CN205354053U - Fingerprint detection module and electronic equipment - Google Patents
Fingerprint detection module and electronic equipment Download PDFInfo
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- CN205354053U CN205354053U CN201520984731.4U CN201520984731U CN205354053U CN 205354053 U CN205354053 U CN 205354053U CN 201520984731 U CN201520984731 U CN 201520984731U CN 205354053 U CN205354053 U CN 205354053U
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- fingerprint detection
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Abstract
The utility model provides a fingerprint detection module and electronic equipment, the fingerprint detection module includes: base plate, setting are in the base plate is with the fingerprint detection sensor of one side and fingerprint detection circuit, cover the protective layer of fingerprint detection sensor. Fingerprint detection module simple structure, the cost of manufacture is low.
Description
Technical field
This utility model relates to fingerprinting detection technique field, more particularly, it relates to a kind of fingerprint detection module and electronic equipment.
Background technology
The fields such as in existing life, fingerprint detection has been widely used and life at present, medical treatment, industry.Along with the high speed development in epoch, the market competition is further fierce；The fingerprint detection module of exploitation new construction, it is possible to optimized Structure Design space, better meets customer demand, strengthens enterprise competitiveness.
Owing to the structure of traditional fingerprint detection module is complicated, cause that cost of manufacture is high.Therefore, optimize the structural design space of fingerprint detection module, can be the main flow in epoch.
Utility model content
For solving the problems referred to above, this utility model provides a kind of fingerprint detection module and electronic equipment, reduces the cost of fingerprint detection module.
To achieve these goals, this utility model provides following technical scheme:
A kind of fingerprint detection module, this fingerprint detection module includes:
Substrate；
It is arranged on fingerprint detection sensor and the fingerprint detection circuit of described substrate the same side；
Cover the protective layer of described fingerprint detection sensor；
Wherein, described fingerprint detection sensor is electrically connected with described fingerprint detection circuit.
Preferably, in above-mentioned fingerprint detection module, described fingerprint detection sensor and described fingerprint detection circuit at same layer or described fingerprint detection sensor between described fingerprint detection circuit and described substrate.
Preferably, in above-mentioned fingerprint detection module, also include: becket；
Described substrate, described fingerprint detection sensor, described fingerprint detection circuit and described protective layer constitute an integral packaging structure.
Wherein, described becket is fixed on described substrate surface；Described becket surrounds described integral packaging structure；Described becket inner surface is provided with the groove for fixing described integral packaging structure.
Preferably, in above-mentioned fingerprint detection module, the bottom of described becket is provided with the base for stablizing described becket.
Preferably, in above-mentioned fingerprint detection module, also include: flexible circuit board and fingerprint detection module protection element；
Wherein, described fingerprint detection module protection element is connected with described integral packaging structure by flexible circuit board；Described fingerprint detection module protection element and described integral packaging structure are positioned at the same surface of described flexible circuit board.
Preferably, in above-mentioned fingerprint detection module, described substrate is glass plate or sapphire plate or ceramic wafer.
Preferably, in above-mentioned fingerprint detection module, described fingerprint sensor includes: fingerprint detection electrode；
Wherein, described fingerprint detection electrode is transparent conductor or nontransparent conducting objects.
Preferably, in above-mentioned fingerprint detection module, described protective layer is epoxy resin layer or layer of silica gel.
This utility model additionally provides a kind of electronic equipment, and this electronic equipment includes: the fingerprint detection module described in any of the above-described item.
By foregoing description it can be seen that the fingerprint detection module that this utility model provides includes: substrate；It is arranged on fingerprint detection sensor and the fingerprint detection circuit of described substrate the same side；Cover described fingerprint detection sensor protection layer.Described fingerprint detection modular structure is simple, and cost of manufacture is low.
Accompanying drawing explanation
In order to be illustrated more clearly that this utility model embodiment or technical scheme of the prior art, the accompanying drawing used required in embodiment or description of the prior art will be briefly described below, apparently, accompanying drawing in the following describes is only embodiment of the present utility model, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to the accompanying drawing provided.
The structural representation of a kind of fingerprint detection module that Fig. 1 provides for the embodiment of the present application；
The structural representation of the another kind of fingerprint detection module that Fig. 1 a provides for the embodiment of the present application；
The structural representation of another fingerprint detection module that Fig. 1 b provides for the embodiment of the present application；
The structural representation of another fingerprint detection module that Fig. 2 provides for the embodiment of the present application；
The schematic flow sheet of a kind of manufacture method that Fig. 3 provides for the embodiment of the present application.
Detailed description of the invention
Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is clearly and completely described, it is clear that described embodiment is only a part of embodiment of this utility model, rather than whole embodiments.Based on the embodiment in this utility model, the every other embodiment that those of ordinary skill in the art obtain under not making creative work premise, broadly fall into the scope of this utility model protection.
As described in the background art, the structure of traditional fingerprint detection module is complicated, causes that cost of manufacture is high.In order to solve this problem, the embodiment of the present application provides a kind of fingerprint detection module, and this fingerprint detection module can realize fingerprint detection and the simple in construction of this fingerprint detection module, and cost of manufacture is low.
With reference to the structural representation of a kind of fingerprint detection module that Fig. 1, Fig. 1 provide for the embodiment of the present application, this fingerprint detection module includes: substrate 11；It is arranged on fingerprint detection sensor 12 and the fingerprint detection circuit 15 of described substrate 11 the same side；Cover the protective layer 14 of described fingerprint detection sensor 12.
When carrying out touch operation, described fingerprint detection sensor 12 can touch by sensing finger, generates the detection signal for detecting fingerprint, is used for realizing fingerprint detection.
This fingerprint detection module includes substrate 11, fingerprint detection sensor 12 and fingerprint detection circuit 15, protective layer 14 are constituted, and simple in construction, cost of manufacture is low.
Fingerprint detection module described in the embodiment of the present application can also include: ink layer 13.
Wherein, described ink layer 13 can be white, black, colour etc..Described ink layer 13 can be one layer or N shell, and N is positive integer, and N≤100.Described ink layer 13 transparency can from 0%～100%.Described ink layer 13 thickness range is 0.1um～100um.Described ink layer 13 can adopt the processes such as silk-screen, intaglio plate, relief printing plate, bat printing, evaporation, physical vapour deposition (PVD), plating, sputter to make.Described ink layer 13 covers substrate area can from 0%～100%.Preferably, the transparency arranging described ink layer 13 is 0, and now ink layer 13 is as barrier bed, blocks the fingerprint detection sensor 12 of lower section, it is ensured that the concordance of appearance color.
In fingerprint detection module shown in Fig. 1, described fingerprint detection sensor 12 is between described fingerprint detection circuit 15 and described substrate 11, and the area of the fingerprint detection module of this embodiment is less.
With reference to Fig. 1 a, the structural representation of the another kind of fingerprint detection module that Fig. 1 a provides for the embodiment of the present application, in this fingerprint detection module, described fingerprint detection sensor 12 is positioned at same layer with described fingerprint detection circuit 15, the thinner thickness of the fingerprint detection module of this embodiment.
With reference to the structural representation of Fig. 1 b, Fig. 1 b another fingerprint detection module provided for the embodiment of the present application, in this fingerprint detection module, described fingerprint detection circuit 15 is between described fingerprint detection sensor 12 and described substrate 11.
General, fingerprint detection circuit 15 is integrated chip, and area is less relative to the area of fingerprint detection sensor 12, therefore needs to arrange implant 16 in this embodiment between cover plate 11 and fingerprint sensor 12, it is ensured that planarization, in order to laminating fingerprint sensor 12.
With reference to the structural representation of another fingerprint detection module that Fig. 2, Fig. 2 provide for the embodiment of the present application, fingerprint detection module described in Fig. 2 farther includes on the basis of fingerprint detection module shown in Fig. 1: becket 22.
In the exemplary embodiment illustrated in fig. 2, aforesaid substrate 11, fingerprint detection sensor 12, fingerprint detection circuit 15 and protective layer 14 integral packaging, constitute an integral packaging structure 21.This integral packaging structure 21 can include above-mentioned ink layer 13.
Wherein, described becket 22 surrounds described integral packaging structure 21.Described becket 22 inner surface is provided with the groove 25 for fixing described integral packaging structure 21.Described becket 22 is for strengthening induced signal intensity during fingerprint detection so that it is fingerprint detection is more accurate.
Also include at becket 22 described in fingerprint detection module described in the embodiment of the present application: base 26.
Fingerprint detection module described in the embodiment of the present application also includes: flexible circuit board 23 and fingerprint detection module protection element 24.The bottom of described becket 22 is provided with the base 26 for stablizing described becket 22.Described base 26 is for increasing the contact area of described becket 22 and described flexible circuit board 23, to increase bonding stability therebetween.Described flexible circuit board 23 connects described fingerprint detection module protection element 24 and described integral packaging structure 21.Described fingerprint detection module protection element 24 and described integral packaging structure 21 are positioned at the same surface of described flexible circuit board 23.
Wherein, described fingerprint detection module protection element 24 includes: protection electric capacity, protective resistance etc..Described fingerprint detection module protection element 24 is for current limliting and voltage-limiting protection, it is prevented that the damage of described integral packaging structure 21.
In this fingerprint detection module, described substrate 11 can be glass plate, sapphire plate, ceramic wafer etc..Described substrate 11 material requested is low relative to wafer cost.Described substrate 11 thickness range is 0.01mm～2.0mm.Described substrate 11 is for protecting fingerprint detection sensor 12 and the carrier as layers below.
Include at fingerprint detection sensor 12 described in fingerprint detection module described in the embodiment of the present application: fingerprint detection electrode.Described fingerprint detection electrode is transparent conductor or nontransparent conducting objects.Described conducting objects can be metal, development, conducting polymer etc..Described fingerprint detection electrode can use the processes such as silk-screen, gold-tinted, intaglio plate, relief printing plate, bat printing to make.
In this fingerprint detection module, described protective layer 14 can be epoxy resin layer, layer of silica gel etc..Described protective layer 14 can use the process such as injection moulding, spraying to make.Described protective layer 14 fingerprint detection sensor 12 described in packaging protection, has moistureproof anti-oxidation function preferably.
In sum, described in the embodiment of the present application, fingerprint detection module has simple in construction, the feature that cost of manufacture is low.
Based on above-mentioned fingerprint detection module embodiment, the embodiment of the present application additionally provides a kind of manufacture method, is used for making above-mentioned fingerprint detection module, and this manufacture method can be as shown in Figure 3.
With reference to the schematic flow sheet of a kind of manufacture method that Fig. 3, Fig. 3 provide for the embodiment of the present application, including:
Step S11 a: substrate is provided.
Described substrate 11 can be glass plate, sapphire plate, ceramic wafer etc.；Described substrate 11 thickness range is 0.01mm～2.0mm.
Step S12: form fingerprint detection sensor and fingerprint detection circuit at described substrate surface；
Described fingerprint detection sensor 12 includes: fingerprint detection electrode.Wherein, fingerprint detection electrode is transparent conductor or nontransparent conducting objects.Described conducting objects can be metal, development, conducting polymer etc..Described fingerprint detection electrode can use the processes such as silk-screen, gold-tinted, intaglio plate, relief printing plate, bat printing to make.Described fingerprint detection circuit 15 is integrated circuit.
Step S13: form protective layer at described fingerprint detection sensor surface, described protective layer covers described fingerprint detection sensor.
Described protective layer 14 can be epoxy resin layer, layer of silica gel etc..Described protective layer 14 can use the process such as injection moulding, spraying to make.
By foregoing description it can be seen that described manufacture method can make the fingerprint detection module described in above-described embodiment, and technique is simple, and cost is low.
Based on above-mentioned fingerprint detection module embodiment, the embodiment of the present application additionally provides a kind of electronic equipment, and this electronic equipment has above-mentioned fingerprint detection module, simple in construction.
This electronic equipment includes mobile phone, Fingerprint Identification Unit, computer etc..Described electronic equipment has display screen, and described display screen includes viewing area and surrounds the rim area of described viewing area.Described fingerprint detection module can be arranged on described rim area.Described other structures of display module are blocked, it is ensured that electronic equipment has the outward appearance of setting by described ink layer.
Described above to the disclosed embodiments, makes professional and technical personnel in the field be capable of or uses this utility model.The multiple amendment of these embodiments be will be apparent from for those skilled in the art, and generic principles defined herein when without departing from spirit or scope of the present utility model, can realize in other embodiments.Therefore, this utility model is not intended to be limited to the embodiments shown herein, and is to fit to the widest scope consistent with principles disclosed herein and features of novelty.
Claims (9)
1. a fingerprint detection module, it is characterised in that including:
Substrate；
It is arranged on fingerprint detection sensor and the fingerprint detection circuit of described substrate the same side；
Cover the protective layer of described fingerprint detection sensor；
Wherein, described fingerprint detection sensor is electrically connected with described fingerprint detection circuit.
2. fingerprint detection module according to claim 1, it is characterised in that described fingerprint detection sensor and described fingerprint detection circuit at same layer or described fingerprint detection sensor between described fingerprint detection circuit and described substrate.
3. fingerprint detection module according to claim 1, it is characterised in that also include: becket；
Described substrate, described fingerprint detection sensor, described fingerprint detection circuit and described protective layer constitute an integral packaging structure；
Wherein, described becket surrounds described integral packaging structure；Described becket inner surface is provided with the groove for fixing described integral packaging structure.
4. fingerprint detection module according to claim 3, it is characterised in that the bottom of described becket is provided with the base for stablizing described becket.
5. fingerprint detection module according to claim 3, it is characterised in that also include: flexible circuit board and fingerprint detection module protection element；
Wherein, described fingerprint detection module protection element is connected with described integral packaging structure by flexible circuit board；Described fingerprint detection module protection element and described integral packaging structure are positioned at the same surface of described flexible circuit board.
6. fingerprint detection module according to claim 1, it is characterised in that described substrate is glass plate or sapphire plate or ceramic wafer.
7. fingerprint detection module according to claim 1, it is characterised in that described fingerprint sensor includes: fingerprint detection electrode；
Wherein, described fingerprint detection electrode is transparent conductor or nontransparent conducting objects.
8. fingerprint detection module according to claim 1, it is characterised in that described protective layer is epoxy resin layer or layer of silica gel.
9. an electronic equipment, it is characterised in that including: the fingerprint detection module as described in any one of claim 1-8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520984731.4U CN205354053U (en) | 2015-11-30 | 2015-11-30 | Fingerprint detection module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520984731.4U CN205354053U (en) | 2015-11-30 | 2015-11-30 | Fingerprint detection module and electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| CN205354053U true CN205354053U (en) | 2016-06-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520984731.4U Active CN205354053U (en) | 2015-11-30 | 2015-11-30 | Fingerprint detection module and electronic equipment |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105488474A (en) * | 2015-11-30 | 2016-04-13 | 信利光电股份有限公司 | Fingerprint detection module, manufacturing method thereof and electronic device |
| CN106845422A (en) * | 2017-01-22 | 2017-06-13 | 广东欧珀移动通信有限公司 | A kind of fingerprint recognition module, fingerprint identification method and mobile terminal |
-
2015
- 2015-11-30 CN CN201520984731.4U patent/CN205354053U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105488474A (en) * | 2015-11-30 | 2016-04-13 | 信利光电股份有限公司 | Fingerprint detection module, manufacturing method thereof and electronic device |
| CN106845422A (en) * | 2017-01-22 | 2017-06-13 | 广东欧珀移动通信有限公司 | A kind of fingerprint recognition module, fingerprint identification method and mobile terminal |
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| C14 | Grant of patent or utility model | ||
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Effective date of registration: 20210819 Address after: 516600 floor 1, building 23, Xinli industrial city, Industrial Avenue, urban area, Shanwei City, Guangdong Province Patentee after: Xinli photoelectric technology (Shanwei) Co., Ltd Address before: 516600 building 15, Xinli industrial city, Industrial Avenue, Shanwei City, Guangdong Province Patentee before: TRULY OPTO-ELECTRONICS Ltd. |