CN205310954U - Copper -clad plate of heat -resisting high peel strength paper base - Google Patents
Copper -clad plate of heat -resisting high peel strength paper base Download PDFInfo
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- CN205310954U CN205310954U CN201521060550.9U CN201521060550U CN205310954U CN 205310954 U CN205310954 U CN 205310954U CN 201521060550 U CN201521060550 U CN 201521060550U CN 205310954 U CN205310954 U CN 205310954U
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- Prior art keywords
- copper
- refill
- paper
- clad plate
- heat
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Abstract
The utility model discloses a copper -clad plate of heat -resisting high peel strength paper base has refill and rubber coating copper foil, this refill comprises a plurality of layers of range upon range of complex of gumming wood pulp paper, and this gumming wood pulp paper flooding has cardanol modified phenolic resin, rubber coating copper foil complex scribbles the modified barium phenol -formaldehyde resin adhesive layer of melamine on the composite surface of this rubber coating copper foil on the upper surface of refill. This novel paper base copper -clad plate has not only improved the heat resistance and the panel wet skid resistance of copper -clad plate, but also has improved the peel strength and the peel strength's of copper -clad plate homogeneity for in the slim copper foil paper base copper -clad plate production, better economic benefits has been gained.
Description
Technical field
This utility model relates to circuit substrate field, specifically refers to a kind of heat-resisting high-peeling strength paper-based copper-coated board.
Background technology
Paper-based copper-coated board has purposes widely in electronic product. In paper-based copper-coated board manufactures, mainly making product obtain good punching, the technology producing paper-based copper-coated board with tung oil modified phenolic resin, epoxy soybean oil modified phenolic resin reaches its maturity, and obtains a wide range of applications. But adopting the copper-clad plate punching that conventional art produces not good, bow warping is big, and resistance to dip solderability undesirable, thermostability, tear resistance there is also deficiency. Copper-clad plate production Copper Foil is developing to slimming direction, and tradition paper-based copper-coated board Copper Foil is based on 35um thickness, and current 18um thickness Copper Foil is occupied an leading position. 15um, 13um thickness Copper Foil increases year by year in the usage ratio of paper-based copper-coated board in recent years. Along with the minimizing of copper thickness, the roughened layer thickness of adhesive surface is also reducing, and the peel strength of product is affected, in electronic product assembling process, it is easy to copper sheet obscission occurring, causes product rejection, economic loss is serious. How to improve thin copper foil or the peel strength of extra thin copper foil paper-based copper-coated board, improve the reliability of electronic product, be paper-based copper-coated board production firm concern.
Utility model content
The purpose of this utility model is in that to provide a kind of heat-resisting high-peeling strength paper-based copper-coated board, not only improve thermostability and the sheet material tear resistance of copper-clad plate, but also improve the peel strength of copper-clad plate and the uniformity of peel strength, in producing for slim Copper Foil paper-based copper-coated board, achieve good economic benefit.
In order to reach above-mentioned purpose, solution of the present utility model is:
A kind of heat-resisting high-peeling strength paper-based copper-coated board, has refill and adhesive coated foil; This refill is made up of the folded compound of some layers of impregnation wood pulp ply of paper, and this impregnation wood pulp paper is impregnated with Cardanol Modified PF Resin; Adhesive coated foil is compound on the upper surface of refill, and the composite surface of this adhesive coated foil scribbles cyanurotriamide modified ba phenolic resin glue-line.
Described refill is made up of eight wood pulp paper stacking compounds being impregnated with Cardanol Modified PF Resin.
The thickness of described adhesive coated foil is 10-40um.
After adopting such scheme, this heat resistance high-peeling strength paper-based copper-coated board, the impregnation wood pulp paper of refill adopts Cardanol Modified PF Resin dipping, and the refill made has good toughness and thermostability, in this thermostability substantially improving copper-clad plate and sheet material tear resistance.Have again, cyanurotriamide modified ba phenolic resin glue-line is adopted to bind between Copper Foil and refill, cyanurotriamide modified ba phenolic resin crosslink density is high, highly polar group is many, it is remarkably improved thermostability and the adhesion strength of resin, in electronic product assembling process, it is not easy that the defects such as layering, foaming, Copper Foil come off occur, also improve adhesion strength, improve the peel strength of Copper Foil and improve the uniformity of peel strength, in producing for slim Copper Foil paper-based copper-coated board, achieve good economic benefit.
Accompanying drawing explanation
Fig. 1 is the Rotating fields schematic diagram of this heat resistance high-peeling strength paper-based copper-coated board.
Label declaration
Refill 1 impregnation wood pulp paper 11
Cardanol Modified PF Resin 12 adhesive coated foil 2.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, this case is described in further detail.
This case relates to a kind of heat-resisting high-peeling strength paper-based copper-coated board, as it is shown in figure 1, have refill 1 and adhesive coated foil 2.
Refill 1 is made up of some layers of impregnation wood pulp paper 11 stacking compound, and this impregnation wood pulp paper 11 is impregnated with Cardanol Modified PF Resin 12. Providing in preferred embodiment, impregnation wood pulp paper 11 is folded is provided with eight, and namely refill 1 is made up of eight wood pulp paper stacking compounds being impregnated with Cardanol Modified PF Resin 12. During impregnation wood pulp paper 11 makes, adopt indicated weight 130-140g/m2Wood pulp paper, soak with the resin liquid of Cardanol Modified PF Resin 12, drying makes the impregnation material of resin content nearly half (44%-46%).
Further, impregnation wood pulp paper 11 is also impregnated with the small-molecular-weight thermosetting phenolic resin by ammonia-catalyzed, and specifically, a kind of mode is, is impregnated with Cardanol Modified PF Resin 12 and small-molecular-weight thermosetting phenolic resin by whole for every layer of impregnation wood pulp paper 11; Impregnation wood pulp paper 11 is divided into the first Dilvar zone of centre and the second Dilvar zone of both sides by another way, and the first middle Dilvar zone is impregnated with Cardanol Modified PF Resin 12, and the second Dilvar zone of both sides is impregnated with small-molecular-weight thermosetting phenolic resin.
Adhesive coated foil 2 is compound on the upper surface of refill 1, constitutes singlesided copperclad laminate. The composite surface of adhesive coated foil 2 scribbles cyanurotriamide modified ba phenolic resin glue-line, by the ba phenolic resin glue-line that this is cyanurotriamide modified, Copper Foil hot pressing is compound on the upper surface of refill 1, also there is between refill 1 and Copper Foil cyanurotriamide modified ba phenolic resin glue-line, and binded by this glue-line. The thickness of adhesive coated foil 2 can be 10-40um.
This heat resistance high-peeling strength paper-based copper-coated board, the impregnation wood pulp paper 11 of refill 1 adopts Cardanol Modified PF Resin 12 to impregnate, on Cardanol phenyl ring, long chain hydrocarbon groups is with double bond structure, a degree of self-polymeric reaction chain extension is carried out time modified, reactant is in phenolic resin building-up process, long-chain participates in the formation of macromolecular main chain, and the refill 1 made has good toughness and thermostability, in this thermostability substantially improving copper-clad plate and sheet material tear resistance. The use of described small-molecular-weight thermosetting phenolic resin, improves the degree of cross linking of resin cured matter, is used in combination with Cardanol Modified PF Resin 12, can improve the thermostability of copper-clad plate further, and make sheet material have excellent tear resistance.
Have again, cyanurotriamide modified ba phenolic resin glue-line is adopted to bind between Copper Foil and refill 1, cyanurotriamide modified ba phenolic resin crosslink density is high, highly polar group is many, it is remarkably improved thermostability and the adhesion strength of resin, in electronic product assembling process, it is not easy that the defects such as layering, foaming, Copper Foil come off occur, also improve adhesion strength, improve the peel strength of Copper Foil and improve the uniformity of peel strength, in producing for slim Copper Foil (15um, 13um) paper-based copper-coated board, achieve good economic benefit.
Preferably, also can being provided with glass layer between described adhesive coated foil 2 and refill 1, this glass layer is impregnated with epoxy resin, the setting of glass layer, is equally used for strengthening heat resistance, uses in high temperature environments and is not likely to produce deformation.
The foregoing is only this novel preferred embodiment, all equalizations done with this novel right change and modify, and all should belong to this novel scope of the claims.
Claims (3)
1. a heat-resisting high-peeling strength paper-based copper-coated board, it is characterised in that: there is refill and adhesive coated foil; This refill is made up of the folded compound of some layers of impregnation wood pulp ply of paper, this impregnation wood pulp paper is divided into the first Dilvar zone of centre and the second Dilvar zone of both sides, the first middle Dilvar zone is impregnated with Cardanol Modified PF Resin, and the second Dilvar zone of both sides is impregnated with small-molecular-weight thermosetting phenolic resin; Adhesive coated foil is compound on the upper surface of refill, and the composite surface of this adhesive coated foil scribbles cyanurotriamide modified ba phenolic resin glue-line.
2. a kind of heat-resisting high-peeling strength paper-based copper-coated board as claimed in claim 1, it is characterised in that: described refill is made up of eight wood pulp paper stacking compounds.
3. a kind of heat-resisting high-peeling strength paper-based copper-coated board as claimed in claim 1, it is characterised in that: the thickness of described adhesive coated foil is 10-40um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521060550.9U CN205310954U (en) | 2015-12-17 | 2015-12-17 | Copper -clad plate of heat -resisting high peel strength paper base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521060550.9U CN205310954U (en) | 2015-12-17 | 2015-12-17 | Copper -clad plate of heat -resisting high peel strength paper base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205310954U true CN205310954U (en) | 2016-06-15 |
Family
ID=56185537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521060550.9U Expired - Fee Related CN205310954U (en) | 2015-12-17 | 2015-12-17 | Copper -clad plate of heat -resisting high peel strength paper base |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205310954U (en) |
-
2015
- 2015-12-17 CN CN201521060550.9U patent/CN205310954U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160615 Termination date: 20161217 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |