CN205229403U - Wafer chip assay frock - Google Patents
Wafer chip assay frock Download PDFInfo
- Publication number
- CN205229403U CN205229403U CN201521040030.1U CN201521040030U CN205229403U CN 205229403 U CN205229403 U CN 205229403U CN 201521040030 U CN201521040030 U CN 201521040030U CN 205229403 U CN205229403 U CN 205229403U
- Authority
- CN
- China
- Prior art keywords
- chaining pin
- wafer chip
- connection block
- chaining
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The utility model relates to a detect frock technical field, disclose a wafer chip assay frock, including circuit board, connecting seat, the one end and the circuit board connection of connecting seat, the both sides of the other end of connecting seat respectively are equipped with one row of chaining pin, and the chaining pin includes the chaining pin cover, establishes the telescopic chaining pin head in the chaining pin cover, is connected through the glue layer between the terminal surface of chaining pin cover and connecting seat, the terminal surface on the chaining pin head height play glue layer of every chaining pin, the chaining pin of every chaining pin overlaps and passes through wire and circuit board connection. The utility model discloses have and to be applicable to automated inspection equipment, greatly improve detection efficiency's beneficial effect.
Description
Technical field
The utility model relates to detection frock technical field, particularly relates to a kind of wafer chip detection frock.
Background technology
Wafer (Wafer) is the carrier producing used in integrated circuits, refers to monocrystalline silicon disk more, monocrystalline silicon disk is drawn by common silica sand and refines, make silicon single crystal rod through dissolving, purifying, distill series of measures, silicon single crystal rod, after polishing, section, just becomes wafer.A discoid wafer sheet is distributed with a lot of one sound of laughing wafer, and wafer needed to detect its performance before encapsulation manufactures chip, and due to a wafer existing up to a hundred wafers, manual detection efficiency is low.
Utility model content
The utility model in order to solve wafer in prior art detect exist detection efficiency low and problem, provide one and can be applicable to automatic checkout equipment, greatly improve the wafer chip detection frock of detection efficiency.
To achieve these goals, the utility model adopts following technical scheme:
A kind of wafer chip detection frock, comprise wiring board, Connection Block, one end of described Connection Block is connected with wiring board, the both sides of the other end of described Connection Block are respectively provided with row's chaining pin, described chaining pin comprises chaining pin cover, the telescopic chaining pin head be located in chaining pin cover, be connected by glue layer between described chaining pin cover and the end face of Connection Block, the chaining pin head height of each chaining pin goes out the end face of glue layer, and the chaining pin cover of each chaining pin is connected with wiring board by wire.Wiring board is connected with automatic detection system, wafer chip is arranged on sliding support, chaining pin head is connected with wafer chip surface Elastic Contact, sliding support drives wafer chip to move, make each lattice on wafer chip all through a chaining pin head, detection is direct afterwards reads testing result from automatic detection system, greatly improves the detection efficiency of wafer chip.
As preferably, be bolted between described wiring board and Connection Block.
As preferably, between described chaining pin and Connection Block end face, tilt distribution forms angle, and the outer end of described chaining pin head is bent to form detection terminal, described detection terminal and wafer Chip Vertical to be detected.There is angle between chaining pin and Connection Block, thus ensure that between chaining pin head and wafer chip be Elastic Contact, detection terminal and wafer Chip Vertical, ensure contact stabilization, chaining pin stability under loading between the two.
As preferably, the end face of described detection terminal is sphere.Sphere can prevent detection terminal from producing scratch when wafer chip surface moves.
Therefore, the utility model has and can be applicable to automatic checkout equipment, greatly improves the beneficial effect of detection efficiency.
Accompanying drawing explanation
Fig. 1 is a kind of structural representation of the present utility model.
Fig. 2 is the sectional side view of convex 1.
Fig. 3 is the structural representation of chaining pin.
In figure: wiring board 1, Connection Block 2, bolt 3, chaining pin 4, glue layer 5, wire 6, wafer chip 7, chaining pin cover 40, chaining pin head 41, detection terminal 42.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is further described:
A kind of wafer chip detection frock as depicted in figs. 1 and 2, comprise wiring board 1, Connection Block 2, one end of Connection Block 2 is connected by bolt 3 with between wiring board 1, the both sides of the other end of Connection Block 2 are respectively provided with row's chaining pin 4, as shown in Figure 3, chaining pin 4 comprises chaining pin cover 40, be located at the telescopic chaining pin head 41 in chaining pin cover, be connected by glue layer 5 between chaining pin cover 40 and the end face of Connection Block 2, glue layer solidifies formation by insulating gel, glue layer entirety is in an annular, chaining pin head 41 is positioned at the inner ring portion of the glue layer of annular, between chaining pin 4 and Connection Block end face, tilt distribution forms angle, the chaining pin head 41 of each chaining pin exceeds the end face of glue layer, the chaining pin cover 40 of each chaining pin is connected with wiring board by wire 6, the outer end of chaining pin head 41 is bent to form detection terminal 42, detection terminal 42 is vertical with wafer chip 7 to be detected, the end face of detection terminal 42 is sphere.
By reference to the accompanying drawings, using method of the present utility model is as follows: wiring board 1 is fixedly connected with automatic detection system, wafer chip 7 is arranged on sliding support, detection terminal 42 on chaining pin head contacts with wafer chip 7 surface elasticity and connects, sliding support drives wafer chip to move, make each lattice on wafer chip all through a chaining pin head, directly after detecting reads testing result from automatic detection system, greatly improve the detection efficiency of wafer chip.
Claims (4)
1. a wafer chip detection frock, it is characterized in that, comprise wiring board, Connection Block, one end of described Connection Block is connected with wiring board, the both sides of the other end of described Connection Block are respectively provided with row's chaining pin, and described chaining pin comprises chaining pin cover, the telescopic chaining pin head be located in chaining pin cover, is connected between described chaining pin cover and the end face of Connection Block by glue layer, the chaining pin head height of each chaining pin goes out the end face of glue layer, and the chaining pin cover of each chaining pin is connected with wiring board by wire.
2. a kind of wafer chip detection frock according to claim 1, is characterized in that, be bolted between described wiring board and Connection Block.
3. a kind of wafer chip detection frock according to claim 1 and 2, it is characterized in that, between described chaining pin and Connection Block end face, tilt distribution forms angle, and the outer end of described chaining pin head is bent to form detection terminal, described detection terminal and wafer Chip Vertical to be detected.
4. a kind of wafer chip detection frock according to claim 3, is characterized in that, the end face of described detection terminal is sphere.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521040030.1U CN205229403U (en) | 2015-12-12 | 2015-12-12 | Wafer chip assay frock |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521040030.1U CN205229403U (en) | 2015-12-12 | 2015-12-12 | Wafer chip assay frock |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205229403U true CN205229403U (en) | 2016-05-11 |
Family
ID=55904460
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521040030.1U Expired - Fee Related CN205229403U (en) | 2015-12-12 | 2015-12-12 | Wafer chip assay frock |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205229403U (en) |
-
2015
- 2015-12-12 CN CN201521040030.1U patent/CN205229403U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160511 Termination date: 20211212 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |