CN205152364U - Electroplating process of circuit board drags jar board - Google Patents
Electroplating process of circuit board drags jar board Download PDFInfo
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- CN205152364U CN205152364U CN201520934716.9U CN201520934716U CN205152364U CN 205152364 U CN205152364 U CN 205152364U CN 201520934716 U CN201520934716 U CN 201520934716U CN 205152364 U CN205152364 U CN 205152364U
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Abstract
The utility model relates to an electroplating process of circuit board drags jar board, including the substrate board that is equipped with first surface and second surface, locate first plating layer on the first surface, locate the second plating layer on the second surface, first surface and second surface set up relatively, the concave a plurality of first recess that communicates the first surface that is equipped with of first plating layer, the concave a plurality of second recesses that communicate the second surface that are equipped with of second plating layer, the first surface is the same with the electroplating area of the naked whole area and gate board of second surface. When the circuit board figure is electroplated, avoid using the jar board that drags of whole board copper face to carry out " the vacation is plated " of height potential difference, guarantee the homogeneity that the circuit board figure electroplated, make the whole board copper of circuit board thick unanimous, guarantee product quality. Dragging the jar board after use a period, will dragging the jar board to carry out etching to the size that requires, repeatedly usable is favorable to cyclic utilization promptly, reduction in production cost.
Description
Technical field
The utility model relates to circuit board electroplating technical field, and the electroplating technology particularly relating to a kind of wiring board drags cylinder plate.
Background technology
Along with the direction of electronic product to miniaturization, densification, high integration and multifunction develops rapidly, also more and more higher to wiring board requirement, live width/spacing is more and more less, and this is just more and more higher to the uniformity requirement of graphic plating.In current industry, drag the consistent size of the general and wiring board of the size of cylinder plate, when graphic plating, the cylinder plate that drags of usual use whole plate copper face carries out " the false plating " of high low potential difference, to remove the impurity in tank liquor, but often there is the situation that the global copper thickness ununiformity of wiring board is even, affect quality product; And after dragging cylinder plate to use for some time, the cover copper and foreign ion and organic pollutant on surface are not easily removed, and recycle difficulty, production cost is high.
Utility model content
The purpose of this utility model is to provide a kind of electroplating technology of wiring board to drag cylinder plate, can ensure the homogeneity that circuit board pattern is electroplated, and be conducive to recycling, and reduces production cost.
For realizing the purpose of this utility model, the technical scheme taked is:
A kind of electroplating technology of wiring board drags cylinder plate, comprise the backing material plate being provided with first surface and second surface, the first electrolytic coating be located on first surface, the second electrolytic coating be located on second surface, first surface and second surface are oppositely arranged, first electrolytic coating is arranged with multiple first grooves being communicated with first surface, second electrolytic coating is arranged with multiple second grooves being communicated with second surface, and the total area that first surface is exposed with second surface is identical with the plating area of wiring board.
When wiring board carries out graphic plating, cylinder plate will be dragged to put into together with wiring board in electroplate liquid, owing to dragging the total area that cylinder plate first surface and second surface are exposed identical with the plating area of wiring board, the cylinder plate that drags using whole plate copper face is avoided to carry out " the false plating " of high low potential difference, ensure the homogeneity of circuit board pattern plating, make wiring board whole plate copper unanimously thick, ensure quality product.After dragging cylinder plate to use for some time, carry out the size being etched to requirement by dragging cylinder plate, namely reusable, be conducive to recycle, reduce production cost.
Below technical scheme is further illustrated:
Further, the edge of the first electrolytic coating and the second electrolytic coating is all convexly equipped with multiple clamping section.Being clamped dragging cylinder plate by clamping section, making the more convenient operation of dragging cylinder plate.
Further, clamping section comprises nickel layer and is located at the Gold plated Layer on nickel layer.By nickel layer on clamping section and layer gold, make the longer service life of clamping section.
Further, multiple clamping section is evenly arranged along edge.Clamping section is evenly arranged in edge, makes dragging the clamping of cylinder plate more stable.
Further, multiple first groove is distributed on the first electrolytic coating, and multiple second groove is distributed on the second electrolytic coating.First groove and the second groove are uniformly distributed, and improve homogeneity during circuit board pattern plating further.
Further, the circular in cross-section of the first groove and the second groove, is convenient to manufacture.
Further, the diameter of the first groove and the second groove is 2mm ~ 4mm, and the width between centers of adjacent two the first grooves is 3mm ~ 5mm, and the width between centers of adjacent two the second grooves is 3mm ~ 5mm.
Compared with prior art, the utility model has following beneficial effect:
The utility model is by identical with the plating area of wiring board by dragging the cylinder plate first surface total area exposed with second surface to be arranged to, the cylinder plate that drags using whole plate copper face is avoided to carry out " the false plating " of high low potential difference, ensure the homogeneity of circuit board pattern plating, make wiring board whole plate copper unanimously thick, ensure quality product.After dragging cylinder plate to use for some time, carry out the size being etched to requirement by dragging cylinder plate, namely reusable, be conducive to recycle, reduce production cost.
Accompanying drawing explanation
Fig. 1 is the structural representation that the electroplating technology of the utility model embodiment wiring board drags cylinder plate;
Fig. 2 is that the A-A of Fig. 1 is to cross-sectional view.
Description of reference numerals:
10. backing material plate, 110. first surfaces, 120. second surfaces, 20. first electrolytic coatings, 210. first grooves, 30. second electrolytic coatings, 310. second grooves, 40. clamping sections, 410. nickel layers, 420. Gold plated Layer.
Embodiment
Below in conjunction with accompanying drawing, embodiment of the present utility model is described in detail:
As depicted in figs. 1 and 2, a kind of electroplating technology of wiring board drags cylinder plate, comprise the backing material plate 10 being provided with first surface 110 and second surface 120, be located at the first electrolytic coating 20 on first surface 110, be located at the second electrolytic coating 30 on second surface 120, first surface 110 and second surface 120 are oppositely arranged, first electrolytic coating 20 is arranged with multiple first grooves 210 being communicated with first surface 110, second electrolytic coating 30 is arranged with multiple second grooves 310 being communicated with second surface 120, the total area that first surface 110 is exposed with second surface 120 is identical with the plating area of wiring board.
When wiring board carries out graphic plating, cylinder plate will be dragged to put into together with wiring board in electroplate liquid, owing to dragging the total area that cylinder plate first surface 110 and second surface 120 are exposed identical with the plating area of wiring board, the cylinder plate that drags using whole plate copper face is avoided to carry out " the false plating " of high low potential difference, ensure the homogeneity of circuit board pattern plating, make wiring board whole plate copper unanimously thick, ensure quality product.After dragging cylinder plate to use for some time, carry out the size being etched to requirement by dragging cylinder plate, namely reusable, be conducive to recycle, reduce production cost.
As depicted in figs. 1 and 2, multiple first groove 210 is distributed on the first electrolytic coating 20, and multiple second groove 310 is distributed on the second electrolytic coating 30.First groove 210 and the second groove 310 are uniformly distributed, and improve homogeneity during circuit board pattern plating further.
In the present embodiment, the circular in cross-section of the first groove 210 and the second groove 310, the diameter of the first groove 210 and the second groove 310 is 2mm ~ 4mm, and the width between centers of adjacent two the first grooves 210 is 3mm ~ 5mm, and the width between centers of adjacent two the second grooves 310 is 3mm ~ 5mm.The shape of cross section of the first groove 210 and the second groove 310 can also be set to other shapes such as Polygons according to actual needs, and size and the quantity of the first groove 210 and the second groove 310 can also be set to other numerical value according to the plating area of wiring board reality.
As depicted in figs. 1 and 2, the edge of the first electrolytic coating 20 and the second electrolytic coating 30 is all convexly equipped with multiple clamping section 40.Being clamped dragging cylinder plate by clamping section 40, making the more convenient operation of dragging cylinder plate.
In the present embodiment, the edge that the first electrolytic coating 20 two is relative being all evenly arranged four clamping sections 40, the edge that the second electrolytic coating 30 two is relative has all been evenly arranged four clamping sections 40, having made dragging the clamping of cylinder plate more stable.Each edge also can arrange more than one clamping section 40 according to actual needs.
As shown in Figure 2, clamping section 40 comprises nickel layer 410 and the Gold plated Layer 420 be located on nickel layer 410.By arranging nickel layer 410 and Gold plated Layer 420 on clamping section 40, make the longer service life of clamping section 40.
When the utility model is used for circuit board pattern plating, as adopted the mode of production of gantry plating line, then dragging two cylinder plate to be placed on the two ends, left and right producing plate, as adopted the mode of production of VCP line, then dragging two cylinder plate to prevent in the rear and front end producing plate, when electroplating parameter is arranged, total plate number is produce plate and the quantity sum of dragging cylinder plate, and cylinder plate structure of dragging of the present utility model is simple, easy to make, and be conducive to recycle, save production cost.
Each technical characteristic of the above embodiment can combine arbitrarily, for making description succinct, the all possible combination of each technical characteristic in above-described embodiment is not all described, but, as long as the combination of these technical characteristics does not exist contradiction, be all considered to be the scope that this specification sheets is recorded.
The above embodiment only have expressed several embodiment of the present utility model, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to utility model patent scope.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be as the criterion with claims.
Claims (7)
1. the electroplating technology of a wiring board drags cylinder plate, it is characterized in that, comprise the backing material plate being provided with first surface and second surface, the first electrolytic coating be located on described first surface, the second electrolytic coating be located on described second surface, described first surface and described second surface are oppositely arranged, described first electrolytic coating is arranged with multiple first grooves being communicated with described first surface, described second electrolytic coating is arranged with multiple second grooves being communicated with described second surface, and the total area that described first surface is exposed with described second surface is identical with the plating area of wiring board.
2. the electroplating technology of wiring board according to claim 1 drags cylinder plate, it is characterized in that, the edge of described first electrolytic coating and described second electrolytic coating is all convexly equipped with multiple clamping section.
3. the electroplating technology of wiring board according to claim 2 drags cylinder plate, it is characterized in that, described clamping section comprises nickel layer and is located at the Gold plated Layer on described nickel layer.
4. the electroplating technology of wiring board according to claim 2 drags cylinder plate, it is characterized in that, multiple described clamping section is evenly arranged along described edge.
5. the electroplating technology of the wiring board according to any one of Claims 1-4 drags cylinder plate, it is characterized in that, multiple first groove is distributed on described first electrolytic coating, and multiple described second groove is distributed on described second electrolytic coating.
6. the electroplating technology of wiring board according to claim 5 drags cylinder plate, it is characterized in that, the circular in cross-section of described first groove and described second groove.
7. the electroplating technology of wiring board according to claim 6 drags cylinder plate, it is characterized in that, the diameter of described first groove and described second groove is 2mm ~ 4mm, the width between centers of adjacent two described first grooves is 3mm ~ 5mm, and the width between centers of adjacent two described second grooves is 3mm ~ 5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520934716.9U CN205152364U (en) | 2015-11-20 | 2015-11-20 | Electroplating process of circuit board drags jar board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520934716.9U CN205152364U (en) | 2015-11-20 | 2015-11-20 | Electroplating process of circuit board drags jar board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205152364U true CN205152364U (en) | 2016-04-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520934716.9U Active CN205152364U (en) | 2015-11-20 | 2015-11-20 | Electroplating process of circuit board drags jar board |
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| Country | Link |
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| CN (1) | CN205152364U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110602893A (en) * | 2019-09-24 | 2019-12-20 | 珠海崇达电路技术有限公司 | Pattern electroplating method capable of repeatedly utilizing plating accompanying plate |
| CN110602891A (en) * | 2019-08-22 | 2019-12-20 | 江门崇达电路技术有限公司 | Electroplating method capable of repeatedly utilizing plating accompanying plate |
| CN114798654A (en) * | 2021-01-29 | 2022-07-29 | 深南电路股份有限公司 | Cylinder dragging plate and cleaning method thereof |
-
2015
- 2015-11-20 CN CN201520934716.9U patent/CN205152364U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110602891A (en) * | 2019-08-22 | 2019-12-20 | 江门崇达电路技术有限公司 | Electroplating method capable of repeatedly utilizing plating accompanying plate |
| CN110602891B (en) * | 2019-08-22 | 2021-01-15 | 江门崇达电路技术有限公司 | Electroplating method capable of repeatedly utilizing plating accompanying plate |
| CN110602893A (en) * | 2019-09-24 | 2019-12-20 | 珠海崇达电路技术有限公司 | Pattern electroplating method capable of repeatedly utilizing plating accompanying plate |
| CN114798654A (en) * | 2021-01-29 | 2022-07-29 | 深南电路股份有限公司 | Cylinder dragging plate and cleaning method thereof |
| CN114798654B (en) * | 2021-01-29 | 2023-09-22 | 深南电路股份有限公司 | Cylinder dragging plate and cleaning method thereof |
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