CN205484926U - Smooth subassembly that interconnects - Google Patents
Smooth subassembly that interconnects Download PDFInfo
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- CN205484926U CN205484926U CN201620103235.8U CN201620103235U CN205484926U CN 205484926 U CN205484926 U CN 205484926U CN 201620103235 U CN201620103235 U CN 201620103235U CN 205484926 U CN205484926 U CN 205484926U
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Abstract
The utility model provides a smooth subassembly that interconnects, it includes the PCB board and uses the PCB board as the IC chip of carrier setting and glue and be equipped with the heat sink of excessive piece, VCSEL chip, its characterized in that: excessive piece includes top surface gold plated layer and the side gold plated layer who links to each other with it including gold plated layer, gold plated layer, and top surface gold plated layer passes through the gold wire and is connected with the foundation of IC chip, side gold plated layer also establishs through gold wire and VCSEL chip and is connected, by aforementioned structure, has solved the technical problem who switches on the light path of buckling through substituting softness circuit of gold plated layer or lens, reached conveniently make, good result that reduce cost just improves the product yield.
Description
Technical field
This utility model relates to technical field of photo communication, espespecially a kind of light network assembly.
Background technology
Optical interconnection module, because lightweight, low in energy consumption, low cost, is liked by Data Market.Even to this day, data communication is developed on an unprecedented scale, and the market demand climbs up and up.While high volume applications, client has had again new demand to cost declining.
The chip selected due to module is VCSEL(vertical light-emitting) chip, its light to be made to enter in the optical fiber of horizontal, it is necessary to realize 90 ° of bendings of light.One of traditional method is to use 90 ° of lens or prism to bend；Two be use soft ribbons realize 90 ° electricity bending, thereby can indirectly reach coupling effect, but both schemes add product cost the most undoubtedly.
Summary of the invention
For solving above-mentioned technical problem, main purpose of the present utility model is to provide a kind of light network assembly, and this assembly is practically applicable to the light network of short distance 40G, 100G multi-channel parallel data communication.
For reaching above-mentioned purpose, the technical scheme of this utility model application is: consider from cost-effective, it is necessary to make the light of VCSEL be directly entered optical fiber, by using Gold plated Layer to substitute lens or soft ribbons circuit bending cost.Wherein: concrete technical scheme is: provide a kind of light network assembly, it include pcb board and the IC chip arranged for carrier with pcb board thereof and adhesive-assembly have excessive block, VCSEL chip heat sink, wherein: excessively block includes Gold plated Layer, Gold plated Layer includes end face Gold plated Layer and the side Gold plated Layer being attached thereto thereof, and end face Gold plated Layer is connected with the foundation of IC chip by spun gold；Side Gold plated Layer is connected with the foundation of VCSEL chip also by spun gold.
Preferred in the present embodiment, light network assembly also includes MT optic fibre switching head, and MT optic fibre switching head has leads a post.
Preferred in the present embodiment, heat sink adhesive-assembly on pcb board, and include the depressed part that top is provided with and the guide hole running through both sides, wherein excessively block is adhesive-assembly in depressed part, VCSEL chip adhesive-assembly deviate from IC chip-side heat sink on,
Preferred in the present embodiment, lead a post and be plugged in guide hole.
Preferred in the present embodiment, pcb board is PCBA and has and the golden finger of outside corollary equipment grafting, and golden finger is located at the other end of MT optic fibre switching head grafting.
Preferred in the present embodiment, light network assembly farther includes protective cover, and protective cover has angle.
Preferred in the present embodiment, pcb board is provided with hole, location in the outside near IC chip, and angle is interfered firm with hole, location.
Preferred in the present embodiment, VCSEL chip has pad, and pad uses spun gold to weld with Gold plated Layer；IC chip attachment connects with pcb board also by spun gold on pcb board, welds with Gold plated Layer also by spun gold simultaneously, thereby makes VCSEL chip be connected with the foundation of IC chip through excessive block.
Compared with prior art, it has the advantages that this utility model:
By transition block with low cost, plate in the faces of two next-door neighbours simultaneously can the layer gold of spun gold welding, realize 90 ° of electricity bendings by the two conducting face, i.e. instead of soft ribbons structure, save again complicated technology during mounted lens, thus not only reduce cost, and assemble simple.
Accompanying drawing explanation
Fig. 1 is the group perspective view of the present embodiment.
Fig. 2 is to present the side schematic view of main member in Fig. 1.
Fig. 3 is to present the schematic perspective view of main member in Fig. 2.
Fig. 4 is the excessive block schematic perspective view using single channel to connect in Fig. 1.
Fig. 5 is the excessive block schematic perspective view using multichannel to connect in Fig. 1.
Fig. 6 is the schematic perspective view at another visual angle of protective cover 70 in Fig. 1.
Detailed description of the invention
Below in conjunction with specific embodiment and accompanying drawing, this utility model is described in further detail.Of the present utility model embodiment is described below in detail, and the example of described embodiment is shown in the drawings, and the most same or similar label represents same or similar element or has the element of same or like function.The embodiment described below with reference to accompanying drawing is exemplary, is only used for explaining the technical solution of the utility model, and is not construed as restriction of the present utility model.
In description of the present utility model, term " interior ", " outward ", " longitudinally ", " laterally ", " on ", D score, " top ", the orientation of the instruction such as " end " or position relationship be based on orientation shown in the drawings or position relationship, it is for only for ease of description this utility model rather than requires that therefore this utility model must be not construed as restriction of the present utility model with specific azimuth configuration and operation.
nullRefer to Fig. 1 and combine refering to shown in Fig. 2 to Fig. 5，This utility model provides a kind of light network assembly，It includes pcb board 10 and the IC chip 20 arranged for carrier with pcb board 10 thereof and adhesive-assembly has excessive block 30、Heat sink the 40 of VCSEL chip 50，Wherein: excessively block 30 based on rectangle and includes single channel Gold plated Layer 31a and multichannel Gold plated Layer 31b，Single、Multichannel Gold plated Layer 31a、31b includes end face Gold plated Layer 311a respectively、311b and side Gold plated Layer 312a、312b，Wherein: end face Gold plated Layer 311a respectively、311b and side Gold plated Layer 312a respectively、312b is connected，In this utility model embodiment，End face Gold plated Layer 311a、311b is connected with IC chip 20 foundation by spun gold (mark)；Side Gold plated Layer 312a, 312b are connected with VCSEL chip 50 foundation also by spun gold (mark).
Referring again to shown in Fig. 1, Fig. 2 and Fig. 3, light network assembly also includes MT optic fibre switching head 60, and MT optic fibre switching head 60 has leads a post 61.In this utility model embodiment, heat sink 40 adhesive-assembly on pcb board 10, and include the depressed part 41 at top and run through the guide hole 42 of both sides, wherein: excessively block 30 is adhesive-assembly in depressed part 41, VCSEL chip is the most adhesive-assembly on deviate from IC chip 20 side heat sink 40, leads a post 61 and is plugged in guide hole 42 and corresponding from VCSEL chip 50.
Referring to shown in Fig. 4, Fig. 5 and Fig. 6 please continue to refer to Fig. 1 combination, pcb board is PCBA and has and directly can carry out the golden finger 11 of grafting communication with outside corollary equipment (not shown), and golden finger 11 is located at the other end (such as Fig. 1) of MT optic fibre switching head 60 grafting.In this utility model embodiment, single channel Gold plated Layer 31a(such as Fig. 4) formed for the entirety made at excessive block 30 end face and one side is gold-plated；Multichannel Gold plated Layer 31b(such as Fig. 5) had spaced gold-plated by make at excessive block 30 end face and one side and formed.In this utility model embodiment, light network assembly farther includes protective cover 70, protective cover 70 has angle 71(such as Fig. 1), pcb board 10 is provided with hole, location (not shown) in the outside (i.e. golden finger 11 side) near IC chip 20 simultaneously, angle 71 is interfered firm with hole, location, make protective cover 70 be fixed on pcb board 10 and cover wherein by IC chip 20, excessive block 30, heat sink 40 and VCSEL chip 50, be allowed to encapsulating the damage that can be prevented effectively from external impact and cause further.
(referring again to shown in Fig. 1 and Fig. 2, Fig. 3), light network assembly by the method for assembling of attachment requirement is in the present embodiment: first with heat-conducting glue, VCSEL chip 50 is mounted on the side of heat sink 40, transition block 30 being attached to the depressed part 41 of heat sink 40, the Gold plated Layer 31 in transition block 30 is beneficial to the orientation of spun gold welding and arranges again；Spun gold is used to weld with the Gold plated Layer 31 in transition block 30 pad (not shown) of VCSEL chip 50 afterwards；Being assemblied on pcb board 10 heat sink 40 after again, and IC chip 20 is also mounted on pcb board, wherein IC chip 20 and pcb board are by spun gold, and IC chip 20 welds also by spun gold with the Gold plated Layer 31 of transition block 30；Finally a post of leading of MT optic fibre switching head 60 is inserted in the guide hole 42 of heat sink 40, i.e. completes light path docking.
In the present embodiment, the brief operation principle of light network assembly is: the signal of telecommunication enters from the golden finger 11 of pcb board 10, it is transferred to IC chip 20 by spun gold, transition block 30 is passed to by the gold thread on IC chip, VCSEL chip 50 is passed to through gold thread again from transition block 30, through VCSEL chip 50 after the signal of telecommunication is converted to optical signal, be transferred to MT optic fibre switching head 60 relaying and resume and broadcast.Optical signal is accepted by PD chip at the other end and is converted the signal of telecommunication, and its order of propagation is contrary process with VCSEL end.
Claims (8)
1. a light network assembly, it include pcb board and the IC chip arranged for carrier with pcb board thereof and adhesive-assembly have excessive block, VCSEL chip heat sink, it is characterized in that: excessively block includes Gold plated Layer, Gold plated Layer includes end face Gold plated Layer and the side Gold plated Layer being attached thereto thereof, and end face Gold plated Layer is connected with the foundation of IC chip by spun gold；Side Gold plated Layer is connected with the foundation of VCSEL chip also by spun gold.
2. light network assembly as claimed in claim 1, it is characterised in that: light network assembly also includes MT optic fibre switching head, and MT optic fibre switching head has leads a post.
3. light network assembly as claimed in claim 2, it is characterized in that: heat sink adhesive-assembly on pcb board, and include the depressed part that top is provided with and the guide hole running through both sides, wherein excessively block is adhesive-assembly in depressed part, VCSEL chip adhesive-assembly deviate from IC chip-side heat sink on.
4. light network assembly as claimed in claim 3, it is characterised in that: lead a post and be plugged in guide hole.
5. light network assembly as claimed in claim 4, it is characterised in that: pcb board is PCBA and has and the golden finger of outside corollary equipment grafting, and golden finger is located at the other end of MT optic fibre switching head grafting.
6. light network assembly as claimed in claim 5, it is characterised in that: light network assembly farther includes protective cover, and protective cover has angle.
7. light network assembly as claimed in claim 6, it is characterised in that: pcb board is provided with hole, location in the outside near IC chip, and angle is interfered firm with hole, location.
8. light network assembly as claimed in claim 7, it is characterised in that: VCSEL chip has pad, and pad uses spun gold to weld with Gold plated Layer；IC chip attachment connects with pcb board also by spun gold on pcb board, welds with Gold plated Layer also by spun gold simultaneously, thereby makes VCSEL chip be connected with the foundation of IC chip through excessive block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620103235.8U CN205484926U (en) | 2016-02-02 | 2016-02-02 | Smooth subassembly that interconnects |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620103235.8U CN205484926U (en) | 2016-02-02 | 2016-02-02 | Smooth subassembly that interconnects |
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| Publication Number | Publication Date |
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| CN205484926U true CN205484926U (en) | 2016-08-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201620103235.8U Active CN205484926U (en) | 2016-02-02 | 2016-02-02 | Smooth subassembly that interconnects |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109323657A (en) * | 2018-08-29 | 2019-02-12 | 桂林电子科技大学 | A method of measurement optical interconnection module key position postwelding alignment offset |
| CN110023806A (en) * | 2016-11-30 | 2019-07-16 | 恩普乐股份有限公司 | The manufacturing method of optical receptacle, optical module and optical module |
-
2016
- 2016-02-02 CN CN201620103235.8U patent/CN205484926U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110023806A (en) * | 2016-11-30 | 2019-07-16 | 恩普乐股份有限公司 | The manufacturing method of optical receptacle, optical module and optical module |
| CN109323657A (en) * | 2018-08-29 | 2019-02-12 | 桂林电子科技大学 | A method of measurement optical interconnection module key position postwelding alignment offset |
| CN109323657B (en) * | 2018-08-29 | 2019-10-22 | 桂林电子科技大学 | A method of measurement optical interconnection module key position postwelding alignment offset |
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