CN205032865U - Solder ball manufacturing system - Google Patents
Solder ball manufacturing system Download PDFInfo
- Publication number
- CN205032865U CN205032865U CN201520583601.XU CN201520583601U CN205032865U CN 205032865 U CN205032865 U CN 205032865U CN 201520583601 U CN201520583601 U CN 201520583601U CN 205032865 U CN205032865 U CN 205032865U
- Authority
- CN
- China
- Prior art keywords
- solder
- heater
- electrode
- micro
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a solder ball manufacturing system, it produces the device, is used for to carry out the collection device who collects and be used for controlling the circuit control device that entire system planned as a whole the operation spraying the solder droplet to spout the device a little, be arranged in to spout heating device that the device solder goes on heating a little, to be used for providing the stationary magnetic field device of stationary magnetic field for the solder spouts the device a little, to be used for to produce the electric field that the solder spouts the required electric field of drive power of device a little to the solder including the solder. The utility model discloses under the effect of nitrogen gas after the pressure regulating, can overcome because toper portion and elongated hole portion design the high driving pressure who brings, and then the solder ball of shaping play high accuracy.
Description
Technical field
The utility model relates to the micro-spray field of liquid, and what be specifically related to is a kind of soldered ball manufacturing system for shaping micron order soldered ball.
Background technology
Chinese patent literature CN103203294A discloses a kind of electromagnetic micro jet device, and it is provided with and puts magnet, sprays cavity, underlying magnet, electrode, feed pipe, feed tank, elevating mechanism, stepper motor and pulse current device; On put magnet and underlying magnet and be fixed in the upper and lower surface of spraying cavity respectively; Spray cavity and be provided with liquid-inlet and fluid injector, electrode is located at and is sprayed cavity both sides, and stretch into injection inside cavity, feed pipe one end is communicated with spray chamber intracoelomic cavity, the feed pipe other end is communicated with feed tank, elevating mechanism input is connected with stepper motor, and elevating mechanism output is connected with feed tank, and pulse current device two end is connected to electrode.
What it utilized liquid metal can electric conductivity, combine upper magnetic field liquid towards metal again and produce Ampere force, this Ampere force can be converted into the kinetic energy of liquid metal, drive the injection of metal liquid, greatly simplifie the frame for movement of injection apparatus, it is more preferably suitable for pulse-type current control mode, is easy to the direct control of the aspects such as the size to driving force, action time, injection frequency.Under normal temperature state, common metal major part is all solid-state, in order to realize micro-spray operation, then needs to heat that solid metallic is transformed into liquid state to injection cavity, need arrange calandria thus in injection cavity both sides; As a result the applicant again studies and have developed Chinese utility model patent ZL201520210143.5, it relates to a kind of solder heater, and solve the select permeability of raw metal, but due in a lot of industry demands such as such as surface-mounted integrated circuit welding, need the soldered ball using about 1mm, adopt above-mentioned traditional structure, although can soldered ball be formed, do not become the soldered ball of precision like this.
For the problems referred to above, the present inventor's hammer away, has this case to produce then.
Utility model content
The purpose of this utility model is to provide a kind of soldered ball manufacturing system, and it may be used for molding high-precision soldered ball.
In order to reach above-mentioned purpose, solution of the present utility model is:
A kind of soldered ball manufacturing system, wherein, comprise solder micro-spray device, for solder in solder micro-spray device is heated heater, for provide for solder micro-spray device the stationary magnetic field device of stationary magnetic field, for generation of solder micro-spray device driving force needed for electric field electric field generating apparatus, for ejecting gathering-device that solder droplet collects and for controlling the circuit control device that whole system is planned as a whole to run;
This solder micro-spray device comprises upper cover, solder heater, first electrode, second electrode and shower nozzle, this solder heater has solder and stores chamber, heating plate standing groove, sensor mounting hole and bolt hole, this solder storage chamber and shower nozzle are separately positioned on two bottom surfaces of solder heater, it is elongated slot-like that this solder stores chamber, this heating plate standing groove is arranged on the side of solder heater, this first electrode and the second electrode base are provided with bolt hole, the two side that this first electrode and the second electrode store chamber along solder is respectively laid and is fixed by bolt hole by bolt, this covers and is also formed with nitrogen inlet, this nitrogen inlet and solder store chamber and are connected, and this nitrogen inlet is connected with the nitrogen pot after pressure regulation to allow droplet be in injection critical point, this shower nozzle has and stores the tapered portion and elongate aperture section that chamber is connected successively with solder.
Further, this heater comprises thermocouple, temperature controller, industrial ceramics sheet and DC controling ac solid-state relay; This stationary magnetic field device comprises at least one permanent magnet, and this gathering-device comprises two-dimensional movement platform, lifting platform, rotation platform, collecting board and collection liquid; This circuit control device comprises DC low voltage power supply, single-chip microcomputer, industrial relay and optocoupler amplification module.
After adopting said structure, a kind of soldered ball manufacturing system that the utility model relates to, the utility model utilizes tapered portion and the elongate aperture section of shower nozzle, can from the more high-precision soldered ball of elongate aperture section ejection;
The utility model passes into nitrogen by storing in chamber toward solder, and allow nitrogen inlet be connected with the nitrogen pot after pressure regulation, it can play deaeration blocks the situations such as nozzle generation to avoid solder oxidized on the one hand, nitrogen can be allowed as mainly driving power by pressure regulation on the other hand, namely allow droplet be in injection critical point, under the effect of electromagnetic force, then break through this critical point realize droplet ejection; Under the effect of nitrogen after pressure regulation like this, the high driving pressure brought based on tapered portion and elongate aperture section design can be overcome, and then mold high-precision soldered ball.
Accompanying drawing explanation
Fig. 1 is the three-dimensional combination figure that the utility model relates to a kind of solder micro-spray device.
Fig. 2 is the three-dimensional exploded view that the utility model relates to a kind of solder micro-spray device.
Fig. 3 is the assembled sectional view that the utility model relates to a kind of solder micro-spray device.
Fig. 4 is the principle framework figure that the utility model relates to a kind of soldered ball manufacturing system.
In figure:
Solder micro-spray device-1; Upper cover-11; Nitrogen inlet-111;
Guide pad-112; Counter sink-113;
Solder heater-12; Solder stores chamber-121; Heating plate standing groove-122;
Sensor mounting hole-123; Junction-125; First electrode-13;
Second electrode-14; Shower nozzle-15; Tapered portion-151;
Elongate aperture section-152; Bolt hole-16; Nut-17;
High-temperature resistant seal ring-18; Heater-2; Stationary magnetic field device-3;
Electric field generating apparatus-4; Gathering-device-5; Circuit control device-6.
Detailed description of the invention
In order to explain the technical solution of the utility model further, below by specific embodiment, the utility model is elaborated.
As shown in Figure 1 to Figure 3, it is the preferred embodiment of a kind of solder micro-spray device 1 for the utility model relates to, and this solder micro-spray device 1 comprises upper cover 11, solder heater 212, first electrode 13, second electrode 14 and shower nozzle 15.
This solder heater 212 has solder and stores chamber 121, heating plate standing groove 122, sensor mounting hole 123 and bolt hole 16, this solder storage chamber 121 and shower nozzle 15 are separately positioned on two bottom surfaces of solder heater 212, this solder stores chamber 121 in elongated slot-like, this heating plate standing groove 122 is arranged on the side of solder heater 212, be provided with bolt hole 16 bottom this first electrode 13 and the second electrode 14, the two side that this first electrode 13 and the second electrode 14 store chamber 121 along solder is respectively laid and is fixed by bolt hole 16 by bolt.
This upper cover 11 is also formed with nitrogen inlet 111, and this nitrogen inlet 111 and solder store chamber 121 and are connected, and this nitrogen inlet 111 is connected with the nitrogen pot after pressure regulation to allow droplet be in injection critical point; This shower nozzle 15 has and stores the tapered portion 151 and elongate aperture section 152 that chamber 121 is connected successively with solder.
More firmly be connected on solder heater 212 to allow shower nozzle 15, elongate aperture section 152 is allowed to be located better, this solder micro-spray device 1 also comprises nut 17, this solder heater 212 is provided with the junction 125 for coupling nut 17 at nozzle place, this nut 17 and junction 125 screw thread are fixedly linked with stable firmly shower nozzle 15.
Like this, the utility model utilizes tapered portion 151 and the elongate aperture section 152 of shower nozzle 15, can spray more high-precision soldered ball from elongate aperture section 152; The utility model passes into nitrogen by storing in chamber 121 toward solder, and allow nitrogen inlet 111 be connected with the nitrogen pot after pressure regulation, it can play deaeration blocks the situations such as nozzle generation to avoid solder oxidized on the one hand, nitrogen can be allowed as mainly driving power by pressure regulation on the other hand, namely allow droplet be in injection critical point, under the effect of electromagnetic force, then break through this critical point realize droplet ejection; Under the effect of nitrogen after pressure regulation like this, the high driving pressure brought based on tapered portion 151 and elongate aperture section 152 design can be overcome, and then mold high-precision soldered ball.
As shown in Figure 2, be also provided with guide pad 112 bottom this upper cover 11, this guide pad 112 stores chamber 121 with solder and matches in length and width; This upper cover 11 and solder heater 212 are provided with counter sink 113, and this upper cover 11 locks with solder heater 212 and is connected.
As shown in Figure 3, this solder micro-spray device 1 also comprises high-temperature resistant seal ring 18, and this high-temperature resistant seal ring 18, between upper cover 11 and solder heater 212, to prevent from leaking gas between upper cover 11 and solder heater 212, has good sealing effectiveness.
As shown in Figure 4, its a kind of soldered ball manufacturing system related to for utility model, comprise solder micro-spray device 1, for solder in solder micro-spray device 1 is heated heater 2, for provide for solder micro-spray device 1 the stationary magnetic field device 3 of stationary magnetic field, for generation of solder micro-spray device 1 driving force needed for electric field electric field generating apparatus 4, for ejecting gathering-device 5 that solder droplet collects and for controlling the circuit control device 6 that whole system is planned as a whole to run.
More specifically, this heater 2 comprises thermocouple, temperature controller, industrial ceramics sheet and DC controling ac solid-state relay; This stationary magnetic field device 3 comprises at least one permanent magnet, and this gathering-device 5 comprises two-dimensional movement platform, lifting platform, rotation platform, collecting board and collection liquid; This circuit control device 6 comprises DC low voltage power supply, single-chip microcomputer, industrial relay and optocoupler amplification module.
Above-described embodiment and graphic and non-limiting product form of the present utility model and style, any person of an ordinary skill in the technical field, to its suitable change done or modification, all should be considered as not departing from patent category of the present utility model.
Claims (2)
1. a soldered ball manufacturing system, it is characterized in that, comprise solder micro-spray device, for solder in solder micro-spray device is heated heater, for provide for solder micro-spray device the stationary magnetic field device of stationary magnetic field, for generation of solder micro-spray device driving force needed for electric field electric field generating apparatus, for ejecting gathering-device that solder droplet collects and for controlling the circuit control device that whole system is planned as a whole to run;
This solder micro-spray device comprises upper cover, solder heater, first electrode, second electrode and shower nozzle, this solder heater has solder and stores chamber, heating plate standing groove, sensor mounting hole and bolt hole, this solder storage chamber and shower nozzle are separately positioned on two bottom surfaces of solder heater, it is elongated slot-like that this solder stores chamber, this heating plate standing groove is arranged on the side of solder heater, this first electrode and the second electrode base are provided with bolt hole, the two side that this first electrode and the second electrode store chamber along solder is respectively laid and is fixed by bolt hole by bolt, this covers and is also formed with nitrogen inlet, this nitrogen inlet and solder store chamber and are connected, and this nitrogen inlet is connected with the nitrogen pot after pressure regulation to allow droplet be in injection critical point, this shower nozzle has and stores the tapered portion and elongate aperture section that chamber is connected successively with solder.
2. a kind of soldered ball manufacturing system as claimed in claim 1, is characterized in that, this heater comprises thermocouple, temperature controller, industrial ceramics sheet and DC controling ac solid-state relay; This stationary magnetic field device comprises at least one permanent magnet, and this gathering-device comprises two-dimensional movement platform, lifting platform, rotation platform, collecting board and collection liquid; This circuit control device comprises DC low voltage power supply, single-chip microcomputer, industrial relay and optocoupler amplification module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520583601.XU CN205032865U (en) | 2015-08-06 | 2015-08-06 | Solder ball manufacturing system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520583601.XU CN205032865U (en) | 2015-08-06 | 2015-08-06 | Solder ball manufacturing system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205032865U true CN205032865U (en) | 2016-02-17 |
Family
ID=55291797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520583601.XU Expired - Fee Related CN205032865U (en) | 2015-08-06 | 2015-08-06 | Solder ball manufacturing system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205032865U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104999197A (en) * | 2015-08-06 | 2015-10-28 | 厦门理工学院 | Solder micro jet device and solder ball making system |
| CN105772893A (en) * | 2016-04-22 | 2016-07-20 | 翔昱电子科技（厦门）有限公司 | Equipment with visual automatic tin planting function |
| CN106112181A (en) * | 2016-07-01 | 2016-11-16 | 厦门理工学院 | A kind of hand held noncontact scolding tin pen |
| CN107498133A (en) * | 2017-08-09 | 2017-12-22 | 李铖 | A kind of magnetic force welding procedure and tin feeding device |
| CN115488463A (en) * | 2022-09-23 | 2022-12-20 | 蒙宝康 | Liquid metal jet welding equipment |
-
2015
- 2015-08-06 CN CN201520583601.XU patent/CN205032865U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104999197A (en) * | 2015-08-06 | 2015-10-28 | 厦门理工学院 | Solder micro jet device and solder ball making system |
| CN105772893A (en) * | 2016-04-22 | 2016-07-20 | 翔昱电子科技（厦门）有限公司 | Equipment with visual automatic tin planting function |
| CN105772893B (en) * | 2016-04-22 | 2018-07-03 | 翔昱电子科技（厦门）有限公司 | Plant the equipment of tin automatically with vision |
| CN106112181A (en) * | 2016-07-01 | 2016-11-16 | 厦门理工学院 | A kind of hand held noncontact scolding tin pen |
| CN107498133A (en) * | 2017-08-09 | 2017-12-22 | 李铖 | A kind of magnetic force welding procedure and tin feeding device |
| CN115488463A (en) * | 2022-09-23 | 2022-12-20 | 蒙宝康 | Liquid metal jet welding equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205032865U (en) | Solder ball manufacturing system | |
| CN204771192U (en) | Solder spouts device a little | |
| CN104999197A (en) | Solder micro jet device and solder ball making system | |
| CN204412499U (en) | A kind of solder micro-spray device | |
| CN107116220A (en) | Electric field driven molten metal jet deposition 3D printing device and working method thereof | |
| CN105772893B (en) | Plant the equipment of tin automatically with vision | |
| CN101892577B (en) | Hanged ironing device with steam | |
| CN103104904A (en) | Novel steam generator | |
| CN204504449U (en) | A kind of solder heater | |
| CN204844888U (en) | Three -dimensional accurate quantitative shower nozzle at a high speed of printing | |
| CN203893142U (en) | Steam generator | |
| CN201330342Y (en) | Repeated vaporization garment steamer | |
| CN103182350B (en) | A kind of electromagnetic induction heat foamable formula micro-spray system | |
| CN204247591U (en) | Printed substrate automatic spray cleaning machine | |
| CN103203294B (en) | Electromagnetic micro jet device | |
| CN204372882U (en) | A kind of steam generator | |
| CN104190570B (en) | The power-actuated S type runner solder jetting head of ampere | |
| CN107390736B (en) | Stable and efficient temperature control system for piezoelectric ceramic injection valve and application method thereof | |
| CN203963893U (en) | A kind of steam generator | |
| CN204429531U (en) | A kind of experiment electromagnetism droplet ejection control system | |
| CN108033421A (en) | Small-sized milk packaging process | |
| CN202637164U (en) | User-friendly water pick | |
| CN211011294U (en) | Proportional unsaturated high-temperature steam heater | |
| CN201462775U (en) | High-temperature steam generator | |
| CN204525226U (en) | A kind of tweezers for collecting droplet particle |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160217 Termination date: 20180806 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |