CN205491452U

CN205491452U - Mainboard and electronic equipment

Info

Publication number: CN205491452U
Application number: CN201620266571.4U
Authority: CN
Inventors: 赵致伦
Original assignee: Shenzhen Jiuzhou Electric Appliance Co Ltd
Current assignee: Shenzhen Jiuzhou Electric Appliance Co Ltd
Priority date: 2016-03-31
Filing date: 2016-03-31
Publication date: 2016-08-17
Anticipated expiration: 2026-03-31

Abstract

The utility model relates to a circuit board technical field provides a mainboard and electronic equipment. The mainboard includes extremely down on the follow in proper order: light filter, mainboard main part, wafer and visor, the light filter is located mainboard main part upside, the visor is located the wafer downside, be provided with the golden finger in the mainboard main part, be equipped with on the wafer with the welding point that the golden finger links to each other. The utility model provides a mainboard adopts the pin of the wafer mode with mainboard main part lug connection, has reduced the technology step, has practiced thrift the cost. Simultaneously, adopt the encapsulation mode of wafer flip -chip, shortened the distance of signal conduction effectively, reduce among decay and the transmission process of signal the electromagnetic wave and to the interference of signal, greatly improved reliability of an item, reached production work simplification, convenient operation, reduce cost's purpose.

Description

A kind of mainboard and electronic equipment

[technical field]

This utility model relates to circuit board technology field, particularly relates to a kind of mainboard and electronic equipment.

[background technology]

At present, the mainboard of the most traditional band wafer, the generally encapsulation of its wafer be all first by Wafer, as carrier, is first cohered and is fixed on chip substrate by chip substrate, then will with metal wire The signal pins of wafer and chip substrate by welding by the way of couple together, then with optical filter cover equipped with The chip substrate of wafer, is finally welded to chip substrate on mainboard.This traditional wafer level packaging side , there is a lot of drawback: processing technique step is more and complicated, production efficiency low, chip substrate in formula And the height of wafer itself also constrains the thickness of mainboard, due to by the connection of metal wire, e-mail Number conduction distance longer, cause the electric property of mainboard to reduce, signal disturb more, stablizing of mainboard Property is the most high.Therefore, the encapsulating structure of the mainboard of band wafer also needs to optimize further.

[utility model content]

The technical problems to be solved in the utility model be existing mainboard processing technique step more and complicated, Production efficiency is low, the height of mainboard main body and wafer itself constrains the thickness of product, signal disturbs Stability more, product is the highest.

For solving above-mentioned technical problem, this utility model offer techniques below scheme:

A kind of mainboard, includes: optical filter, mainboard main body, wafer and protection cap the most successively, Described optical filter is positioned on the upside of described mainboard main body, and described protection cap is positioned on the downside of described wafer, described Being provided with golden finger in mainboard main body, described wafer is provided with the pad being connected with described golden finger.

In certain embodiments, described optical filter a size of 0.5mm × 0.5mm.

In certain embodiments, described optical filter is plate glass.

In certain embodiments, described mainboard size of main body be 1.2mm × 1.2mm～1.6mm × 1.6mm。

In certain embodiments, described mainboard main body is glass mat.

In certain embodiments, described protection cap a size of 0.6mm × 0.6mm～0.8mm × 0.8mm.

In certain embodiments, described protection cap is metal coating lid or plastic protection cover.

In certain embodiments, described protection cap being offered groove, described groove is used for accommodating described crystalline substance Circle.

In certain embodiments, described pad is golden spherical pad.

On the other hand, this utility model also provides for a kind of electronic equipment, including shell and this utility model Described mainboard；Described mainboard is positioned at described enclosure.

The beneficial effects of the utility model are: this utility model provides a kind of mainboard and electronic equipment. This mainboard uses the mode being directly connected to by the pin of wafer with mainboard main body, decreases processing step, Save cost.Meanwhile, use the packaged type of wafer upside-down mounting, be effectively shortened signal conduction Distance, the electromagnetic wave interference to signal in the decay of minimizing signal and conductive process, drastically increase The reliability of product, has reached product processes simplification, easy to operate, the purpose of reduction cost. The electronic equipment with this mainboard is widely used in security protection, vehicle-mounted, mobile phone, network communication equipment, number Code-phase machine, notebook computer and various types of flat panel display consumer electronics market.

[accompanying drawing explanation]

Fig. 1 is conventional motherboard structural representation；

Fig. 2 is conventional motherboard structural section figure；

Fig. 3 is 1 one kinds of mainboard structure schematic diagrams of this utility model embodiment；

Fig. 4 is 1 one kinds of mainboard structure sectional views of this utility model embodiment.

[detailed description of the invention]

In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with Drawings and Examples, are further elaborated to this utility model.Should be appreciated that this place is retouched The specific embodiment stated is only used for explaining this utility model, is not used to limit this utility model.

As shown in Figure 1-2, it is conventional motherboard structural representation and sectional view.Traditional mainboard structure includes: Optical filter 10, wafer 11, metal wire 12, chip substrate 13 and mainboard main body 14, described chip base Plate 13 is welded in described mainboard main body 14 after being connected by metal wire 12 with described wafer 11 again, There is a lot of drawback in this traditional wafer 11 packaged type: processing technique is complicated, needs metal wire 12 It is attached one by one and needs first to be fixed to by wafer 11 on described chip substrate 13, needing chip base Plate 13 and a lot of metal wire 12, relatively costly and signal disturbing is more, the stability of product is the highest, gold The connection belonging to line 12 adds signal transmission distance, causes the electric property of electronic equipment to reduce.

Embodiment 1

As shown in Figure 3-4, for this utility model embodiment one mainboard structure schematic diagram and sectional view, basis Utility model provides a kind of mainboard, includes the most successively: optical filter 20, mainboard main body 21, Wafer 22 and protection cap 23, described optical filter 20 is positioned on the upside of described mainboard main body 21, described protection Lid 23 is positioned on the downside of described wafer 22, and described mainboard main body 21 is provided with golden finger 211, described Golden finger a size of 0.01mm × 0.01mm, described wafer 22 is provided with and described golden finger 211 phase Pad 221 even, described pad 221 is golden spherical pad, described golden finger 211 position It is correspondingly arranged with described pad 221 position.

Preferably, described optical filter 20 a size of 0.5mm × 0.5mm, thickness is 0.1mm～0.8mm, Described optical filter 20 is plate glass, has and protects described wafer 22 and filter the effect of light；Institute Stating mainboard main body 21 a size of 1.2mm × 1.2mm～1.6mm × 1.6mm, thickness is 0.3mm～2.4mm, described mainboard main body 21 is glass mat, is used for fixing described wafer 22； Described wafer 22 is Silicon Wafer, and Silicon Wafer is relatively stable, can be processed into various circuit on its wafer Component structure, is the preferred material of mainboard；Described protection cap 23 a size of 0.6mm × 0.6mm～0.8mm × 0.8mm, described protection cap 23 is metal coating lid or plastic protection cover, and described protection cap 23 is opened If groove, described groove is used for accommodating described wafer 22 and protecting described wafer 22 to prevent dust from falling into Or other external environments affect described wafer 22 and normally work.

Below in conjunction with specific embodiment, the envelope of a kind of mainboard that this utility model embodiment is provided Dress step is further detailed: be provided with in mainboard main body 21 for fixing described wafer 22 Position, goes out one in these position Design and Machining and matches with described wafer 22 photosensitive region size Through hole, and at the through hole surrounding layout of described mainboard main body 21 and the pad 221 on described wafer 22 The golden finger 211 being connected, welds the pad 221 on described wafer 22 and described mainboard main body 21 On golden finger 211, then solidified further by gluing process so that described wafer 22 is fixed on institute Stating in mainboard main body 21, the signal on described wafer 22 can be transferred in described mainboard main body 21, Then on the downside of described wafer 22, protection cap 23 is fixed for protecting described wafer 22 by gluing process, To prevent described wafer 22 from rupturing, gluing technique is finally used to paste filter in described mainboard main body 21 Mating plate 20, mainboard has encapsulated.

The present embodiment provides a kind of mainboard, uses the side being directly connected to by the pin of wafer with mainboard main body Formula, decreases processing step, has saved cost.Meanwhile, use the packaged type of wafer upside-down mounting, have Shortening to effect the distance of signal conduction, in the decay of minimizing signal and conductive process, electromagnetic wave is to signal Interference, drastically increase the reliability of product, reached product processes simplification, operation side Just the purpose of cost, is reduced.The encapsulating structure that the present embodiment provides is applicable to encapsulate specification and varies in size Wafer, this packaging technology is applicable to product production line of batch, can improve production further Efficiency, it is possible to the preferably market competitiveness of improving product.

Embodiment 2

This utility model also provides for a kind of electronic equipment (not shown), real including shell and this utility model Executing the mainboard that example 1 provides, described mainboard is positioned at described enclosure, and the concrete structure of this mainboard please be joined Readding the narration in embodiment 1, here is omitted.

This utility model provides a kind of electronic equipment, provides including shell and this utility model embodiment 1 Mainboard.This mainboard uses the mode being directly connected to by the pin of wafer with mainboard main body, decreases work Skill step, has saved cost.Meanwhile, use the packaged type of wafer upside-down mounting, be effectively shortened letter The distance of number conduction, reduces the electromagnetic wave interference to signal in the decay of signal and conductive process, greatly Improve the reliability of product, reached product processes simplification, easy to operate, reduce cost Purpose.There is the electronic equipment of this mainboard and be widely used in security protection, vehicle-mounted, mobile phone, network service Equipment, digital camera, notebook computer and various types of flat panel display consumer electronics market.

The foregoing is only preferred embodiment of the present utility model, be not limited to this practicality new Type.All any amendment, equivalent and improvement made within spirit of the present utility model and principle Deng, within should be included in protection domain of the present utility model.

Claims

1. a mainboard, it is characterised in that include the most successively: optical filter, mainboard main body, Wafer and protection cap, described optical filter is positioned on the upside of described mainboard main body, and described protection cap is positioned at described On the downside of wafer, described mainboard main body being provided with golden finger, described wafer is provided with and described golden finger The pad being connected.

2. mainboard as claimed in claim 1, it is characterised in that described optical filter a size of 0.5mm ×0.5mm。

3. mainboard as claimed in claim 1, it is characterised in that described optical filter is plate glass.

4. mainboard as claimed in claim 1, it is characterised in that described mainboard size of main body is 1.2mm × 1.2mm～1.6mm × 1.6mm.

5. mainboard as claimed in claim 1, it is characterised in that described mainboard main body is glass fibre Plate.

6. mainboard as claimed in claim 1, it is characterised in that described protection cap a size of 0.6mm × 0.6mm～0.8mm × 0.8mm.

7. mainboard as claimed in claim 1, it is characterised in that described protection cap is metal coating lid Or plastic protection cover.

8. mainboard as claimed in claim 1, it is characterised in that offer groove in described protection cap, Described groove is used for accommodating described wafer.

9. mainboard as claimed in claim 1, it is characterised in that described pad is golden spherical weldering Contact.

10. an electronic equipment, it is characterised in that include shell and as arbitrary in claim 1～9 Mainboard described in Xiang, described mainboard is positioned at described enclosure.