CN205194741U - Curing equipment of tin cream - Google Patents
Curing equipment of tin cream Download PDFInfo
- Publication number
- CN205194741U CN205194741U CN201520925297.2U CN201520925297U CN205194741U CN 205194741 U CN205194741 U CN 205194741U CN 201520925297 U CN201520925297 U CN 201520925297U CN 205194741 U CN205194741 U CN 205194741U
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- tin
- tin cream
- heating
- dish
- cream
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Abstract
The utility model discloses a curing equipment of tin cream can carry out the solid installation operation on the base plate of LED chip ann among the LED light structures, LED light structures includes the base plate, lay on the base plate and have the tin dish conductive circuit, place yu xipan and go up and heat fusible tin cream, the LED chip of the fusional tin cream welding installation of accessible heating between two tin coil, it has the scaling powder to mix in the tin cream, curing equipment includes the support, set firmly on the support and can hold the heating platform of putting LED light structures, thereby lay on the heating platform and can carry out quick high temperature heating to the tin cream and make the tin cream receive the heat fusing and can put down the heater that the unfertile land was paved with whole tin dish, set firmly on the support and the heating temperature of steerable heater and the temperature controller of the time of generating heat, thereby the work of thermostat controller heater is carried out high temperature heating to the tin cream and then makes the tin cream receive the heat fusing and can put down the unfertile land being paved with on whole tin dish welds the tin dish with the LED chip simultaneously.
Description
Technical field
The utility model relates to the technical field of the production equipment of LED light source structure, particularly a kind of curing apparatus of tin cream.
Background technology
The fitting operation that in LED light source structure, LED chip is fixedly welded on substrate is generally undertaken by traditional reflow soldering process, the nucleus equipment of reflow soldering process is solder reflow device, solder reflow device can provide a kind of heating environment to make the tin cream melted by heat be positioned on the tin panel of substrate, and the tin cream of fusing can make LED chip and tin dish reliably weld together.But, traditional solder reflow device is generally in long strip type, inside is provided with several warm areas, each warm area arranges, LED light source structure is transmitted successively by horizontal transport mechanism between each warm area, and each warm area progressively heats tin cream thus tin cream is melted finally makes LED chip be welded on substrate.But, there is following shortcoming in above-mentioned reflow soldering process: tin cream fusing is not thorough, can bubble in fusion process thus cause the uneven thickness of tin paste layer after melting, surface irregularity, the out-of-shape of the tin paste layer after fusing and whole tin dish can not be paved with, heat conductivility is poor, the easy heat conduction affecting LED chip, and, the reflective function of tin cream is better, surface ratio is brighter, there is reflection action, and the reflective function of tin dish is poor, surface ratio is more black, reflecting effect is poor, as the tin paste layer after fusing can not be paved with whole tin dish, then can affect the illumination effect of LED chip.In addition, solder reflow device bulky, the parking space taken is large, and heating time is long, and production efficiency is low, and the production cycle is long, and equipment complex and expensive, production cost is high.
Therefore, how realizing one can make tin cream thoroughly melt and flat unfertile land is paved with whole tin dish, thickness evenly and flat thin, good heat conductivity, reflection action is strong, make LED light source structure light-emitting effective, and simple and reasonable, equipment manufacturing cost is lower, equipment volume is little, take up room little, production efficiency is high, and the curing apparatus effectively reducing the tin cream of production cost is technical problem urgently to be resolved hurrily in the industry.
Utility model content
Main purpose of the present utility model is to provide a kind of curing apparatus of tin cream, being intended to realize one can make tin cream thoroughly melt and flat unfertile land is paved with whole tin dish, thickness evenly and flat thin, good heat conductivity, reflection action is strong, make LED light source structure light-emitting effective, and simple and reasonable, equipment manufacturing cost is lower, equipment volume is little, take up room little, production efficiency is high, effectively reduces the curing apparatus of the tin cream of production cost.
The utility model proposes a kind of curing apparatus of tin cream, LED chip in LED light source structure can be carried out and pacify the fitting operation be fixed on substrate, LED light source structure comprises substrate, be layed on substrate and with tin dish conducting channel, be positioned on tin dish and heat fusible tin cream, the LED chip of tin cream welded and installed between two tin dishes by heat fused, be mixed with scaling powder in tin cream; Curing apparatus comprises support, be fixedly arranged on support and can bear LED light source structure heating platform, be layed on heating platform and high-temperature heating fast can be carried out to tin cream thus make tin cream melted by heat and can flat unfertile land be paved with whole tin dish heating wire, be fixedly arranged on support and the heating temp of heating wire and the thermostat of fever time can be controlled, thermostat controls the work of heating wire thus carries out high-temperature heating to tin cream and then make tin cream melted by heat and can be paved with whole tin dish and LED chip is welded to Xi Panshang simultaneously by flat unfertile land.
Preferably, thermostat controls the work of heating wire thus is 260 to 280 degree to the temperature range that tin cream carries out high-temperature heating, and the time range of heating is 4 to 10 seconds.
Curing apparatus of the present utility model comprises support, be fixedly arranged on support and can bear LED light source structure heating platform, be layed on heating platform and high-temperature heating fast can be carried out to tin cream thus make tin cream melted by heat and can flat unfertile land be paved with whole tin dish heating wire, be fixedly arranged on support and the heating temp of heating wire and the thermostat of fever time can be controlled, thermostat controls the work of heating wire thus carries out high-temperature heating to tin cream and then make tin cream melted by heat and can be paved with whole tin dish and LED chip is welded to Xi Panshang simultaneously by flat unfertile land.During operation, substrate is placed on heating platform, the tin dish of substrate is equipped with tin cream, tin cream is equipped with LED chip, control heating wire work by thermostat, thus carry out high-temperature heating to tin cream, heating-up temperature is 270 degree, time is about 4 to 10 seconds, tin cream is fully heated and thoroughly fusing thus can be paved with whole tin dish and LED chip is welded to Xi Panshang simultaneously by flat unfertile land.Such curing apparatus is simple and reasonable, tin cream can be made thoroughly to melt and flat unfertile land is paved with whole tin dish, can not bubble, thickness is even and flat thin, good heat conductivity, be conducive to the heat conduction of LED chip, and, the reflective function of tin cream is good, the reflective function of tin dish is poor, and the tin paste layer after fusing is paved with whole tin dish, make the reflection action of whole tin dish strong, make the illumination effect of LED light source structure good, and, this curing apparatus simple and reasonable, equipment manufacturing cost is lower, equipment volume is little, take up room little, production efficiency is high, effective reduction production cost.The utility model achieves one can make tin cream thoroughly melt and flat unfertile land is paved with whole tin dish, thickness is even and flat thin, good heat conductivity, reflection action is strong, makes LED light source structure light-emitting effective, and it is simple and reasonable, equipment manufacturing cost is lower, and equipment volume is little, takes up room little, production efficiency is high, effectively reduces the curing apparatus of the tin cream of production cost.
Accompanying drawing explanation
Fig. 1 is the perspective view of an embodiment of the curing apparatus of a kind of tin cream of the utility model;
Fig. 2 is the side structure enlarged diagram of LED light source structure in an embodiment of the curing apparatus of a kind of tin cream of the utility model, and in figure, LED light source structure is not inserted in this curing apparatus and carried out high-temperature heating, and tin cream does not melt;
Fig. 3 is the side structure enlarged diagram of LED light source structure in an embodiment of the curing apparatus of a kind of tin cream of the utility model, in figure, LED light source structure has been inserted in this curing apparatus and has been carried out high-temperature heating, and tin cream thoroughly melts and can be paved with whole tin dish by flat unfertile land.
The realization of the utility model object, functional characteristics and advantage will in conjunction with the embodiments, are described further with reference to accompanying drawing.
Embodiment
Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
Referring to figs. 1 through Fig. 3, one embodiment of the curing apparatus of a kind of tin cream of the present utility model is proposed, LED chip 101 in LED light source structure 100 can be carried out and pacify the fitting operation be fixed on substrate 102, LED light source structure 100 comprises substrate 102, be layed on substrate 102 and with tin dish 103 conducting channel, be positioned on tin dish 103 and heat fusible tin cream 104, the LED chip 101 of tin cream 104 welded and installed between two tin dishes 103 by heat fused.Be mixed with scaling powder in tin cream 104, scaling powder can make the fusing of tin cream 104 more thorough.
Curing apparatus comprises support 201, be fixedly arranged on the heating platform 202 that support 201 also can bear LED light source structure 100, to be layed on heating platform 202 and high-temperature heating fast can be carried out to tin cream 104 thus make tin cream 104 melted by heat and the heating wire 203 of whole tin dish 103 can be paved with by flat unfertile land, be fixedly arranged on support 201 and also can control the heating temp of heating wire 203 and the thermostat 204 of fever time, thermostat 204 controls the work of heating wire 203 thus carries out high-temperature heating to tin cream 104 and then make tin cream 104 melted by heat and can be paved with whole tin dish 103 and be welded on tin dish 103 by LED chip 101 simultaneously by flat unfertile land.
Thermostat 204 controls the work of heating wire 203 thus is 260 to 280 degree to the temperature range that tin cream 104 carries out high-temperature heating, and the time range of heating is 4 to 10 seconds.
During operation, substrate 102 is placed on heating platform 202, the tin dish 103 of substrate 102 is equipped with tin cream 104, tin cream 104 is equipped with LED chip 101, control heating wire 203 by thermostat 204 to work, thus carry out high-temperature heating to tin cream 104, heating-up temperature is 270 degree, time is about 4 to 10 seconds, tin cream 104 is fully heated and thoroughly fusing thus can be paved with whole tin dish 103 and be welded on tin dish 103 by LED chip 101 simultaneously by flat unfertile land.Such curing apparatus is simple and reasonable, tin cream 104 thoroughly fusing flat unfertile land is paved with whole tin dish 103 can be made, can not bubble, thickness is even and flat thin, good heat conductivity, be conducive to the heat conduction of LED chip 101, and, the reflective function of tin cream 104 is good, the reflective function of tin dish 103 is poor, and the tin cream 104 layers after fusing is paved with whole tin dish 103, make the reflection action of whole tin dish 103 strong, make the illumination effect of LED light source structure 100 good, and, this curing apparatus simple and reasonable, equipment manufacturing cost is lower, equipment volume is little, take up room little, production efficiency is high, effective reduction production cost.
The fitting operation that in LED light source structure, LED chip is fixedly welded on substrate is generally undertaken by traditional reflow soldering process, the nucleus equipment of reflow soldering process is solder reflow device, solder reflow device can provide a kind of heating environment to make the tin cream melted by heat be positioned on the tin panel of substrate, and the tin cream of fusing can make LED chip and tin dish reliably weld together.But, traditional solder reflow device is generally in long strip type, inside is provided with several warm areas, each warm area arranges, LED light source structure is transmitted successively by horizontal transport mechanism between each warm area, and each warm area progressively heats tin cream thus tin cream is melted finally makes LED chip be welded on substrate.But, there is following shortcoming in above-mentioned reflow soldering process: tin cream fusing is not thorough, can bubble in fusion process thus cause the uneven thickness of tin paste layer after melting, surface irregularity, the out-of-shape of the tin paste layer after fusing and whole tin dish can not be paved with, heat conductivility is poor, the easy heat conduction affecting LED chip, and, the reflective function of tin cream is better, surface ratio is brighter, there is reflection action, and the reflective function of tin dish is poor, surface ratio is more black, reflecting effect is poor, as the tin paste layer after fusing can not be paved with whole tin dish, then can affect the illumination effect of LED chip.In addition, solder reflow device bulky, the parking space taken is large, and heating time is long, and production efficiency is low, and the production cycle is long, and equipment complex and expensive, production cost is high.And curing apparatus of the present utility model comprises support 201, be fixedly arranged on the heating platform 202 that support 201 also can bear LED light source structure 100, to be layed on heating platform 202 and high-temperature heating fast can be carried out to tin cream 104 thus make tin cream 104 melted by heat and the heating wire 203 of whole tin dish 103 can be paved with by flat unfertile land, be fixedly arranged on support 201 and also can control the heating temp of heating wire 203 and the thermostat 204 of fever time, thermostat 204 controls the work of heating wire 203 thus carries out high-temperature heating to tin cream 104 and then make tin cream 104 melted by heat and can be paved with whole tin dish 103 and be welded on tin dish 103 by LED chip 101 simultaneously by flat unfertile land.During operation, substrate 102 is placed on heating platform 202, the tin dish 103 of substrate 102 is equipped with tin cream 104, tin cream 104 is equipped with LED chip 101, control heating wire 203 by thermostat 204 to work, thus carry out high-temperature heating to tin cream 104, heating-up temperature is 270 degree, time is about 4 to 10 seconds, tin cream 104 is fully heated and thoroughly fusing thus can be paved with whole tin dish 103 and be welded on tin dish 103 by LED chip 101 simultaneously by flat unfertile land.Such curing apparatus is simple and reasonable, tin cream 104 thoroughly fusing flat unfertile land is paved with whole tin dish 103 can be made, can not bubble, thickness is even and flat thin, good heat conductivity, be conducive to the heat conduction of LED chip 101, and, the reflective function of tin cream 104 is good, the reflective function of tin dish 103 is poor, and the tin cream 104 layers after fusing is paved with whole tin dish 103, make the reflection action of whole tin dish 103 strong, make the illumination effect of LED light source structure 100 good, and, this curing apparatus simple and reasonable, equipment manufacturing cost is lower, equipment volume is little, take up room little, production efficiency is high, effective reduction production cost.The utility model achieves one can make tin cream 104 thoroughly fusing flat unfertile land is paved with whole tin dish 103, thickness is even and flat thin, good heat conductivity, reflection action is strong, makes LED light source structure 100 illumination effect good, and it is simple and reasonable, equipment manufacturing cost is lower, and equipment volume is little, takes up room little, production efficiency is high, effectively reduces the curing apparatus of the tin cream 104 of production cost.
The foregoing is only preferred embodiment of the present utility model; not thereby the scope of the claims of the present utility model is limited; every equivalent structure transformation utilizing the utility model specification and accompanying drawing content to do; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present utility model.
Claims (2)
1. the curing apparatus of a tin cream, it is characterized in that, LED chip in LED light source structure can be carried out and pacify the fitting operation be fixed on substrate, described LED light source structure comprises described substrate, be layed on described substrate and with tin dish conducting channel, be positioned on described tin dish and heat fusible tin cream, the described LED chip of described tin cream welded and installed between two described tin dishes by heat fused, be mixed with scaling powder in described tin cream, described curing apparatus comprises support, be fixedly arranged on the heating platform that described support also can bear described LED light source structure, to be layed on described heating platform and high-temperature heating fast can be carried out to described tin cream thus make described tin cream melted by heat and the heating wire of whole described tin dish can be paved with by flat unfertile land, be fixedly arranged on described support and also can control the heating temp of described heating wire and the thermostat of fever time, described thermostat controls the work of described heating wire thus carries out high-temperature heating to described tin cream and then make described tin cream melted by heat and can be paved with whole described tin dish and be welded on described tin dish by described LED chip simultaneously by flat unfertile land.
2. the curing apparatus of a kind of tin cream according to claim 1, is characterized in that, described thermostat controls the work of described heating wire thus is 260 to 280 degree to the temperature range that described tin cream carries out high-temperature heating, and the time range of heating is 4 to 10 seconds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520925297.2U CN205194741U (en) | 2015-11-19 | 2015-11-19 | Curing equipment of tin cream |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520925297.2U CN205194741U (en) | 2015-11-19 | 2015-11-19 | Curing equipment of tin cream |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205194741U true CN205194741U (en) | 2016-04-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520925297.2U Expired - Fee Related CN205194741U (en) | 2015-11-19 | 2015-11-19 | Curing equipment of tin cream |
Country Status (1)
| Country | Link |
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| CN (1) | CN205194741U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117976564A (en) * | 2023-12-29 | 2024-05-03 | 上海捷策创电子科技有限公司 | Seamless bonding method of multilayer substrate and test carrier plate |
-
2015
- 2015-11-19 CN CN201520925297.2U patent/CN205194741U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117976564A (en) * | 2023-12-29 | 2024-05-03 | 上海捷策创电子科技有限公司 | Seamless bonding method of multilayer substrate and test carrier plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160427 Termination date: 20161119 |