CN205231118U - 一种具有强附着力的压电陶瓷器件电极结构 - Google Patents
一种具有强附着力的压电陶瓷器件电极结构 Download PDFInfo
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- CN205231118U CN205231118U CN201520900672.8U CN201520900672U CN205231118U CN 205231118 U CN205231118 U CN 205231118U CN 201520900672 U CN201520900672 U CN 201520900672U CN 205231118 U CN205231118 U CN 205231118U
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- 239000000853 adhesive Substances 0.000 title claims abstract description 24
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 claims abstract description 35
- 239000002184 metal Substances 0.000 claims abstract description 35
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 22
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims abstract description 21
- 238000000576 coating method Methods 0.000 claims abstract description 6
- 239000000919 ceramic Substances 0.000 claims description 32
- 230000008020 evaporation Effects 0.000 claims description 16
- 238000001704 evaporation Methods 0.000 claims description 16
- 229910052804 chromium Inorganic materials 0.000 claims description 12
- 239000011651 chromium Substances 0.000 claims description 12
- 239000011159 matrix material Substances 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 abstract description 12
- 239000004411 aluminium Substances 0.000 abstract description 12
- 230000007704 transition Effects 0.000 abstract description 9
- 230000008646 thermal stress Effects 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract 2
- 238000009834 vaporization Methods 0.000 abstract 2
- 239000000463 material Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000002474 experimental method Methods 0.000 description 4
- 238000005289 physical deposition Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 238000000637 aluminium metallisation Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
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- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
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CN201520900672.8U CN205231118U (zh) | 2015-11-12 | 2015-11-12 | 一种具有强附着力的压电陶瓷器件电极结构 |
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CN201520900672.8U CN205231118U (zh) | 2015-11-12 | 2015-11-12 | 一种具有强附着力的压电陶瓷器件电极结构 |
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CN205231118U true CN205231118U (zh) | 2016-05-11 |
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CN201520900672.8U Expired - Fee Related CN205231118U (zh) | 2015-11-12 | 2015-11-12 | 一种具有强附着力的压电陶瓷器件电极结构 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107195769A (zh) * | 2017-06-02 | 2017-09-22 | 西人马(厦门)科技有限公司 | 多层压电陶瓷堆叠结构、传感器及其制备方法 |
CN109786951A (zh) * | 2018-12-20 | 2019-05-21 | 兰州空间技术物理研究所 | 一种热电防护一体化薄膜结构 |
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2015
- 2015-11-12 CN CN201520900672.8U patent/CN205231118U/zh not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107195769A (zh) * | 2017-06-02 | 2017-09-22 | 西人马(厦门)科技有限公司 | 多层压电陶瓷堆叠结构、传感器及其制备方法 |
CN109786951A (zh) * | 2018-12-20 | 2019-05-21 | 兰州空间技术物理研究所 | 一种热电防护一体化薄膜结构 |
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Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CB03 | Change of inventor or designer information |
Inventor after: Zheng Dongchen Inventor after: Zhang Guoqing Inventor before: Zheng Dongchen |
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CB03 | Change of inventor or designer information | ||
TR01 | Transfer of patent right |
Effective date of registration: 20190627 Address after: 101300 Beijing Shunyi District Niulanshan Town Tengren Road 22 4 Building 1 Floor Patentee after: Beijing run LIAN Microelectronics Technology Development Co., Ltd. Address before: 101320 Building 03, 21 Linhe Street, Renhe and Linhe Industrial Development Zone, Shunyi District, Beijing Patentee before: BEIJING AOTUOMITE ELECTRONIC CO., LTD. |
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TR01 | Transfer of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160511 Termination date: 20191112 |
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CF01 | Termination of patent right due to non-payment of annual fee |