CN205096970U - BGA soldering tin ball roughness's processing apparatus - Google Patents
BGA soldering tin ball roughness's processing apparatus Download PDFInfo
- Publication number
- CN205096970U CN205096970U CN201520934047.5U CN201520934047U CN205096970U CN 205096970 U CN205096970 U CN 205096970U CN 201520934047 U CN201520934047 U CN 201520934047U CN 205096970 U CN205096970 U CN 205096970U
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- solder ball
- polished part
- cylinder
- face
- gear
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Abstract
The utility model discloses a BGA soldering tin ball roughness's processing apparatus, include: the frame, it includes the base and is located the back timber of base top, be in through the gliding setting of linear slide rail loading board on the base, be used for carrying on the polishing unit of smooth finish operation to the sphere of soldering tin ball, it includes a polishing member and the 2nd polishing member, be used for the installation the 2nd polishing member's gear unit, it includes first cylinder, fixed plate, pivot, gear, bowl portion, be provided with in the bowl portion the 2nd polishing member, with gear unit matched with rack unit, install be used for the drive on the back timber the cylinder unit of rack unit motion, wherein, a polishing member and the 2nd polishing member enclose jointly to establish and form one and be used for the holding the spherical space of soldering tin ball, the shaping has a plurality of recesses on the top face of loading board. The utility model discloses can effectively improve the roughness of soldering tin ball, simple structure, convenient to use.
Description
Technical field:
The utility model relates to roughness treatment facility technical field, relates to a kind of device of treatments B GA solder ball surface roughness in particular.
Background technology:
BGA solder ball is the pith of BGA welding, and automatic BGA solder ball feed mainly contains the cutting remelting method of forming and spray up moulding two kinds, and the former is the unit solder stick of different-diameter being cut into uniform quality, then carries out fusing balling-up in glycerine; Solder is placed in specific container (crucible) to melt by the latter, then inflates in crucible, and the solder after increase pressure makes fusing sprays from the specific aperture of crucible bottom, re-uses the higher-order of oscillation and makes it balling-up.No matter be that the solder ball surface adopting the cutting remelting method of forming or spray up moulding to be formed all exists surperficial uneven, has the surface quality problems such as gauffer.And surface smoothness (roughness) quality evaluates an important indicator of BGA solder ball quality good or not, ball failure is inhaled when the defect on surface can cause planting ball, also can affect welding performance and each transaction capabilities, therefore, also need after BGA solder ball is shaping to carry out surface roughness process to it, make it meet instructions for use.The cylinder that solder ball is normally put into rotation by prior art carries out the operation of surface smoothness, and the fineness operation of this mode effectively can not improve the surface roughness of solder ball, and effect is undesirable.
Utility model content:
The purpose of this utility model is exactly the deficiency for prior art, and a kind for the treatment of apparatus of BGA solder ball surface roughness is provided, it effectively can solve the surface quality problems such as solder ball surface is vaporific, gauffer, effectively improve the surface roughness of solder ball, structure is simple, easy to use.
Technology solution of the present utility model is as follows: a kind for the treatment of apparatus of BGA solder ball surface roughness, comprising: frame, and it comprises pedestal and is positioned at the back timber above described pedestal; By the loading plate be arranged on described pedestal that line slide rail slides; For carrying out the polishing unit of fineness operation to the sphere of solder ball, it comprises and carries out the first polished part of fineness operation to second sphere of solder ball and first sphere of solder ball is carried out to the second polished part of fineness operation; For installing the gear unit of described second polished part, it comprise one be fixedly mounted on the first cylinder on described back timber bottom face, the fixed head be arranged on the piston rod of described first cylinder, be positioned at described fixed head below and rotate and be arranged on the multiple rotating shafts on described fixed head, the gear be set in described rotating shaft, the bowl portion be fixedly installed on the free end of described rotating shaft, dismountablely in described bowl portion be provided with described second polished part; The rack unit matched with described gear unit, it comprises connecting plate and is fixedly installed on the tooth bar be meshed on described connecting plate and with described gear; Be arranged on the piston-cylinder unit for driving described rack unit to move on described back timber; Wherein, described first polished part and described second polished part enclose the diameter of Spherical Volume of formation one for accommodating described solder ball jointly, and the radius of described solder ball is equal with the radius of described diameter of Spherical Volume; The top end face of described loading plate forms multiple groove for installing described first polished part, described groove and described bowl portion one_to_one corresponding are arranged.
Preferred as technique scheme, described line slide rail is arranged on the top end face of described pedestal, and quantity is 2.
Preferred as technique scheme, described rotating shaft is arranged with a described gear.
Preferred as technique scheme, described piston-cylinder unit comprises the cylinder on the bottom face being fixedly installed on described back timber, be arranged on the installing plate on the bottom face of described cylinder, be arranged on the second cylinder and the back-up block of described installing plate both sides, the piston rod of one end and described second cylinder is hinged, the connecting rod be hinged with slide block after the other end runs through described back-up block, wherein, described slide block and described connecting plate are connected, the piston rod of described second cylinder runs through described installing plate, described back-up block forms and supplies the cell body of described slide block linear reciprocation movement and offer the through hole worn for described connecting rod, the region that described connecting rod matches with described through hole is provided with pin shaft hole, bearing pin is provided with in described pin shaft hole, described connecting rod by described bearing pin and described back-up block hinged, one end face of described cell body is also fixedly installed a limiting plate.
Preferred as technique scheme, the one-tenth-value thickness 1/10 of described gear is less than or equal to the width value of described tooth bar, and the width value of described tooth bar is greater than the movement travel of described first cylinder.
Preferred as technique scheme, described first polished part and described second polished part size, shape are identical, all in hemispherical.
Preferred as technique scheme, the top end face of described first polished part is higher than the top end face of described loading plate; The bottom face of described second polished part is lower than the bottom face in described bowl portion.
Preferred as technique scheme, the top end face of described first polished part and the bottom face of described second polished part are coated with one deck high-abrasive material.
The beneficial effects of the utility model are:
1) the first polished part and the second polished part enclose the diameter of Spherical Volume of formation one for accommodating solder ball jointly, first polished part is fixedly installed in the groove on loading plate, second polished part is fixedly installed in bowl portion, the rotation of described second polished part relative to described first polished part can be realized by gear unit and rack unit, thus the surface smoothness operation realized solder ball, structure is simple, easy to use;
2) realize transmission by wheel and rack, stable drive, reliability are high, effectively ensure that the carrying out of the surface smoothness operation of solder ball;
3) do straight reciprocating motion by tooth bar described in the second air cylinder driven, have be swift in motion, swift advantage.
Accompanying drawing illustrates:
The following drawings is only intended to schematically illustrate the utility model and explain, does not limit scope of the present utility model.Wherein:
Fig. 1 is perspective view of the present utility model;
Fig. 2 is part-structure decomposing schematic representation of the present utility model;
Fig. 3 is the structural representation of gear unit of the present utility model and rack unit;
Fig. 4 is the location diagram between loading plate of the present utility model and solder ball;
Fig. 5 is the decomposition texture schematic diagram of piston-cylinder unit of the present utility model;
Fig. 6 is the structural representation of back-up block of the present utility model.
In figure, 10, pedestal; 20, back timber; 30, loading plate; 31, line slide rail; 32, groove; 40, polishing unit; 41, the first polished part; 42, the second polished part; 50, gear unit; 51, fixed head; 52, rotating shaft; 53, gear; 54, bowl portion; 55, the first cylinder; 60, rack unit; 61, connecting plate; 62, tooth bar; 70, piston-cylinder unit; 71, cylinder; 72, the second cylinder; 73, installing plate; 74, connecting rod; 75, back-up block; 751, cell body; 752, through hole; 76, slide block; 77, limiting plate; 80, solder ball.
Detailed description of the invention:
Embodiment: by particular specific embodiment, embodiment of the present utility model is described below, those skilled in the art can understand other advantages of the present utility model and effect easily by content disclosed in the present specification, " top " mentioned in the present embodiment, " below ", " top ", " bottom " etc. describe and define according to common meaning, such as, the direction definition of reference to gravitational, the direction of gravity is below, contrary direction is top, similarly up be top or top, in below is bottom or bottom, be also only to be convenient to describe and understand, and be not used to limit the enforceable scope of the utility model, the change of its relativeness or adjustment, under changing technology contents without essence, also when being considered as the enforceable category of the utility model.
As shown in Figure 1, a kind for the treatment of apparatus of BGA solder ball surface roughness, comprising: frame, it back timber 20 comprising pedestal 10 and be positioned at above described pedestal 10, by the loading plate 30 be arranged on described pedestal 10 that line slide rail 31 slides, described line slide rail 31 is arranged on the top end face of described pedestal 10, quantity is 2, for carrying out the polishing unit 40 of fineness operation to the sphere of solder ball 80, as shown in Figure 2, described polishing unit 40 comprises and carries out the first polished part 41 of fineness operation to second sphere of solder ball 80 and first sphere of solder ball 80 is carried out to the second polished part 42 of fineness operation, described first polished part 41 and described second polished part 42 size, shape are identical, all in hemispherical, for installing the gear unit 50 of described second polished part 42, see shown in Fig. 2 and Fig. 3, described gear unit 50 comprises one and is fixedly mounted on the first cylinder 55 on described back timber 20 bottom face, be arranged on the fixed head 51 on the piston rod of described first cylinder 55, be positioned at the below of described fixed head 51 and rotate the multiple rotating shafts 52 be arranged on described fixed head 51, be set in the gear 53 in described rotating shaft 52, be fixedly installed on the bowl portion 54 on the free end of described rotating shaft 52, dismountablely in described bowl portion 54 be provided with described second polished part 42, in the utility model, each described rotating shaft 52 is arranged with a described gear 53, the rack unit 60 matched with described gear unit 50, is shown in shown in Fig. 2 and Fig. 3, and described rack unit 60 comprises connecting plate 61 and is fixedly installed on the tooth bar 62 be meshed on described connecting plate 61 and with described gear 53, be arranged on the piston-cylinder unit 70 for driving described rack unit 60 to move on described back timber 20, see shown in Fig. 1 to Fig. 4, described first polished part 41 and described second polished part 42 enclose the diameter of Spherical Volume of formation one for accommodating described solder ball 80 jointly, and the radius of described solder ball 80 is equal with the radius of described diameter of Spherical Volume, the top end face of described loading plate 30 forms multiple groove 32 for installing described first polished part 41, described groove 32 is arranged with described bowl portion 54 one_to_one corresponding, the top end face of described first polished part 41 is higher than the top end face of described loading plate 30, the bottom face of described second polished part 42 is lower than the bottom face in described bowl portion 54, the top end face of described first polished part 41 and the bottom face of described second polished part 42 are coated with one deck high-abrasive material, in the utility model, the top end face of described first polished part 41 is arranged to higher than the top end face of described loading plate 30 and the bottom face of described second polished part 42 is arranged to the bottom face lower than described bowl portion 54, the top end face of described loading plate 30 can be avoided to contact with the bottom face in described bowl portion 54, avoid unnecessary friction and wear, in addition, when carrying out polishing operation, the top end face of described first polished part 41 and the bottom face of described second polished part 42 offset, and described second polished part 42 rotates relative to described first polished part 41, there is friction between the two, therefore, the top end face of described first polished part 41 and the bottom face of described second polished part 42 are coated with one deck high-abrasive material, effectively can extend the service life of described first polished part 41 and described second polished part 42.
See shown in Fig. 5 and Fig. 6, described piston-cylinder unit 70 comprises the cylinder 71 on the bottom face being fixedly installed on described back timber 20, be arranged on the installing plate 73 on the bottom face of described cylinder 71, be arranged on the second cylinder 72 and the back-up block 75 of described installing plate 73 both sides, the piston rod of one end and described second cylinder 72 is hinged, the connecting rod 74 that the other end runs through after described back-up block 75 and slide block 76 is hinged, wherein, described slide block 76 is connected with described connecting plate 61, the piston rod of described second cylinder 72 runs through described installing plate 73, described back-up block 75 forms and supplies the cell body 751 of described slide block 76 linear reciprocation movement and offer the through hole 752 worn for described connecting rod 74, the region that described connecting rod 74 matches with described through hole 752 is provided with pin shaft hole, bearing pin is provided with in described pin shaft hole, described connecting rod 74 by described bearing pin and described back-up block 75 hinged, one end face of described cell body 751 is also fixedly installed a limiting plate 77, described limiting plate 77 and described cell body 751 enclose the passage that formation one is slided for described slide block 76, the setting of described limiting plate 77 can prevent described slide block 76 from departing from described cell body 751.Described piston-cylinder unit 70 can provide a linear reciprocating motion for described connecting plate 61, when described tooth bar 62 engages with described gear 53, described gear 53 can be ordered about rotate, the rotation of described gear 53 can drive again described rotating shaft 52 to rotate, the rotation of described rotating shaft 52 and then drive described bowl portion 54 to rotate, namely can drive described bowl portion 54 to rotate with engaging of described gear 53 by described tooth bar 62.The one-tenth-value thickness 1/10 of gear 53 described in the utility model is less than or equal to the width value of described tooth bar 62, the width value of described tooth bar 62 is greater than the movement travel of described first cylinder 55, like this when described first cylinder 55 presses down described fixed head 51, still can ensure that described tooth bar 62 is in engagement with described gear 53, ensure effective transmission.
Operation principle: during use, by described line slide rail 31, described loading plate 30 is moved to feeding area, described solder ball 80 is placed on after in described first polished part 41, by described line slide rail 31, described loading plate 30 is slid onto the below of described gear unit 50 again, described first polished part 41 is made to be positioned at immediately below described second polished part 42, then described fixed head 51 is pressed down by described first cylinder 55, the top end face of the bottom face of described second polished part 42 and described first polished part 41 is offseted, now, described second polished part 42 encloses formation one diameter of Spherical Volume with described first polished part 41, described solder ball 80 is positioned at described diameter of Spherical Volume, described connecting plate 61 is driven to do straight reciprocating motion by described second cylinder 72, described tooth bar 62 drives described gear 53 to rotate, the rotation of described gear 53 drives again described rotating shaft 52 to rotate, the rotation of described rotating shaft 52 drives described bowl portion 54 to rotate, described second polished part 42 of final drive rotates, radius due to described solder ball 80 in the utility model is equal with the radius of described diameter of Spherical Volume, therefore, described first polished part 41 and described second polished part 42 can produce friction to the surface of described solder ball 80, vaporific by described solder ball 80 surface, gauffers etc. polish, thus improve the surface roughness of solder ball.
Described embodiment in order to illustrative the utility model, but not for limiting the utility model.Any those skilled in the art all without prejudice under spirit of the present utility model and category, can modify to described embodiment, therefore rights protection scope of the present utility model, should listed by claim of the present utility model.
Claims (8)
1. a treating apparatus for BGA solder ball surface roughness, is characterized in that, comprising:
Frame, it comprises pedestal (10) and is positioned at the back timber (20) of described pedestal (10) top;
By the loading plate (30) be arranged on described pedestal (10) that line slide rail (31) slides;
For carrying out the polishing unit (40) of fineness operation to the sphere of solder ball (80), it comprises and carries out first polished part (41) of fineness operation to second sphere of solder ball (80) and first sphere of solder ball (80) is carried out to second polished part (42) of fineness operation;
For installing the gear unit (50) of described second polished part (42), it comprises one and is fixedly mounted on the first cylinder (55) on described back timber (20) bottom face, be arranged on the fixed head (51) on the piston rod of described first cylinder (55), be positioned at the below of described fixed head (51) and rotate the multiple rotating shafts (52) be arranged on described fixed head (51), be set in the gear (53) in described rotating shaft (52), be fixedly installed on the bowl portion (54) on the free end of described rotating shaft (52), dismountablely in described bowl portion (54) be provided with described second polished part (42),
The rack unit (60) matched with described gear unit (50), it comprises connecting plate (61) and is fixedly installed on described connecting plate (61) goes up and the tooth bar (62) be meshed with described gear (53);
Be arranged on the piston-cylinder unit (70) for driving described rack unit (60) to move on described back timber (20);
Wherein, described first polished part (41) and described second polished part (42) enclose the diameter of Spherical Volume of formation one for accommodating described solder ball (80) jointly, and the radius of described solder ball (80) is equal with the radius of described diameter of Spherical Volume; The top end face of described loading plate (30) forms multiple groove (32) for installing described first polished part (41), described groove (32) and described bowl portion (54) one_to_one corresponding are arranged.
2. the treating apparatus of BGA solder ball surface roughness according to claim 1, it is characterized in that: described line slide rail (31) is arranged on the top end face of described pedestal (10), quantity is 2.
3. the treating apparatus of BGA solder ball surface roughness according to claim 1, is characterized in that: described rotating shaft (52) is arranged with a described gear (53).
4. the treating apparatus of BGA solder ball surface roughness according to claim 1, it is characterized in that: described piston-cylinder unit (70) comprises the cylinder (71) on the bottom face being fixedly installed on described back timber (20), be arranged on the installing plate (73) on the bottom face of described cylinder (71), be arranged on the second cylinder (72) and the back-up block (75) of described installing plate (73) both sides, the piston rod of one end and described second cylinder (72) is hinged, the other end runs through the connecting rod (74) that described back-up block (75) is hinged with slide block (76) afterwards, wherein, described slide block (76) and described connecting plate (61) are connected, the piston rod of described second cylinder (72) runs through described installing plate (73), described back-up block (75) forms and supplies the cell body (751) of described slide block (76) linear reciprocation movement and offer the through hole (752) worn for described connecting rod (74), the upper region of matching with described through hole (752) of described connecting rod (74) is provided with pin shaft hole, bearing pin is provided with in described pin shaft hole, described connecting rod (74) by described bearing pin and described back-up block (75) hinged, one end face of described cell body (751) is also fixedly installed a limiting plate (77).
5. the treating apparatus of BGA solder ball surface roughness according to claim 1, it is characterized in that: the one-tenth-value thickness 1/10 of described gear (53) is less than or equal to the width value of described tooth bar (62), the width value of described tooth bar (62) is greater than the movement travel of described first cylinder (55).
6. the treating apparatus of BGA solder ball surface roughness according to claim 1, is characterized in that: described first polished part (41) and described second polished part (42) size, shape are identical, all in hemispherical.
7. the treating apparatus of BGA solder ball surface roughness according to claim 1, is characterized in that: the top end face of described first polished part (41) is higher than the top end face of described loading plate (30); The bottom face of described second polished part (42) is lower than the bottom face of described bowl portion (54).
8. the treating apparatus of BGA solder ball surface roughness according to claim 7, is characterized in that: the top end face of described first polished part (41) and the bottom face of described second polished part (42) are coated with one deck high-abrasive material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520934047.5U CN205096970U (en) | 2015-11-22 | 2015-11-22 | BGA soldering tin ball roughness's processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520934047.5U CN205096970U (en) | 2015-11-22 | 2015-11-22 | BGA soldering tin ball roughness's processing apparatus |
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| Publication Number | Publication Date |
|---|---|
| CN205096970U true CN205096970U (en) | 2016-03-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520934047.5U Expired - Fee Related CN205096970U (en) | 2015-11-22 | 2015-11-22 | BGA soldering tin ball roughness's processing apparatus |
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| CN (1) | CN205096970U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105345618A (en) * | 2015-11-22 | 2016-02-24 | 苏州光韵达光电科技有限公司 | Processing unit for BGA solder ball surface roughness |
| CN109623541A (en) * | 2018-10-16 | 2019-04-16 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Bga device soldered ball eliminating equipment and its method |
-
2015
- 2015-11-22 CN CN201520934047.5U patent/CN205096970U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105345618A (en) * | 2015-11-22 | 2016-02-24 | 苏州光韵达光电科技有限公司 | Processing unit for BGA solder ball surface roughness |
| CN105345618B (en) * | 2015-11-22 | 2017-07-04 | 苏州光韵达光电科技有限公司 | A kind of processing unit of BGA solder balls surface roughness |
| CN109623541A (en) * | 2018-10-16 | 2019-04-16 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Bga device soldered ball eliminating equipment and its method |
| CN109623541B (en) * | 2018-10-16 | 2020-07-17 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Solder ball removing equipment and method for BGA packaging device |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160323 Termination date: 20161122 |
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| CF01 | Termination of patent right due to non-payment of annual fee |