CN205510662U - Novel aluminium base plate structure module power metallic shield cover - Google Patents
Novel aluminium base plate structure module power metallic shield cover Download PDFInfo
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- CN205510662U CN205510662U CN201620229849.0U CN201620229849U CN205510662U CN 205510662 U CN205510662 U CN 205510662U CN 201620229849 U CN201620229849 U CN 201620229849U CN 205510662 U CN205510662 U CN 205510662U
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Abstract
The utility model discloses a novel aluminium base plate structure module power metallic shield cover is equipped with the metal and encloses the frame on the aluminium base board, the metal encloses and forms the encapsulating chamber between frame and the aluminium base board after the bonding, and the encapsulating intracavity has injected the heat -conducting glue, and the metal encloses the frame top and is equipped with PCB shielding apron, and PCB shielding apron encloses to paste between the frame with the metal to be connected for aluminium base board, metal enclose the frame and PCB screening cover hoarding becomes the enclosure space. The utility model discloses simple structure is reliable, has simplified encapsulating work, has good maneuverability, has improved safety protection and shielding effect to the power simultaneously, has reduced switching power supply's radiation.
Description
Technical field
This utility model relates to a kind of Novel aluminum base plate construction module power Metal radome.
Background technology
Current existing modular power source is plastic cement/cover of meter hood structure respectively, has glue filling opening at top, pours into heat-conducting glue by this hole.This structure there is problems in that
1, the present opening of module is less, and owing to PCB fabric swatch is the most nervous, module interior space is little, and heat-conducting glue mobility is poor, and encapsulating is difficult to fill and there is bubble and the encapsulating time is long, increases the operation easier in production process；
2, existing plastic cement/cover of meter hood needs stifled seam gap to there is the problem of leakage glue, and needs just can carry out encapsulating operation after processing, and adds cost of labor；
3, plastic cement cover cap comprcssive strength is low, and plastic cement is the highest to power protection reliability, if cover of meter hood then exists input to series of problems such as output, inputoutput pair metal cover board safe insulation；
4, plastic cement cover structure is poor to EMI shield effectiveness.
Accordingly, it would be desirable to one can be arranged on modular power source aluminium base, and modular power source is played the radome of security mask protective effect.
Summary of the invention
In order to overcome the deficiency of existing technology; this utility model provides a kind of Novel aluminum base plate construction module power Metal radome; solve modular power source plastic cement cover cap encapsulating difficulty and cover of meter hood input to output, the problem of inputoutput pair metal cover board safe insulation; solve plastic cement cover cap comprcssive strength difference and the plastic cement cover cap integrity problem to power protection; also solving the heat radiation of plastic cement cover cap and radiation problem, outward appearance is more attractive simultaneously.
Technical solutions of the utility model are as described below:
A kind of Novel aluminum base plate construction module power Metal radome, it is characterized in that, aluminium base is provided with metal enclosure frame, encapsulating chamber is formed after bonding between described metal enclosure frame and described aluminium base, described encapsulating intracavity has poured into heat-conducting glue, described metal enclosure frame is arranged over PCB shielding cover board, pastes and be connected between described PCB shielding cover board and described metal enclosure frame so that described aluminium base, described metal enclosure frame and described PCB shielding cover board surround closing space.
Further, described metal enclosure frame is that aluminum casts peripheral frame.
Further, described aluminum casting peripheral frame is that black aluminum casts peripheral frame.
Further, described PCB shielding cover board is one side or the pcb board of above flaggy.
Further, described PCB shielding cover board is double-sided PCB board.
Further, described PCB shielding cover board is the pcb board of 4 layers or more than 4 layers flaggies.
Further, by G500 epoxy cement glue bond between described aluminium base and described metal enclosure frame.
Further, by G500 epoxy cement glue bond between described metal enclosure frame and described PCB shielding cover board.
According to this utility model of such scheme, it has the beneficial effects that, this utility model is simple and reliable for structure, it is very easy to the encapsulating assembly work of modular power source, shortens power supply installation time, by contrast, technique has good operability, and process for filling colloid flow process is greatly simplified；Use aluminum casting peripheral frame and PCB shielding cover cap, aluminium base to closely cooperate, define a complete cover of meter hood, improve the safeguard protection effect to power supply；Additionally, utilize multi-layer PCB board lined with copper to add aluminum substrate structure and there is good shielding, the problem that can effectively solve Switching Power Supply radiation, the problem that simultaneously can also solve cover of meter hood safe insulation, wherein, dual platen even 4 laminate or above flaggy can be taken into account and solve shielding and the problem of insulation.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
In the drawings, 1, PCB shielding cover board；2, metal enclosure frame；3, aluminium base.
Detailed description of the invention
Below in conjunction with the accompanying drawings and this utility model is conducted further description by embodiment:
As shown in Figure 1; a kind of Novel aluminum base plate construction module power Metal radome; aluminium base 3 is provided with metal enclosure frame 2; forming encapsulating chamber between metal enclosure frame 2 and aluminium base 3 after bonding, encapsulating intracavity has poured into heat-conducting glue, and metal enclosure frame 2 is arranged over PCB shielding cover board 1; paste between PCB shielding cover board 1 with metal enclosure frame 2 and be connected; make aluminium base 3, metal enclosure frame 2 and PCB shielding cover board 1 surround closing space, components and parts are enclosed in cover cap, thus play safeguard protection and shielding action.
Metal enclosure frame 2 casts peripheral frame for black aluminum.
PCB shielding cover board 1 is the pcb board of one side or above flaggy.Preferably, PCB shielding cover board 1 is double-sided PCB board, or the pcb board of 4 layers or more than 4 layers flaggies, can take into account and solve shielding and the problem of insulation.
Preferably, by G500 epoxy cement glue bond between aluminium base 3 and metal enclosure frame 2, by G500 epoxy cement glue bond between metal enclosure frame 2 and PCB shielding cover board 1.
It should be appreciated that for those of ordinary skills, can be improved according to the above description or be converted, and all these modifications and variations all should be belonged to the protection domain of this utility model claims.
Above in conjunction with accompanying drawing, this utility model patent is carried out exemplary description; obviously the realization of this utility model patent is not subject to the restrictions described above; if the various improvement that the method design that have employed this utility model patent is carried out with technical scheme; or the most improved design by this utility model patent and technical scheme directly apply to other occasion, all in protection domain of the present utility model.
Claims (8)
1. a Novel aluminum base plate construction module power Metal radome, it is characterized in that, aluminium base is provided with metal enclosure frame, encapsulating chamber is formed after bonding between described metal enclosure frame and described aluminium base, described encapsulating intracavity has poured into heat-conducting glue, described metal enclosure frame is arranged over PCB shielding cover board, pastes and be connected between described PCB shielding cover board and described metal enclosure frame so that described aluminium base, described metal enclosure frame and described PCB shielding cover board surround closing space.
Novel aluminum base plate construction module power Metal radome the most according to claim 1, it is characterised in that described metal enclosure frame is that aluminum casts peripheral frame.
Novel aluminum base plate construction module power Metal radome the most according to claim 2, it is characterised in that described aluminum casting peripheral frame is that black aluminum casts peripheral frame.
Novel aluminum base plate construction module power Metal radome the most according to claim 1, it is characterised in that described PCB shielding cover board is one side or the pcb board of above flaggy.
Novel aluminum base plate construction module power Metal radome the most according to claim 4, it is characterised in that described PCB shielding cover board is double-sided PCB board.
Novel aluminum base plate construction module power Metal radome the most according to claim 4, it is characterised in that described PCB shielding cover board is the pcb board of 4 layers or more than 4 layers flaggies.
Novel aluminum base plate construction module power Metal radome the most according to claim 1, it is characterised in that by G500 epoxy cement glue bond between described aluminium base and described metal enclosure frame.
Novel aluminum base plate construction module power Metal radome the most according to claim 1, it is characterised in that by G500 epoxy cement glue bond between described metal enclosure frame and described PCB shielding cover board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620229849.0U CN205510662U (en) | 2016-03-24 | 2016-03-24 | Novel aluminium base plate structure module power metallic shield cover |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620229849.0U CN205510662U (en) | 2016-03-24 | 2016-03-24 | Novel aluminium base plate structure module power metallic shield cover |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205510662U true CN205510662U (en) | 2016-08-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620229849.0U Active CN205510662U (en) | 2016-03-24 | 2016-03-24 | Novel aluminium base plate structure module power metallic shield cover |
Country Status (1)
| Country | Link |
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| CN (1) | CN205510662U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107509383A (en) * | 2017-09-22 | 2017-12-22 | 昆山维开安电子科技有限公司 | A kind of Transparent shielding cover for pcb board |
-
2016
- 2016-03-24 CN CN201620229849.0U patent/CN205510662U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107509383A (en) * | 2017-09-22 | 2017-12-22 | 昆山维开安电子科技有限公司 | A kind of Transparent shielding cover for pcb board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000 Shenzhen City, Shenzhen, Guangdong, Nanshan District Taoyuan street, No. 1268, honghualing industrial North District, 1, 2 4 floors, West, 5, 6. Patentee after: Shenzhen holdluck-zyt supply technology Limited by Share Ltd Address before: 518000 Shenzhen City, Shenzhen, Guangdong, Nanshan District Taoyuan street, No. 1268, honghualing industrial North District, 1, 2 4 floors, West, 5, 6. Patentee before: ShenZhen VAPEL Power Supply Technology Co., Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: 518116 Shenzhen, Longgang, Guangdong Longgang District, Baolong Industrial Zone, Longgang Road, three road 4, A Building 1, 2 floor B building 3, 4 floor C building 3, 4 Building D Patentee after: Shenzhen holdluck-zyt supply technology Limited by Share Ltd Address before: 518000 Shenzhen City, Shenzhen, Guangdong, Nanshan District Taoyuan street, No. 1268, honghualing industrial North District, 1, 2 4 floors, West, 5, 6. Patentee before: Shenzhen holdluck-zyt supply technology Limited by Share Ltd |
|
| CP02 | Change in the address of a patent holder |