CN205105454U - Aluminium base circuit board of high heat dissipation single face - Google Patents
Aluminium base circuit board of high heat dissipation single face Download PDFInfo
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- CN205105454U CN205105454U CN201520977405.0U CN201520977405U CN205105454U CN 205105454 U CN205105454 U CN 205105454U CN 201520977405 U CN201520977405 U CN 201520977405U CN 205105454 U CN205105454 U CN 205105454U
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- insulating barrier
- aluminium base
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Abstract
The utility model belongs to the technical field of aluminium base circuit board, a aluminium base circuit board of high heat dissipation single face is related to, including aluminium base board, insulating layer, circuit layer, its characterized in that: the upper surface of aluminium base board sets up the dovetail groove, and the insulating layer passes through the dovetail groove is in the same place with aluminium base board zonulae occludens, and the upper surface of insulating layer sets up the circuit layer, and the circuit layer is the electrolytic copper foil. The utility model discloses a need not to use glue between insulating layer and the aluminium base board, the insulating layer direct with aluminium substrate connection, firm in connection can not yin wendu risees and a little less than taking off.
Description
Technical field
The utility model relates to a kind of high heat radiation single-side aluminum circuit board, belongs to aluminum base circuit board technical field.
Background technology
Along with the develop rapidly of electronics industry, the volume size of electronic product is more and more less, and power is increasing, and heat is the biggest threat of LED and other silicon series products, and solving heat dissipation problem is the huge challenge designed electronics industry.Aluminium base is then one of effective means solving heat dissipation problem, but insulating barrier and aluminium base need to be bondd by glue, although insulating barrier can adopt highly heat-conductive material, the general poor thermal conductivity of glue, and glue easily melts when temperature raises, insulating barrier and aluminium base is caused to depart from.
Utility model content
The purpose of this utility model is to provide a kind of high heat radiation single-side aluminum circuit board, and without the need to using glue between insulating barrier and aluminium base, insulating barrier is directly connected with aluminium base, be connected firmly, can not raise and take off weak by Yin Wendu, not using glue, can further improve radiating effect.
The utility model adopts following technical proposals to realize.A kind of high heat radiation single-side aluminum circuit board, comprise aluminium base, insulating barrier, circuit layer, it is characterized in that: the upper surface of aluminium base arranges dovetail groove, insulating barrier by dovetail groove together with aluminium base compact siro spinning technology, the upper surface of insulating barrier arranges circuit layer, and circuit layer is electrolytic copper foil.
In order to promote the rate of heat dispation of aluminium base, evenly offer cylindrical hole at the lower surface of aluminium base, plating one deck copper in cylindrical hole.
Described circuit layer comprises 9 sandwich circuit structures, the first routing layer, the first insulating barrier, ground plane, the second insulating barrier, the second routing layer, the 3rd insulating barrier, bus plane, the 4th insulating barrier and the 3rd routing layer is followed successively by the 9th layer from ground floor, the thickness of described second insulating barrier and the 3rd insulating barrier is 6.65 ~ 7.35mil, and the thickness of described first insulating barrier and the 4th insulating barrier is 4.72 ~ 5.28mil.
Advantage of the present utility model: solve insulating barrier and aluminium base without glue connectivity problem, time insulating barrier and aluminium base be connected firmly, can not come off because temperature is high, ensure circuit board job stability.And offer cylindrical hole at aluminium base lower surface, increasing heat radiation area, improve radiating efficiency.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of embodiment 1.
Fig. 2 is the cutaway view of embodiment 2.
Fig. 3 is the upward view of embodiment 2.
Embodiment
Embodiment 1
As shown in Figure 1, a kind of high heat radiation single-side aluminum circuit board, comprise aluminium base 1, insulating barrier 2, circuit layer 3, the upper surface of aluminium base 1 arranges dovetail groove 11, and insulating barrier 2 is formed by the polymer of the ceramic dielectric filling of high heat conduction, high insulation, insulating barrier 2 is directly shaping at aluminium base 1 upper surface, by dovetail groove 11 together with aluminium base 1 compact siro spinning technology, such insulating barrier 2 would not come off, after insulating barrier 2 solidifies, surface arranges circuit layer 3 thereon, and circuit layer 3 is electrolytic copper foil.
Embodiment 2
As shown in Figure 2, a kind of high heat radiation single-side aluminum circuit board, comprise aluminium base 1, insulating barrier 2, circuit layer 3, the upper surface of aluminium base 1 arranges dovetail groove 11, insulating barrier 2 is directly shaping at aluminium base 1 upper surface, by dovetail groove 11 together with aluminium base 1 compact siro spinning technology, insulating barrier 2 upper surface arranges circuit layer 3, and circuit layer 3 is electrolytic copper foil; As shown in Figure 3, aluminium base 1 lower surface is uniformly distributed cylindrical hole 12, can increase the area of dissipation of aluminium base 1, improves radiating efficiency, because copper is higher compared to aluminium thermal diffusivity, so electroplate one deck copper in cylindrical hole 12.
Described insulating barrier 2 is the epoxy resin insulating layers being mixed with alumina particle.
Described circuit layer 3 comprises 9 sandwich circuit structures, the first routing layer, the first insulating barrier, ground plane, the second insulating barrier, the second routing layer, the 3rd insulating barrier, bus plane, the 4th insulating barrier and the 3rd routing layer is followed successively by the 9th layer from ground floor, the thickness of described second insulating barrier and the 3rd insulating barrier is 6.65 ~ 7.35mil, and the thickness of described first insulating barrier and the 4th insulating barrier is 4.72 ~ 5.28mil.Described second insulating barrier and the 3rd insulating barrier are papery or glass fibre class base material, and described first insulating barrier and the 4th insulating barrier are mylar.
The above only have expressed preferred implementation of the present utility model, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion, improvement and substitute, these all belong to protection range of the present utility model.Therefore, the protection range of the utility model patent should be as the criterion with claims.
Claims (5)
1. one kind high heat radiation single-side aluminum circuit board, comprise aluminium base, insulating barrier, circuit layer, it is characterized in that: the upper surface of aluminium base arranges dovetail groove, insulating barrier by dovetail groove together with aluminium base compact siro spinning technology, the upper surface of insulating barrier arranges circuit layer, and circuit layer is electrolytic copper foil.
2. height heat radiation single-side aluminum circuit board according to claim 1, is characterized in that: evenly offer cylindrical hole at the lower surface of aluminium base, plating one deck copper in cylindrical hole.
3. height heat radiation single-side aluminum circuit board according to claim 1, is characterized in that: described insulating barrier is epoxy resin insulating layers.
4. height heat radiation single-side aluminum circuit board according to claim 1, it is characterized in that: described circuit layer comprises 9 sandwich circuit structures, the first routing layer, the first insulating barrier, ground plane, the second insulating barrier, the second routing layer, the 3rd insulating barrier, bus plane, the 4th insulating barrier and the 3rd routing layer is followed successively by the 9th layer from ground floor, the thickness of described second insulating barrier and the 3rd insulating barrier is 6.65 ~ 7.35mil, and the thickness of described first insulating barrier and the 4th insulating barrier is 4.72 ~ 5.28mil.
5. height heat radiation single-side aluminum circuit board according to claim 4, is characterized in that: the second insulating barrier and the 3rd insulating barrier are papery or glass fibre class base material, and described first insulating barrier and the 4th insulating barrier are mylar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520977405.0U CN205105454U (en) | 2015-11-30 | 2015-11-30 | Aluminium base circuit board of high heat dissipation single face |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520977405.0U CN205105454U (en) | 2015-11-30 | 2015-11-30 | Aluminium base circuit board of high heat dissipation single face |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205105454U true CN205105454U (en) | 2016-03-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520977405.0U Active CN205105454U (en) | 2015-11-30 | 2015-11-30 | Aluminium base circuit board of high heat dissipation single face |
Country Status (1)
| Country | Link |
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| CN (1) | CN205105454U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105792505A (en) * | 2016-03-25 | 2016-07-20 | 龙南骏亚电子科技有限公司 | Aluminum-based circuit board of high thermal conductivity |
| CN110121235A (en) * | 2018-02-05 | 2019-08-13 | 深圳市五株科技股份有限公司 | Aluminum base circuit board and its processing method |
-
2015
- 2015-11-30 CN CN201520977405.0U patent/CN205105454U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105792505A (en) * | 2016-03-25 | 2016-07-20 | 龙南骏亚电子科技有限公司 | Aluminum-based circuit board of high thermal conductivity |
| CN110121235A (en) * | 2018-02-05 | 2019-08-13 | 深圳市五株科技股份有限公司 | Aluminum base circuit board and its processing method |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |