CN205248254U

CN205248254U - A baffle for three -dimensional MCM

Info

Publication number: CN205248254U
Application number: CN201521051023.1U
Authority: CN
Inventors: 李建辉; 沐方清; 吴建利; 马涛; 吕洋
Original assignee: CETC 43 Research Institute
Current assignee: CETC 43 Research Institute
Priority date: 2015-12-16
Filing date: 2015-12-16
Publication date: 2016-05-18
Anticipated expiration: 2025-12-16

Abstract

The utility model provides a baffle for three -dimensional MCM, the baffle adopts multilayer LTCC green area, splices a plurality of unilateral baffles to become to be used for to connect the whole baffle of MCM's a loop configuration from top to bottom, is equipped with a plurality of electricity interconnection plated -through holes and pads on it, can be used to the welding and makes the solder bump, and the effect of machinery interconnection is also played in both having electrified interconnection. The utility model discloses a LTCC material forms the whole baffle that is applicable to three -dimensional MCM with unilateral baffle through the concatenation. Using the baffle of concatenation method preparation and having saved the material, be favorable to the heat dissipation, the equipment is convenient. This kind of baffle also can be used to the three -dimensional MCM's of base plates such as aluminium oxide, aluminum nitride and PCB equipment.

Description

A kind of dividing plate for three-dimensional MCM

Technical field

The utility model belongs to microelectronics technology, relates to microelectronics assembling, particularly a kind of dividing plate for three-dimensional MCM.

Background technology

Complicated electronic equipment usually comprises multiple MCM (multi-chip module or module) structure, assemble many components and parts. If only, at two dimension (2D) surface-assembled components and parts, occupy larger assembling area, the volume of system is difficult to dwindle. If system is divided into multiple modules, use LTCC(LTCC) make substrate, system can be divided into multiple LTCC2D-MCM patterns. Connect by polylith 2D-MCM lamination, the components and parts such as the chip assembled, resistance, electric capacity not only launch on two dimensional surface, also in its perpendicular interconnection assembling direction, arrange, realize the MCM sandwich construction of perpendicular interconnection, form three-dimensional MCM (3D-MCM). Not only volume and surface area obviously dwindle to adopt circuit that this assembling form of perpendicular interconnection 3D-MCM makes, and because interconnection line shortens, interconnection resistance and ghost effect are reduced, therefore signal delay shortens, noise and loss also all decline, and can further improve signaling rate.

In the time that 2D-MCM lamination connects, because 2D-MCM surface-assembled has components and parts, therefore between the 2D-MCM of lamination, must there is dividing plate to be separated, in order to avoid components and parts pressurized or impaired. In dividing plate, must there is the plated-through hole of power-on and power-off connection effect and play the pad of welding effect. For LTCC3D-MCM, dividing plate adopts the green carrying material identical with substrate to make conventionally. The manufacturing process of prior art is: first also use metal paste filling perforation at dividing plate with the corresponding site punching of green band; Then, the middle part of green band is cut out; Secondly the dividing plate green band after hollowing out and substrate green band are overlapped together; Finally, the large cavity structure substrate of the integral sintered formation of substrate and dividing plate. Conventional LTCC green band is mainly imported material, expensive. The thickness of dividing plate is relevant with the height that the MCM that treats lamination goes up components and parts, and components and parts are higher, and required dividing plate is thicker. These are as the green band of dividing plate, and except four side partition parts retain, most of region is dug up, and therefore, dividing plate green band utilization rate is very low. If the dividing plate laminating does not overlap together sintering with substrate, during due to LTCC green band sintering, there is larger contraction, four easily evaginations of middle part, limits when the independent sintering of dividing plate of back-shaped structure, it is straight that every side partition is difficult to keep. The design attitude of lead to the hole site on these not straight dividing plates when evenly shrinking will be easy to occur deviation, form and misplace, thereby affect the connectedness of perpendicular interconnection when application with upper and lower MCM.

Utility model content

For overcoming the deficiencies in the prior art, the purpose of this utility model is to provide a kind of and saves material, is conducive to heat radiation, make easy to operate, technique flexibly for the dividing plate of 3D-MCM.

The utility model is achieved through the following technical solutions:

For a dividing plate of three-dimensional MCM, described dividing plate is the overall dividing plate of the loop configuration that is spliced by multiple monolateral dividing plates.

A kind of dividing plate for three-dimensional MCM described in the utility model, described dividing plate is provided with multiple electrical interconnection plated-through holes, and through-hole surfaces is coated with pad.

A kind of dividing plate for three-dimensional MCM described in the utility model, described baffle surface is also provided with the pad of non-intercommunicating pore.

A kind of dividing plate for three-dimensional MCM described in the utility model, described dividing plate is made up of two pairs of 4 the same monolateral dividing plates of rectangle of specification, comprises two long side partitions and two minor face dividing plates.

A kind of dividing plate for three-dimensional MCM described in the utility model, the length of described long side partition is the poor of three-dimensional MCM length and minor face spacer width, the width of long side partition is the poor of three-dimensional MCM width and long side partition width.

A kind of dividing plate for three-dimensional MCM described in the utility model, the length that the length of described long side partition is three-dimensional MCM, the width of long side partition is the half of the difference of three-dimensional MCM width and minor face dividing plate length.

A kind of dividing plate for three-dimensional MCM described in the utility model, the width that the length of described minor face dividing plate is three-dimensional MCM, the width of minor face dividing plate is the half of the difference of three-dimensional MCM length and long side partition length.

The beneficial effects of the utility model are:

1, independent operation technique. For the dividing plate of LTCC3D-MCM, be that bulk LTCC green band middle part is cut out at present, then overlap together sintering with upper strata or lower laminar substrate and form. The utility model is independent single separator plate of making, and does not need to overlap together sintering with substrate. The after-contraction of single separator plate sintering is even, does not have problem on deformation. In addition, substrate separates to make with dividing plate to be made to have reduced to influence each other in operation, and the yield rate of product is higher.

2, reduce costs. The mode that hollows out chamber with existing full wafer is made overall dividing plate, and stock utilization is low, if there are higher components and parts in 3D-MCM, block board thickness is often also thick than substrate, therefore makes intact diaphragm and need to consume a large amount of green carrying materials. The overall dividing plate that adopts the splicing of the utility model single separator plate, green carrying material is fully used. In the time of batch production 3D-MCM, saving green carrying material effect is very obvious.

3, favourable heat radiation. Existing 3D-MCM dividing plate and substrate are sintered together. The utility model dividing plate separates making with substrate, between dividing plate and substrate, is connected by solder bump. Like this, many many convection channel between 3D-MCM inside and outside, this is conducive to scattering and disappearing of 3D-MCM internal heat.

Brief description of the drawings

Fig. 1 is a kind of schematic cross-section for three-dimensional MCM dividing plate of the utility model;

Fig. 2 is the top view of a kind of balanced type connecting method for three-dimensional MCM dividing plate of the utility model;

Fig. 3 is the top view of a kind of full-length connecting method for three-dimensional MCM dividing plate of the utility model;

Fig. 4 is the top view of a kind of width type connecting method for three-dimensional MCM dividing plate of the utility model.

Reference numeral: 1, dividing plate; 2, pad; 3, plated-through hole; 4, stitching portion.

Detailed description of the invention

For better understanding the utility model, below in conjunction with embodiment and accompanying drawing, the utility model is further described, following examples are only the utility model to be described but not it is limited.

In the time carrying out 3D-MCM assembling, for making polylith substrate and divider upright interconnection accurate, easy to operate, the dividing plate that the upper surrounding of 2D-MCM plays buffer action need to be connected conventionally, becomes the overall dividing plate of a loop configuration. Monolateral dividing plate is adopted the binding material dividing plate in aggregates that is stitched together by the utility model. In principle, Fig. 2-Fig. 4 can be used for the dividing plate of perpendicular interconnection in the 3D-MCM of any rectangular planar shape. But while making the monolateral dividing plate of certain 3D-MCM, two kinds of dividing plate length differences of length and width are as far as possible minimum.

Embodiment 1:

For square 3D-MCM, dividing plate is preferably selected the connecting method of balanced type shown in Fig. 2, comprise two long side partitions and two minor face dividing plates, the length of long side partition is the poor of 3D-MCM length and minor face spacer width, and the width of long side partition is the poor of 3D-MCM width and minor face dividing plate length. In the time that the width of long side partition equates with minor face spacer width, long side partition is identical with minor face dividing plate size. As shown in Figure 2, the wide side of each monolateral dividing plate one end and one end long side of adjacent monolateral dividing plate are as stitching portion 4 for concrete connecting method.

As shown in Figure 1, dividing plate 1 adopts multilayer LTCC green band to make, and inside has electrical interconnection plated-through hole 3, and plated-through hole 3 surface coverage have pad 2, can be used for welding and makes solder bump. Pad 2 had both played electrical interconnection and had also risen mechanically interconnected. Put when less when electrical interconnection, also can use the pad 2 of non-intercommunicating pore.

Embodiment 2:

For the 3D-MCM of long limit/broadside≤1.2 of 1 <, dividing plate is preferably selected the connecting method of full-length shown in Fig. 3, comprise two long side partitions and two minor face dividing plates, the length of long side partition is the length of 3D-MCM, the width of long side partition is the half of the difference of 3D-MCM width and minor face dividing plate length, as shown in Figure 3, the wide side at minor face dividing plate two ends and the long side of adjacent long edges dividing plate are as stitching portion 4 for concrete connecting method.

As shown in Figure 1, dividing plate 1 adopts multilayer LTCC green band, inside has electrical interconnection plated-through hole 3, and plated-through hole 3 surface coverage have pad 2, both play a part electrical interconnection also rise mechanically interconnected, can be used for welding with make solder bump.

Embodiment 3:

For the 3D-MCM of non-square and long limit/broadside≤1.2 of non-1 <, dividing plate is preferably selected the connecting method of width type shown in Fig. 4, comprise two long side partitions and two minor face dividing plates, the length of minor face dividing plate is the width of 3D-MCM, the width of minor face dividing plate is the half of the difference of long side partition length and 3D-MCM length, the length of long side partition is the length of 3D-MCM, the width of long side partition is the half of the difference of minor face dividing plate length and 3D-MCM width, concrete connecting method as shown in Figure 4, the wide side at long side partition two ends and the long side of adjacent short sides dividing plate are as stitching portion 4.

As shown in Figure 1, dividing plate 1 adopts multilayer LTCC green band, inside has electrical interconnection plated-through hole 3, and plated-through hole 3 surface coverage have pad 2, can be used for welding and makes solder bump. Pad 2 had both played electrical interconnection and had also risen mechanically interconnected. Put when less when electrical interconnection, also can use the pad 2 of non-intercommunicating pore.

The utility model adopts LTCC material that monolateral dividing plate is applicable to the overall dividing plate that three-dimensional MCM assembles by being spliced to form. The dividing plate that application splicing method is made has been saved material, is conducive to heat radiation, easy to assembly. This kind of dividing plate also can be used for the assembling of the three-dimensional MCM of the substrates such as aluminium oxide, aluminium nitride and PCB.

The above embodiment is only that preferred embodiment of the present utility model is described; not scope of the present utility model is limited; do not departing under the prerequisite of the utility model design spirit; various distortion and improvement that those of ordinary skill in the art make the technical solution of the utility model, all should fall in the definite protection domain of claims of the present utility model.

Claims

1. for a dividing plate of three-dimensional MCM, it is characterized in that, described dividing plate is the overall dividing plate of the loop configuration that is spliced by multiple monolateral dividing plates.

2. a kind of dividing plate for three-dimensional MCM according to claim 1, is characterized in that, described dividing plate is provided with multiple electrical interconnection plated-through holes, and through-hole surfaces is coated with pad.

3. a kind of dividing plate for three-dimensional MCM according to claim 2, is characterized in that, described baffle surface is also provided with the pad of non-intercommunicating pore.

4. according to a kind of dividing plate for three-dimensional MCM described in claim 2 or 3, it is characterized in that, described dividing plate is made up of two pairs of 4 the same monolateral dividing plates of rectangle of specification, comprises two long side partitions and two minor face dividing plates.

5. a kind of dividing plate for three-dimensional MCM according to claim 4, is characterized in that, the length of described long side partition is the poor of three-dimensional MCM length and minor face spacer width, and the width of long side partition is the poor of three-dimensional MCM width and long side partition width.

6. a kind of dividing plate for three-dimensional MCM according to claim 4, is characterized in that, the length that the length of described long side partition is three-dimensional MCM, and the width of long side partition is the half of the difference of three-dimensional MCM width and minor face dividing plate length.

7. a kind of dividing plate for three-dimensional MCM according to claim 4, is characterized in that, the width that the length of described minor face dividing plate is three-dimensional MCM, and the width of minor face dividing plate is the half of the difference of three-dimensional MCM length and long side partition length.