CN205028920U - Dark purple outer LED packaging structure - Google Patents
Dark purple outer LED packaging structure Download PDFInfo
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- CN205028920U CN205028920U CN201520777374.4U CN201520777374U CN205028920U CN 205028920 U CN205028920 U CN 205028920U CN 201520777374 U CN201520777374 U CN 201520777374U CN 205028920 U CN205028920 U CN 205028920U
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- deep ultraviolet
- ultraviolet led
- transparency carrier
- transparent cover
- dark purple
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Abstract
The utility model provides a dark purple outer LED packaging structure, includes transparency carrier, transparent cover and dark purple outer LED, dark purple outer LED fixes the front of transparency carrier, the front of transparency carrier in dark purple outer LED's periphery is equipped with the first metal layer, transparent cover's bottom surface is equipped with the second metal level, and the first metal layer and the welding of second metal level make transparent cover and transparency carrier enclose into airtight cavity, dark purple outer LED locates in the airtight cavity, dark purple outer LED just, the negative pole pin respectively with the lens base plate on just, negative pole circuit connection. Transparent cover, transparency carrier, the first metal layer, second metal level are inorganic material, are fit for being used for encapsulating dark purple outer LED, transparent apron makes the dark purple outer LED can the front light -emitting, and the dark purple outer LED of transparent base plate messenger can back light -emitting to it gives out light, give off light to form 360. (U /)
Description
Technical field
The utility model relates to field of LED illumination, especially a kind ofly can realize 360 ° of luminous deep ultraviolet LED encapsulation structure.
Background technology
LED has the advantages such as long service life, light efficiency is high, power consumption is low, thermal radiation is little, controllability is strong, and deep ultraviolet LED has bactericidal action, therefore, has occurred LED ultraviolet germicidal at present.For LED light source, deep ultraviolet be applied to lacking very so far, and because deep ultraviolet is to the particular/special requirement of material, easily turn yellow after running into ultraviolet light as organic materials such as silica gel, therefore, for LED light source, no matter be deep ultraviolet light source or ordinary light source, the ultraviolet light that they send all can have an impact to silica gel lamp organic material, traditional LED is when encapsulating, glass cover-plate is fixed on substrate by silica gel solid, and silica gel is aging by meeting after ultraviolet irradiation for a long time, finally causes glass cover-plate to come off.Along with the utilization of deep ultraviolet LED light source is ripe gradually, in order to utilize the irradiation light of deep ultraviolet light source to greatest extent, people wish to make 360 ° of luminous deep ultraviolet light sources, so seek a kind ofly be applicable to deep ultraviolet LED and can necessitate by 360 ° of luminous encapsulating structures.
Summary of the invention
Technical problem to be solved in the utility model is to provide a kind of deep ultraviolet LED encapsulation structure, is applicable to the inorganic encapsulated of deep ultraviolet, and can realizes 360 ° of luminescences.
For solving the problems of the technologies described above, the technical solution of the utility model is: a kind of deep ultraviolet LED encapsulation structure, comprise transparency carrier, transparent cover plate and deep ultraviolet LED, described deep ultraviolet LED is fixed on the front of described transparency carrier, the front of described transparency carrier is arranged with the first metal layer in described the outer of deep ultraviolet LED, the bottom surface of described transparent cover plate is provided with the second metal level, the first metal layer welds with the second metal level and makes transparent cover plate and transparency carrier surround airtight cavity, and described deep ultraviolet LED is located in described airtight cavity; The positive and negative electrode pin of described deep ultraviolet LED is connected with the positive and negative electrode circuit on lens substrate respectively.Transparent cover plate of the present utility model, transparency carrier, the first metal layer, the second metal level are inorganic material, are suitable for encapsulation deep ultraviolet LED; Transparent cover plate enables deep ultraviolet LED front bright dipping, and transparent substrate enables deep ultraviolet LED back side bright dipping, thus forms the luminescence of 360 °; The first metal layer welds with the second metal level and makes transparent cover plate and transparency carrier surround airtight cavity, and deep ultraviolet LED encloses by confined space, for the protection of deep ultraviolet LED, extends the useful life of deep ultraviolet LED; Cathode circuit and cathode traces are arranged on outside confined space, facilitate deep ultraviolet LED to be connected with external power source.
As improvement, the front of described transparency carrier is provided with cathode circuit outside described airtight cavity, the back side of transparency carrier is provided with cathode traces, the positive pole pin of described deep ultraviolet LED is electrically connected by the first metal layer and cathode circuit, described transparency carrier is provided with perforation, and the negative pole pin of deep ultraviolet LED is electrically connected by described perforation and cathode traces.Positive pole pin is electrically connected by the first metal layer with cathode circuit thus can effectively utilizes the first metal layer and realizes being connected, and is convenient to wiring.
As improvement, described the first metal layer and the second metal level are kovar alloy layer.
As improvement, described transparent cover plate and transparency carrier are sapphire glass plate.
As improvement, described cathode circuit and cathode traces are located at the side of the same side of transparency carrier.The side that the both positive and negative polarity of external circuit is clamped in substrate can form loop by conducting deep ultraviolet LED, thus fast and easy is inserted into the outside draw-in groove connected, and is convenient to grafting.
As improvement, described deep ultraviolet LED is yi word pattern arrangement, facilitates the wiring of deep ultraviolet LED.
As improvement, the line between cathode circuit and positive pole pin is transparency conducting layer, and the line between cathode traces and negative pole pin is transparency conducting layer.Thus reduce conductive layer blocking light further.
As improvement, cathode circuit and cathode traces form circuit by transparency conducting layer.
The beneficial effect that the utility model is compared with prior art brought is:
1, transparent cover plate, transparency carrier, the first metal layer, the second metal level are inorganic material, are suitable for encapsulation deep ultraviolet LED;
2, transparent cover plate enables deep ultraviolet LED front bright dipping, and transparent substrate enables deep ultraviolet LED back side bright dipping, thus forms the luminescence of 360 °;
3, the first metal layer welds with the second metal level and makes transparent cover plate and transparency carrier surround airtight cavity, and deep ultraviolet LED encloses by confined space, for the protection of deep ultraviolet LED, extends the useful life of deep ultraviolet LED;
4, to be arranged on confined space outer and be positioned at the side of substrate for cathode circuit and cathode traces, facilitates deep ultraviolet LED to be connected with external power source.
Accompanying drawing explanation
Fig. 1 is the utility model cross sectional view.
Fig. 2 is the utility model vertical view.
Embodiment
Below in conjunction with Figure of description, the utility model is described in further detail.
As shown in Figure 1, 2, a kind of deep ultraviolet LED encapsulation structure, comprises transparency carrier 2, transparent cover plate 1 and some deep ultraviolet LED3.Described transparent cover plate 1 and transparency carrier 2 are sapphire glass plate, and transparency carrier 2 can do transparent line layer.Described deep ultraviolet LED3 is fixed on the front of described transparency carrier 2, and deep ultraviolet LED3 is yi word pattern arrangement.The front of described transparency carrier 2 is arranged with the first metal layer 5 in the outer of described deep ultraviolet LED3, the bottom surface of described transparent cover plate 1 is provided with the second metal level 4, described the first metal layer 5 and the second metal level 4 are kovar alloy layer, the first metal layer 5 welds with the second metal level 4 and makes transparent cover plate 1 and transparency carrier 2 surround airtight cavity 10, and described deep ultraviolet LED3 is located in described airtight cavity 10.Described transparent cover plate 1 and transparency carrier 2 are square, the area of transparency carrier 2 is greater than the area of transparent cover plate 1, the side of transparency carrier 2 is made to protrude from transparent cover plate 1, the front of described transparency carrier 2 is provided with cathode circuit 6 outside described airtight cavity 10, the back side of transparency carrier 2 is provided with cathode traces 7, and described cathode circuit 6 and cathode traces 7 are located at the side of the protrusion side of transparency carrier 2.The positive pole pin 8 of described deep ultraviolet LED3 is electrically connected by the first metal layer 5 and cathode circuit 6, and described transparency carrier 2 is provided with perforation, and the negative pole pin 9 of deep ultraviolet LED3 is electrically connected by described perforation and cathode traces 7.Line between the utility model cathode circuit 6 and positive pole pin 8 is transparency conducting layer, and the line between cathode traces 7 and negative pole pin 9 is transparency conducting layer; Cathode circuit 6 and cathode traces 7 form circuit by transparency conducting layer; Transparent circuitry can reduce shading.
Transparent cover plate 1 of the present utility model, transparency carrier 2, the first metal layer 5, second metal level 4 are non-organic material, are suitable for encapsulation deep ultraviolet LED3; Transparent cover plate enables deep ultraviolet LED3 front bright dipping, and transparent substrate enables deep ultraviolet LED3 back side bright dipping, thus forms the luminescence of 360 °; The first metal layer 5 welds with the second metal level 4 and makes transparent cover plate 1 and transparency carrier 2 surround airtight cavity 10, and deep ultraviolet LED3 encloses by confined space, for the protection of deep ultraviolet LED3, extends the useful life of deep ultraviolet LED3; Cathode circuit 6 and cathode traces 7 are arranged on outside confined space, facilitate deep ultraviolet LED3 to be connected with external power source.
Claims (8)
1. a deep ultraviolet LED encapsulation structure, it is characterized in that: comprise transparency carrier, transparent cover plate and deep ultraviolet LED, described deep ultraviolet LED is fixed on the front of described transparency carrier, the front of described transparency carrier is arranged with the first metal layer in described the outer of deep ultraviolet LED, the bottom surface of described transparent cover plate is provided with the second metal level, the first metal layer welds with the second metal level and makes transparent cover plate and transparency carrier surround airtight cavity, and described deep ultraviolet LED is located in described airtight cavity; The positive and negative electrode pin of described deep ultraviolet LED is connected with the positive and negative electrode circuit on lens substrate respectively.
2. a kind of deep ultraviolet LED encapsulation structure according to claim 1, it is characterized in that: the front of described transparency carrier is provided with cathode circuit outside described airtight cavity, the back side of transparency carrier is provided with cathode traces, the positive pole pin of described deep ultraviolet LED is electrically connected by the first metal layer and cathode circuit, described transparency carrier is provided with perforation, and the negative pole pin of deep ultraviolet LED is electrically connected by described perforation and cathode traces.
3. a kind of deep ultraviolet LED encapsulation structure according to claim 1, is characterized in that: described the first metal layer and the second metal level are kovar alloy layer.
4. a kind of deep ultraviolet LED encapsulation structure according to claim 1, is characterized in that: described transparent cover plate and transparency carrier are sapphire glass plate.
5. a kind of deep ultraviolet LED encapsulation structure according to claim 1, is characterized in that: described cathode circuit and cathode traces are located at the side of the same side of transparency carrier.
6. a kind of deep ultraviolet LED encapsulation structure according to claim 1, is characterized in that: described deep ultraviolet LED is yi word pattern arrangement.
7. a kind of deep ultraviolet LED encapsulation structure according to claim 1, it is characterized in that: the line between cathode circuit and positive pole pin is transparency conducting layer, the line between cathode traces and negative pole pin is transparency conducting layer.
8. a kind of deep ultraviolet LED encapsulation structure according to claim 1, is characterized in that: cathode circuit and cathode traces form circuit by transparency conducting layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520777374.4U CN205028920U (en) | 2015-10-09 | 2015-10-09 | Dark purple outer LED packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520777374.4U CN205028920U (en) | 2015-10-09 | 2015-10-09 | Dark purple outer LED packaging structure |
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| Publication Number | Publication Date |
|---|---|
| CN205028920U true CN205028920U (en) | 2016-02-10 |
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| CN201520777374.4U Active CN205028920U (en) | 2015-10-09 | 2015-10-09 | Dark purple outer LED packaging structure |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105845813A (en) * | 2016-04-25 | 2016-08-10 | 陈海英 | LED luminescent device and LED light source |
| CN108269902A (en) * | 2018-01-16 | 2018-07-10 | 深圳市光脉电子有限公司 | A kind of LED encapsulation structure and its packaging method |
| CN108321279A (en) * | 2018-03-16 | 2018-07-24 | 江苏鸿利国泽光电科技有限公司 | A kind of deep ultraviolet LED light source inorganic encapsulated structure |
| CN110660893A (en) * | 2019-09-06 | 2020-01-07 | 深圳市银宝山新科技股份有限公司 | Light-emitting element packaging structure and manufacturing method and manufacturing equipment thereof |
| CN112838077A (en) * | 2021-01-08 | 2021-05-25 | 厦门市信达光电科技有限公司 | LED packaging structure, preparation process and display module |
| WO2024046441A1 (en) * | 2022-08-31 | 2024-03-07 | 惠州市聚飞光电有限公司 | Packaging structure, led device, and packaging method |
-
2015
- 2015-10-09 CN CN201520777374.4U patent/CN205028920U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105845813A (en) * | 2016-04-25 | 2016-08-10 | 陈海英 | LED luminescent device and LED light source |
| CN105845813B (en) * | 2016-04-25 | 2018-10-26 | 陈海英 | A kind of LED light emitting device and LED light source |
| CN108269902A (en) * | 2018-01-16 | 2018-07-10 | 深圳市光脉电子有限公司 | A kind of LED encapsulation structure and its packaging method |
| CN108321279A (en) * | 2018-03-16 | 2018-07-24 | 江苏鸿利国泽光电科技有限公司 | A kind of deep ultraviolet LED light source inorganic encapsulated structure |
| CN110660893A (en) * | 2019-09-06 | 2020-01-07 | 深圳市银宝山新科技股份有限公司 | Light-emitting element packaging structure and manufacturing method and manufacturing equipment thereof |
| CN112838077A (en) * | 2021-01-08 | 2021-05-25 | 厦门市信达光电科技有限公司 | LED packaging structure, preparation process and display module |
| WO2024046441A1 (en) * | 2022-08-31 | 2024-03-07 | 惠州市聚飞光电有限公司 | Packaging structure, led device, and packaging method |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
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Address after: 510890 Huadu District, Guangdong, Guangzhou Flower Town, SAST Road, No. 1, No. 1 Patentee after: Hongli Newell group Limited by Share Ltd Address before: 510890 Huadu District, Guangdong, Guangzhou Flower Town, SAST Road, No. 1, No. 1 Patentee before: Guangzhou Hongli Tronic Co., Ltd. |