CN205364708U - Novel copper -clad plate - Google Patents
Novel copper -clad plate Download PDFInfo
- Publication number
- CN205364708U CN205364708U CN201620082083.8U CN201620082083U CN205364708U CN 205364708 U CN205364708 U CN 205364708U CN 201620082083 U CN201620082083 U CN 201620082083U CN 205364708 U CN205364708 U CN 205364708U
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- China
- Prior art keywords
- layer
- copper foil
- heat conduction
- sensitive adhesive
- foil layer
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Abstract
The utility model provides a novel copper -clad plate, includes copper foil layer, heat conduction pressure sensitive adhesive layer and oxidation resisting layer, the copper foil layer has two -layerly, and heat conduction pressure sensitive adhesive layer is located between the two -layer copper foil layer, and the copper foil layer passes through the adhesive mutual adhesion with heat conduction pressure sensitive adhesive layer, the heat conduction pressure sensitive adhesive mixes syntheticly by acrylic acid glue and high heat conduction powder, there are not a plurality of electric shock recesses that produce through the electric shock with the one side of heat conduction pressure sensitive adhesive layer contact on the two -layer copper foil layer, the electric shock recess be that the honeycomb formula is arranged and the closely spaced array on the copper foil layer. The utility model discloses simple structure, low in cost, quality are reliable, have high heat conductivity and thermal diffusivity, and can be anti -oxidant, have strengthened the cohesion of copper foil layer and substrate, prolong the life of copper -clad plate greatly.
Description
Technical field
This utility model relates to board substrate field, specifically a kind of novel copper-clad plate.
Background technology
Along with the high speed development of electron trade, the power of electronic product, power consumption are increasing, and the heat that unit are produces is more and more higher, and the heat dissipation problem of electronic product directly affects the performance and used life of electronic product, especially LED product.Along with LED technology develops, the range of application of product is increasingly wider, and its power consumption and caloric value also improve therewith, and LED product face shaping is also required that have multiformity, and the requirement of the basic material of printed circuit board is also more and more higher.
Utility model content
This utility model aims to provide a kind of novel copper-clad plate.
For achieving the above object, this utility model provides following technical scheme: a kind of novel copper-clad plate, and including copper foil layer, heat conduction pressure-sensitive adhesive layer and anti oxidation layer, described copper foil layer has two-layer, heat conduction pressure-sensitive adhesive layer is between two-layer copper foil layer, and copper foil layer is bonded by binding agent mutually with heat conduction pressure-sensitive adhesive layer；Described heat conduction pressure sensitive adhesive is mixed synthesis by acrylic acid glue with high conductive powder；The one side not contacted with heat conduction pressure-sensitive adhesive layer on described two-layer copper foil layer has some by the electric shock groove produced that shocks by electricity, described electric shock groove be honeycomb fashion arrangement and closely spaced array on copper foil layer, make product adhesion strengthen to some extent, under the high voltage of electronic circuit, heavy current effect, have higher adhesion than mill run.
The thickness of described copper foil layer is 12～50um, and the thickness of described heat conduction pressure-sensitive adhesive layer is 30～120um.
Described sealing strip is detachable strip of paper used for sealing, and described high conductive powder can be selected for aluminium oxide, zinc oxide, magnesium oxide, aluminium nitride, boron nitride etc..
The one side not contacted with heat conduction pressure-sensitive adhesive layer on described two-layer copper foil layer is additionally provided with anti oxidation layer.
Compared with prior art, the beneficial effects of the utility model are:
1, two sides all adopts Copper Foil, heat conductivity is identical, the problem that in use will not cause seesaw, deformation, and owing to copper foil layer and heat conduction pressure-sensitive adhesive layer are all flexibility, making double face copper deflection of the present utility model is weblike material, and client can be tailored into various length and structure as required and be applied in LED product, it is possible to volume to volume exposure, development, etching form circuit, improve production efficiency, reduce cost.
2, heat conduction pressure-sensitive adhesive layer is mixed synthesis by acrylic acid glue with high conductive powder, there is the strongly adherent feature of high heat conduction, its heat conductivility is higher than common high-heat-conductivity glue tens times, and it is applied in the Heat Conduction Material preparation of electronic applications, reasonable in design, have wide range of applications, there is splendid market-oriented prospect.
3, the electric shock groove on copper foil layer improves area of dissipation, enhances the adhesion between electrodeposited copper foil layer and base material PP sheet, and peel strength has had better improvement, is also greatly improved the heat dispersion of copper-clad plate simultaneously.
4, the one side not contacted with heat conduction pressure-sensitive adhesive layer on two-layer copper foil layer is provided with anti oxidation layer, accordingly even when from being worked into the time using interval many again, anti oxidation layer can make the upper and lower surface of Copper Foil not easily oxidized, thus ensureing the normal result of use of copper-clad plate.
Accompanying drawing explanation
Fig. 1 is front view of the present utility model；
Fig. 2 is cross-sectional view of the present utility model.
Shown in figure: 1, heat conduction pressure-sensitive adhesive layer, 2, copper foil layer, 3, anti oxidation layer, 4, electric shock groove.
Detailed description of the invention
Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is clearly and completely described, it is clear that described embodiment is only a part of embodiment of this utility model, rather than whole embodiments.Based on the embodiment in this utility model, the every other embodiment that those of ordinary skill in the art obtain under not making creative work premise, broadly fall into the scope of this utility model protection.
Refer to Fig. 1-2, in this utility model embodiment, a kind of novel copper-clad plate, including copper foil layer 2, heat conduction pressure-sensitive adhesive layer 1 and anti oxidation layer 3, described copper foil layer 2 has two-layer, and heat conduction pressure-sensitive adhesive layer 1 is between two-layer copper foil layer 2, and copper foil layer 2 is bonded by binding agent mutually with heat conduction pressure-sensitive adhesive layer 1；The thickness of described copper foil layer 2 is 12～50um, and the thickness of described heat conduction pressure-sensitive adhesive layer 1 is 30～120um.Two sides all adopts Copper Foil, heat conductivity is identical, the problem that in use will not cause seesaw, deformation, and owing to copper foil layer 2 and heat conduction pressure-sensitive adhesive layer 1 are all flexibility, making double face copper deflection of the present utility model is weblike material, and client can be tailored into various length and structure as required and be applied in LED product, it is possible to volume to volume exposure, development, etching form circuit, improve production efficiency, reduce cost.
Described heat conduction pressure-sensitive adhesive layer 1 is mixed synthesis by acrylic acid glue with high conductive powder, there is the strongly adherent feature of high heat conduction, adhesion and heat conductivility between its PP sheet are higher than common high-heat-conductivity glue tens times, and it is applied in the Heat Conduction Material preparation of electronic applications, reasonable in design, have wide range of applications, there is splendid market-oriented prospect.High conductive powder can be selected for aluminium oxide, zinc oxide, magnesium oxide, aluminium nitride, boron nitride etc..
The one side not contacted with heat conduction pressure-sensitive adhesive layer 1 on described two-layer copper foil layer 2 has some by the electric shock groove 4 produced that shocks by electricity, and described electric shock groove 4 arranges in honeycomb fashion and closely spaced array is on copper foil layer 2.Electric shock groove 4 on copper foil layer 2 improves area of dissipation, is greatly improved the heat dispersion of copper-clad plate.
The one side not contacted with heat conduction pressure-sensitive adhesive layer 1 on described two-layer copper foil layer 2 is additionally provided with anti oxidation layer 3, accordingly even when from being worked into the time using interval many again, anti oxidation layer 3 can make the upper and lower surface of Copper Foil not easily oxidized, thus ensureing the normal result of use of copper-clad plate.
Claims (3)
1. a novel copper-clad plate, including copper foil layer, heat conduction pressure-sensitive adhesive layer and anti oxidation layer, it is characterised in that described copper foil layer has two-layer, and heat conduction pressure-sensitive adhesive layer is between two-layer copper foil layer, and copper foil layer is bonded by binding agent mutually with heat conduction pressure-sensitive adhesive layer；The one side not contacted with heat conduction pressure-sensitive adhesive layer on described two-layer copper foil layer have some by shock by electricity produce electric shock groove, described electric shock groove be honeycomb fashion arrange and closely spaced array on copper foil layer.
2. a kind of novel copper-clad plate according to claim 1, it is characterised in that the thickness of described copper foil layer is 12～50um, and the thickness of described heat conduction pressure-sensitive adhesive layer is 30～120um.
3. a kind of novel copper-clad plate according to claim 1, it is characterised in that the one side not contacted with heat conduction pressure-sensitive adhesive layer on described two-layer copper foil layer is additionally provided with anti oxidation layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620082083.8U CN205364708U (en) | 2016-01-26 | 2016-01-26 | Novel copper -clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620082083.8U CN205364708U (en) | 2016-01-26 | 2016-01-26 | Novel copper -clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205364708U true CN205364708U (en) | 2016-07-06 |
Family
ID=56269527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620082083.8U Expired - Fee Related CN205364708U (en) | 2016-01-26 | 2016-01-26 | Novel copper -clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205364708U (en) |
-
2016
- 2016-01-26 CN CN201620082083.8U patent/CN205364708U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160706 Termination date: 20170126 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |