CN205376475U - Concertina type wafer scanning device and wafer scanning system - Google Patents
Concertina type wafer scanning device and wafer scanning system Download PDFInfo
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- CN205376475U CN205376475U CN201620115640.1U CN201620115640U CN205376475U CN 205376475 U CN205376475 U CN 205376475U CN 201620115640 U CN201620115640 U CN 201620115640U CN 205376475 U CN205376475 U CN 205376475U
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Abstract
The utility model discloses concertina type wafer scanning device and wafer scanning system relates to semiconductor wafer detection area. Its purpose is in order to provide a compatibility and strong adaptability, space -saving concertina type wafer scanning device and a wafer scanning system. The utility model discloses concertina type wafer scanning device includes the base, installs sharp actuating mechanism on the base, and the connecting plate is installed to sharp actuating mechanism's output, is fixed with the probe mounting panel on the connecting plate, and bilateral symmetry processes on the probe mounting panel has a plurality of installation position, installs two fiber optic probes on the probe mounting panel, during two fiber optic probe symmetries are installed and control relative position's installation position on the probe mounting panel. Wafer scanning system includes concertina type wafer scanning device, and end effector is installed to concertina type wafer scanning device's rear end, and concertina type wafer scanning device fixes on the manipulator below.
Description
Technical field
The present invention relates to semiconductor crystal wafer detection field, particularly relate to a kind of concertina type wafer-scanning device and wafer-scanning system.
Background technology
In semicon industry, wafer often uses wafer-scanning device between wafer film magazine or when wafer film magazine transmits with wafer process equipment room; the function of its correspondence is wafer-scanning function, and this device is to judge wafer number in wafer film magazine, the important tool of position and be usually combined use with mechanical arm.
Wafer-scanning device is the device using Fibre Optical Sensor to carry out wafer-scanning, classifies according to its optical fiber scanning mode and is broadly divided into correlation type and reflection-type two class.Correlation type wafer-scanning device be characterized in that scanning result is accurate, scanning accuracy is high, but it has two fibre-optical probes, one is transmitting terminal, and one is receiving terminal, and two probes must be oppositely arranged, and it is not relative position is more fixing, when actually used, the wafer compatibility of various sizes is good.And owing to this device is loaded on the rear portion of end effector more, end effector needs to carry out wafer carrying, and carrying part occupies major part space, therefore wafer-scanning device is by the motion of mechanical hand, can not have very long stroke, be unsuitable for the occasion that depth is longer.For the demand of the different depth of reply and size in practical operation, it may be necessary to changing the part-structure of wafer-scanning device or modification means, thus having influence on manufacturing schedule, adding input cost.Reflection-type wafer-scanning device takes up room less, and the wafer of various sizes is compatible strong, is suitable to the occasion that depth is longer, but its scanning accuracy is far below correlation type wafer-scanning device, it is impossible to provide scanning result accurately.Such as the silicon chip distribution photoelectric scanning device of a kind of semiconductor equipment bearing area disclosed in Chinese invention patent CN105097592A in prior art, including two two correlation photoelectric sensor being fixedly installed on mechanical hand U-shaped end relative position, two correlation photoelectric sensor are positioned at same level height, jointly carry out motion both horizontally and vertically and location along with mechanical hand, it is achieved Scanning Detction.This scanning means has some limitations in actual use, and first, the distance between two photoelectric sensors is fixed, it is impossible to freely adjust, and the wafer adaptability for different-diameter is not strong, can only scan the wafer of single model；Next photoelectric sensor can only be followed mechanical hand and be carried out motion both horizontally and vertically, and photoelectric sensor self does not possess mobile and flexible function, cannot be carried out scanning for the wafer that depth is longer, and compatibility and adaptability are clearly present deficiency.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of compatible and strong adaptability, joint space-efficient concertina type wafer-scanning device and a kind of wafer-scanning system.
Concertina type wafer-scanning device of the present invention, including base, base is provided with straight line driving mechanism, the outfan of straight line driving mechanism is provided with connecting plate, connecting plate is fixed with probe installing plate, on probe installing plate, left and right is symmetrily processed with several installation positions, and probe installing plate is provided with two fibre-optical probes, and two fibre-optical probes are symmetrically mounted on probe installing plate in the installation position of left and right relative position.
Concertina type wafer-scanning device of the present invention, wherein said straight line driving mechanism includes cylinder, and described connecting plate installs the end of cylinder rod in the cylinder, cylinder arranged outside has cover plate, cover plate is fixed on the top of connecting plate, and covers above cylinder rod, jointly moves back and forth with cylinder rod.
Concertina type wafer-scanning device of the present invention, wherein said cylinder selects double-rod cylinder.
Concertina type wafer-scanning device of the present invention, wherein said base is provided with guard shield, and described straight line driving mechanism is positioned at inside guard shield.
Wafer-scanning system of the present invention, including concertina type wafer-scanning device, the rear end of concertina type wafer-scanning device is provided with end effector, fixes on a robotic arm below concertina type wafer-scanning device.
Concertina type wafer-scanning device of the present invention and wafer-scanning system difference from prior art are in that wafer-scanning system of the present invention includes concertina type wafer-scanning device, generally, factor for safety and the optimum layout space, wafer-scanning system needs to be limited within the scope of minimum tactical diameter by end effector and wafer-scanning device in rotation process, and the wafer workpiece of end effector and its pickup can occupy bigger space, therefore on wafer-scanning device, the position of fibre-optical probe must close proximity to the center of rotation of mechanical hand, make it meet and be positioned at the condition descending revolution diameter range most.And the concertina type wafer-scanning device of the present invention includes straight line driving mechanism, straight line driving mechanism can drive correlation fibre-optical probe to carry out rectilinear motion, when two fibre-optical probe relative positions are determined, the scanning depth of extended fiber probe, meet the needs of different operating mode, strengthen compatibility and the adaptability of wafer-scanning device.The characteristic that fibre-optical probe can stretch simultaneously can also reduce the floor space of wafer-scanning system, saves space.
It is described further below in conjunction with the accompanying drawing concertina type wafer-scanning device to the present invention and wafer-scanning system.
Accompanying drawing explanation
Fig. 1 is the assembling explosive view of concertina type wafer-scanning device of the present invention；
View when Fig. 2 is that in concertina type wafer-scanning device of the present invention, two fibre-optical probes are closest；
Fig. 3 is two fibre-optical probes view when farthest in concertina type wafer-scanning device of the present invention；
Fig. 4 is the structural representation of wafer-scanning system of the present invention.
Detailed description of the invention
As shown in Figure 4, wafer-scanning system of the present invention includes concertina type wafer-scanning device 11, end effector 12 and mechanical hand 13.As it is shown in figure 1, concertina type wafer-scanning device 11 includes base 6, base 6 is arranged on mechanical hand 13, carries out motion both horizontally and vertically with mechanical hand 13, base 6 is provided with guard shield 9.On base 6, inside guard shield 9, straight line driving mechanism is installed.Straight line driving mechanism includes cylinder 7, and cylinder 7 selects double-rod cylinder, strengthen its flexible time stability.The end of the cylinder rod 5 of cylinder 7 is provided with connecting plate 4 as the outfan of straight line driving mechanism, connecting plate 4 is fixed with probe installing plate 2, on probe installing plate 2, symmetrical each processing has four installation positions 3, being provided with two fibre-optical probes 1 on probe installing plate 2, two fibre-optical probes 1 are separately mounted on probe installing plate 2 in the installation position 3 of left and right relative position.Straight line driving mechanism can drive two fibre-optical probes 1 to carry out straight reciprocating motion.The concrete installation site of two fibre-optical probes 1 can be adjusted according to the size of the wafer 10 of required scanning, with the compatibility of enhanced ct scans device and adaptability, as shown in Figures 2 and 3, the distance between two fibre-optical probe 1 installation sites range for D1～D2.According to the distance between two fibre-optical probes 1, as shown in Figures 2 and 3, wafer 10 diameter range that it can scan is R1～R2, and the diameter range in real work is 50mm～300mm.As shown in Figure 1 and Figure 4, cylinder 7 arranged outside has cover plate 8, cover plate 8 to be fixed on the top of connecting plate 4, and covers above cylinder rod 5, jointly moves back and forth with cylinder rod 5, it is prevented that cylinder 7 clips to foreign material when stretching out and bounce back.End effector 12 is arranged on rear side of guard shield 9, for picking up work piece.
Wafer-scanning system of the present invention, with in the process that mechanical hand 13 rotates, concertina type wafer-scanning device 11 and the outermost end of end effector 12 above mechanical hand 13 form a circular interference field, when the cylinder rod 5 of concertina type wafer-scanning device 11 is in retracted state, this interferes the diameter in field to be called minimum tactical diameter.Generally, in mechanical hand 13 rotation process, factor for safety and the optimum layout space, not allowing end effector 12 and concertina type wafer-scanning device 11 beyond outside this minimum tactical diameter scope, only after arm stops circumnutation, whole system just can carry out the motion of horizontal direction.And the space that wafer 10 workpiece of end effector 12 pickup takies is relatively greatly, further limit the length of wafer-scanning device, depend the horizontal movement of mechanical hand 13 alone, it is impossible to suitable in the demand of great depth scanning.But after fibre-optical probe 1 itself has Telescopic, it is not necessary to rely only on the movement of mechanical hand 13, straight line driving mechanism the Telescopic brought can strengthen its scanning depth, makes fibre-optical probe 1 be adapted to more scanning circumstance.
The operation principle of wafer-scanning system of the present invention is as follows: first according to installation position 3 fixing optical fiber probe 1 that the size Selection of wafer 10 is suitable.When mechanical hand 13 circles round, the fibre-optical probe 1 of concertina type wafer-scanning device 11 is in retracted state, within being positioned at minimum tactical diameter；When mechanical hand 13 stops convolution, and when performing wafer 10 scan task, the straight line driving mechanism of concertina type wafer-scanning device 11 demand according to scanning depth, stretches out designated length by cylinder rod 5, makes fibre-optical probe 1 specify position close to wafer 10 and it is scanned.
Embodiment described above is only that the preferred embodiment of the present invention is described; not the scope of the present invention is defined; under the premise designing spirit without departing from the present invention; various deformation that technical scheme is made by those of ordinary skill in the art and improvement, all should fall in the protection domain that claims of the present invention is determined.
Claims (5)
1. a concertina type wafer-scanning device, it is characterized in that: include base, base is provided with straight line driving mechanism, the outfan of straight line driving mechanism is provided with connecting plate, connecting plate is fixed with probe installing plate, on probe installing plate, left and right is symmetrily processed with several installation positions, and probe installing plate is provided with two fibre-optical probes, and two fibre-optical probes are symmetrically mounted on probe installing plate in the installation position of left and right relative position.
2. concertina type wafer-scanning device according to claim 1, it is characterized in that: described straight line driving mechanism includes cylinder, described connecting plate installs the end of cylinder rod in the cylinder, cylinder arranged outside has cover plate, cover plate is fixed on the top of connecting plate, and cover above cylinder rod, jointly move back and forth with cylinder rod.
3. concertina type wafer-scanning device according to claim 2, it is characterised in that: described cylinder selects double-rod cylinder.
4. concertina type wafer-scanning device according to claim 1, it is characterised in that: being provided with guard shield on described base, described straight line driving mechanism is positioned at inside guard shield.
5. a wafer-scanning system, it is characterised in that: including concertina type wafer-scanning device, the rear end of concertina type wafer-scanning device is provided with end effector, fixes on a robotic arm below concertina type wafer-scanning device.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201620115640.1U CN205376475U (en) | 2016-02-04 | 2016-02-04 | Concertina type wafer scanning device and wafer scanning system |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201620115640.1U CN205376475U (en) | 2016-02-04 | 2016-02-04 | Concertina type wafer scanning device and wafer scanning system |
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| CN205376475U true CN205376475U (en) | 2016-07-06 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105575845A (en) * | 2016-02-04 | 2016-05-11 | 北京锐洁机器人科技有限公司 | Telescopic wafer scanning device and wafer scanning system |
| CN106783683A (en) * | 2016-12-19 | 2017-05-31 | 安徽天裕汽车零部件制造有限公司 | A kind of wafer-scanning cleans swinging arm device |
-
2016
- 2016-02-04 CN CN201620115640.1U patent/CN205376475U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105575845A (en) * | 2016-02-04 | 2016-05-11 | 北京锐洁机器人科技有限公司 | Telescopic wafer scanning device and wafer scanning system |
| CN105575845B (en) * | 2016-02-04 | 2018-12-21 | 北京锐洁机器人科技有限公司 | Concertina type wafer-scanning device and wafer-scanning system |
| CN106783683A (en) * | 2016-12-19 | 2017-05-31 | 安徽天裕汽车零部件制造有限公司 | A kind of wafer-scanning cleans swinging arm device |
| CN106783683B (en) * | 2016-12-19 | 2019-08-09 | 安徽天裕汽车零部件制造有限公司 | A kind of wafer-scanning cleaning swinging arm device |
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