CN205380086U - Wafer cleaning device - Google Patents
Wafer cleaning device Download PDFInfo
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- CN205380086U CN205380086U CN201521140775.5U CN201521140775U CN205380086U CN 205380086 U CN205380086 U CN 205380086U CN 201521140775 U CN201521140775 U CN 201521140775U CN 205380086 U CN205380086 U CN 205380086U
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- wafer
- support platform
- cleaner equipment
- equipment according
- wafer cleaner
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Abstract
The utility model discloses a wafer cleaning device. Wafer cleaning device includes supporting mechanism, evacuating device and brace table. Evacuating device includes the trachea. The brace table rotatably sets up on the supporting mechanism. The absorption through -hole has been seted up on the brace table. Adsorb the through -hole set up into with the trachea intercommunication. The brace table is used for supporting the wafer. Wafer cleaning device's efficient and clean degree height.
Description
Technical field
This utility model relates to the process equipment of a kind of semiconductor device, particularly to a kind of wafer cleaner equipment.
Background technology
Wafer is the important materials manufacturing semiconductor chip.Wafer refers to the silicon wafer used by silicon semiconductor production of integrated circuits, owing to it is generally circular in shape, therefore is called wafer；Various circuit component structure can be manufactured on silicon, and become the IC products having certain electric sexual function.The original material of wafer is silicon, and there is nexhaustible silicon dioxide on earth's crust surface.Silicon dioxide Ore refines via electric arc furnace, chlorination of hydrochloric acid, and after distillation, is made for highly purified polysilicon.Wafer is it is generally required to pass through chemistry, physical treatment.Thus, the wafer of intermediate product is likely to remain various impurity, such as colloid.The existence of impurity, significantly impacts the performance of wafer, even causes the situation of cisco unity malfunction.Thus, it is the basic demand of semiconductor applications for the high standard standard of the purity of wafer.
Utility model content
The purpose of this utility model is to overcome deficiency of the prior art, it is provided that the wafer cleaner equipment that a kind of cleaning efficiency is high, clean-up performance is high.
For realizing object above, this utility model is achieved through the following technical solutions:
This utility model provides a kind of wafer cleaner equipment.Described wafer cleaner equipment includes:
Supporting mechanism；
Vacuum extractor, described vacuum extractor includes trachea；
Supporting platform, described support platform can be rotatably set on described supporting mechanism, and described support platform offers absorption through hole, and described absorption through hole is set to connect with described trachea, and described support platform is used for supporting wafer.
Preferably, described wafer cleaner equipment also includes rotating mechanism, and described rotating mechanism is arranged on described supporting mechanism to drive described support platform to rotate.
Preferably, described rotating mechanism includes motor and rotating shaft, and described motor is set to drive described rotating shaft to rotate, and described rotating shaft is connected setting with described support platform.
Preferably, described wafer cleaner equipment also includes Pneumatic rotary joint；Described rotating shaft offers through hole vertically；Described Pneumatic rotary joint, described vacuum extractor trachea be respectively set to connect with the through hole of described rotating shaft.
Preferably, described wafer cleaner equipment also includes cleaning assemblies, and described cleaning assemblies is arranged on described supporting mechanism, and described cleaning assemblies includes cleaning head, and described cleaning head is arranged in contact with the wafer being arranged on described support platform.
Preferably, described cleaning head rotatably arranged with, and the rotation direction of described cleaning head is set to contrary with the rotation direction of described support platform.
Preferably, the material of described cleaning head is hair.
Preferably, the diameter of described cleaning head is more than or equal to the radius of the circumscribed circle of described support platform.
Preferably, described cleaning head is movably disposed relative to described support platform.
Preferably, described cleaning assemblies also includes load plate, connector and driving device；Described driving device is arranged on described supporting mechanism, drives described connector to arrange movably；Described connector is connected with described driving device and is set to extend to and faces with described support platform；Described load plate is arranged on described connector；Described cleaning head is arranged on described load plate.
Preferably: described driving device includes cylinder.
Preferably: also include cleanout fluid shower nozzle, described cleanout fluid shower nozzle is directed at described support platform and arranges, and described cleanout fluid shower nozzle is for spraying cleanout fluid to described wafer；Described cleanout fluid shower nozzle connects with reservoir.
The wafer cleaner equipment that this utility model provides is by rotating wafer, thus improve the cleaning efficiency to wafer and clean-up performance height.Described vacuum extractor can firmly adsorb again wafer while not damaging experience so that wafer when high speed rotating all without the problem flown away from such that it is able to realize high speed contact with realize cleaning.Further, rotated by the direction of cleaning head, increase the relative velocity with wafer contacts, improve clean-up performance.The diameter of cleaning head is more than the half of diameter wafer, make cleaning head only in one direction linear reciprocation move and coordinate wafer to rotate, the all positions of clean wafer surface can be realized, what therefore drive that the driving mechanism that moves of cleaning head and drive mechanism can arrange is relatively simple, only needing to drive cleaning head to move back and forth in one direction, production cost is low.
Accompanying drawing explanation
The structural representation of a kind of wafer cleaner equipment that Fig. 1 provides for this utility model.
Fig. 2 supports, in Fig. 1, the structural representation that platform, motor are arranged on supporting mechanism.
Fig. 3 is the top view supporting platform concealment upper cover plate of Fig. 2.
Fig. 4 is the Fig. 3 sectional view along line A-A.
Fig. 5 is the structural representation of the cleaning assemblies of Fig. 1.
Fig. 6 is the enlarged diagram at the B place in Fig. 5.
Detailed description of the invention
Below in conjunction with accompanying drawing, this utility model is described in detail:
As shown in Figures 1 to 6, its a kind of wafer cleaner equipment 101 provided for this utility model.Described wafer cleaner equipment 101 includes supporting mechanism 10, vacuum extractor 20 and supports platform 30.
Please continue to refer to Fig. 1, described vacuum extractor 20 includes trachea.Described vacuum extractor 20, for evacuation, adsorbs wafer 108 to produce gas negative pressure.
Please continue to refer to Fig. 1 to Fig. 4, described support platform 30 can be rotatably set on described supporting mechanism 10.Described support platform 30 offers absorption through hole 31.Described absorption through hole 31 is set to connect with described trachea.Described support platform 30 is used for supporting wafer 108.
Please continue to refer to Fig. 1 to Fig. 4, in order to realize controllably rotating, described wafer cleaner equipment 101 also includes rotating mechanism 40.Described rotating mechanism 40 is set on described supporting mechanism 10 to drive described support platform 30 to rotate.In the present embodiment, described rotating mechanism 40 bag motor 41 and rotating shaft 42.Described motor 41 is set to drive described rotating shaft 42 to rotate.Described rotating shaft 42 is connected setting with common rotation with described support platform 30.
In order to remain in that higher air-tightness connection at high speed rotating, this utility model adopts Pneumatic rotary joint 45 to realize connecting.Described rotating shaft 42 offers through hole 421 vertically.Described startup swivel joint 45, described vacuum extractor 20 trachea connect with the through hole of described rotating shaft 42 respectively.
Referring to Fig. 1, Fig. 5 and Fig. 6, the cleaning effect higher in order to obtain clean-up performance, described wafer cleaner equipment 101 also includes cleaning assemblies 60.Described cleaning assemblies 60 is arranged on described supporting mechanism 10.Described cleaning assemblies 60 includes cleaning head 61.Described cleaning head 61 is arranged in contact with the wafer 108 being arranged on described support platform 30.In order to promote cleaning effect further, described cleaning head 61 rotatably arranged with, and the rotation direction of described cleaning head 61 is set to contrary with the rotation direction of described support platform 30.In order to avoid the damage that wafer 108 is possible, the material of described cleaning head 61 is hair.Obtain the effect of cleaning comprehensively to clean 108 at an arbitrary position, the diameter of described cleaning head 61 is more than described or circumscribed circle equal to described support platform 30 radius.In the present embodiment, described support platform 30 is patty, thus the circumscribed circle of this support platform 30 is the circular diameter of cross section of this cake.
Described cleaning assemblies 60 also includes load plate 65, connector 66 and driving device 67.Described driving device 67 is arranged on described supporting mechanism 10.Described connector 66 is connected with described driving device 67, and driving device 67 drives connector 66 to arrange movably.Connector 66 is set to extension and faces as described support platform 30.Described load plate 65 is arranged on described connector 66.Described cleaning head 61 is arranged on described load plate 65.In the present embodiment, described driving device 67 includes cylinder.This cylinder is mobile described cleaning head 61 by mobile described connector 66, load plate 65.
Please continue to refer to Fig. 1, in order to reach more abrasive degree, described wafer cleaner equipment 101 also includes cleanout fluid shower nozzle 70.Described cleanout fluid shower nozzle 70 is directed at described support platform 30 and arranges.Described cleanout fluid shower nozzle 70 is used for spraying cleanout fluid cleaning wafer.
Embodiment in this utility model, only for this utility model is illustrated, is not intended that the restriction to right, those skilled in that art it is contemplated that other replacements being substantially equal to, all in this utility model protection domain.
Claims (12)
1. a wafer cleaner equipment, it is characterised in that described wafer cleaner equipment includes:
Supporting mechanism；
Vacuum extractor, described vacuum extractor includes trachea；
Supporting platform, described support platform can be rotatably set on described supporting mechanism, and described support platform offers absorption through hole, and described absorption through hole is set to connect with described trachea, and described support platform is used for supporting wafer.
2. wafer cleaner equipment according to claim 1, it is characterised in that: described wafer cleaner equipment also includes rotating mechanism, and described rotating mechanism is arranged on described supporting mechanism to drive described support platform to rotate.
3. wafer cleaner equipment according to claim 2, it is characterised in that: described rotating mechanism includes motor and rotating shaft, and described motor is set to drive described rotating shaft to rotate, and described rotating shaft is connected setting with described support platform.
4. wafer cleaner equipment according to claim 3, it is characterised in that: also include Pneumatic rotary joint；Described rotating shaft offers through hole vertically；Described Pneumatic rotary joint, described vacuum extractor trachea be respectively set to connect with the through hole of described rotating shaft.
5. wafer cleaner equipment according to any one of claim 1 to 4, it is characterized in that: also include cleaning assemblies, described cleaning assemblies is arranged on described supporting mechanism, and described cleaning assemblies includes cleaning head, and described cleaning head is arranged in contact with the wafer being arranged on described support platform.
6. wafer cleaner equipment according to claim 5, it is characterised in that: described cleaning head rotatably arranged with, and the rotation direction of described cleaning head is set to contrary with the rotation direction of described support platform.
7. wafer cleaner equipment according to claim 6, it is characterised in that: the material of described cleaning head is hair.
8. wafer cleaner equipment according to claim 6, it is characterised in that: the diameter of described cleaning head is more than or equal to the radius of the circumscribed circle of described support platform.
9. wafer cleaner equipment according to claim 5, it is characterised in that: described cleaning head is movably disposed relative to described support platform.
10. wafer cleaner equipment according to claim 9, it is characterised in that: described cleaning assemblies also includes load plate, connector and driving device；Described driving device is arranged on described supporting mechanism, drives described connector to arrange movably；Described connector is connected with described driving device and is set to extend to and faces with described support platform；Described load plate is arranged on described connector；Described cleaning head is arranged on described load plate.
11. wafer cleaner equipment according to claim 10, it is characterised in that: described driving device includes cylinder.
12. wafer cleaner equipment according to claim 1, it is characterised in that: also including cleanout fluid shower nozzle, described cleanout fluid shower nozzle is directed at described support platform and arranges, and described cleanout fluid shower nozzle is for spraying cleanout fluid to described wafer；Described cleanout fluid shower nozzle connects with reservoir.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521140775.5U CN205380086U (en) | 2015-12-31 | 2015-12-31 | Wafer cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521140775.5U CN205380086U (en) | 2015-12-31 | 2015-12-31 | Wafer cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205380086U true CN205380086U (en) | 2016-07-13 |
Family
ID=56348261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521140775.5U Active CN205380086U (en) | 2015-12-31 | 2015-12-31 | Wafer cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205380086U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105478391A (en) * | 2015-12-31 | 2016-04-13 | 上海新阳半导体材料股份有限公司 | Wafer cleaning apparatus |
-
2015
- 2015-12-31 CN CN201521140775.5U patent/CN205380086U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105478391A (en) * | 2015-12-31 | 2016-04-13 | 上海新阳半导体材料股份有限公司 | Wafer cleaning apparatus |
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