILHTTGWKLQ-UHFFFAOYSA-N 0.000 description 1
- GBMIXWKIMPJTEJ-UHFFFAOYSA-N C(C)C=1SC=CC1.[O] Chemical compound C(C)C=1SC=CC1.[O] GBMIXWKIMPJTEJ-UHFFFAOYSA-N 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- KUCOHFSKRZZVRO-UHFFFAOYSA-N terephthalaldehyde Chemical compound O=CC1=CC=C(C=O)C=C1 KUCOHFSKRZZVRO-UHFFFAOYSA-N 0.000 description 1
- 238000010257 thawing Methods 0.000 description 1
Abstract
The utility model relates to a heatable glued glass structure, it contains transparent conductive substrate, goes up glass substrate and lower glass substrate. The transparent conductive substrate has an upper surface and a lower surface disposed opposite to the upper surface, the upper glass substrate is attached to the upper surface of the transparent conductive substrate through an upper adhesive layer, and the lower glass substrate is attached to the lower surface of the transparent conductive substrate through a lower adhesive layer. The transparent conductive substrate comprises a bearing substrate and a conductive layer arranged on the bearing substrate, wherein the conductive layer is provided with a plurality of strip conductive circuits arranged along the direction of a longitudinal axis and at least one connecting wire connected with the strip conductive circuits, and the respective widths of the plurality of strip conductive circuits are decreased progressively along the direction of the longitudinal axis. The utility model discloses can improve heatable glued glass structure and heat the in-process uneven phenomenon of intensification effect distribution.
Description
Technical field
This utility model relates to a kind of glyglass structure, particularly relates to a kind of heatable glued glass
Glass structure.
Background technology
It is said that in general, for the glyglass structure of prior art, it is by following manufacture method
It is fabricated by: arrange between the common annealing glass of two-layer or more layers by PVB (polyvinyl alcohol contracting
Butyral resin, Polyvinyl Butyral) bonding coat that formed, and it is heated to about 70 degree Celsius,
With roller bearing, the air between interlayer is extruded again so that PVB is by tight for adjacent two-layer common annealing glass
Stick together.For example, general glyglass is the common annealing glass using two-layer 3 millimeters,
The interlayer PVB glue of 0.38 millimeter on folder between its grade, thus constituting gross thickness is 6.38 millimeters
Glass structure.Alternatively, it is also possible to increase intensity with more layers, thicker glass.Consequently, it is possible to
When glass fragmentation faced on glyglass, bonding coat still can stick together layer glass, it is to avoid glass produces
The fragment that life can be hurted sb.'s feelings.Therefore, glyglass has been widely used for manufacturing mankind life article, as
Articles for use, door and window, tables and chairs ornaments or transport vehicle at home, such as car, ship, aircraft are used
Glass.
For promoting the application of the glyglass of prior art, metal can be set up in bonding interlayer further
The wire of material, as door and window for building or the de-fog of automobile front and rear windshield, or utilizes gold
Belong to wire and replace the function of antenna, in order to promote the communication products reception quality in indoor or car.But,
Due to heat free convection phenomenon, i.e. compared to cold air, hot-air density less and can be by lower
Hoist flowing, often causes uneven the showing of heat distribution by heating plain conductor when being carried out except mist
As.In other words, the laying mode of the plain conductor of prior art can make the temperature above glass
Rise ground faster than the temperature below glass, produce the phenomenon of obvious Temperature Distribution difference, even more so that
Mist has been removed in region above the surface of same time point glyglass is close, and close to the region of lower section
Also do not eliminate mist.The laying mode of prior art be likely to result in above glass except fog effect than glass below
Except fog effect good.It addition, the translucent effect of plain conductor is poor, cause the restriction in application.Lift
For example, the poor plain conductor of translucent effect is not used in shield glass.Therefore, profit
The technology reaching the effect except mist with the plain conductor in glyglass is still waited to improve.
Utility model content
Technical problem to be solved in the utility model is, for the open one of the deficiencies in the prior art
Heatable glyglass structure, its can by the particular arrangement mode of conducting wire in conductive layer, with
Reach uniformly to heat up, uniformly except the effect of mist.
This utility model wherein embodiment discloses a kind of heatable glyglass structure, and it comprises one
Transparent conductive substrate, a top glass substrate and a lower glass substrate.Transparent conductive substrate has table on
Face and one with the lower surface of described upper surface setting opposite each other, and described top glass substrate is by one
Bonding glue-line is to be attached on the described upper surface of described transparent conductive substrate, and described lower glass substrate
By once binding glue-line to be attached on the described lower surface of described transparent conductive substrate.Described transparent
Electrically-conductive backing plate comprises the conductive layer that a bearing substrate and is arranged on described bearing substrate, wherein said
Conductive layer has multiple strips of conductive circuit and at least along a y direction arrangement and is connected to institute
Stating the wiring of strips of conductive circuit, multiple described respective width of strips of conductive circuit are along the described longitudinal axis
Successively decrease in direction.
Further, described heatable glyglass structure is used for a vehicle windshield, Duo Gesuo
State the respective described width of strips of conductive circuit by the bottom of described vehicle windshield towards described car
Successively decrease in the top of windshield.
Further, described upper bonding glue-line is arranged at described transparent conductive substrate and described upper glass base
Between plate.
Further, described lower bonding glue-line is arranged at described transparent conductive substrate and described lower glass base
Between plate.
Further, described strips of conductive circuit is set parallel to each other.
Further, the described respective width of strips of conductive circuit is that described strips of conductive circuit is described
Size on y direction.
Further, described upper bonding glue-line and described lower bonding glue-line each have between 100 microns
Thickness between 500 microns.
Further, the thickness of described bearing substrate is between 10 microns to 500 microns.
Further, described conductive layer is formed by an inorganic conductive material or an organic conductive material,
And the thickness of described conductive layer is between 10 microns to 500 microns.
Further, described heatable glyglass structure may further comprise: an optics hardened layer,
Described optics hardened layer is arranged between described bearing substrate and described conductive layer, described optics hardened layer
Thickness between 1 micron to 10 micron.
The other embodiment of this utility model discloses a kind of heatable glyglass structure, and it comprises:
One transparent conductive substrate, a top glass substrate and a lower glass substrate.Transparent conductive substrate has on one
Surface and one with the lower surface of described upper surface setting opposite each other, and described top glass substrate and described
Lower glass substrate is attached to the described upper surface of described transparent conductive substrate respectively by an adhesive glue
And on described lower surface.Described transparent conductive substrate comprises a bearing substrate, one is arranged on described carrying
Conductive layer on substrate and multiple breakdown region puncturing described bearing substrate and described conductive layer
Territory, wherein said conductive layer has multiple strips of conductive circuit and at least along a y direction arrangement
One wiring being connected to described strips of conductive circuit, multiple described strips of conductive circuit respective width edge
Described y direction to successively decrease.Described adhesive glue is from described transparent conductive substrate and described lower glass base
Bind through described breakdown area with described top glass substrate between plate.
Owing to conducting wire that area is bigger has bigger impedance and preferable temperature rise effect can be provided,
Heatable glyglass structure disclosed in this utility model embodiment is by " multiple described strips are led
The respective width of electric line successively decreases along described y direction " design, it is provided that electric heating conversion is all
Homogenized effect.
For enable be further understood that feature of the present utility model and technology contents, refer to below in connection with
Detailed description of the present utility model and accompanying drawing, but the accompanying drawing provided only provides reference and explanation use,
Not it is used for this utility model person of being any limitation as.
Accompanying drawing explanation
Fig. 1 is the stereoscopic signal of the heatable glyglass of this utility model wherein embodiment
Figure；
Fig. 2 A is the profile of the heatable glyglass of this utility model wherein embodiment；
Fig. 2 B is the profile of the heatable glyglass of another embodiment of this utility model；
Fig. 3 is that transparent in the heatable glyglass structure of this utility model wherein embodiment is led
The schematic top plan view of electric substrate；
Fig. 4 is that transparent in the heatable glyglass structure of this utility model wherein embodiment is led
The profile of electric substrate；And
Fig. 5 is the electrically conducting transparent in the heatable glyglass structure of another embodiment of this utility model
The profile of substrate.
Detailed description of the invention
The following is and illustrate disclosed in this utility model relevant " heatable by specific instantiation
Glyglass " detailed description of the invention, those skilled in the art can be by content disclosed in this specification
Understand advantage of the present utility model and technique effect.This utility model can be by other different concrete realities
Executing example implemented or apply, the every details in this specification may be based on different viewpoints and application,
Various modification and change is carried out under not departing from spirit of the present utility model.It addition, it is of the present utility model
Accompanying drawing be only the most schematically illustrate, not according to the description of actual size, first give chat bright.Following is concrete
Embodiment will be explained in further detail correlation technique content of the present utility model, but disclosure of that
And be not used to limit technology category of the present utility model.
First, refer to shown in Fig. 1 and Fig. 2 A.Fig. 1 is this utility model wherein embodiment
The stereoscopic schematic diagram of heatable glyglass, and Fig. 2 A is this utility model wherein enforcement
The profile of the heatable glyglass of example.Please referring initially to shown in Fig. 2 A, of the present utility model can
Glyglass structure S of heating (heatable) comprises transparent conductive substrate 11, top glass substrate 2
And lower glass substrate 3.Transparent conductive substrate 11 has upper surface S1 and with upper surface S1 each other
The lower surface S2 being reversed, and top glass substrate 2 and lower glass substrate 3 are respectively by upper glutinous
Rubber alloy layer 12 and lower bonding glue-line 13 and be attached to respectively transparent conductive substrate 11 upper surface S1 and
On lower surface S2.Specifically, upper bonding glue-line 12 is arranged at transparent conductive substrate 11 and upper glass
Between glass substrate 2, and lower bonding glue-line 13 is arranged at transparent conductive substrate 11 and lower glass substrate 3
Between.
Furthermore, by will be located in the both sides of transparent conductive substrate 11 upper bonding glue-line 12 and
Lower bonding glue-line 13 hot pressing is binded, and bonding glue-line 12 and lower bonding glue-line 13 can be made to fuse each other
And transparent conductive substrate 11 is packaged between upper bonding glue-line 12 and lower bonding glue-line 13, whereby
Form cementing layer 1.Top glass substrate 2 and the material of lower glass substrate 3 and shape system not subject to the limits.
Owing to heatable glyglass structure S disclosed in this utility model embodiment can be used as vehicle
Front windshield, therefore, top glass substrate 2 and lower glass substrate 2 preferably have trapezoidal shape.
In other words, when as the front windshield of vehicle, adding disclosed in this utility model embodiment
Glyglass structure S of heat has the trapezoidal shape that lower width is wider, upper width is narrower.Upper glutinous
Rubber alloy layer 12 and lower bonding glue-line 13 can be formed by polyvinyl butyral resin (PVB), and
Each there is the thickness between 100 to 500 microns.
It follows that refer to shown in Fig. 3 to Fig. 5.Fig. 3 is this utility model wherein embodiment
The schematic top plan view of transparent conductive substrate in heatable glyglass structure；Fig. 4 is this utility model
The wherein profile of the transparent conductive substrate in the heatable glyglass structure of an embodiment；And scheme
5 is the transparent conductive substrate in the heatable glyglass structure of another embodiment of this utility model
Profile.Transparent conductive substrate 11 comprises bearing substrate 111 and is arranged on bearing substrate 111
Conductive layer 112, wherein conductive layer 112 has multiple along y direction (that is, Y direction) arrangement
Strips of conductive circuit 1121 and at least be connected to the wiring 1122 of strips of conductive circuit 1121,
Multiple strips of conductive circuits 1121 respective width h1～h7Successively decrease along y direction.
Hold above-mentioned, as it is shown on figure 3, in the present embodiment, the conductive layer 112 of transparent conductive substrate 11
There is the strips of conductive circuit 1121 being arranged in parallel with each other along y direction (that is, Y direction), and
The two ends of strips of conductive circuit 1121 are connected by wiring 1122, and by wiring 1122 and external electrical
Source (not shown) is interconnected to form electric connection.Lead by external power source is imported strip
Electric line 1121, it is possible to use impedance produces the effect of electric heating conversion.Consequently, it is possible to by electrically conducting transparent
The cementing layer 1 that substrate 11, upper bonding glue-line 12 and lower bonding glue-line 13 are constituted can connect outside
Power supply and thermo-electric conversion is provided, and then formed there is the vehicle windscreen structure of defrosting function.
Specifically, transparent conductive substrate 11 can be selected for plastic material, such as polyethylene terephthaldehyde
Acid esters (Polyethylene Terephthalate, PET) as bearing substrate 111, and in carrying base
Conductive layer 112 is formed on one surface of plate 111.In addition to polyethylene terephthalate, it is also possible to
Use selected from by polyethylene (PE), polyimides (PI), polyamide (PA), polyurethane (PU)
And one or more material of group that acryl is formed is to manufacture bearing substrate 111.Bearing substrate 111
Thickness can be between 10 to 500 microns.
For forming conductive layer 112, can first pass through and electrically conducting transparent ink is taken shape in bearing substrate 111
Conductive film (non-label) is formed on surface.Available physical vapor depositing technology (Physical
Vapor Deposition, PVD), including evaporation (Evaporation Deposition), ion plating (Ion
Plating), the one of which of sputter (Sputtering Deposition) forms conductive film.It addition,
Electrically conducting transparent ink is taken shape in bearing substrate 111 by the technology can also utilize printing, being impregnated with or spraying
Surface on and form conductive film.Then, further with chemical etching or laser carved technology,
By on conductive film not need part removed, with produce strips of conductive circuit 1121 and with
The wiring 1122 that external power source is electrically connected with, and then form conductive layer 112.Alternatively, it is also possible to it is extra
Making metallic line (not shown) be for electrically connecting to strips of conductive circuit 1121, wiring
1122 and external power source.
Electrically conducting transparent ink can be made up of inorganic conductive material or organic conductive material.For example,
The inorganic conductive material of composition electrically conducting transparent ink can be metal or metal-oxide, such as Sb doped oxygen
Change stannum (ATO), nm silver, tin indium oxide (Indium Tin Oxide, ITO) or its etc. combination.
The organic conductive material of composition electrically conducting transparent ink can be organic semiconductor macromolecular material, the most poly-two
Oxygen ethylthiophene (Poly-3,4-Ethylenedioxythiophene, PEDOT), carbon nanotube or its etc.
Combination.For example, heatable glyglass structure S disclosed in this utility model embodiment
In conductive layer 112 can be by the electrically conducting transparent glue mixed with carbon nanotube, i.e. carbon nanotube and PEDOT
Mixture formed.Use the optics percent of pass of conductive layer 112 made by described material up to
More than 85%, and the most oxidizable, deterioration, do not affect the printing opacity demand of bare glass, because of
This, can be highly suitable for manufacturing the front windshield of vehicle.
It addition, in heatable glyglass structure S disclosed in this utility model embodiment, conduction
Layer 112 thickness can between 10 to 500 microns, and the sheet resistance of conductive layer 112 can be between
10 to 1000 ohm-sq.
Then, Fig. 5 is referred to.In another embodiment of this utility model, heatable glyglass
Structure S further comprises optics hardened layer 113, and it is arranged at bearing substrate 111 and conductive layer 112
Between.The thickness of optics hardened layer 113 is between 1 to 10 micron, and optics hardened layer 113 can be by
Acryl, epoxy resin, silicon dioxide or its etc. combination formed.
Referring to Fig. 3, strips of conductive circuit 1121 is parallel to each other and along y direction (Y direction)
It is arranged on the surface of bearing substrate 111.It addition, strips of conductive circuit 1121 respective width h1～h7
It it is the size at y direction such as its grade.In heatable glyglass structure disclosed in the utility model
In S, strips of conductive circuit 1121 respective width h1～h7Successively decrease along described y direction.
As previously described, because heatable glyglass structure S disclosed in this utility model embodiment
Can be as the front windshield of vehicle, therefore it is generally of that upper end width is narrower, lower width is wider
Trapezoidal shape.As it is shown on figure 3, the width of the strips of conductive circuit 1121 closest to trapezoidal bottom
h1It is greater than the width h of its neighbouring strips of conductive circuit 11212, and width h2It is greater than it neighbouring
The width h of strips of conductive circuit 11213, the rest may be inferred.In other words, in the reality shown in Fig. 3
Execute in example, width h1>h2>h3>h4>h5>h6>h7.In other words, the width of strips of conductive circuit 1121
Degree h1～h7It is to be successively decreased to top by the bottom of heatable glyglass structure S.
Owing to, for conductor, its resistance and length are directly proportional, the strips of conductive circuit that area is bigger
1121 can have bigger impedance and have preferably temperature rise effect.Therefore, the closer at the bottom of trapezoidal shape
The strips of conductive circuit 1121 of end has bigger width and area, its can have bigger resistance and
There is preferably temperature rise effect；On the contrary, closer to trapezoidal top strips of conductive circuit 1121 then
Because having lesser width and area, it can have less resistance and have the phenomenon of intensification more
Slowly.Consequently, it is possible to by making strips of conductive circuit 1121 respective width h1～h7Along longitudinal axis side
To successively decreasing, i.e. successively decreased towards top by the bottom of vehicle front windshield, it is right effectively to offset by heat
The phenomenon of heating (except the mist) inequality that stream effect is caused, reaches to improve heatable glyglass knot
The heat of structure S is uniformly distributed effect.Utilizing this specific live width to configure, this utility model embodiment institute is public
The effect of the electric heating conversion homogenization that heatable glyglass structure S opened may be provided under large area
Really.
It addition, refer to Fig. 2 B, in another embodiment of this utility model, for strengthening upper glass base
Cohesive force between plate 2 and lower glass substrate 3, i.e. avoid top glass substrate 2 and lower glass base
Cohesive force between plate 3 is affected by arranging of transparent conductive substrate 11, transparent conductive substrate 11
(comprising bearing substrate 111 and conductive layer 112) is at the logicalnot circuit region (conductor wire of conductive layer 112
Region beyond road 1121 and wiring 1122) can through cutting or punching press and basket is empty, formed whereby
Breakdown area 114, makes the bonding coat 12 ' being arranged on transparent conductive substrate 11 wherein side directly wear
The breakdown area 114 of transparent conductive substrate 11 and the bonding between upper lower glass plate is provided.
Heatable glyglass structure S disclosed in this utility model embodiment may be provided at multiple
Position, such as: cabinet, window, door, table, wall, vehicle, attemperator, cold-keeping device, baking
The glass for windows and doors of device.But, this utility model is not limited.Preferably, this utility model
Heatable glyglass structure S disclosed in embodiment is disposed on vehicle front windshield or car
On door and window, in order to provide the effect except mist, guarantee the good driving visual field simultaneously.
In sum, the beneficial effects of the utility model are, disclosed in this utility model embodiment
Heatable glyglass structure S, it can pass through " multiple respective width of strips of conductive circuit 1121
h1～h7Successively decrease along y direction " design, it is provided that electric heating conversion homogenization effect.In other words
Say, when as vehicle front windshield, by multiple strips of conductive circuits 1121 can be added with oneself
The mode successively decreased towards top in the bottom of glyglass structure S of heat configures, and can offset by thermal convection current effect
The uneven phenomenon that heats up caused.Furthermore, heatable glyglass disclosed in the utility model
Structure S be utilize electrically conducting transparent ink make provide heating effect strips of conductive circuit 1121 and
Wiring 1122, therefore, well suited can guarantee the excellent driving visual field in the front windshield of vehicle.
The foregoing is only preferred possible embodiments of the present utility model, non-therefore limit to this utility model
The scope of the claims, therefore the equivalence techniques such as using this utility model description and accompanying drawing content to be done becomes
Change, be both contained in protection domain of the present utility model.
Claims (11)
1. a heatable glyglass structure, it is characterised in that described heatable glyglass
Structure includes:
One transparent conductive substrate, described transparent conductive substrate has a upper surface and with described
The lower surface of upper surface setting opposite each other；
One top glass substrate, described top glass substrate is attached to described by adhesive glue laminating on
On the described upper surface of transparent conductive substrate；And
One lower glass substrate, described lower glass substrate is attached to described by adhesive glue laminating once
On the described lower surface of transparent conductive substrate；
Wherein, described transparent conductive substrate comprises a bearing substrate and and is arranged on described carrying
Conductive layer on substrate, wherein said conductive layer has multiple bar along a y direction arrangement
Shape conducting wire and at least one is connected to the wiring of described strips of conductive circuit, multiple described
The respective width of strips of conductive circuit successively decreases along described y direction.
Heatable glyglass structure the most according to claim 1, it is characterised in that described
Heatable glyglass structure is used for a vehicle windshield, multiple described strips of conductive lines
The respective described width in road by the bottom of described vehicle windshield towards described vehicle front glass
Successively decrease in the top of glass.
Heatable glyglass structure the most according to claim 1, it is characterised in that described
Upper bonding glue-line is arranged between described transparent conductive substrate and described top glass substrate.
Heatable glyglass structure the most according to claim 1, it is characterised in that described
Lower bonding glue-line is arranged between described transparent conductive substrate and described lower glass substrate.
Heatable glyglass structure the most according to claim 1, it is characterised in that described
Strips of conductive circuit is set parallel to each other.
Heatable glyglass structure the most according to claim 1, it is characterised in that described
The respective width of strips of conductive circuit is that described strips of conductive circuit is on described y direction
Size.
Heatable glyglass structure the most according to claim 1, it is characterised in that described
Upper bonding glue-line and described lower bonding glue-line each have between 100 microns to 500 microns it
Between thickness.
Heatable glyglass structure the most according to claim 1, it is characterised in that described
The thickness of bearing substrate is between 10 microns to 500 microns.
Heatable glyglass structure the most according to claim 1, it is characterised in that described
Conductive layer is formed by an inorganic conductive material or an organic conductive material, and described conductive layer
Thickness between 10 microns to 500 microns.
Heatable glyglass structure the most according to claim 1, it is characterised in that described
Heatable glyglass structure may further comprise: an optics hardened layer, and described optics is hard
Change layer to be arranged between described bearing substrate and described conductive layer, the thickness of described optics hardened layer
Degree is between 1 micron to 10 micron.
11. 1 kinds of heatable glyglass structures, it is characterised in that described heatable glyglass
Structure includes:
One transparent conductive substrate, described transparent conductive substrate has a upper surface and with described
The lower surface of upper surface setting opposite each other；
One top glass substrate, described top glass substrate is attached to described transparent by an adhesive glue
On the described upper surface of electrically-conductive backing plate；And
One lower glass substrate, described lower glass substrate is attached to described by described adhesive glue
On the described lower surface of bright electrically-conductive backing plate；
Wherein, described transparent conductive substrate comprises a bearing substrate, one is arranged on described carrying
Conductive layer on substrate and multiple puncture hitting of described bearing substrate and described conductive layer
Wearing region, wherein said conductive layer has multiple strips of conductive line along a y direction arrangement
Road and at least one is connected to the wiring of described strips of conductive circuit, multiple described strips of conductive
The respective width of circuit successively decreases along described y direction；
Wherein, described adhesive glue is between described transparent conductive substrate and described lower glass substrate
Bind through described breakdown area with described top glass substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105203214 | 2016-03-09 | ||
| TW105203214U TWM525272U (en) | 2016-03-09 | 2016-03-09 | Heatable triplex structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205553431U true CN205553431U (en) | 2016-09-07 |
Family
ID=56817167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620201841.3U Active CN205553431U (en) | 2016-03-09 | 2016-03-16 | Heatable laminated glass structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN205553431U (en) |
| TW (1) | TWM525272U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111556808A (en) * | 2018-12-11 | 2020-08-18 | 法国圣戈班玻璃厂 | Laminated glass panel comprising a transparent substrate with a heating layer comprising a set of flow lines of variable width |
-
2016
- 2016-03-09 TW TW105203214U patent/TWM525272U/en unknown
- 2016-03-16 CN CN201620201841.3U patent/CN205553431U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111556808A (en) * | 2018-12-11 | 2020-08-18 | 法国圣戈班玻璃厂 | Laminated glass panel comprising a transparent substrate with a heating layer comprising a set of flow lines of variable width |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM525272U (en) | 2016-07-11 |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |