CN205066981U - Pressure sensor - Google Patents
Pressure sensor Download PDFInfo
- Publication number
- CN205066981U CN205066981U CN201520790800.8U CN201520790800U CN205066981U CN 205066981 U CN205066981 U CN 205066981U CN 201520790800 U CN201520790800 U CN 201520790800U CN 205066981 U CN205066981 U CN 205066981U
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- Prior art keywords
- cavity
- bleeder vent
- separator
- pressure transducer
- roof
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Abstract
The utility model provides a pressure sensor, including have accommodating space the casing, general accommodating space separates into the separator of first cavity of mutually independent and second cavity and is located pressure sensor chip and integrated circuit chip in the second cavity, the casing is provided with the intercommunication first cavity and outside first bleeder vent, the intercommunication has been seted up on the separator first cavity with the second bleeder vent of second cavity, the second bleeder vent with first bleeder vent dislocation set. The utility model discloses a set up the separator on pressure sensor to set up mutual dislocation set's bleeder vent respectively on separator and shell, thereby avoid extraneous light and pollutant direct action to the inside chip of packaging structure, and then weaken the influence that these factors caused to the sensor chip precision, promote the reliability of sensor.
Description
[technical field]
The utility model relates to a kind of sensor technical field, particularly relates to a kind of pressure transducer.
[background technology]
Along with the develop rapidly that science and technology is maked rapid progress, intelligentized portable electric appts comes into vogue gradually, such as smart mobile phone, Intelligent bracelet, intelligence on hand, panel computer etc.User is constantly pursuit portable electric appts is intelligentized while, and what more focus on is need portable electric appts to have the impression of colourful Consumer's Experience.Pressure transducer is placed in portable electric appts by increasing manufacturer at present, and the sensor of test pressure is strain transducer usually, but the measuring accuracy of strain gauge is low.
A kind of MEMS pressure sensor is provided to improve measuring accuracy in prior art, as shown in Figure 1, existing MEMS sensor 3 comprise substrate 32, coordinate with substrate 32 form receiving space 300 shell 31, be housed in MEMS pressure sensor chip 33 in receiving space and asic chip 34.Shell 31 offers bleeder vent 310.But extraneous light and pollutant directly can enter into receiving space inside by bleeder vent, thus on the impact that sensor chip precision causes, reduce the reliability of sensor.
Therefore, be necessary to provide a kind of new pressure transducer to solve the problems referred to above.
[utility model content]
The purpose of this utility model is to provide a kind of extraneous light and pollutant can avoided to be applied directly to pressure transducer on the chip of encapsulating structure inside.
The technical solution of the utility model is as follows: a kind of pressure transducer, comprise the housing with receiving space, the separator described receiving space being separated into the first separate cavity and the second cavity and be arranged in pressure sensor chip and the integrated circuit (IC) chip of described second cavity, described housing is provided with and is communicated with described first cavity and the first outside bleeder vent, described separator offers the second bleeder vent being communicated with described first cavity and described second cavity, described second bleeder vent and described first bleeder vent shift to install.
Preferably, described housing comprise substrate and with described substrate mounting to form the upper cover of described receiving space, described upper cover comprises the first roof and bends along described first roof the first side wall extended to form, and described the first side wall is fixedly connected with described substrate.
Preferably, described first bleeder vent is arranged on the first roof.
Preferably, described separator is tabular, and the side of described separator is fixedly connected with described the first side wall.
Preferably, described separator comprises with spaced second roof of described first roof and bends the second sidewall extended to form along described second roof, and described second sidewall is fixedly connected with described substrate.
Preferably, described second bleeder vent is arranged on described second roof.
Preferably, described second bleeder vent is arranged on the second sidewall.
Preferably, described separator and described upper cover one-body molded.
Preferably, the volume ratio of described first cavity and described second cavity is 1:2 ~ 1:4.
The beneficial effects of the utility model are: the utility model by arranging separator on pressure transducer, and on separator and shell, offer the bleeder vent of mutual dislocation setting respectively, thus avoid extraneous light and pollutant to be applied directly on the chip of encapsulating structure inside, and then weaken the impact that these factors cause sensor chip precision, promote the reliability of sensor.
[accompanying drawing explanation]
Fig. 1 is the structural representation of pressure transducer in prior art;
The structural representation of the pressure transducer of the first embodiment that Fig. 2 provides for the utility model;
The structural representation that the pressure sensing of the second embodiment that Fig. 3 provides for the utility model rises.
[embodiment]
Below in conjunction with drawings and embodiments, the utility model is described in further detail.
With reference to figure 2, the pressure transducer 1 of the first embodiment that the utility model provides comprise there is receiving space 100 housing 10, for receiving space 100 being divided into the separator 50 of the first separate cavity 101 and the second cavity 102 and the pressure sensor chip 30 be contained in the second cavity 102 and integrated circuit (IC) chip 40.Housing 10 offers the first bleeder vent 110 being communicated with outside and the first cavity 101.The second bleeder vent 500, second bleeder vent 500 and the first bleeder vent 110 that separator 50 offer connection first cavity 101 and the second cavity 102 shift to install.Adopt this kind of structure, extraneous light and pollutant can be avoided to be applied directly on the chip of encapsulating structure inside, and then weaken the impact that these factors cause sensor chip precision, promote the reliability of sensor.In the present embodiment, the volume ratio between the first cavity 101 and the second cavity 102 is 1:2 ~ 1:4, is preferably 1:4.Adopt this kind of structure can improve the sensitivity of pressure sensor chip.
In the present embodiment, housing 10 comprises substrate 12 and assembles to be formed the upper cover 11 of receiving space 100 with substrate 12.Upper cover 11 is provided with this first bleeder vent 110.Substrate 12 is PCB, and pressure sensor chip 30 and integrated circuit (IC) chip 40 are disposed on substrate 12 side by side, and realizes the electrical connection between three by binding gold thread 60.In other embodiments, this pressure sensor chip 30 and the stacking setting of integrated circuit (IC) chip 40 are on the substrate 12.In other examples, this bleeder vent also can be arranged on the substrate 12, and pressure sensor chip 30 and integrated circuit (IC) chip 40 is arranged on upper cover 11.Or pressure sensor chip and integrated circuit (IC) chip one are arranged on substrate, and another is arranged on and covers.In the present embodiment, pressure sensor chip 40 can be MEMS pressure sensor chip.
The roughly rectangular box body shape of upper cover 11, comprises the first roof 111 and bends the first side wall 112 extended to form along the first roof 111.The end of the first side wall 112 is fixing on the substrate 12 by welding, the mode such as bonding.First bleeder vent 110 is arranged on the first roof 111.In other embodiments, the first bleeder vent 110 also can be arranged on the first side wall 112.
Separator 50 is roughly in tabular, and separator 50 and interval parallel with roof 111 is arranged, and each side of separator 50 is fixed on sidewall 112 by the mode such as welding, bonding.In other embodiments, separator 50 is one-body molded with upper cover 12.Second bleeder vent 500 is arranged on separator 50, and shifts to install with the first bleeder vent 110, and namely two bleeder vents are not just to setting.
With reference to figure 3, the pressure transducer 2 of the second embodiment that the utility model provides, from the difference of pressure transducer 1, this pressure transducer 2 is only that the structure of separator is different.In the present embodiment, the roughly rectangular box body shape of separator 51, comprises the second roof 511 and bends the second sidewall 512 extended to form along the second roof 511 towards substrate 12.Second roof 511 is roughly in tabular, and the parallel and interval of the first roof 111 is arranged, and the second sidewall 512 and the parallel and interval of the first side wall 112 are arranged.Separator 51 is fixedly connected with substrate 12 with welding, the mode such as bonding by the end of the second sidewall 512.In other embodiments, separator 51 can be one-body molded with upper cover 11.Separator 51 and substrate 12 define the second cavity 102 of hold pressure unit chip 30 and integrated circuit (IC) chip 40.Upper cover 11, separator 51 and substrate 12 define the first cavity 101.In the present embodiment, the second bleeder vent 510 is opened on the second roof 511, and shifts to install with the first bleeder vent 110.In other examples, the second bleeder vent 510 can be arranged on the second sidewall 512.
Above-described is only embodiment of the present utility model; it should be pointed out that for the person of ordinary skill of the art at this, under the prerequisite not departing from the utility model creation design; improvement can also be made, but these all belong to protection domain of the present utility model.
Claims (9)
1. a pressure transducer, comprise the housing with receiving space, it is characterized in that, described pressure transducer also comprises the separator described receiving space being separated into the first separate cavity and the second cavity and the pressure sensor chip being arranged in described second cavity and integrated circuit (IC) chip, described housing is provided with and is communicated with described first cavity and the first outside bleeder vent, described separator offers the second bleeder vent being communicated with described first cavity and described second cavity, described second bleeder vent and described first bleeder vent shift to install.
2. pressure transducer according to claim 1, it is characterized in that, described housing comprise substrate and with described substrate mounting to form the upper cover of described receiving space, described upper cover comprises the first roof and bends along described first roof the first side wall extended to form, and described the first side wall is fixedly connected with described substrate.
3. pressure transducer according to claim 2, is characterized in that, described first bleeder vent is arranged on the first roof.
4. pressure transducer according to claim 3, is characterized in that, described separator is tabular, and the side of described separator is fixedly connected with described the first side wall.
5. pressure transducer according to claim 3, it is characterized in that, described separator comprises with spaced second roof of described first roof and bends the second sidewall extended to form along described second roof, and described second sidewall is fixedly connected with described substrate.
6. pressure transducer according to claim 5, is characterized in that, described second bleeder vent is arranged on described second roof.
7. pressure transducer according to claim 5, is characterized in that, described second bleeder vent is arranged on the second sidewall.
8. pressure transducer according to claim 2, is characterized in that, described separator and described upper cover one-body molded.
9. pressure transducer according to claim 1, is characterized in that, the volume ratio of described first cavity and described second cavity is 1:2 ~ 1:4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520790800.8U CN205066981U (en) | 2015-10-14 | 2015-10-14 | Pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520790800.8U CN205066981U (en) | 2015-10-14 | 2015-10-14 | Pressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205066981U true CN205066981U (en) | 2016-03-02 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520790800.8U Active CN205066981U (en) | 2015-10-14 | 2015-10-14 | Pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205066981U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106123996A (en) * | 2016-06-25 | 2016-11-16 | 苏州赛智达智能科技有限公司 | Digital level indicator |
| CN106289602A (en) * | 2016-07-28 | 2017-01-04 | 麦克传感器股份有限公司 | Gravitation cancellation element and method |
| CN106525295A (en) * | 2016-11-11 | 2017-03-22 | 中国电子科技集团公司第四十八研究所 | Silicon piezoresistive type core body |
| CN110345985A (en) * | 2018-04-05 | 2019-10-18 | 海成帝爱斯株式会社 | Optical sensor arrangement and packaging part comprising this optical sensor arrangement |
-
2015
- 2015-10-14 CN CN201520790800.8U patent/CN205066981U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106123996A (en) * | 2016-06-25 | 2016-11-16 | 苏州赛智达智能科技有限公司 | Digital level indicator |
| CN106289602A (en) * | 2016-07-28 | 2017-01-04 | 麦克传感器股份有限公司 | Gravitation cancellation element and method |
| CN106525295A (en) * | 2016-11-11 | 2017-03-22 | 中国电子科技集团公司第四十八研究所 | Silicon piezoresistive type core body |
| CN110345985A (en) * | 2018-04-05 | 2019-10-18 | 海成帝爱斯株式会社 | Optical sensor arrangement and packaging part comprising this optical sensor arrangement |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |