CN205160902U - PCB technology limit gummosis structure - Google Patents
PCB technology limit gummosis structure Download PDFInfo
- Publication number
- CN205160902U CN205160902U CN201520911537.3U CN201520911537U CN205160902U CN 205160902 U CN205160902 U CN 205160902U CN 201520911537 U CN201520911537 U CN 201520911537U CN 205160902 U CN205160902 U CN 205160902U
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- gummosis
- point
- technology limit
- pcb technology
- guiding gutter
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Abstract
The utility model discloses a PCB technology limit gummosis structure. Wherein, the gummosis structure includes the gummosis point that sets up with a plurality of predetermined intervals, be provided with in the gummosis point and link up a plurality of crisscross guiding gutter of gummosis point, have at least a guiding gutter to set up relatively between the adjacent gummosis point, gummosis point shape is regular hexagon, and gummosis point area is 6 -8mm2. Through set up the guiding gutter in gummosis point for distance between the gummosis point keeps good gummosis ability when can suitably dwindle, makes technology limit structure more stable, and the stress point is more balanced, and the holding power preferred is difficult to disconnected board phenomenon appear when the dielectric layer attenuation, reduces production and abandonment at present, stablizes the product size, improves production efficiency.
Description
Technical field
The utility model relates to PCB manufacture technology field, particularly relates to a kind of PCB technology limit gummosis structure.
Background technology
In PCB field, along with the development of electronic product device, operational capability and small form factor requirements more and more higher, the range of application of multilayer printed circuit board is more and more extensive.
And cause because each PCB finished product is not of uniform size, usually needing to be combined into certain size during making makes and could meet machinery equipment requirement, and the technique edges needing to add one fixed width is for the positioning requirements of the technological requirement and equipment machine that meet each production process.
In the prior art, in order to the needs making the technique edges of core material meet multilayer printed board pressing prepreg gummosis, as shown in Figure 1, the top layer of the technique edges of core material and bottom are provided with the gummosis point 100 of multiple circle to choked flow graphic structure.Top layer gummosis point and bottom gummosis point are concentric circles, and the diameter of gummosis point 100 is generally designed to 2.0-3.2mm, and the spacing between the adjacent gummosis null circle heart of same layer two is generally designed to 2.3-3.8mm.
When there being thickness of slab requirement, the core material of jigsaw design will be more and more thinner, and on central layer, copper is thick more and more thicker.In order to meet this designing requirement, epoxy resin and the glass fiber fabric medium of core material can be more and more thinner.And this design is in the production process of core material and lamination, because needs arrange gummosis dot structure, technique edges structural instability, easily occurs that technique edges breaks the problem of plate.
Therefore, prior art need development.
Summary of the invention
In view of above-mentioned the deficiencies in the prior art part, the purpose of this utility model is to provide a kind of PCB gummosis point technique edges structure, is intended to solve gummosis point in prior art and arranges the problem causing the easy disconnected plate of technique edges.
In order to achieve the above object, the utility model takes following technical scheme:
A kind of PCB technology limit gummosis structure, wherein, described gummosis structure comprises the gummosis point arranged with some predetermined spaces, is provided with the some staggered guiding gutter of through described gummosis point in described gummosis point;
A guiding gutter is had at least to be oppositely arranged between adjacent gummosis point;
Described gummosis point shape is regular hexagon, and gummosis point area is 6-8mm
2.
Described PCB technology limit gummosis structure, wherein, described gummosis structure specifically comprises top layer and bottom, and described top layer and bottom are respectively arranged with corresponding upper groove and low groove, split thus form described gummosis point.
Described PCB technology limit gummosis structure, wherein, described gummosis structure comprises some gummosis bars;
Some gummosis points be provided at predetermined intervals are comprised in described gummosis bar; Drainage road by having preset width between described gummosis bar connects.
Described PCB technology limit gummosis structure, wherein, described gummosis bar is set to 4.
Described PCB technology limit gummosis structure, wherein, the width in described drainage road is 10-12mm.
Described PCB technology limit gummosis structure, wherein, described predetermined space is 0.5-1mm.
Beneficial effect: a kind of PCB technology limit gummosis structure that the utility model provides, by arranging guiding gutter in gummosis point, good gummosis ability is kept while distance between gummosis point can suitably be reduced, make technique edges structure more stable, stress point is more balanced, and support force is better, be not easy when dielectric layer is thinning to occur disconnected plate phenomenon, now reduce manufacturing scrap, stable prod size, enhances productivity.
Accompanying drawing explanation
Fig. 1 is the structural representation of existing PCB technology limit gummosis point.
Fig. 2 is the structural representation of the PCB technology limit gummosis point of the utility model specific embodiment.
Fig. 3 is the structural representation of the PCB technology limit gummosis structure of the utility model specific embodiment
Embodiment
The utility model provides a kind of PCB technology limit gummosis structure.For making the purpose of this utility model, technical scheme and effect clearly, clearly, developing simultaneously referring to accompanying drawing, the present invention is described in more detail for embodiment.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
As shown in Figure 2, be the structural representation of a kind of PCB technology limit gummosis structure of the utility model specific embodiment.
Described gummosis structure comprises the gummosis point 200 (comprising 201,202) arranged with some predetermined spaces.The some staggered guiding gutter 210 of through described gummosis point is provided with in described gummosis point.
Described gummosis point shape is regular hexagon, and gummosis point area is 6-8mm
2.As shown in Figure 2, described guiding gutter can be set to 3, intersects at described orthohexagonal center.
Have at least a guiding gutter 210 to be oppositely arranged between described adjacent gummosis point (such as 201 and 202), thus formation continuous print runner go out for remaining solation.That is as shown in Figure 2, the opening between guiding gutter 210 is relative.
In specific embodiment of the utility model, due to the existence of guiding gutter 210, the predetermined space between described gummosis point can be set to less 0.5-1mm, for technique edges provides good supporting construction, is not easy to rupture in the gap of gummosis point.
The above-mentioned vibrational power flow that guiding gutter is set in gummosis point, compared with existing gummosis dot structure (as shown in Figure 1), when providing equivalent gummosis ability, can be distributed stressed (strong point is more) uniformly, bear larger pressure, thus be not easy when dielectric layer is thinning to occur disconnected plate phenomenon, now reduce manufacturing scrap, stable prod size, enhances productivity.
Concrete, described gummosis structure specifically comprises top layer and bottom, and described top layer and bottom are respectively arranged with corresponding upper groove and low groove.Described gummosis structure can be formed by the split of top layer and bottom.
More specifically, as shown in Figure 3, described gummosis structure comprises some gummosis bars 300.In described gummosis bar, 300 comprise some gummosis points 200 be provided at predetermined intervals.
Drainage road 310 by having preset width between described gummosis bar connects.That is described gummosis point sets in a row, form a gummosis bar.Be crisscross arranged between gummosis bar, thus form drainage road.It is preferred that the width arranging described drainage road is 10-12mm (such as 10mm) can meet primary demand.
Said structure is arranged, can the bearing capacity on further lifting process limit, better dispersive pressure.Concrete, described gummosis bar is set to 4.Too much gummosis bar can affect binder removal effect, and the width that also can increase technique edges causes the waste of material.
Be understandable that; for those of ordinary skills; can be equal to according to the technical solution of the utility model and the utility model design and replace or change, and all these change or replace the protection range that all should belong to the claim appended by the utility model.
Claims (6)
1. a PCB technology limit gummosis structure, is characterized in that, described gummosis structure comprises the gummosis point arranged with some predetermined spaces, is provided with the some staggered guiding gutter of through described gummosis point in described gummosis point;
A guiding gutter is had at least to be oppositely arranged between adjacent gummosis point;
Described gummosis point shape is regular hexagon, and gummosis point area is 6-8mm
2.
2. PCB technology limit according to claim 1 gummosis structure, is characterized in that, described gummosis structure specifically comprises top layer and bottom, and described top layer and bottom are respectively arranged with corresponding upper groove and low groove, split thus form described gummosis point.
3. PCB technology limit according to claim 1 gummosis structure, is characterized in that, described gummosis structure comprises some gummosis bars;
Some gummosis points be provided at predetermined intervals are comprised in described gummosis bar; Drainage road by having preset width between described gummosis bar connects.
4. PCB technology limit according to claim 3 gummosis structure, is characterized in that, described gummosis bar is set to 4.
5. PCB technology limit according to claim 3 gummosis structure, is characterized in that, the width in described drainage road is 10-12mm.
6. PCB technology limit according to claim 1 gummosis structure, is characterized in that, described predetermined space is 0.5-1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520911537.3U CN205160902U (en) | 2015-11-16 | 2015-11-16 | PCB technology limit gummosis structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520911537.3U CN205160902U (en) | 2015-11-16 | 2015-11-16 | PCB technology limit gummosis structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205160902U true CN205160902U (en) | 2016-04-13 |
Family
ID=55696539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520911537.3U Expired - Fee Related CN205160902U (en) | 2015-11-16 | 2015-11-16 | PCB technology limit gummosis structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205160902U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109640547A (en) * | 2018-12-01 | 2019-04-16 | 广东骏亚电子科技股份有限公司 | A method of improving multilayer circuit board interlayer alignment precision |
-
2015
- 2015-11-16 CN CN201520911537.3U patent/CN205160902U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109640547A (en) * | 2018-12-01 | 2019-04-16 | 广东骏亚电子科技股份有限公司 | A method of improving multilayer circuit board interlayer alignment precision |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160413 Termination date: 20181116 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |