CN205491580U - IGBT heat dissipation module and have its IGBT module - Google Patents
IGBT heat dissipation module and have its IGBT module Download PDFInfo
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- CN205491580U CN205491580U CN201520976338.0U CN201520976338U CN205491580U CN 205491580 U CN205491580 U CN 205491580U CN 201520976338 U CN201520976338 U CN 201520976338U CN 205491580 U CN205491580 U CN 205491580U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Abstract
The utility model discloses a IGBT heat dissipation module and have its IGBT module, this IGBT heat dissipation module includes: radiator bottom plate, radiator bottom plate includes: a bottom plate body and N heat dissipation post, bottom plate body include this somatic part and set up first top layer and the second top layer on two relative surfaces of this somatic part respectively, and this somatic part is made for aluminium carborundum, and a N heat dissipation intercolumniation separates to be established on first top layer, and the one end of every heat dissipation post is the free end with the fixed just other end in first top layer, and the first top layer and the post that dispels the heat all are suitable for and contact with the coolant liquid, copper -clad plate, copper -clad plate include base plate, first copper layer and second copper layer, and first copper layer sets up two surfaces of the relative setting on the base plate respectively with second copper layer on, and the thickness on first copper layer is lighter than the thickness on second copper layer, and establish on the second top layer on first copper layer. Because first copper layer is different with the thickness on second copper layer, can be so that the copper -clad plate after the welding be more straight.
Description
Technical field
This utility model relates to heat sink technology field, particularly relates to a kind of IGBT heat radiation module and has this IGBT and dissipate
The IGBT module of thermal module.
Background technology
Compact using liquid as the heat spreader structures of cooling medium and be configured to than relatively thin tabular or strip metal fin
Or needle-like structure, fluid passage is arranged in the inside of radiator so that generation heat convection between fluid and cooled plate, thus fluid
The heat power consumption of cooled plate surface high power electronic components and parts can be dispersed.
In correlation technique, the copper plate thickness of two-layer up and down of copper-clad plate is identical, owing to the thermal coefficient of expansion of copper is big, in high tender feeling
Under condition, copper-clad plate is prone to stick up foot, affects the setting of electric elements.
Utility model content
One of technical problem that this utility model is intended to solve in correlation technique the most to a certain extent.To this end, this reality
With novel proposition one IGBT heat radiation module, the copper-clad plate of this IGBT heat radiation module is possible to prevent to tilt, and can effectively support electricity
Device element.
This utility model proposes a kind of IGBT module further.
According to IGBT of the present utility model dispel the heat module, including: base plate of radiator, described base plate of radiator includes: base plate
Body and N number of thermal column, described base plate body includes body and relative two surface being separately positioned on described body
On the first top layer and the second top layer, described body is that aluminium silicon carbide is made, and described N number of thermal column is spaced apart is located at described
On one top layer, and one end of each described thermal column fixes with described first top layer and the other end is free end, described first table
Layer is adapted to contact with coolant with described thermal column；Copper-clad plate, described copper-clad plate includes substrate, the first layers of copper and the second bronze medal
Layer, described first layers of copper and described second layers of copper are respectively provided with on be oppositely arranged two surfaces on the substrate, and institute
Stating the thickness thickness less than described second layers of copper of the first layers of copper, described first layers of copper is located on described second top layer.
According to IGBT of the present utility model heat radiation module, by the thickness of the first layers of copper is set smaller than the second layers of copper
Thickness, can be beneficial to the welding of chip, so that the copper-clad plate after Han Jie is more straight, can effectively prevent copper-clad plate upwards
Tilt, such that it is able to be effectively improved the copper-clad plate support effect to electric elements, the envelope of copper-clad plate and igbt chip can be improved
Dress stability, it is ensured that the functional reliability of igbt chip, it is also possible to improve the structural strength of copper-clad plate, extends copper-clad plate
Service life.
According to IGBT module of the present utility model, including igbt chip and described IGBT heat radiation module, described IGBT core
Sheet is arranged in described second layers of copper.By the thickness of the first layers of copper being set smaller than the thickness of the second layers of copper, can be beneficial to
The welding of chip, so that the copper-clad plate after Han Jie is more straight, can effectively prevent copper-clad plate to be upturned, thus can
To be effectively improved the copper-clad plate support effect to electric elements, the packaged stability of copper-clad plate and igbt chip can be improved, can
To ensure the functional reliability of igbt chip, it is also possible to improve the structural strength of copper-clad plate, extend the service life of copper-clad plate.
Accompanying drawing explanation
Fig. 1 is the side view of the base plate of radiator in the IGBT heat radiation module according to this utility model embodiment；
Fig. 2 is the enlarged drawing of region A in Fig. 1；
Fig. 3 is the upward view of the IGBT heat radiation module according to first embodiment of this utility model；
Fig. 4 is the enlarged drawing of region B in Fig. 3；
The sectional view of the base plate of radiator that Fig. 5 is located in cooling bath；
Fig. 6 is the enlarged drawing of region C in Fig. 5；
Fig. 7 is the side view according to this utility model embodiment IGBT heat radiation module；
Fig. 8 is the enlarged drawing of region D in Fig. 7；
Fig. 9 is the schematic diagram of the IGBT heat radiation module according to first embodiment of this utility model；
Figure 10 is the axonometric chart of the IGBT heat radiation module according to first embodiment of this utility model；
Figure 11 is the upward view of the IGBT heat radiation module according to second embodiment of this utility model；
Figure 12 is the top view of the IGBT heat radiation module according to second embodiment of this utility model；
Figure 13 is the side view of the IGBT heat radiation module according to this utility model embodiment；
Figure 14 is the enlarged drawing of region E in Figure 13；
Figure 15 is the steady state heat resistance numerical tabular according to IGBT module of the present utility model；
Figure 16 is the maximum temperature numerical tabular according to IGBT module of the present utility model.
Reference:
IGBT dispels the heat module 1000；
Base plate of radiator 100；
Base plate body 10；First top layer 11；Second top layer 12；Body 13；
Thermal column 20；Free end 21；Fixing end 22；Cooling bath 30；
Copper-clad plate 200；Substrate 210；First layers of copper 220；Second layers of copper 230.
Detailed description of the invention
Of the present utility model embodiment is described below in detail, and the example of described embodiment is shown in the drawings.Below by
The embodiment being described with reference to the drawings is exemplary, it is intended to be used for explaining this utility model, and it is not intended that new to this practicality
The restriction of type.
Below with reference to the accompanying drawings IGBT (the Insulated Gate Bipolar according to this utility model embodiment is described in detail
Transistor-insulated gate bipolar transistor) heat radiation module 1000.
IGBT heat radiation module 1000 according to this utility model embodiment may include that base plate of radiator 100 and copper-clad plate
200.Base plate of radiator 100 may include that base plate body 10 and N number of thermal column 20.As shown in figures 1 and 3, base plate body 10 can
With include body 13 be separately positioned on body 13 relative two surface on the first top layer 11 and the second top layer 12,
I.e. first top layer 11 and the second top layer 12 are oppositely arranged on body 13.As shown in fig. 10 and fig. 12, the second top layer 12 is pacified
Equipped with copper-clad plate 200, copper-clad plate 200 is provided with electric elements (not shown, such as igbt chip).It should be noted that
Base plate of radiator 100 has multiple choices, such as, although the quantity of the thermal column 20 on the base plate of radiator 100 shown in Figure 11 is bright
The aobvious quantity more than the thermal column 20 on the base plate of radiator 100 shown in Fig. 3, but two kinds of base plate of radiator 100 all can select
Take.
By copper-clad plate 200 being arranged between base plate of radiator 100 and electric elements, copper-clad plate 200 can be played and prop up
Support electric elements effect, and copper-clad plate 200 and electric elements can also produce be mutually linked, the effect of mutually insulated, from
And can ensure that electric elements and the job security of base plate of radiator 100.
Wherein, alternatively, the second top layer 12 can be aluminium lamination.N number of thermal column 20 is spaced apart to be located on the first top layer 11, and
And one end of each thermal column 20 fixes with the first top layer 11, and the other end of each thermal column 20 is free end 21, first
Top layer 11 is adapted to contact with coolant with thermal column 20.
As in figure 2 it is shown, one end of thermal column 20 is the fixing end 22 of thermal column 20, the fixing end 22 of thermal column 20 is permissible
It is fixedly connected on the first top layer 11.Thus, coolant can contact with the first top layer 11, it is also possible to each thermal column 20
The surface contact exposed, the heat that the electric elements being arranged on the second top layer 12 send can pass through copper-clad plate the 200, second table
Layer 12 and body 13 pass to the first top layer 11 and N number of thermal column 20, thus the first top layer 11 and N number of thermal column 20 can be by
The heat of electric elements passes to coolant further, and then can play the effect of the heat distributing electric elements, it is ensured that
Electric elements job stability.
Shown in Fig. 7 and Fig. 8, copper-clad plate 200 can include substrate the 210, first layers of copper 220 and the second layers of copper 230, the
One layers of copper 220 and the second layers of copper 230 can be respectively provided with on be oppositely arranged two surfaces over the substrate 210, such as Fig. 8 institute
Showing, the first layers of copper 220 is arranged on the lower surface of substrate 210, and the second layers of copper 230 is arranged on the upper surface of substrate 210, and
The thickness h 1 of the first layers of copper 220 can be less than the thickness h 2 of the second layers of copper 230, and the first layers of copper 220 is located on the second top layer 12, the
In two layers of copper 220, electric elements are installed, say, that the thickness h 2 of the second layers of copper 230 being provided with electric elements is greater than
It is fitted without the first layers of copper 220h1 of electric elements, i.e. h2 ＞ h1.By the thickness h 1 of the first layers of copper 220 is set smaller than
The thickness h 2 of the second layers of copper 230, can improve the entirety of copper-clad plate 200 and be heated ability, can be beneficial to the welding of chip, can make
Copper-clad plate 200 after must welding is the most straight, can effectively prevent copper-clad plate 200 to be upturned, cover such that it is able to be effectively improved
The copper coin 200 support effect to electric elements, can improve copper-clad plate 200 and the packaged stability of igbt chip 2000, permissible
Ensure the functional reliability of igbt chip 2000, it is also possible to improve the structural strength of copper-clad plate 200, extend making of copper-clad plate 200
Use the life-span.
Thus, according to the IGBT heat radiation module 1000 of this utility model embodiment, by the thickness h 1 by the first layers of copper 220
It is set smaller than the thickness h 2 of the second layers of copper 230, the welding of chip can be beneficial to, so that the copper-clad plate 200 after Han Jie is compared
More straight, can effectively prevent copper-clad plate 200 to be upturned, such that it is able to be effectively improved copper-clad plate 200, electric elements be propped up
Support effect, can improve copper-clad plate 200 and the packaged stability of igbt chip 2000, it is ensured that the work of igbt chip 2000
Reliability, it is also possible to improve the structural strength of copper-clad plate 200, extends the service life of copper-clad plate 200.
The optional arrangement of copper-clad plate 200 is described below in detail.
Alternatively, substrate 210 can be the one in aluminum oxide substrate, aluminium nitride substrate, silicon nitride board.Wherein, oxygen
Changing the radiating effect that aluminium base, aluminium nitride substrate, silicon nitride board all can reach, the radiating effect of silicon nitride board is more than
The radiating effect of aluminum oxide substrate, but the cost of silicon nitride board is higher than the cost of aluminum oxide substrate.Thermal coefficient of expansion: silicon nitride
(2.5ppm/K) ≈ silicon (2.5ppm/K) ＜ aluminium nitride (4.7ppm/K) ＜ aluminium oxide (6.8ppm/K), when substrate 210 and IGBT
Chip 2000 thermal expansion coefficient difference is the least, and the reliability of the work of igbt chip 2000 is the best.
Alternatively, the thickness h 1 of the first layers of copper 220 can be 0.2 millimeter-0.6 millimeter, and the thickness h 2 of the second layers of copper 230 can
Think 0.2 millimeter-0.6 millimeter.It should be noted that the span of the first layers of copper 220 and the second layers of copper 230 can be identical,
But, the first layers of copper 220 is different with the selected value of the second layers of copper 230, and such as, the thickness h 1 of the first layers of copper 220 can be 0.2 milli
Rice, the thickness h 2 of the second layers of copper 220 can be 0.2 millimeter outside other values.Preferably, the thickness h 2 of the second layers of copper 230 can
With the thickness h 1 more than the first layers of copper 220.
Alternatively, the thickness h 3 of substrate 210 can be 0.25 millimeter-1 millimeter.By rationally arranging the thickness of substrate 210
H3, it is ensured that the first layers of copper 220 and the second layers of copper 230 install reliability over the substrate 210, can promote copper-clad plate 200
Support the effect of electric elements, but also can ensure that the structural strength of copper-clad plate 200, extend the service life of copper-clad plate 200.
Alternatively, as shown in Figure 9 and Figure 10, copper-clad plate 200 can be multiple, and multiple copper-clad plate 200 is along base plate of radiator
Length direction (i.e. direction before and after shown in Fig. 9) the spaced apart setting of 100.Preferably, between adjacent two copper-clad plates 200 away from
It it is 3 millimeters-10 millimeters from L3.By rationally arranging distance L3 between adjacent two copper-clad plates 200, cover copper so that multiple
Plate 200 can support multiple electric elements.
The optional arrangement of base plate of radiator 100 is described below in detail.
Wherein, on the first top layer 11, the area with coolant contact portion is S1, with each thermal column on the first top layer 11
20 areas contacting part are S2,180≤S1/S2≤800.It is understood that meet at the bottom of the radiator of above-mentioned relation formula
Plate 100 is so that the first top layer 11 is reasonable in design with the area S1 of coolant contact portion, it is also possible to make the first top layer 11
It is reasonable in design with the area S2 of N number of thermal column 20 contact portion, so that the first top layer 11 and N number of thermal column 20 are respectively
Stable with coolant heat exchange and reliable, can well reduce coolant flow resistance while ensureing sufficiently large area of dissipation,
Improve radiating efficiency.Preferably, 200≤S1/S2≤500.
Wherein, the quantity of thermal column 20 meets relational expression: 300≤N ＜ 650.The thermal column 20 meeting above-mentioned relation formula can
With in the case of ensureing that thermal column 20 and coolant heat exchange effect are reliably, it is also possible to make base plate of radiator 100 effectively subtract
The quantity of few thermal column 20, such that it is able to reduce the processing technique requirement of base plate of radiator 100, it is also possible to reduce at the bottom of radiator
The demoulding difficulty of plate 100, improves the yield rate of base plate of radiator 100, reduces the production difficulty of base plate of radiator 100, reduces and dissipates
The production cost of hot device base plate 100.Preferably, 300≤N ＜ 420.
According to an embodiment of the present utility model, the area of dissipation of IGBT heat radiation module 1000 is S, N number of thermal column 20
The area sum of outer surface of perisporium be S3, the area sum of the end face of the free end 21 of N number of thermal column 20 is S4, S=S1+
S3+S4, and 40000mm2≤S≤50000mm2.Thus, by rationally arranging the area of dissipation S of IGBT heat radiation module 1000,
So that the volume of IGBT heat radiation module 1000 is arranged rationally, and can ensure that the first top layer 11 and N number of thermal column 20 points
Not with the heat exchange effect of coolant so that base plate of radiator 100 heat-sinking capability is good and area design rationally, effectively
Ensure that the radiating effect of radiator.
In examples more of the present utility model, as in figure 2 it is shown, from one end of thermal column 20 to free end 21, thermal column
The area of the cross section of 20 can reduce to free end 21 from one end of thermal column 20.By each thermal column of appropriate design 20
The size of fixing end 22 and the size of free end 21 so that each thermal column 20 all with the first top layer 11 stable connection, and
And it is also possible that thermal column 20 structure is reliable, and beneficially thermal column 20 and the heat exchange of coolant.
Alternatively, as shown in Figure 6, the height of thermal column 20 is h, wherein, and 7.5mm≤h ＜ 8.2mm.Preferably, h=
8mm.By rationally arranging the height h of thermal column 20, can be so that thermal column 20 be arranged in cooling bath 30, it is ensured that heat radiation
The radiating effect of post 20.Preferably, the area of dissipation of each thermal column 20 is (S3+S4)/N, 80≤(S3+S4)/N≤120.
Wherein, the concrete structure of thermal column 20 is not limited.According to an embodiment of the present utility model, thermal column 20
It is so structured that pyramidal structure, the cross section of thermal column 20 can be circular, the radius of one end of thermal column 20 and free end 21
The ratio of radius be α, 1.2≤α≤1.8.As in figure 2 it is shown, the radius of the free end 21 of thermal column 20 is r1, consolidating of thermal column 20
The radius of fixed end 22 is r2, α=r2/r1.Thermal column 20 structure meeting above-mentioned relation formula is reliable, and with coolant contact site
Point area relatively big, the radiating effect of radiator can be fully ensured that so that heat exchange between thermal column 20 and coolant.Excellent
Selection of land, α=1.69.
In examples more of the present utility model, as shown in Figure 5 and Figure 6, coolant is suitable to be contained in cooling bath 30, cold
But groove 30 is suitable to be connected with the first top layer 11, and the free end 21 of thermal column 20 is apart from the minimum range of the diapire of cooling bath 30
For L1,0.2 millimeter≤L1≤2 millimeter.It is understood that the length of thermal column 20 is cooled the depth limit of groove 30, from
And the degree of depth of cooling bath 30 can be rationally set so that the length of thermal column 20 is reasonable.Meet the cooling bath 30 of above-mentioned relation formula
The cooling bath 30 interference to thermal column 20 can be reduced with thermal column 20, and can ensure that the normal work of thermal column 20.
In an optional embodiment of the present utility model, as shown in Figure 4, the distance of adjacent two thermal columns 20 can
Think L2,0.4 millimeter≤L2≤1.1 millimeter.Meet distance L2 of adjacent two thermal columns 20 of above-mentioned relation formula so that N
Individual thermal column 20 is arranged rationally on the first top layer 11, and can reduce the most to a certain extent adjacent two thermal columns 20 it
Between interfere with each other, thereby may be ensured that the normal heat exchange of each thermal column 20 and coolant, and then can ensure that radiator
The normal work of base plate 100.
Alternatively, two thermal columns 20 of arbitrary neighborhood may be constructed one group, the L2 of one of which and a group in remaining group
L2 can be unequal.Therefrom, it may be appreciated that, distance L2 of adjacent two thermal columns 20 can be according to practical condition
It is adjusted, thus the production difficulty of base plate of radiator 100 can be reduced the most to a certain extent.Such as, neighbouring first top layer
Distance L2 between two adjacent heat radiation posts 20 that the corner of 11 is arranged can regulate as the case may be.
The concrete arrangement form of the N number of thermal column 20 of a kind of base plate of radiator 100 is given below, but is not limited to this, wherein,
Quantity N=368 of N number of thermal column 20, the L2=0.62 millimeter of first group, the L2=1.038 millimeter of second group, the L2 of remaining group
Meet following condition: 0.62 millimeter≤L2≤1.04 millimeter.It is understood that distance L2 between adjacent two thermal columns 20
Minimum can be 0.62 millimeter, and maximum can be 1.04 millimeters.Thus, the connection and reasonable arrangement of thermal column 20, the demoulding is easy, becomes
Product rate is high.
Alternatively, the withdrawing pattern angle beta of each thermal column 20 can be 2 degree of-4 degree.Wherein, the withdrawing pattern angle beta of a thermal column 20
Can be different from the withdrawing pattern angle beta of another thermal column 20, it is also possible to identical.Withdrawing pattern angle beta meets the thermal column of above-mentioned angular range
20 demoulding difficulty that can reduce base plate of radiator 100 the most to a certain extent, improve the production finished product of base plate of radiator 100
Rate.
Preferably, withdrawing pattern angle beta is that the radiating effect of thermal column 20 of 2 degree to be better than the thermal column that withdrawing pattern angle beta is 4 degree slightly
The radiating effect of 20, but there is no and be obviously improved, withdrawing pattern can be more conducive to owing to increasing withdrawing pattern angle beta, and ensure that turnover
Mouth pressure reduction is minimum, and the withdrawing pattern angle beta of thermal column 20 can be determined according to technology difficulty and actual demand when using.
Preferably, the 11, second top layer 12, body the 13, first top layer can be with thermal column 20 by air pressure THROUGH METHOD die casting
One-body molded.Thus, integrated base plate of radiator 100 structural strength is high, and service life is long, and manufacturing process is simple.
According to a preferred embodiment of the present utility model, body 13 can be volume fraction be the aluminum of 60%-70%
Carborundum is made.Wherein, volume fraction refers to the volume of carborundum and the ratio of Al+ carborundum volume.It is understood that
Body 13 structure using aforementioned proportion to make is reliable, and heat-exchange capacity is good, and while guarantor's radiating efficiency, is manufactured into
This is low.Alternatively, thermal column 20 can be aluminum post or aluminium alloy column, and the first top layer 11 and the second top layer 12 can be aluminium lamination
Or aluminium alloy layer.Thus, it is possible to the heat exchange being easy between electric elements and the second top layer 12, can be so that coolant be distinguished
With the first top layer 11 and the heat exchange of thermal column 20, and manufacturing cost reduce.Preferably, body 13 can be that volume fraction is
The aluminium silicon carbide of 65% is made.
The setting value of one group according to the IGBT of this utility model embodiment dispel the heat module 1000 be given below, but this practicality
Novel it is not limited to this.40000 square millimeters≤S≤50000 square millimeter, N=368, S1/S2=229.284, thermal column 20
Height h=8mm, α=1.69, L1=0.4mm.
Wherein, the arrangement being arranged on the N number of thermal column 20 on the first top layer 11 has multiple, provides below a kind of N number of
The arrangement of thermal column 20.N number of thermal column 20 can be divided into many groups, and the many groups of length directions along base plate of radiator 100 (are i.e. schemed
Direction before and after shown in 3) interval setting, many groups include the first subgroup being arranged alternately along the length direction of base plate of radiator 100
D1 and the second subgroup d2, the first subgroup d1 and the second subgroup d2 all include width (the i.e. Fig. 3 along base plate of radiator 100
Shown left and right directions) spaced multiple thermal columns 20.It is understood that the first subgroup d1 and second being arranged alternately
Subgroup d2 is so that N number of thermal column 20 is reasonably distributed on the first top layer 11, it is ensured that thermal column 20 and the heat of coolant
Exchange capacity.Wherein, the quantity of the thermal column 20 in the first subgroup d1 and the second subgroup d2 can adjust according to practical situation.
Shown in Figure 13 and Figure 14, according to the IGBT module of this utility model embodiment, including above-mentioned IGBT heat radiation
Module 1000 and igbt chip 2000, igbt chip 2000 is arranged in the copper-clad plate 200 of IGBT heat radiation module 1000.By inciting somebody to action
The thickness h 1 of the first layers of copper 220 is set smaller than the thickness h 2 of the second layers of copper 230, can be beneficial to the welding of chip, so that
Copper-clad plate 200 after welding is the most straight, can effectively prevent copper-clad plate 200 to be upturned, cover copper such that it is able to be effectively improved
The plate 200 support effect to electric elements, can improve copper-clad plate 200 and the packaged stability of igbt chip 2000, Ke Yibao
The functional reliability of card igbt chip 2000, it is also possible to improve the structural strength of copper-clad plate 200, extends the use of copper-clad plate 200
Life-span.
The following detailed description of the test to the IGBT module according to utility model embodiment.
First the experimental condition of IGBT module is discussed in detail, the preferred dimension of all kinds of copper-clad plates 200 is 61 × 67 ×
0.92mm, the composite that body 13 is aluminium silicon carbide composition of the base plate body 10 of base plate of radiator 100 makes, and voltage is
480V, electric current 0-150A, be stepped up output current phase to 150A from 0, the maximum temperature of test IGBT module, and uses thermal resistance
The steady state heat resistance that igbt chip 2000 joins the copper-clad plate 200 of different pottery measured by tester.Wherein, the substrate 210 of copper-clad plate 200
Aluminium nitride substrate, aluminum oxide substrate and silicon nitride board can be respectively.Wherein it is desired to explanation, igbt chip 2000 is adopted
Model be IGC193T120T8RMA, and igbt chip 2000 is 1200v/200A, the production company of igbt chip 2000
For company of Infineon.
Finally introduce the result of the test of IGBT module, shown in Figure 15 and Figure 16, recorded by thermal resistance tester
The temperature thermal resistance of the copper-clad plate 200 of aluminium nitride substrate is 0.08802k/w, and maximum temperature is 83 DEG C；The copper-clad plate of aluminum oxide substrate
The temperature thermal resistance of 200 is 0.09226k/w, and maximum temperature is 85 DEG C；The temperature thermal resistance of the copper-clad plate 200 of silicon nitride board is
0.08926k/w, maximum temperature is 83 DEG C.Thus it is appreciated that: use the IGBT module of above-mentioned three kinds of substrates 210 all can expire
Foot cooling requirements, and the good heat dissipation effect of IGBT module.
In description of the present utility model, it is to be understood that term " " center ", " longitudinally ", " laterally ", " length ", " width
Degree ", " thickness ", " on ", D score, "front", "rear", "left", "right", " vertically ", " level ", " top ", " end " " interior ", " outward ", " suitable
Hour hands ", " counterclockwise ", " axially ", " radially ", the orientation of the instruction such as " circumferential " or position relationship be based on orientation shown in the drawings
Or position relationship, be for only for ease of describe this utility model and simplify describe rather than instruction or hint indication device or
Element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to limit of the present utility model
System.
Additionally, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can express or
Person implicitly includes at least one this feature.In description of the present utility model, " multiple " are meant that at least two, such as two
Individual, three etc., unless otherwise expressly limited specifically.
In this utility model, unless otherwise clearly defined and limited, term " install ", " being connected ", " connection ", " Gu
Fixed " etc. term should be interpreted broadly, connect for example, it may be fixing, it is also possible to be to removably connect, or integral；Can be
Be mechanically connected, it is also possible to be electrical connection or each other can communication；Can be to be joined directly together, it is also possible to by the indirect phase of intermediary
Even, can be connection or the interaction relationship of two elements of two element internals, unless otherwise clear and definite restriction.For this
For the those of ordinary skill in field, above-mentioned term concrete meaning in this utility model can be understood as the case may be.
In this utility model, unless otherwise clearly defined and limited, fisrt feature second feature " on " or D score
Can be that the first and second features directly contact, or the first and second features are by intermediary mediate contact.And, first is special
Levy second feature " on ", " top " and " above " but fisrt feature directly over second feature or oblique upper, or only
Represent that fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " permissible
Be fisrt feature immediately below second feature or obliquely downward, or be merely representative of fisrt feature level height less than second feature.
In the description of this specification, reference term " embodiment ", " some embodiments ", " example ", " specifically show
Example " or the description of " some examples " etc. means to combine this embodiment or example describes specific features, structure, material or spy
Point is contained at least one embodiment of the present utility model or example.In this manual, the schematic table to above-mentioned term
State and be necessarily directed to identical embodiment or example.And, the specific features of description, structure, material or feature are permissible
One or more embodiment in office or example combine in an appropriate manner.Additionally, in the case of the most conflicting, this area
Technical staff the feature of the different embodiments described in this specification or example and different embodiment or example can be entered
Row combines and combination.
Although above it has been shown and described that embodiment of the present utility model, it is to be understood that above-described embodiment is
Exemplary, it is impossible to it is interpreted as that those of ordinary skill in the art is in scope of the present utility model to restriction of the present utility model
In above-described embodiment can be changed, revise, replace and modification.
Claims (23)
1. an IGBT heat radiation module, it is characterised in that including:
Base plate of radiator, described base plate of radiator includes: base plate body and N number of thermal column, and described base plate body includes body
With the first top layer on relative two surface being separately positioned on described body and the second top layer, described body is aluminum carbon
SiClx is made, and described N number of thermal column is spaced apart to be located on described first top layer, and one end of each described thermal column and described the
One top layer is fixed and the other end is free end, and described first top layer is adapted to contact with coolant with described thermal column；
Copper-clad plate, described copper-clad plate includes that substrate, the first layers of copper and the second layers of copper, described first layers of copper are divided with described second layers of copper
Do not arrange on be oppositely arranged two surfaces on the substrate, and the thickness of described first layers of copper is less than described second layers of copper
Thickness, described first layers of copper is located on described second top layer.
IGBT the most according to claim 1 dispels the heat module, it is characterised in that described substrate is aluminum oxide substrate, aluminium nitride
One in substrate, silicon nitride board.
IGBT the most according to claim 1 dispels the heat module, it is characterised in that described first layers of copper is 0.2 millimeter of-0.6 milli
Rice, the thickness of described second layers of copper is 0.2 millimeter-0.6 millimeter.
IGBT the most according to claim 1 dispels the heat module, it is characterised in that the thickness of described substrate is 0.25 millimeter of-1 milli
Rice.
IGBT the most according to claim 1 dispels the heat module, it is characterised in that described copper-clad plate is multiple, multiple described in cover
Copper coin along the spaced apart setting of length direction of described base plate of radiator, the distance between adjacent two described copper-clad plates is 3 millimeters-
10 millimeters.
IGBT the most according to claim 1 dispels the heat module, it is characterised in that connect with described coolant on described first top layer
The area that contact portion is divided is S1, and the area of part that described first top layer contacts with each described thermal column is S2,180≤S1/
S2≤800, wherein 300≤N ＜ 650.
IGBT the most according to claim 6 dispels the heat module, it is characterised in that 200≤S1/S2≤500；Wherein 300≤N ＜
420。
IGBT the most according to claim 6 dispels the heat module, it is characterised in that the area of dissipation of described IGBT heat radiation module is
S, the area sum of the outer surface of the perisporium of N number of described thermal column is S3, the area of the end face of the free end of N number of described thermal column
Sum is S4, S=S1+S3+S4, and 40000 square millimeters≤S≤50000 square millimeter.
IGBT the most according to claim 6 dispels the heat module, it is characterised in that the height of described thermal column is h, wherein, 7.5
Millimeter≤h ＜ 8.2 millimeters.
IGBT the most according to claim 9 dispels the heat module, it is characterised in that the area of dissipation of each described thermal column is
(S3+S4)/N,80≤(S3+S4)/N≤120。
11. IGBT according to claim 6 heat radiation modules, it is characterised in that from described one end of described thermal column to institute
Stating free end, the area of the cross section of described thermal column reduces to described free end from described one end of described thermal column.
12. IGBT according to claim 11 heat radiation modules, it is characterised in that the cross section of described thermal column is circular,
The radius of described one end of described thermal column is α with the ratio of the radius of described free end, 1.2≤α≤1.8.
13. IGBT according to claim 6 heat radiation modules, it is characterised in that described coolant is suitable to be contained in cooling bath
In, described cooling bath is suitable to be connected with described first top layer, and the free end of described thermal column is apart from the diapire of described cooling bath
Distance minimum at be L1,0.2 millimeter≤L1≤2 millimeter.
14. IGBT according to claim 6 heat radiation modules, it is characterised in that the distance of adjacent two described thermal columns is
L2,0.4 millimeter≤L2≤1.1 millimeter.
15. IGBT according to claim 14 heat radiation modules, it is characterised in that two described thermal columns of arbitrary neighborhood are constituted
One group, the L2 of one of which is unequal with the L2 of a group in remaining group.
16. IGBT according to claim 15 heat radiation modules, it is characterised in that N=368, the wherein L2=of first group
0.62 millimeter, the L2=1.04 millimeter of second group, L2 of remaining group meets following condition: 0.62 millimeter≤L2≤1.04 millimeter.
17. IGBT according to claim 6 heat radiation modules, it is characterised in that the withdrawing pattern angle beta of each described thermal column is 2
Degree-4 degree.
18. IGBT according to claim 6 heat radiation modules, it is characterised in that described body, described first top layer, institute
State the second top layer and described thermal column one-body molded by air pressure THROUGH METHOD die casting.
19. IGBT according to claim 1 dispel the heat modules, it is characterised in that described body be volume fraction be 60%-
The aluminium silicon carbide of 70% is made.
20. IGBT according to claim 1 heat radiation modules, it is characterised in that described thermal column is aluminum post or aluminium alloy column,
Described first top layer and the second top layer are aluminium lamination or aluminium alloy layer.
21. IGBT according to claim 8 heat radiation modules, it is characterised in that 40000 square millimeters≤S≤50000 square
Millimeter, N=368, S1/S2=229.284.
22. according to the IGBT heat radiation module according to any one of claim 1-21, it is characterised in that described N number of thermal column divides
For many groups, the many groups of length direction intervals along described IGBT heat radiation module are arranged, and described many groups include along described IGBT heat radiation mould
First subgroup that is arranged alternately of length direction of group and the second subgroup, described first subgroup and described second subgroup all include edge
The spaced multiple thermal columns of width of described IGBT heat radiation module.
23. 1 kinds of IGBT modules, it is characterised in that include igbt chip and according to according to any one of claim 1-22
IGBT dispels the heat module, and described igbt chip is arranged in described second layers of copper.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520976338.0U CN205491580U (en) | 2015-11-30 | 2015-11-30 | IGBT heat dissipation module and have its IGBT module |
| PCT/CN2016/107345 WO2017092628A1 (en) | 2015-11-30 | 2016-11-25 | Heat dissipation module for igbt module and igbt module comprising same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520976338.0U CN205491580U (en) | 2015-11-30 | 2015-11-30 | IGBT heat dissipation module and have its IGBT module |
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| Publication Number | Publication Date |
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| CN205491580U true CN205491580U (en) | 2016-08-17 |
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| CN201520976338.0U Active CN205491580U (en) | 2015-11-30 | 2015-11-30 | IGBT heat dissipation module and have its IGBT module |
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| Country | Link |
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| WO (1) | WO2017092628A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017092628A1 (en) * | 2015-11-30 | 2017-06-08 | 比亚迪股份有限公司 | Heat dissipation module for igbt module and igbt module comprising same |
| CN112289207A (en) * | 2019-07-23 | 2021-01-29 | 深圳光峰科技股份有限公司 | Shading frame and LED display device |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7215545B1 (en) * | 2003-05-01 | 2007-05-08 | Saeed Moghaddam | Liquid cooled diamond bearing heat sink |
| JP5381561B2 (en) * | 2008-11-28 | 2014-01-08 | 富士電機株式会社 | Semiconductor cooling device |
| JP5577980B2 (en) * | 2010-09-16 | 2014-08-27 | 三菱マテリアル株式会社 | Power module substrate with heat sink, power module, and method for manufacturing power module substrate with heat sink |
| JP2013021254A (en) * | 2011-07-14 | 2013-01-31 | Mitsubishi Electric Corp | Semiconductor device and manufacturing method of the same |
| JP2013229579A (en) * | 2012-03-30 | 2013-11-07 | Mitsubishi Materials Corp | Substrate for power module, substrate for power module having heat sink, and power module |
| CN103413790B (en) * | 2013-08-16 | 2016-03-02 | 中国科学院深圳先进技术研究院 | A kind of encapsulating structure of integrated power control unit |
| CN205491580U (en) * | 2015-11-30 | 2016-08-17 | 比亚迪股份有限公司 | IGBT heat dissipation module and have its IGBT module |
| CN205430852U (en) * | 2015-11-30 | 2016-08-03 | 惠州比亚迪实业有限公司 | IGBT heat dissipation module and have its IGBT module |
-
2015
- 2015-11-30 CN CN201520976338.0U patent/CN205491580U/en active Active
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2016
- 2016-11-25 WO PCT/CN2016/107345 patent/WO2017092628A1/en active Application Filing
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017092628A1 (en) * | 2015-11-30 | 2017-06-08 | 比亚迪股份有限公司 | Heat dissipation module for igbt module and igbt module comprising same |
| CN112289207A (en) * | 2019-07-23 | 2021-01-29 | 深圳光峰科技股份有限公司 | Shading frame and LED display device |
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| Publication number | Publication date |
|---|---|
| WO2017092628A1 (en) | 2017-06-08 |
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