CN205021826U - Abrasive material is diamond wire saw that double helix was arranged - Google Patents
Abrasive material is diamond wire saw that double helix was arranged Download PDFInfo
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- CN205021826U CN205021826U CN201520590811.1U CN201520590811U CN205021826U CN 205021826 U CN205021826 U CN 205021826U CN 201520590811 U CN201520590811 U CN 201520590811U CN 205021826 U CN205021826 U CN 205021826U
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- diamond
- abrasive material
- stainless steel
- double helix
- abrasive
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Abstract
The utility model relates to a diamond instrument, specificly relate to an abrasive material is diamond wire saw that double helix was arranged, this diamond wire saw is by 304 nonrust steel wire base members, braze binder with be the mixed abrasive material triplex that the double helix was arranged, mixed abrasive material is brazed through the binder of brazing on the 304 nonrust steel wire base members, wherein the diameter of 304 nonrust steel wires is 0.8mm -1.6mm, mixed abrasive material is the double helix and arranges, and be pitch in the mixed abrasive material that the double helix arranged and be 2.1mm -2.5mm, lead angle is 15 - 18, the brazing material is regarded as with the aluminium magnesium titanium alloy to the binder of brazing, it is diamond and the mixed abrasive material of CBN to mix the abrasive material, and the diamond grit is 5 with the ratio of CBN grit: 1. This coping saw has the abrasive material advantage that even, grit and base member compaginated that distributes.
Description
Technical field
The utility model relates to a kind of diamond fretsaw, is specifically related to the diamond fretsaw that a kind of abrasive material is double helix arrangement.
Background technology
As a kind of cutting tool of extensive use, diamond fretsaw is used for crystal-cut, its diameter, mostly at 0.1 to 0.45mm, can be used for the fragile materials such as cutting silicon wafer, stone material, pottery, concrete, optical glass, also can be applicable to the cutting processing of the non ferrous metal and their alloy such as aluminium alloy.Its advantage is that joint-cutting is narrow, volume recovery is high; Cutting process is steady, and fragile material such as cutting silicon wafer, pottery etc. does not collapse limit; Cutting temperature is low, and cut surface is without burn; Energy cutting large size workpiece, environmental pollution is little, usually uses water as cooling fluid.But existing diamond fretsaw is all the plating of individual layer abrasive material or resin thermosets method to be made, its subject matter existed: one is diamond abrasive random arrangement, and chip space is little, and cutting easily blocks scroll saw; Two is that abrasive material is just embedded in bonding agent by the embedding of machinery, and bond strength is not high, and abrasive material easily comes off, and the scroll saw life-span is short.
Summary of the invention
The purpose of this utility model to be to solve in prior art diamond with matrix in conjunction with insecure, that abrasive material random arrangement, chip space are little problem, and provide diamond abrasive be uniformly dispersed arrangement, abrasive particle and matrix strong bonded a kind of abrasive material be the diamond fretsaw that double helix is arranged.
The technical scheme that the utility model adopts is:
A kind of abrasive material is the diamond fretsaw of double helix arrangement, comprise 304 stainless steel wire matrixes, soldering bonding agent and compound abrasive three part composition, compound abrasive passes through soldering binding agent braze welding on 304 stainless steel wire matrixes, wherein the diameter of 304 stainless steel wires is 0.8mm-1.6mm, and compound abrasive is double helix arrangement.
Further, the pitch in the compound abrasive of the arrangement in double helix is 2.1mm-2.5mm, and lead angle is 15 °-18 °.
Further, soldering bonding agent is using magnalium titanium alloy as brazing material.
Further, compound abrasive refers to diamond and cubic boron nitride compound abrasive, and the proportioning of diamond abrasive grain and cubic boron nitride abrasive grain is 5:1.
The preparation method of diamond fretsaw of the present invention, comprises the following steps:
1), the 304 stainless steel wire matrixes of gage straightener to diameter 0.8mm-1.6mm are adopted to carry out alignment;
2), Steel Wire Surface cleaning:
A, with water base metal cleaning agent, solvent clean and chemical treatment are carried out to steel wire;
B, carry out sand papering to Steel Wire Surface, sand paper can select the one in 2000 orders or 2500 orders;
C, 304 stainless steel wires of having polished are put into supersonic wave cleaning machine carry out Ultrasonic Cleaning, then use acetone degreasing;
3), a layer binder is applied at 304 stainless steel wire surface uniforms;
4), 304 stainless steel wires are at the uniform velocity rotated with the speed of 8-10r/s around axis, being first nylon wire of 0.5mm and second nylon wire of diameter 1mm by diameter scribbles on 304 stainless steel wire matrixes of binding agent with the pitch of 2.1mm-2.5mm, the lead angle uniform winding of 15 °-18 °;
5), diamond abrasive grain and cubic boron nitride abrasive grain are distributed in 304 stainless steel wire matrix binder surfaces after coiling with the proportioning of 5:1;
6), by the first nylon wire and the second nylon wire remove from 304 stainless steel wire matrix surfaces, diamond and cubic boron nitride present tool bifilar helix at regular intervals at 304 stainless steel wire matrix surfaces and arrange;
7), to arrange one deck powdered filler metal in 304 stainless steel wire adhesive surface and compound abrasive surface uniform;
8), coated with adhesive;
9), under argon shield; with under the heating power of the eddy-current heating frequency of 500-1000kHz, 1kW-1.5kW, 900-1200 ° condition; with magnalium titanium alloy for brazing material rapid melting solder; after cooling, diamond and cubic boron nitride abrasive materials fixedly secure at 304 stainless steel wire matrix surfaces by soldering bonding agent, form the diamond fretsaw that abrasive material is double helix arrangement.
Wherein, 3rd) step and the 8th) bonding agent in step is all one or more in waterglass, resin, bentonite, glue, 3rd) coating thickness of the binding agent in is 0.1mm, and the 3rd) concentration of binding agent in step is greater than the 8th) in the concentration of bonding agent, the 4th) spacing of the first nylon wire in step and the second nylon wire is 0.5mm.
The beneficial effects of the utility model are:
1. adopt the heating power of the eddy-current heating frequency of 500-1000kHz, 1kW-1.5kW, 900-1200 degree condition under argon shield, with magnalium titanium alloy for brazing material, improve the adhesion of compound abrasive and 304 stainless steel wire matrixes, and early stage can make abrasive particle fixedly secure at steel wire matrix surface to the process of 304 stainless steel wires;
2. adopt abrasive material to be diamond with cubic boron nitride with the proportioning of 5:1, make abrasive surface concavo-convex, be more conducive to cutting, and cubic boron nitride is to iron and carbon material good cutting effect, diamond is to stone material and concrete good cutting effect;
3. diamond and cubic boron nitride abrasive grain are that double helix is arranged, the groove formed by helical form cut time contact surface little, can water storage, chip removal, realize fly-cutting.
Accompanying drawing explanation
Fig. 1 be in embodiment 1,2,3 stainless steel wire matrix surface around the structural representation of helix.
Fig. 2 be stainless steel wire surface in embodiment 1,2,3 binding agent on adhere to the structural representation of diamond abrasive grain.
Fig. 3 is that after removing coiling in embodiment 1,2,3, abrasive particle is the scroll saw structural representation of double helix arrangement.
Fig. 4 is the glue coating unit structural representation used in gluing process in embodiment 1,2,3.
In figure: 1,304 stainless steel wires; 2, abrasive particle is mixed; 3, the first nylon wire; 4, container; 5, binding agent; 6, the second nylon wire.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the invention will be further described.
A kind of abrasive material is the diamond fretsaw of double helix arrangement, comprise 304 stainless steel wire 1 matrixes, soldering bonding agent and compound abrasive 2 three part composition, compound abrasive 2 passes through soldering binding agent braze welding on 304 stainless steel wire 1 matrixes, wherein the diameter of 304 stainless steel wires 1 is 0.8mm-1.6mm, and compound abrasive 2 is arrangement in double helix, wherein soldering bonding agent is using magnalium titanium alloy as brazing material, can improve the adhesion of compound abrasive 2 and 304 stainless steel wire 1 matrix, makes mixing abrasive particle 2 fixedly secure on 304 stainless steel wire matrix 1 surfaces, compound abrasive 2 refers to diamond and cubic boron nitride compound abrasive, and the proportioning of diamond abrasive grain and cubic boron nitride abrasive grain is 5:1, the compound abrasive 2 that diamond and cubic boron nitride form with the proportioning of 5:1, helix can be made to present concavo-convex, be conducive to cutting, and the different in kind of diamond and cubic boron nitride, diamond is when high temperature and iron, carbon has obvious affine effect, when cutting irony material, the high temperature produced is easy to make diamond produce graphitization, thus lose cutting power, but there is good dissection to stone material and concrete, and cubic boron nitride and iron, carbon material is without obvious affine effect, overcome the simple defect using a kind of diamond abrasive grain, both life-spans can improving scroll saw used in combination, in the compound abrasive 2 of the arrangement in double helix, pitch is 2.1mm-2.5mm, and lead angle is 15 °-18 °.
Embodiment 1
During concrete making, be after the 304 stainless steel wire 1 matrix gage straightener alignments of 0.8mm by a diameter, with water base metal cleaning agent, solvent clean and chemical treatment are carried out to 304 stainless steel wires 1, polish with 2000 object sand paper again, acetone degreasing is used after putting into Ultrasonic Cleaning, waterglass is placed in the container 4 of glue coating unit, 304 stainless steel wires 1 are at the uniform velocity passed from the hole bottom container 4 and is evenly coated on stainless steel wire with the thickness of 0.1mm by waterglass, 304 stainless steel wires are rotated with the speed of 8r/s around axis, cut-off footpath is that second nylon wire 6 of first nylon wire 3 of 0.5mm and diameter 1mm is with the pitch of 2.1mm, the lead angle uniform winding of 15 ° scribbles 304 stainless steel wire 1 matrixes of binding agent 5, and keep the distance between the first nylon wire 3 and the second nylon wire 6 to be 0.5mm, again diamond abrasive grain and cubic boron nitride abrasive grain are distributed in 304 stainless steel wire 1 matrix binder 5 surfaces after coiling with the proportioning of 5:1, again the first nylon wire 3 and the second nylon wire 6 are removed from 304 stainless steel wire 1 matrix surfaces, obtain the bifilar helix that diamond and cubic boron nitride present a determining deviation at stainless steel wire matrix surface to arrange, and then to arrange one deck In Powdered Aluminium magnesium titanium alloy solder with compound abrasive 2 surface uniform on 304 stainless steel wire 1 binding agents 5 surfaces, apply the less waterglass of one deck concentration again for fixing solder, last under argon shield, with the eddy-current heating frequency of 500kHz, the heating power of 1kW, under 900 degree of conditions, rapid melting solder, after cooling, diamond and cubic boron nitride abrasive materials fixedly secure at 304 stainless steel wire 1 matrix surfaces by soldering bonding agent, form the diamond fretsaw that abrasive material is double helix arrangement.
Embodiment 2
During concrete making, be after the 304 stainless steel wire 1 matrix gage straightener alignments of 1.2mm by a diameter, with water base metal cleaning agent, solvent clean and chemical treatment are carried out to 304 stainless steel wires 1, polish with 2500 object sand paper again, acetone degreasing is used after putting into Ultrasonic Cleaning, the hybrid adhesive 5 of waterglass and resin is placed in the container 4 of glue coating unit, at the uniform velocity being passed from the hole bottom container 4 by 304 stainless steel wires 1 and passing through mixing bonding agent 5 is evenly coated on 304 stainless steel wires 1 with the thickness of 0.1mm, 304 stainless steel wires 1 are rotated with the speed of 9r/s around axis, cut-off footpath is that second nylon wire 6 of first nylon wire 3 of 0.5mm and diameter 1mm is with the pitch of 2.3mm, the lead angle uniform winding of 16 ° scribbles 304 stainless steel wire 1 matrixes of binding agent 5, and keep the distance between the first nylon wire 3 and the second nylon wire 6 to be 0.5mm, again diamond abrasive grain and cubic boron nitride abrasive grain are distributed in 304 stainless steel wire 1 matrix binder 5 surfaces after coiling with the proportioning of 5:1, again the first nylon wire 3 and the second nylon wire 6 are removed from 304 stainless steel wire 1 matrix surfaces, obtain the bifilar helix that diamond and cubic boron nitride present a determining deviation at 304 stainless steel wire 1 matrix surfaces to arrange, and then evenly to arrange one deck In Powdered Aluminium magnesium titanium alloy solder with abrasive surface on 304 stainless steel wire 1 binding agents 5 surfaces, apply the less waterglass of one deck concentration and mixed with resin binding agent 5 again for fixing solder, last under argon shield, with the eddy-current heating frequency of 750kHz, 1.25kW heating power, under 1100 degree of conditions, rapid melting solder, after cooling, diamond and cubic boron nitride abrasive materials fixedly secure at 304 stainless steel wire 1 matrix surfaces by soldering bonding agent, form the diamond fretsaw that abrasive material is double helix arrangement.
Embodiment 3
During concrete making, be after the 304 stainless steel wire 1 matrix gage straightener alignments of 1.6mm by a diameter, with water base metal cleaning agent, solvent clean and chemical treatment are carried out to 304 stainless steel wires 1, polish with 2000 object sand paper or steel-wire napper again, acetone degreasing is used after putting into Ultrasonic Cleaning, by waterglass, resin, bentonite, glue four kinds of hybrid adhesives 5 are placed in the container 4 of glue coating unit, 304 stainless steel wires 1 are at the uniform velocity passed from the hole bottom container 4 and is evenly coated on 304 stainless steel wires 1 by four kinds of hybrid adhesives 5 with the thickness of 0.1mm, 304 stainless steel wires 1 are rotated with the speed of 10r/s around axis, cut-off footpath is that second nylon wire 6 of first nylon wire 3 of 0.5mm and diameter 1mm is with the pitch of 2.5mm, the lead angle uniform winding of 18 ° scribbles 304 stainless steel wire 1 matrixes of binding agent 5, and keep the distance between the first nylon wire 3 and the second nylon wire 6 to be 0.5mm, again diamond abrasive grain and cubic boron nitride abrasive grain are distributed in 304 stainless steel wire 1 matrix binder 5 surfaces after coiling with the proportioning of 5:1, again the first nylon wire 3 and the second nylon wire are removed from stainless steel wire matrix surface, obtain the bifilar helix that diamond and cubic boron nitride present a determining deviation at stainless steel wire matrix surface to arrange, and then to arrange one deck In Powdered Aluminium magnesium titanium alloy solder with compound abrasive 2 surface uniform on 304 stainless steel wire 1 binding agents 5 surfaces, apply the waterglass that one deck concentration is less again, resin, bentonite, glue hybrid adhesive 5 is for fixing solder, last under argon shield, with the eddy-current heating frequency of 1000kHz, the heating power of 1.5kW, under 1200 degree of conditions, rapid melting solder, after cooling, diamond and cubic boron nitride abrasive materials fixedly secure at 304 stainless steel wire 1 matrix surfaces by soldering bonding agent, form the diamond fretsaw that abrasive material is double helix arrangement.
Claims (3)
1. an abrasive material is the diamond fretsaw that double helix is arranged, it is characterized in that: comprise 304 stainless steel wires (1) matrix, soldering bonding agent and compound abrasive (2) three part composition, described compound abrasive (2) by soldering binding agent braze welding on 304 stainless steel wires (1) matrix, wherein the diameter of 304 stainless steel wires (1) is 0.8mm-1.6mm, and compound abrasive (2) is arranged in double helix.
2. abrasive material according to claim 1 is the diamond fretsaw of double helix arrangement, it is characterized in that: in the compound abrasive (2) of the described arrangement in double helix, pitch is 2.1mm-2.5mm, and lead angle is 15 °-18 °.
3. abrasive material according to claim 1 is the diamond fretsaw of double helix arrangement, it is characterized in that: described soldering bonding agent is using magnalium titanium alloy as brazing material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520590811.1U CN205021826U (en) | 2015-08-08 | 2015-08-08 | Abrasive material is diamond wire saw that double helix was arranged |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520590811.1U CN205021826U (en) | 2015-08-08 | 2015-08-08 | Abrasive material is diamond wire saw that double helix was arranged |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205021826U true CN205021826U (en) | 2016-02-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520590811.1U Withdrawn - After Issue CN205021826U (en) | 2015-08-08 | 2015-08-08 | Abrasive material is diamond wire saw that double helix was arranged |
Country Status (1)
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| CN (1) | CN205021826U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105058592A (en) * | 2015-08-08 | 2015-11-18 | 河南万里路桥集团股份有限公司 | Diamond wire saw with grinding materials distributed in double-helix manner and manufacturing method of diamond wire saw |
| CN105921815A (en) * | 2016-04-26 | 2016-09-07 | 泉州众志新材料科技有限公司 | Annular diamond rope saw and manufacturing method thereof |
| CN108687980A (en) * | 2017-04-10 | 2018-10-23 | 上海新昇半导体科技有限公司 | Cut wire rod, cutting machine and cutting method |
-
2015
- 2015-08-08 CN CN201520590811.1U patent/CN205021826U/en not_active Withdrawn - After Issue
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105058592A (en) * | 2015-08-08 | 2015-11-18 | 河南万里路桥集团股份有限公司 | Diamond wire saw with grinding materials distributed in double-helix manner and manufacturing method of diamond wire saw |
| CN105921815A (en) * | 2016-04-26 | 2016-09-07 | 泉州众志新材料科技有限公司 | Annular diamond rope saw and manufacturing method thereof |
| CN108687980A (en) * | 2017-04-10 | 2018-10-23 | 上海新昇半导体科技有限公司 | Cut wire rod, cutting machine and cutting method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20160210 Effective date of abandoning: 20170901 |