CN205482995U - Intelligence acoustic wave sensor - Google Patents
Intelligence acoustic wave sensor Download PDFInfo
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- CN205482995U CN205482995U CN201620056479.5U CN201620056479U CN205482995U CN 205482995 U CN205482995 U CN 205482995U CN 201620056479 U CN201620056479 U CN 201620056479U CN 205482995 U CN205482995 U CN 205482995U
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- conversion chip
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Abstract
The utility model provides an intelligence acoustic wave sensor, include: casing, microphone, acoustic -electric conversion chip, microcontroller and circular connector, wherein, microphone, acoustic -electric conversion chip and microcontroller locate the inside of casing, and circular connector locates the surface of casing, and the microphone is located the bottom of casing, and acoustic -electric conversion chip is connected through winding displacement and microphone and is fixed in the top of microphone the convex part through locating the first of casing inside, and microcontroller is connected through the winding displacement with acoustic -electric conversion chip and fixes in the top of acoustic -electric conversion chip the convex part through locating the inside second of casing, and microcontroller passes through the winding displacement and is connected with circular connector. Practiced thrift a large amount of cables, to a great extent has reduced the work load of cabling, simultaneously, having got rid of the host computer link with the integration of micro -control rounding card in acoustic wave sensor's inside, having reduced the fault point, the operation of messenger system is more reliable.
Description
Technical field
This utility model relates to sensor technical field, particularly relates to a kind of intelligent sound wave sensor.
Background technology
Sonic sensor function as a microphone, be used for receiving sound wave, the vibrational image of display sound.At present, the leakage on-line monitoring of jet chimney uses sonic sensor the most exactly, the acoustical signal collected is converted to faint voltage pulsation through mike by it, after be amplified this signal subsequently, filtering etc. processes, be converted to 0～6mA current signal outwards export, it is achieved the monitoring to jet chimney leakage.
But there is many defects in this monitoring method, such as: 1). stability is the highest, is easily disturbed；2). signal easily drifts about；3). each sensor needs independent cable to be connected to host computer；4). sonic sensor output is audio signal rather than final sound intensity signal, it is impossible to be directly connected to DCS (Distributed Control System, Distributed Control System) system as transmitter；5). Self-Test Diagnostics and state instruction can not be carried out.
Utility model content
For the problems referred to above, this utility model aims to provide a kind of intelligent sound wave sensor, runs more reliable and more stable.
The technical scheme that this utility model provides is as follows:
A kind of intelligent sound wave sensor, including: housing, microphone, acoustic-electro conversion chip, microcontroller and aviation plug, wherein, the inside of described housing is located at by described microphone, acoustic-electro conversion chip and microcontroller, and described aviation plug is located at the surface of described housing；And described microphone is positioned at the bottom of described housing, described acoustic-electro conversion chip is connected with described microphone by winding displacement and is fixed on the top of described microphone by being located at first pair of protuberance of described enclosure interior, described microcontroller is connected by winding displacement with described acoustic-electro conversion chip and is fixed on the top of described acoustic-electro conversion chip by being located at second pair of protuberance of described enclosure interior, and described microcontroller is connected with described aviation plug by winding displacement.
It is further preferred that also include the buzzer being located at described enclosure interior in described sonic sensor, described buzzer is connected with described acoustic-electro conversion chip by winding displacement.
Further preferably, described sonic sensor also includes an audio frequency amplification chip being connected with described acoustic-electro conversion chip and described microphone respectively, described acoustic-electro conversion chip and described audio frequency amplification chip integrate and obtain acoustic-electric conversion circle card, and described acoustic-electric conversion circle card is fixed on the top of described microphone by being located at described first pair of protuberance of described enclosure interior.
It is further preferred that described microcontroller includes a modulus conversion chip, described modulus conversion chip is connected with described acoustic-electric conversion circle card by described winding displacement.
It is further preferred that also include a signal transmission chip in described microcontroller, described signal transmission chip is connected with described aviation plug by described winding displacement.
It is further preferred that also include a fast Fourier transform chip in described microcontroller, described fast Fourier transform chip transmits chip with described modulus conversion chip and described signal respectively and is connected.
It is further preferred that described microcontroller also including, one transmits, with described fast Fourier transform chip and described signal, the Fault Identification chip that chip is connected respectively.
It is further preferred that described microcontroller is integrated in a micro-control rounding card, described micro-control rounding cartoon is crossed and is located at second pair of protuberance of described enclosure interior and is fixed on the top of described acoustic-electric conversion circle card.
It is further preferred that described signal transmission chip is 485 chips, and/or described Fault Identification chip is HART chip.
The intelligent sound wave sensor that this utility model provides, it is possible to bring following beneficial effect:
In this utility model, by acoustic-electro conversion chip, microcontroller etc. being integrated in respectively in acoustic-electric conversion circle card and micro-control rounding card, and by acoustic-electric conversion circle card and micro-control rounding cartoon cross winding displacement connect be arranged on first pair of protuberance and second pair of protuberance of enclosure interior, realize the integrated of intelligent sound wave sensor, save a large amount of cable, largely decrease the workload of cabling；Meanwhile, the inside that micro-control rounding card is integrated in sonic sensor is eliminated host computer link, decreases trouble point, make system run relatively reliable；Further, this utility model uses standard communication protocol so that it is more convenient that the sonic sensor operation and maintenance of this pick-up type is got up；Finally, we are also provided with Fault Identification chip in sonic sensor, and it detects the state of sonic sensor automatically, and the fault detected externally is shown, facilitates technical staff to check.
Accompanying drawing explanation
Below by the way of the most understandable, accompanying drawings preferred implementation, above-mentioned characteristic, technical characteristic, advantage and implementation thereof are further described.
Fig. 1 is intelligent sound wave sensor construction schematic diagram in this utility model；
Reference:
1-housing, 2-microphone, 3-buzzer, 4-winding displacement, 5-acoustic-electric conversion circle card, 6-micro-control rounding card, 7-aviation plug.
Detailed description of the invention
Structural representation with reference to intelligent sound wave sensor as shown in Figure 1.
In one embodiment, this intelligent sound wave sensor includes: housing 1, microphone 2, acoustic-electro conversion chip, microcontroller and aviation plug 7, wherein, the inside of housing 1 is located at by microphone 2, acoustic-electro conversion chip and microcontroller, and aviation plug 7 is located at the surface of housing 1；And microphone 2 is positioned at the bottom of housing 1, acoustic-electro conversion chip is connected with microphone 2 by winding displacement 4 and is fixed on the top of microphone 2 by being located at first pair of protuberance within housing 1, microcontroller is connected with acoustic-electro conversion chip by winding displacement 4 and is fixed on the top of acoustic-electro conversion chip by being located at second pair of protuberance within housing 1, and microcontroller is connected with aviation plug 7 by winding displacement 4.
In the course of the work, microphone 2 gathers the acoustical signal in the external world and by winding displacement 4, the acoustical signal of acquisition is transferred to acoustic-electro conversion chip；Acoustic-electro conversion chip converts thereof into the corresponding signal of telecommunication immediately and is passed through winding displacement 4 and be transferred in microcontroller after receiving this acoustical signal；Microcontroller is received this signal of telecommunication and processes accordingly and sent by winding displacement 4 and aviation plug 7 afterwards, achieves the collection to acoustical signal and process with this.Certainly, in the present embodiment, aviation plug 7, except the transmission for signal, is additionally operable to power for whole sonic sensor.
Above-mentioned embodiment is improved and obtains new embodiment, in the present embodiment, sonic sensor also including, the buzzer 3 being located within housing 1, buzzer 3 are connected with acoustic-electro conversion chip by winding displacement 4.So, find after the signal of telecommunication received is processed by microcontroller except fault, then can automatic alarm, reminding technology personnel.
In the above-described embodiment, microphone 2 is a high-sensitive microphone, so as to collect the faintest acoustical signal.Additionally, an audio frequency amplification chip being connected respectively is also included with acoustic-electro conversion chip and microphone 2 in sonic sensor, acoustic-electro conversion chip and audio frequency amplification chip are integrated simultaneously and obtain acoustic-electric conversion circle card 5, and this acoustic-electric conversion circle is blocked 5 tops being fixed on microphone 2 by being located at first pair of protuberance within housing 1；Being integrated in by microcontroller in a micro-control rounding card 6, micro-control rounding card 6 is fixed on the top of acoustic-electric conversion circle card 5 by being located at second pair of protuberance within housing 1.So, after microphone 2 collects acoustical signal, the faint acoustical signal collected is amplified by this audio frequency amplification chip, and then is converted into the signal of telecommunication by acoustic-electro conversion chip.Certainly, in other embodiments, it is also possible to first pass through and the acoustical signal of collection is converted into the signal of telecommunication, being amplified by the signal of telecommunication being converted to by audio frequency amplification chip, the signal of telecommunication after finally amplifying is sent in microcontroller the most again.Concrete which kind of mode of employing can be set as the case may be, and we do not limit.More particularly, in the above-described embodiment, this acoustic-electric conversion circle card 5 can export the signal of telecommunication of 0～1VAc (Volt Alternating Current, alternating voltage).Above-mentioned first pair of protuberance and the second pair of protuberance are actually arranged on the boss of enclosure interior, so as to place acoustic-electric conversion circle card 5 and micro-control rounding card 6, certainly, two circle cards can be placed in the way of using other, as arranged the baffle plate of hollow out in enclosure interior, fastening at baffle plate first-class by circle, technical staff can carry out the design of corresponding construction according to practical situation.
For more progressive one, in the above-described embodiment, microcontroller includes that the modulus conversion chips being connected by winding displacement 4 and acoustic-electric conversion circle card 5, a signal being connected with aviation plug 7 by winding displacement 4 transmit chip, a fast Fourier transform chip being connected respectively, the Fault Identification chip that fast Fourier transform chip and is connected with fast Fourier transform chip and signal transmission chip respectively with modulus conversion chip and signal transmission chip.So, after microcontroller receives the signal of telecommunication of acoustic-electric conversion circle card 5 transmission, it is converted into digital signal by modulus conversion chip immediately and the digital signal obtained is sent in Fourier transform chip；Fourier transform chip receive this digital signal after with it proceeding to frequency domain from time domain；Finally by signal pio chip, this frequency-region signal is sent by aviation plug 7, thus feature recognition algorithms can be used to judge the frequency spectrum that steam leaks according to this audio signal.
More particularly, in the above-described embodiment, modulus conversion chip uses 16 high guarantee audio collection chips to complete analog digital conversion, it is acquired with the sample frequency of 30kHz (KHz) during gathering, 1024 points of collection the most per second, to improve high-resolution and the high accuracy of the digital signal generated.It addition, signal transmission chip is specially 485 chips, Fault Identification chip is specially HART chip.The frequency distribution of 0～15kHz frequency range can be obtained when the digital signal received is converted to frequency-region signal by Fourier transform chip.Certainly, in this utility model, the sample thief of modulus conversion chip, the concrete signal etc. of each chip are all not specifically limited by we, as long as being capable of the purpose of this utility model, being included in content of the present utility model, technical staff can carry out unrestricted choice in conjunction with concrete condition.
It should be noted that, above-described embodiment all can independent assortment as required.The above is only preferred implementation of the present utility model; it should be pointed out that, for those skilled in the art, on the premise of without departing from this utility model principle; can also make some improvements and modifications, these improvements and modifications also should be regarded as protection domain of the present utility model.
Claims (9)
1. an intelligent sound wave sensor, it is characterized in that, described sonic sensor includes: housing, microphone, acoustic-electro conversion chip, microcontroller and aviation plug, wherein, the inside of described housing is located at by described microphone, acoustic-electro conversion chip and microcontroller, and described aviation plug is located at the surface of described housing；And described microphone is positioned at the bottom of described housing, described acoustic-electro conversion chip is connected with described microphone by winding displacement and is fixed on the top of described microphone by being located at first pair of protuberance of described enclosure interior, described microcontroller is connected by winding displacement with described acoustic-electro conversion chip and is fixed on the top of described acoustic-electro conversion chip by being located at second pair of protuberance of described enclosure interior, and described microcontroller is connected with described aviation plug by winding displacement.
2. intelligent sound wave sensor as claimed in claim 1, it is characterised in that also including the buzzer being located at described enclosure interior in described sonic sensor, described buzzer is connected with described acoustic-electro conversion chip by winding displacement.
3. intelligent sound wave sensor as claimed in claim 1 or 2, it is characterized in that, described sonic sensor also includes an audio frequency amplification chip being connected with described acoustic-electro conversion chip and described microphone respectively, described acoustic-electro conversion chip and described audio frequency amplification chip integrate and obtain acoustic-electric conversion circle card, and described acoustic-electric conversion circle card is fixed on the top of described microphone by being located at described first pair of protuberance of described enclosure interior.
4. intelligent sound wave sensor as claimed in claim 3, it is characterised in that described microcontroller includes a modulus conversion chip, described modulus conversion chip is connected with described acoustic-electric conversion circle card by described winding displacement.
5. intelligent sound wave sensor as claimed in claim 4, it is characterised in that also include a signal transmission chip in described microcontroller, described signal transmission chip is connected with described aviation plug by described winding displacement.
6. intelligent sound wave sensor as claimed in claim 5, it is characterised in that also include a fast Fourier transform chip in described microcontroller, described fast Fourier transform chip transmits chip with described modulus conversion chip and described signal respectively and is connected.
7. intelligent sound wave sensor as claimed in claim 6, it is characterised in that also include in described microcontroller that transmits, with described fast Fourier transform chip and described signal, the Fault Identification chip that chip is connected respectively.
8. intelligent sound wave sensor as claimed in claim 7, it is characterised in that described microcontroller is integrated in a micro-control rounding card, described micro-control rounding cartoon is crossed and is located at second pair of protuberance of described enclosure interior and is fixed on the top of described acoustic-electric conversion circle card.
9. intelligent sound wave sensor as claimed in claim 8, it is characterised in that described signal transmission chip is 485 chips, and/or described Fault Identification chip is HART chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620056479.5U CN205482995U (en) | 2016-01-20 | 2016-01-20 | Intelligence acoustic wave sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620056479.5U CN205482995U (en) | 2016-01-20 | 2016-01-20 | Intelligence acoustic wave sensor |
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| Publication Number | Publication Date |
|---|---|
| CN205482995U true CN205482995U (en) | 2016-08-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620056479.5U Expired - Fee Related CN205482995U (en) | 2016-01-20 | 2016-01-20 | Intelligence acoustic wave sensor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108765916A (en) * | 2018-04-08 | 2018-11-06 | 南京达凯电力自动化设备有限公司 | A kind of sensor that signal carrier encrypted state is controllable |
-
2016
- 2016-01-20 CN CN201620056479.5U patent/CN205482995U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108765916A (en) * | 2018-04-08 | 2018-11-06 | 南京达凯电力自动化设备有限公司 | A kind of sensor that signal carrier encrypted state is controllable |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170209 Address after: Read City Road in Yuhuatai District of Nanjing City, Jiangsu Province, No. 20 -1 210012 Patentee after: NANJING DAKAI POWER AUTOMATION EQUIPMENT Co.,Ltd. Address before: 211100 Shengli Road, Jiangning District, Jiangsu, China, No. 19, No. Patentee before: Wu Tongwang Patentee before: Yang Yunfang Patentee before: Wang Haitao |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160817 Termination date: 20220120 |
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| CF01 | Termination of patent right due to non-payment of annual fee |