CN205050871U - LED paster support of double chip pad formula - Google Patents
LED paster support of double chip pad formula Download PDFInfo
- Publication number
- CN205050871U CN205050871U CN201520812784.8U CN201520812784U CN205050871U CN 205050871 U CN205050871 U CN 205050871U CN 201520812784 U CN201520812784 U CN 201520812784U CN 205050871 U CN205050871 U CN 205050871U
- Authority
- CN
- China
- Prior art keywords
- radiating area
- plastic cement
- led patch
- main body
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- Led Device Packages (AREA)
Abstract
The utility model discloses a LED paster support of double chip pad formula relates to the SMD support technical field of LED lamp and LED. The utility model discloses a metal support base and plastic main part, the shaping of plastic main part is on the metal support base, the lateral part of plastic main part surrounds the metal support base in the plastic main part downwards along stretching to the length direction along LED paster support who makes the metal support base exposes first soldering tin foot, first radiating area, second radiating area and second soldering tin foot in proper order downwards. Because the utility model discloses the lateral part of plastic main part surrounds the metal support base in the plastic main part downwards along stretching, therefore combines between messenger's plastic main part and the metal support base together firmly, because the length direction along LED paster support of metal support base exposes first soldering tin foot, first radiating area, second radiating area and second soldering tin foot in proper order downwards, thereby makes the utility model discloses the welding is convenient, and the heat dissipation is good.
Description
Technical field
The utility model relates to LED and LED patch type bracket technical field, particularly a kind of LED patch support of dual chip pad formula.
Background technology
Along with LED illumination technology is increasingly mature and development, LED has become a kind of new type light source, is widely used in every field.LED chip being made into the LED with actual illumination effect will through the technical process of a more complicated, and wherein will LED chip is mounted on support, this support be referred to as LED patch support.
LED patch support comprises metallic support pedestal and plastic cement main body, plastic cement main body takes shape on metallic support pedestal, during production due to plastic cement main body and metallic support pedestal different in conjunction with material, cause plastic cement main body and metallic support pedestal bond strength deficiency, in subsequent handling, particularly in bending technique, easily occur that segregation phenomenon appears in plastic cement main body and metallic support pedestal, cause the excesssive gap of plastic cement main body and metallic support pedestal, oxygen in air by entered into plastic cement main body by the gap between plastic cement main body and metallic support pedestal bowl cup in the middle of, cause the pad oxide of LED patch support, conductance reduces, LED is finally caused easily to turn to be yellow aging, LED brightness deterioration, service life reduction, quality variation.
Utility model content
The technical problems to be solved in the utility model is according to above-mentioned the deficiencies in the prior art, a kind of LED patch support of dual chip pad formula is provided, this LED patch support can make greatly strengthening in conjunction with confining force between plastic cement main body and metallic support pedestal, the problem that the air-tightness of LED patch support is bad can be improved, solving LED easily turns to be yellow aging, LED brightness deterioration, service life reduction, these problems of quality variation.
For solving the problems of the technologies described above, the technical solution of the utility model is: a kind of LED patch support of dual chip pad formula, comprise metallic support pedestal and plastic cement main body, described plastic cement main body takes shape on metallic support pedestal, the sidepiece of described plastic cement main body is downwards along stretching, metallic support pedestal is surrounded in plastic cement main body, and makes metallic support pedestal expose the first scolding tin pin, the first radiating area, the second radiating area and the second scolding tin pin successively downwards along the length direction of LED patch support.
As to further elaboration of the present utility model:
Described first radiating area sidepiece and the second radiating area sidepiece are provided with the step be inwardly recessed, and the sidepiece of described plastic cement main body, along stretching and being filled in this step, forms firm " L " shape extension.
The length of described LED patch support is 7.0mm, width is 2.0mm, described first radiating area and the second radiating area are symmetrical arranged, the length ratio of the first radiating area/the second radiating area and LED patch support is the 1: 5 ~ 1: 4, first radiating area/the second radiating area is 1: 2 ~ 3: 5 with the ratio of the width of LED patch support.
Described plastic cement main body comprises at the bottom of rim of a cup, wall of cup and cup, metallic support pedestal is exposed at the bottom of this glass, and the metallic support pedestal exposed is provided with the first pad and the second pad, first pad and the second pad are coated with silver-colored circuit, be separated by cut-off rule between first pad and the second pad, filled by plastic cement in this cut-off rule.
Described rim of a cup is fillet rectangle, it is domatic that wall of cup is provided with reflection, the domatic long reflection comprised along two symmetries of LED patch support length direction of this reflection is domatic, and it is domatic along the short reflection of two symmetries of LED patch support Width, angle between the long reflection of described two symmetries is domatic is 40-50 degree, and the angle between the short reflection of described two symmetries is domatic is 102-118 degree.
The beneficial effects of the utility model are: because the sidepiece of the utility model plastic cement main body is downwards along stretching, is surrounded on by metallic support pedestal in plastic cement main body, thus makes firmly to combine between plastic cement main body and metallic support pedestal; Because the length direction along LED patch support of metallic support pedestal exposes the first scolding tin pin, the first radiating area, the second radiating area and the second scolding tin pin successively downwards, thus make the utility model convenient welding, heat radiation is good.
Accompanying drawing explanation
Fig. 1 is the plan structure figure of LED patch support.
Fig. 2 is the face upwarding assumption diagram of LED patch support.
Fig. 3 is the cutaway view along A-A line in Fig. 2.
Fig. 4 is the cutaway view along B-B line in Fig. 2.
Fig. 5 is the plan structure figure after LED patch support attachment LED chip.
In figure: 1. metallic support pedestal; 11. first scolding tin pin; 12. first radiating areas; 13. second radiating areas; 14. second scolding tin pin; 2.. plastic cement main body; 21. " L " shape extension; 22. rims of a cup; 23. wall of cups; At the bottom of 24. glasss; 3. the first pad; 4. the second pad; 5. cut-off rule; 6. the first LED chip; 7. the second LED chip; 8. strong alloy wire.
Embodiment
Below in conjunction with accompanying drawing, structural principle of the present utility model and operation principle are described in further detail.
As Figure 1-Figure 4, the utility model is a kind of LED patch support of dual chip pad formula, comprise metallic support pedestal 1 and plastic cement main body 2, described plastic cement main body 2 takes shape on metallic support pedestal 1, the sidepiece of described plastic cement main body 2 is downwards along stretching, metallic support pedestal 1 is surrounded in plastic cement main body 2, and makes metallic support pedestal 1 expose the first radiating area, scolding tin pin 11, first radiating area 12, second 13 and the second scolding tin pin 14 successively downwards along the length direction of LED patch support.
As shown in Figure 4, described first radiating area 12 sidepiece and the second radiating area 13 sidepiece are provided with the step be inwardly recessed, and the sidepiece of described plastic cement main body 2, along stretching and being filled in this step, forms firm " L " shape extension 21.
As shown in Figure 2, the length of described LED patch support is 7.0mm, width is 2.0mm, described first radiating area 12 and the second radiating area 13 are symmetrical arranged, the length ratio of the first radiating area/the second radiating area and LED patch support is the 1: 5 ~ 1: 4, first radiating area/the second radiating area is 1: 2 ~ 3: 5 with the ratio of the width of LED patch support.
As shown in Figure 3, described plastic cement main body 2 to comprise at the bottom of rim of a cup 22, wall of cup 23 and cup 24, at the bottom of this glass, 24 expose metallic support pedestal 1, and the metallic support pedestal 1 exposed is provided with the first pad 3 and the second pad 4, first pad 3 and the second pad 4 are coated with silver-colored circuit, be separated by cut-off rule 5 between first pad 3 and the second pad 4, filled by plastic cement in this cut-off rule 5.As shown in Figure 5, during welding LED chip, the first LED chip 6 is mounted on the first pad 3, the second LED chip 7 is mounted on the second pad 4; Then respectively draw a strong alloy wire 8 at the two ends of the first LED chip 6, wherein a strong alloy wire 8 welds the first pad 3, and another root is good for alloy wire 8 and is welded the second pad 3; Then respectively draw a strong alloy wire 8 at the two ends of the second LED chip 7, wherein a strong alloy wire 8 welds the first pad 3, and another root is good for alloy wire 8 and is welded the second pad 3.
As shown in Figure 1, described rim of a cup 22 is fillet rectangle, it is domatic that wall of cup 23 is provided with reflection, the domatic long reflection comprised along two symmetries of LED patch support length direction of this reflection is domatic, and it is domatic along the short reflection of two symmetries of LED patch support Width, angle a between the long reflection of described two symmetries is domatic is 40-50 degree (with reference to Fig. 4), and the angle b between the short reflection of described two symmetries is domatic is 102-118 degree (with reference to Fig. 3).Adopt the wall of cup 23 of this kind of structure can improve the reflecting light rate of plastic cement main body 2 well.
In technique scheme, the material of described plastic cement main body 2 is preferably phenylpropanolamine HC1 PPA, and described metallic support pedestal 1 can adopt red metal, brass and stainless steel, is preferably red metal.
The above is only the utility model better embodiment, every above execution mode is done according to the technical solution of the utility model any trickle amendment, equivalent variations and modification, all belong in the scope of technical solutions of the utility model.
Claims (6)
1. the LED patch support of a dual chip pad formula, it is characterized in that: comprise metallic support pedestal and plastic cement main body, described plastic cement main body takes shape on metallic support pedestal, the sidepiece of described plastic cement main body is downwards along stretching, metallic support pedestal is surrounded in plastic cement main body, and makes metallic support pedestal expose the first scolding tin pin, the first radiating area, the second radiating area and the second scolding tin pin successively downwards along the length direction of LED patch support.
2. the LED patch support of dual chip pad formula according to claim 1, it is characterized in that: described first radiating area sidepiece and the second radiating area sidepiece are provided with the step be inwardly recessed, the sidepiece of described plastic cement main body, along stretching and being filled in this step, forms firm " L " shape extension.
3. the LED patch support of dual chip pad formula according to claim 1, it is characterized in that: the length of described LED patch support is 7.0mm, width is 2.0mm, described first radiating area and the second radiating area are symmetrical arranged, the length ratio of the first radiating area/the second radiating area and LED patch support is the 1: 5 ~ 1: 4, first radiating area/the second radiating area is 1: 2 ~ 3: 5 with the ratio of the width of LED patch support.
4. the LED patch support of dual chip pad formula according to claim 1, it is characterized in that: described plastic cement main body comprises at the bottom of rim of a cup, wall of cup and cup, metallic support pedestal is exposed at the bottom of this glass, and the metallic support pedestal exposed is provided with the first pad and the second pad, first pad and the second pad are coated with silver-colored circuit, be separated by cut-off rule between first pad and the second pad, filled by plastic cement in this cut-off rule.
5. the LED patch support of dual chip pad formula according to claim 4, it is characterized in that: described rim of a cup is fillet rectangle, it is domatic that wall of cup is provided with reflection, the domatic long reflection comprised along two symmetries of LED patch support length direction of this reflection is domatic, and it is domatic along the short reflection of two symmetries of LED patch support Width, angle between the long reflection of described two symmetries is domatic is 40-50 degree, and the angle between the short reflection of described two symmetries is domatic is 102-118 degree.
6., according to the LED patch support of dual chip pad formula described in any one in claim 1-5, it is characterized in that: described plastic cement main body for PPA plastic cement main body, described metallic support pedestal is red metal pedestal or brass pedestal or stainless steel pedestal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520812784.8U CN205050871U (en) | 2015-10-15 | 2015-10-15 | LED paster support of double chip pad formula |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520812784.8U CN205050871U (en) | 2015-10-15 | 2015-10-15 | LED paster support of double chip pad formula |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205050871U true CN205050871U (en) | 2016-02-24 |
Family
ID=55344416
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520812784.8U Expired - Fee Related CN205050871U (en) | 2015-10-15 | 2015-10-15 | LED paster support of double chip pad formula |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205050871U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106067508A (en) * | 2016-08-03 | 2016-11-02 | 江西亚中电子科技有限公司 | Multipurpose dual-colored LED patch support |
| CN106449938A (en) * | 2016-10-09 | 2017-02-22 | 李鹤荣 | LED patch bracket |
| CN109599472A (en) * | 2018-11-29 | 2019-04-09 | 江门市三兴照明科技有限公司 | A kind of LED core chip package |
-
2015
- 2015-10-15 CN CN201520812784.8U patent/CN205050871U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106067508A (en) * | 2016-08-03 | 2016-11-02 | 江西亚中电子科技有限公司 | Multipurpose dual-colored LED patch support |
| CN106449938A (en) * | 2016-10-09 | 2017-02-22 | 李鹤荣 | LED patch bracket |
| CN109599472A (en) * | 2018-11-29 | 2019-04-09 | 江门市三兴照明科技有限公司 | A kind of LED core chip package |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160224 Termination date: 20191015 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |