CN205343490U - Many line cutting device of curved surface of sapphire - Google Patents
Many line cutting device of curved surface of sapphire Download PDFInfo
- Publication number
- CN205343490U CN205343490U CN201521051306.6U CN201521051306U CN205343490U CN 205343490 U CN205343490 U CN 205343490U CN 201521051306 U CN201521051306 U CN 201521051306U CN 205343490 U CN205343490 U CN 205343490U
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- sapphire
- wiring roller
- curved surface
- workbench
- crystal block
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Abstract
The utility model provides a many line cutting device of curved surface of sapphire. It is including being fixed with the workstation of wabbler mechanism, multi -thread cutting wiring roller and setting up the diamond cutting line on multi -thread cutting wiring roller, and the sapphire crystal block is fixed on the workstation, and program element is connected to workstation, multi -thread cutting wiring roller, and multi -thread cutting wiring roller can be followed Y axle direction and is made a round trip to be by a small margin linear motion under program element program control, and the workstation drives the sapphire crystal block and is swinging in certain amplitude range. The utility model discloses can overcome shortcomings such as traditional sapphire material curved surface processing technology degree of difficulty is big, the yield low, material loss is big, adopt the many line cutting device of modified directly once only to be cut into the wafers that hundreds of pieces have the bend plane with the crystal block, can effectively improve wafer machining efficiency, reduce required allowance, reduce cost.
Description
(1) technical field
This utility model relates to a kind of surface incising technology, is specifically related to a kind of sapphire curved surface multi-wire saw technology.
(2) background technology
Sapphire single-crystal has the combination property that mechanics, optics etc. are excellent, is commonly used for the substrate of LED epitaxial growth of semiconductor material at present.Sapphire production cost constantly reduces, and makes sapphire widespread adoption in consumer electronics and other consumer product be possibly realized, and wherein, curved surface sapphire screen is also one of direction of future development.
But, sapphire hardness is high, and is hard brittle material under room temperature, and Machining of Curved Surface is more difficult in technology controlling and process, and yield rate is low.According to being first cut into sapphire crystal block, it is reprocessed into the process route of bender element, then not only long processing time, and spillage of material is relatively big, has a strong impact on the manufacturing cost of product.
Multi-wire saw is efficient method for cutting chip conventional at present, it is possible to once cut into hundreds of sheet, and working (machining) efficiency is high, and product surface quality is good, advantage of lower cost.But the common operation principle of common multi-line cutting machine is；Workbench moves downward, and drives workpiece to move gradually downward, and wiring roller swings by a small margin along direction of routing, to realize the cutting of wafer.But due to the restriction of motion mode, common multi-line cutting machine but cannot complete the cutting of curved wafer.
(3) summary of the invention
The purpose of this utility model is in that to provide one can overcome the tradition shortcomings such as sapphire material Machining of Curved Surface technology difficulty is big, yield rate is low, spillage of material is big, the multi-wire saw equipment improved is adopted directly to be cut into the hundreds of wafers with flexure plane by disposable for crystal block, wafer working (machining) efficiency can be effectively improved, reduce required allowance, reduce the sapphire curved surface Multi-wire cutting device of cost.
The purpose of this utility model is achieved in that it includes being fixed with the workbench of wabbler mechanism 3, multi-wire saw wiring roller 1 and the diamond cutting secant 2 being arranged on multi-wire saw wiring roller 1, sapphire crystal block 4 is fixing on the table, workbench, multi-wire saw wiring roller linker unit, under program unit programme-control, multi-wire saw wiring roller 1 can do rectilinear motion by a small margin back and forth along Y direction, and workbench 3 drives sapphire crystal block 4 to swing within the scope of certain amplitude.
This utility model also has so some features:
1, described workbench pendulum angle is 0 ~ 7.
This utility model cuts curved surface for right side, diamond cutting secant contacts along ab direction with sapphire crystal block, while workbench moves downward, follow procedure sets, and multi-wire saw wiring roller moves in the Y-axis direction, and wabbler mechanism swings along diamond cutting secant direction, diamond cutting secant is by b, through d, e, most Zhongdao c completes the cutting of whole workpiece, forms sapphire curved surface.When cutting cambered surface bd section and ec section, workbench does not swing, during cutting planes de section, it is provided that program unit programme-control, workbench swings.Multi-wire saw wiring roller 1 can do rectilinear motion by a small margin back and forth along Y direction, and workbench 3 drives sapphire crystal block 4 to swing (in θ swing angle) within the scope of certain amplitude, to accelerate sapphire cutting speed.
Concrete cutting process is: adopt the diamond wire multi-wire cutting equipment improved so that it is can realize bidirectional-movement, and namely on the basis that workbench can move up and down, wiring roller can realize front and back walking.It addition, for improving cutting efficiency, improve cut quality, sizing workbench adds supersonic vibration and oscillating function.In the course of processing, during cutting arc face portion, workbench keeps level, does not swing, and during cutting planes part, workbench swings along line of cut direction.
The beneficial effects of the utility model have:
1. workbench increases high frequency ultrasound vibration and oscillating function, can improve cutting speed, and then improve cutting efficiency.
2. adopt the diamond cutting secant improved can realize the cutting of arc wafer, be greatly improved working (machining) efficiency, reduce material unaccounted-for (MUF).
(4) accompanying drawing explanation
Fig. 1 is this utility model structural representation；
Fig. 2 is embodiment operation chart.
(5) detailed description of the invention
Below in conjunction with accompanying drawing, this utility model is described in detail.
In conjunction with Fig. 1, the present embodiment includes the diamond cutting secant 2 being fixed with the workbench 3 of wabbler mechanism, multi-wire saw wiring roller 1 and being arranged on multi-wire saw wiring roller 1, sapphire is brilliant, and 4 fix on the table, workbench, multi-wire saw wiring roller linker unit.Multi-wire saw wiring roller 1 can do rectilinear motion by a small margin back and forth along Y direction, and workbench 3 drives sapphire crystal block 4 to swing (in θ angle) within the scope of certain amplitude, to accelerate the cutting speed of sapphire crystal block.During operation, sapphire crystal block is fixed on the workbench with wabbler mechanism, and determines the relative position of workbench and multi-wire saw wiring roller；2) workbench moves gradually downward and contacts with sapphire crystal block；3) according to required cutting curve form, programme-control multi-wire saw connect up roller and move in the Y direction and the duration of oscillation of wabbler mechanism and amplitude of fluctuation, ultimately form sapphire curved surface.Described workbench supersonic vibration frequency is 17000 ~ 23000Hz.Multi-wire saw wiring roller can be walked 0 ~ 5mm before and after Y-axis.In surface incising process, during cutting planes part, workbench pendulum angle is 0 ~ 7；Diamond cutting secant wire diameter 0.2 ~ 0.5mm, Trace speed 600 ~ 1500m/min during cutting, feed-speed 0.1 ~ 0.5mm/min during cutting arc face portion, feed-speed 0.2 ~ 0.8mm/min during cutting planes part.
In conjunction with Fig. 2, the concrete cutting process of the present embodiment is: 1) be fixed on workbench 3 by sapphire crystal block 4, and determines the relative position of workbench and multi-wire saw wiring roller；2) workbench moves gradually downward and contacts with sapphire crystal block；3) according to required cutting curve form, programme-control multi-wire saw connect up roller and move in the Y direction and the duration of oscillation of wabbler mechanism and amplitude of fluctuation, ultimately form sapphire curved surface.Right side cutting curved surface in Fig. 2, diamond cutting secant contacts along ab direction with sapphire crystal block, while workbench moves downward, follow procedure sets, and roller moves in the Y-axis direction, and wabbler mechanism swings along diamond wire direction, diamond cutting secant is by b, through d, e, most Zhongdao c completes the cutting of whole workpiece, forms sapphire curved surface.When cutting cambered surface bd section and ec section, workbench does not swing, and during cutting planes de section, workbench swings.
This utility model set forth sapphire curved surface Multi-wire cutting device, on idea basis of the present utility model, all can pass through similar means obtain sapphire flexure plane purpose fall within protection domain of the present utility model.
Claims (2)
1. a sapphire curved surface Multi-wire cutting device, it is characterized in that it includes being fixed with the workbench of wabbler mechanism, multi-wire saw wiring roller and the diamond cutting secant being arranged on multi-wire saw wiring roller, sapphire crystal block is fixing on the table, workbench, multi-wire saw wiring roller linker unit, under program unit programme-control, multi-wire saw wiring roller can do rectilinear motion by a small margin back and forth along Y direction, and workbench drives sapphire crystal block to swing within the scope of certain amplitude.
2. the sapphire curved surface Multi-wire cutting device of one according to claim 1, it is characterised in that described workbench pendulum angle is 0 ~ 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521051306.6U CN205343490U (en) | 2015-12-16 | 2015-12-16 | Many line cutting device of curved surface of sapphire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521051306.6U CN205343490U (en) | 2015-12-16 | 2015-12-16 | Many line cutting device of curved surface of sapphire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205343490U true CN205343490U (en) | 2016-06-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521051306.6U Active CN205343490U (en) | 2015-12-16 | 2015-12-16 | Many line cutting device of curved surface of sapphire |
Country Status (1)
| Country | Link |
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| CN (1) | CN205343490U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106985296A (en) * | 2017-04-07 | 2017-07-28 | 苏州赫瑞特电子专用设备科技有限公司 | A kind of multi-line cutting machine waves table mechanism |
| CN108406458A (en) * | 2018-02-27 | 2018-08-17 | 成都青洋电子材料有限公司 | A kind of monocrystalline silicon piece production system and its production technology |
| CN110370481A (en) * | 2019-08-20 | 2019-10-25 | 玉田县昌通电子有限公司 | Five roller scroll saw machining centers of one kind and its operating method |
-
2015
- 2015-12-16 CN CN201521051306.6U patent/CN205343490U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106985296A (en) * | 2017-04-07 | 2017-07-28 | 苏州赫瑞特电子专用设备科技有限公司 | A kind of multi-line cutting machine waves table mechanism |
| CN106985296B (en) * | 2017-04-07 | 2019-04-05 | 苏州赫瑞特电子专用设备科技有限公司 | A kind of multi-line cutting machine waves table mechanism |
| CN108406458A (en) * | 2018-02-27 | 2018-08-17 | 成都青洋电子材料有限公司 | A kind of monocrystalline silicon piece production system and its production technology |
| CN110370481A (en) * | 2019-08-20 | 2019-10-25 | 玉田县昌通电子有限公司 | Five roller scroll saw machining centers of one kind and its operating method |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |