CN205454364U - Heat dissipation post and radiator - Google Patents
Heat dissipation post and radiator Download PDFInfo
- Publication number
- CN205454364U CN205454364U CN201620246084.1U CN201620246084U CN205454364U CN 205454364 U CN205454364 U CN 205454364U CN 201620246084 U CN201620246084 U CN 201620246084U CN 205454364 U CN205454364 U CN 205454364U
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- China
- Prior art keywords
- heat dissipation
- radiator
- post
- dissipation post
- thermal column
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Abstract
The utility model relates to a heat dissipation technical field specifically discloses a heat dissipation post and radiator who is used for small -size electronic component heat dissipation usefulness such as CPU, LED lamp. The post that wherein dispels the heat includes cylindric body and evenly distributed in the supplementary radiator of cylindric body circumferencial direction surface, is equipped with the clearance between the adjacent supplementary radiator, should supplementary radiator and cylindric body integrated into one piece. Wherein the radiator is including above -mentioned heat dissipation post and radiating basal plate, radiating basal plate is last to be equipped with a plurality of mounting holes, a plurality of heat dissipation posts install in in the mounting hole. The utility model discloses a heat dissipation post has increased evenly distributed's supplementary radiator on the outer peripheral surface of the cylindric body of conventionality, this structure heat dissipation post cylindric with the conventionality is compared, greatly increases the surface area and the cross -sectional area of heat dissipation post, has increased the heat radiating area of monomer heat dissipation post promptly. With the radiator that this heat dissipation post is constituteed, to compare with the radiator that the cylindric heat dissipation post of equal specification is constituteed, the radiating effect very promotes.
Description
Technical field
This utility model relates to technical field of heat dissipation, is specifically related to a kind of thermal column for the miniature electronic component heat transmission such as CPU, LED and radiator.
Background technology
Publication No. CN204730153U, the Chinese utility model patent application of CN204756842U disclose two kinds of similar LED heat abstractors of structure, and this kind of heat abstractor includes heat dissipation base and the some thermal columns being arranged on heat dissipation base.The heat abstractor of this type is usually used in the heat radiation of the miniature electronic component such as CPU, LED.Applicant finds in life-time service, and the radiator of this type exists the technological deficiency that heat radiation is not enough, and due to structure and the restriction in space, the scheme changing dissimilar radiator is relatively difficult to achieve.Therefore, it is necessary to existing heat spreader structures is carried out structure improvement, to meet radiating requirements.
Summary of the invention
The technical problems to be solved in the utility model is to provide the thermal column of a kind of Improved-structure and includes the radiator of this thermal column, to solve the defect of prior art.
In order to solve above-mentioned technical problem, the technical scheme that this utility model provides is as follows: a kind of thermal column, including cylindrical body and the auxiliary heat dissipation body being uniformly distributed in cylindrical body circumferencial direction outer surface, being provided with gap between adjacent auxiliary heat dissipation body, this auxiliary heat dissipation body is one-body molded with cylindrical body.
Further, the shape of cross section of described auxiliary heat dissipation body is close to triangle.
A kind of radiator, at least includes that above-mentioned thermal column and heat-radiating substrate, described heat-radiating substrate are provided with some installing holes, and some thermal columns are installed in described installing hole.
Further, the material of described thermal column is 1070 fine aluminiums.
Described thermal column passes through Cold Forging molding.
Further, further, the formal rule arrangement of some thermal columns row in M row × N on described heat-radiating substrate, wherein M, N are the natural number not less than 2.
Thermal column of the present utility model, the external peripheral surface of conventional cylindrical shape body adds equally distributed auxiliary heat dissipation body, and it is provided with gap between adjacent auxiliary heat dissipation body, this structure is compared with the thermal column of conventional cylindrical shape, greatly increase surface area and the cross-sectional area of thermal column, i.e. increase the area of dissipation of single body radiating post.The radiator formed with this thermal column, compared with the radiator of the cylindric thermal column of equivalent specifications composition, radiating effect significantly increases.
Accompanying drawing explanation
Fig. 1 is the structural representation of the radiator of the present embodiment；
Fig. 2 is the structural representation of the present embodiment thermal column.
Detailed description of the invention
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, this utility model is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain this utility model, is not used to limit this utility model.
As it is shown in figure 1, a kind of radiator of the present embodiment, including heat-radiating substrate 1 and some thermal columns 2 being fixedly installed on heat-radiating substrate 1, the formal rule arrangement of the most some thermal columns row in M row × N on heat-radiating substrate, M, N are the natural number not less than 2.Heat-radiating substrate 1 is provided with some installing hole (not shown)s, thermal column 2 and installing hole one_to_one corresponding, and is installed in installing hole.
As the improvement of the present embodiment, wherein the structure of thermal column 2 is as in figure 2 it is shown, this thermal column 2 includes cylindrical body 21 and is uniformly distributed in the auxiliary heat dissipation body 22 of cylindrical body 21 circumferencial direction outer surface, and is provided with gap between adjacent auxiliary heat dissipation body 22.Compared with existing columned thermal column, what the present embodiment was maximum is improved by increasing the exterior surface area of thermal column and cross-sectional area, increase accordingly area of dissipation, enhances the radiating effect of equivalent specifications thermal column monomer.
It should be noted that above-mentioned auxiliary heat dissipation body 22 and cylindrical body 1 are one-body molded by cold forging, processing technique is simple, and production cost is low.As preferably, the material of thermal column is 1070 fine aluminiums.
As preferably, in the present embodiment, auxiliary heat dissipation body 22 at least includes 2 heat radiation planes, forms angle between 2 heat radiation planes, and 2 heat radiation planes are configured proximate to the structure of triangle with the arc surface of corresponding cylindrical body 1.The contribution that thermal column is improved radiating effect by the auxiliary heat dissipation body of this structure is relatively big, and in the case of equivalent specifications, the radiating effect of thermal column is more preferable.As preferably, the thermal column 2 of the present embodiment, uniform on the circumferential surface of its cylindrical body 21 8 auxiliary heat dissipation bodies are distributed.Certainly, this be one preferred embodiment, the particular number for its auxiliary heat dissipation body does not limits.
The radiator of the present embodiment, compared with prior art equivalent specifications (heat-radiating substrate size is identical, thermal column quantity is identical) cylindric heat radiation column radiator, takies heat-dissipating space identical, but radiating effect promotes the most obvious.
In a word; the foregoing is only preferred embodiment of the present utility model; not in order to limit this utility model, all any amendment, equivalent and improvement etc. made within spirit of the present utility model and principle, within should be included in protection domain of the present utility model.
Claims (6)
1. a thermal column, it is characterized in that, including cylindrical body (21) and the auxiliary heat dissipation body (22) that is uniformly distributed in cylindrical body circumferencial direction outer surface, being provided with gap between adjacent auxiliary heat dissipation body, this auxiliary heat dissipation body (22) is one-body molded with cylindrical body (21).
2. according to the thermal column described in claim 1, it is characterised in that the shape of cross section of described auxiliary heat dissipation body (22) is close to triangle.
3. a radiator, it is characterised in that at least include the thermal column (2) described in claim 1 or 2 and heat-radiating substrate (1), described heat-radiating substrate is provided with some installing holes, and some thermal columns (2) are installed in described installing hole.
4. according to the radiator described in claim 3, it is characterised in that the formal rule arrangement of some thermal columns row in M row × N on described heat-radiating substrate, wherein M, N are the natural number not less than 2.
5. according to the radiator described in claim 3, it is characterised in that the material of described thermal column is 1070 fine aluminiums.
6. according to the radiator described in claim 4 or 5, it is characterised in that described thermal column passes through Cold Forging molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620246084.1U CN205454364U (en) | 2016-03-29 | 2016-03-29 | Heat dissipation post and radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620246084.1U CN205454364U (en) | 2016-03-29 | 2016-03-29 | Heat dissipation post and radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205454364U true CN205454364U (en) | 2016-08-10 |
Family
ID=56608007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620246084.1U Expired - Fee Related CN205454364U (en) | 2016-03-29 | 2016-03-29 | Heat dissipation post and radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205454364U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107491151A (en) * | 2017-08-06 | 2017-12-19 | 深圳市益鑫智能科技有限公司 | A kind of heat abstractor of cloud computing mainboard |
| CN113375131A (en) * | 2021-07-13 | 2021-09-10 | 广东启国照明科技有限公司 | Strong convection radiator of lamp |
-
2016
- 2016-03-29 CN CN201620246084.1U patent/CN205454364U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107491151A (en) * | 2017-08-06 | 2017-12-19 | 深圳市益鑫智能科技有限公司 | A kind of heat abstractor of cloud computing mainboard |
| CN113375131A (en) * | 2021-07-13 | 2021-09-10 | 广东启国照明科技有限公司 | Strong convection radiator of lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160810 Termination date: 20180329 |