CN205393783U - Laser processing apparatus - Google Patents
Laser processing apparatus Download PDFInfo
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- CN205393783U CN205393783U CN201620232178.3U CN201620232178U CN205393783U CN 205393783 U CN205393783 U CN 205393783U CN 201620232178 U CN201620232178 U CN 201620232178U CN 205393783 U CN205393783 U CN 205393783U
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Abstract
The application discloses LASER PROCESSING APPARATUS includes: a laser instrument for launching penetrate laser, link to each other with the laser instrument for the beam diameter that enlarges outgoing laser forms expanding to get one's things ready and putting of gauss's laser, link to each other with laser beam expanders for the laser reshaper that is the plastic of gauss's laser the even laser of energy distribution, link to each other with the laser reshaper for even laser to the laser focusing camera lens of processing workpiece surface of focus energy distribution. The energy distribution of laser has been improved on prior art's basis, be the even laser of energy distribution from the inhomogeneous gauss's laser plastic of energy distribution, promptly expand get one's things ready put and the laser focusing camera lens between increased the laser reshaper, the laser reshaper will be the even laser of energy distribution through gauss's laser plastic of expanding the postpone of getting one's things ready, solve LASER PROCESSING APPARATUS's laser energy volume nonuniform distribution effectively, and then the processing that leads to is inhomogeneous, process not in placely or process excessively, part edge after the processing is coarse, the serious problem of deckle edge.
Description
Technical field
This utility model relates to technical field of laser processing, more particularly, it relates to a kind of laser processing device.
Background technology
In Laser Processing industry, laser processing device utilizes laser beam with the characteristic of matter interaction, such as metal or nonmetallic material to be cut, welds, surface treatment, punching, micro Process etc. processes.At present, the shoot laser of the laser instrument in laser processing device is after beam expanding lens, and the energy of shoot laser is the energy of Gauss distribution, now shoot laser is called gauss laser, by gauss laser after over-focusing to metal or nonmetal be processed.The Laser beam energy distribution of gauss laser follows Gauss distribution, namely intermediate energy is strong, edge energy is weak, Energy distribution is uneven, therefore, when using gauss laser that part is processed, it is easy to cause that cutting is uneven, cut not in place or cut excessive phenomenon, meanwhile, the part edge after cutting is coarse, burr are serious.
Therefore, how solving the Laser beam energy distribution of laser processing device uneven is those skilled in the art's urgency technical issues that need to address.
Utility model content
For solving above-mentioned technical problem, this utility model provides a kind of laser processing device, and Laser beam energy distribution is uniform so that the part edge after cut is smooth, effectively prevent the burr phenomenon after part cutting, and processes excessive or processing deficiency.
For achieving the above object, this utility model provides following technical scheme:
A kind of laser processing device, including:
For launching the laser instrument of shoot laser；
Be connected with described laser instrument, for expand described shoot laser beam diameter formed gauss laser expand device；
It is connected with described laser beam expanding lens, for described gauss laser being shaped as the laser shaping device of the uniform laser of Energy distribution；
It is connected with described laser shaping device, for focusing on the described Energy distribution uniform laser laser focusing camera lens to processing work surface.
Preferably, in above-mentioned laser processing device, described laser shaping device is non-spherical lens group laser shaping device.
Preferably, in above-mentioned laser processing device, described non-spherical lens group laser shaping device includes:
For described gauss laser being shaped as a flat recessed aspherical mirror of the uniform laser of Energy distribution；
For by a flat convex aspheric surface mirror of uniform for described Energy distribution laser exiting parallel, the convex surface of a described flat recessed concave surface and a described flat convex aspheric surface mirror is oppositely arranged.
Preferably, in above-mentioned laser processing device, described laser shaping device is microlens array laser shaping device.
Preferably, in above-mentioned laser processing device, described microlens array laser shaping device includes:
For described gauss laser being divided into the lenslet array system of multiple gauss laser bundle；
For the plurality of gauss laser bundle superposition is formed the spherical focusing lens of the uniform laser of Energy distribution, the convex surface of the convex surface of described spherical focusing lens and described lenslet array system is oppositely arranged.
Preferably, in above-mentioned laser processing device, described laser instrument is semiconductor laser.
Preferably, in above-mentioned laser processing device, described in expand device be laser beam expanding lens.
From technique scheme it can be seen that a kind of laser processing device provided by the utility model, including: for launching the laser instrument of shoot laser；Be connected with described laser instrument, for expand described shoot laser beam diameter formed gauss laser expand device；It is connected with described laser beam expanding lens, for described gauss laser being shaped as the laser shaping device of the uniform laser of Energy distribution；It is connected with described laser shaping device, for focusing on the described Energy distribution uniform laser laser focusing camera lens to processing work surface.
This utility model improves the Energy distribution of laser on the basis of existing technology, it is shaped as the uniform laser of Energy distribution from the gauss laser that Energy distribution is uneven, namely laser shaping device is added between device and laser focusing camera lens expanding, the gauss laser passed through after expanding device is shaped as the uniform laser of Energy distribution by laser shaping device, its spot energy distribution is uniform, when laser focusing camera lens focuses on described hot spot to processing work, processing work is cut by the uniform laser of Energy distribution, welding, surface treatment, the work such as punching and micro Process, processing work the smooth of the edge after cutting, effectively prevent the burr phenomenon after part cutting, welding, surface treatment, processing work processing after punching and micro Process is appropriate, avoid processing excessive or not enough.
Accompanying drawing explanation
In order to be illustrated more clearly that this utility model embodiment or technical scheme of the prior art, the accompanying drawing used required in embodiment or description of the prior art will be briefly described below, apparently, accompanying drawing in the following describes is only embodiment of the present utility model, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to the accompanying drawing provided.
A kind of laser processing device schematic diagram that Fig. 1 provides for this utility model embodiment；
A kind of laser shaping device schematic diagram that Fig. 2 provides for this utility model embodiment；
The another kind of laser shaping device schematic diagram that Fig. 3 provides for this utility model embodiment.
Detailed description of the invention
This utility model embodiment discloses a kind of laser processing device, the Laser beam energy distribution efficiently solving laser processing device is uneven, so cause processing uneven, process not in place or process excessive, processing after the problem that part edge is coarse, burr are serious.
Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is clearly and completely described, it is clear that described embodiment is only a part of embodiment of this utility model, rather than whole embodiments.Based on the embodiment in this utility model, the every other embodiment that those of ordinary skill in the art obtain under not making creative work premise, broadly fall into the scope of this utility model protection.
Refer to a kind of laser processing device schematic diagram that Fig. 1, Fig. 1 provide for this utility model embodiment.
In a kind of specific embodiment, it is provided that a kind of laser processing device, including: for launching the laser instrument 101 of shoot laser；Be connected with laser instrument 101, for expand shoot laser beam diameter formed gauss laser expand device 102；It is connected with laser beam expanding lens, for gauss laser being shaped as the laser shaping device 103 of the uniform laser of Energy distribution；Being connected with laser shaping device 103, the laser being evenly distributed for focus energy is to the laser focusing camera lens 104 on processing work surface.
In field of laser processing, utilize the shoot laser of laser processing device that processing work is cut, weld, surface treatment, punching, micro Process etc. processes.The shoot laser that laser instrument 101 is launched enters into and expands in device 102, expand the beam diameter of shoot laser, so that follow-up processing, the energy density distribution that laser beam after expanding device 102 and expanding is in that on the cross section that transmission direction is vertical is Gauss distribution, the laser beam energy of Gauss distribution is also uneven, therefore, the present embodiment adds laser shaping device 103 expanding between device 102 and laser focusing camera lens 104, the gauss laser passed through after expanding device 102 is shaped as the uniform laser of Energy distribution by laser shaping device 103, such as, the uniform laser of Energy distribution after shaping is flat-top distribution laser, namely the energy density distribution being in that on the cross section that transmission direction is vertical is flat-top distribution.Afterwards, uniform for Energy distribution laser focusing on whole processing work surface, is formed evenly sized focal beam spot, processing work is processed by laser focusing camera lens 104.Owing to laser facula Energy distribution is uniform, when making that described in laser focusing camera lens 104 laser focusing, the uniform laser of Energy distribution to processing work is processed, such as, processing work cut, weld, surface treatment, the processing mode such as punching and micro Process, processing work the smooth of the edge after cutting, effectively prevent the burr phenomenon after part cutting, the processing work processing after welding, surface treatment, punching and micro Process is in right amount, it is to avoid processing is excessive or not enough.
In another embodiment, as in figure 2 it is shown, a kind of laser shaping device 103 schematic diagram of providing for this utility model embodiment of Fig. 2.Laser shaping device 103 is non-spherical lens group laser shaping device 103.Described non-spherical lens group laser shaping device 103 includes: for described gauss laser is shaped as a flat recessed aspherical mirror 105 of the uniform laser of Energy distribution；For by a flat convex aspheric surface mirror 106 of uniform for described Energy distribution laser exiting parallel, the convex surface of a described flat recessed concave surface and a described flat convex aspheric surface mirror 106 is oppositely arranged.Gauss laser is carried out shaping by a flat recessed aspherical mirror 105, form the laser beam of flat-top distribution, by a flat convex aspheric surface mirror 106, laser beam being carried out collimation process again, it is good that non-spherical lens realizes laser beam non-spherical lens group laser shaping device 103 shaping effect, and capacity usage ratio is high.
It is pointed out that in the present embodiment, the non-spherical lens group laser shaping device 103 of said structure is Galilean type structure, whole system compact conformation, it does not have real focus, is suitable for high-power Gaussian laser beam shaping.Certainly, non-spherical lens group laser shaping device 103 can also be Kepler-type structure, the laser shaping device 103 of this structure includes former and later two flat convex aspheric surface mirrors 106, and the convex surface of the two is oppositely arranged, focus overlaps, and gauss laser is focused at public focus place by first flat convex aspheric surface mirror 106, and second flat convex aspheric surface mirror 106 is imaged on infinity, by the face type curve dullness of the non-spherical lens that numerical solution obtains, it is simple to processing.
In another embodiment, as it is shown on figure 3, another kind of laser shaping device 103 schematic diagram that provides for this utility model embodiment of Fig. 3.Laser shaping device 103 is microlens array laser shaping device 103.Described microlens array laser shaping device 103 includes: for described gauss laser is divided into the lenslet array system 107 of multiple gauss laser bundle；For the plurality of gauss laser bundle superposition is formed the spherical focusing lens 108 of the uniform laser of Energy distribution, the convex surface of the convex surface of described spherical focusing lens 108 and described lenslet array system 107 is oppositely arranged.Lenslet array system 107 includes the lenticule of multiple same shape, identical material regular array, by the segmentation of gauss laser and superposition again, eliminate the impact that laser energy is uneven, microlens array laser shaping device 103 achieves the modulation to light distribution, can also change size and the shape of hot spot simultaneously.
It is pointed out that this utility model includes but not limited to above two laser shaping device 103, it is also possible to for diffraction element laser shaping device 103, LCD space light modulator, element with long focal depth reshaper etc., all within protection domain.
On the basis of above-described embodiment, laser instrument 101 is preferably semiconductor laser.Semiconductor laser is the stimulated emission effect that produces using certain semi-conducting material as operation material, its principle is by certain energisation mode (electrical pumping, optical pumping or high-power electron beam inject), maybe can be able to be with between impurity energy level between being with at semiconductor substance, by exciting nonequilibrium carrier to realize population inversion, thus producing the stimulated emission effect of light.
On the basis of above-described embodiment, for the ease of follow-up processing, expand device 102 and be preferably laser beam expanding lens.Laser beam expanding lens mainly has two purposes: the diameter of first expanded beam；Its two be reduce laser beam the angle of divergence.
A kind of laser processing device that this utility model embodiment provides, improve the Energy distribution of laser on the basis of existing technology, it is shaped as the uniform laser of Energy distribution from the gauss laser that Energy distribution is uneven, such as, after described in laser focusing camera lens 104 laser focusing, the uniform laser of Energy distribution is processed to square groove, the groove edge processed is smooth, and right angle is it can be avoided that the fillet that processes time uneven of gauss laser energy, it is to avoid the phenomenon that processing is excessive or not enough occur.
In this specification, each embodiment adopts the mode gone forward one by one to describe, and what each embodiment stressed is the difference with other embodiments, between each embodiment identical similar portion mutually referring to.
Described above to the disclosed embodiments, makes professional and technical personnel in the field be capable of or uses this utility model.The multiple amendment of these embodiments be will be apparent from for those skilled in the art, and generic principles defined herein when without departing from spirit or scope of the present utility model, can realize in other embodiments.Therefore, this utility model is not intended to be limited to the embodiments shown herein, and is to fit to the widest scope consistent with principles disclosed herein and features of novelty.
Claims (7)
1. a laser processing device, it is characterised in that including:
For launching the laser instrument of shoot laser；
Be connected with described laser instrument, for expand described shoot laser beam diameter formed gauss laser expand device；
It is connected with described laser beam expanding lens, for described gauss laser being shaped as the laser shaping device of the uniform laser of Energy distribution；
It is connected with described laser shaping device, for focusing on the described Energy distribution uniform laser laser focusing camera lens to processing work surface.
2. laser processing device as claimed in claim 1, it is characterised in that described laser shaping device is non-spherical lens group laser shaping device.
3. laser processing device as claimed in claim 2, it is characterised in that described non-spherical lens group laser shaping device includes:
For described gauss laser being shaped as a flat recessed aspherical mirror of the uniform laser of Energy distribution；
For by a flat convex aspheric surface mirror of uniform for described Energy distribution laser exiting parallel, the convex surface of a described flat recessed concave surface and a described flat convex aspheric surface mirror is oppositely arranged.
4. laser processing device as claimed in claim 1, it is characterised in that described laser shaping device is microlens array laser shaping device.
5. laser processing device as claimed in claim 4, it is characterised in that described microlens array laser shaping device includes:
For described gauss laser being divided into the lenslet array system of multiple gauss laser bundle；
For the plurality of gauss laser bundle superposition is formed the spherical focusing lens of the uniform laser of Energy distribution, the convex surface of the convex surface of described spherical focusing lens and described lenslet array system is oppositely arranged.
6. the laser processing device as described in any one of claim 1 to 5, it is characterised in that described laser instrument is semiconductor laser.
7. laser processing device as claimed in claim 6, it is characterised in that described in expand device be laser beam expanding lens.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201620232178.3U CN205393783U (en) | 2016-03-24 | 2016-03-24 | Laser processing apparatus |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201620232178.3U CN205393783U (en) | 2016-03-24 | 2016-03-24 | Laser processing apparatus |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106735868A (en) * | 2017-02-21 | 2017-05-31 | 长春理工大学 | Laser interference micro-nano technology device and method based on reflective dammann grating beam splitting |
| CN107914080A (en) * | 2016-10-11 | 2018-04-17 | 财团法人工业技术研究院 | Laser uniform processing device and method thereof |
| CN109613707A (en) * | 2019-01-03 | 2019-04-12 | 海特光电有限责任公司 | A kind of beam shaping mirror and semiconductor laser light compensating apparatus |
| CN109807476A (en) * | 2019-04-03 | 2019-05-28 | 大族激光科技产业集团股份有限公司 | A kind of laser cutting method and laser cutting device of adjustable line width |
| CN109975258A (en) * | 2019-03-25 | 2019-07-05 | 武汉理工大学 | A kind of micro-fluidic detection system of signal enhancing |
| CN110731019A (en) * | 2017-06-12 | 2020-01-24 | 罗伯特·博世有限公司 | Method for cutting a separator foil, separator foil and battery cell |
| CN112643100A (en) * | 2020-12-10 | 2021-04-13 | 华侨大学 | Shimming laser auxiliary milling device and method suitable for difficult-to-machine materials |
| CN115576113A (en) * | 2022-11-03 | 2023-01-06 | 苏州天准科技股份有限公司 | Gaussian beam shaping aspheric lens group |
-
2016
- 2016-03-24 CN CN201620232178.3U patent/CN205393783U/en active Active
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107914080A (en) * | 2016-10-11 | 2018-04-17 | 财团法人工业技术研究院 | Laser uniform processing device and method thereof |
| US10705346B2 (en) | 2016-10-11 | 2020-07-07 | Industrial Technology Research Institute | Laser uniformly machining apparatus and method |
| CN106735868A (en) * | 2017-02-21 | 2017-05-31 | 长春理工大学 | Laser interference micro-nano technology device and method based on reflective dammann grating beam splitting |
| CN106735868B (en) * | 2017-02-21 | 2018-10-23 | 长春理工大学 | Laser interference micro-nano technology device and method based on reflective dammann grating beam splitting |
| CN110731019A (en) * | 2017-06-12 | 2020-01-24 | 罗伯特·博世有限公司 | Method for cutting a separator foil, separator foil and battery cell |
| CN109613707A (en) * | 2019-01-03 | 2019-04-12 | 海特光电有限责任公司 | A kind of beam shaping mirror and semiconductor laser light compensating apparatus |
| CN109975258A (en) * | 2019-03-25 | 2019-07-05 | 武汉理工大学 | A kind of micro-fluidic detection system of signal enhancing |
| CN109807476A (en) * | 2019-04-03 | 2019-05-28 | 大族激光科技产业集团股份有限公司 | A kind of laser cutting method and laser cutting device of adjustable line width |
| CN112643100A (en) * | 2020-12-10 | 2021-04-13 | 华侨大学 | Shimming laser auxiliary milling device and method suitable for difficult-to-machine materials |
| CN115576113A (en) * | 2022-11-03 | 2023-01-06 | 苏州天准科技股份有限公司 | Gaussian beam shaping aspheric lens group |
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