CN205009071U - Diamond grinding wheel of diamond outer arc straight line grinding machine - Google Patents

Diamond grinding wheel of diamond outer arc straight line grinding machine Download PDF

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Publication number
CN205009071U
CN205009071U CN201520763661.XU CN201520763661U CN205009071U CN 205009071 U CN205009071 U CN 205009071U CN 201520763661 U CN201520763661 U CN 201520763661U CN 205009071 U CN205009071 U CN 205009071U
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China
Prior art keywords
diamond
emery wheel
silicon carbide
base layer
straight line
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CN201520763661.XU
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Inventor
沈永生
俞云伟
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Hangzhou Xihu Friction Materials Co Ltd
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Hangzhou Xihu Friction Materials Co Ltd
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Abstract

The utility model discloses a diamond grinding wheel of diamond outer arc straight line grinding machine, include that grindstone body fixes the bolt hole on grinding wheel stand with being used for with grindstone body, grindstone body includes base member layer and buddha's warrior attendant sand bed that the axial ties for, and the base member layer is close to grinding wheel stand, and the buddha's warrior attendant sand bed is fixed in the base member layer outside, and the bolt hole lies in the base member in situ. The beneficial effects of the utility model are that: not extravagant diamond dust.

Description

A kind of skive of diamond outer arc straight line grinding machine
Technical field
The utility model relates to grinding apparatus field, specifically a kind of skive of diamond outer arc straight line grinding machine.
Background technology
Grinding machine utilizes grinding tool to carry out the lathe of grinding to surface of the work, and most grinding machine uses the emery wheel of High Rotation Speed to carry out grinding, the material that grinding machine energy workhardness is higher, as hardened steel, carbide alloy etc.Such as, and the material of the emery wheel used also must have sufficiently high hardness, diamond.Diamond has very high hardness, but it is expensive, even if use diamond as material, the holistic cost of emery wheel is still very high.Emery wheel needs to be fixed by fixture and emery wheel pedestal, for the emery wheel being working face with the end face rotated, the position that fixture is fixed is exactly the extreme position that emery wheel weares and teares in theory, once may wear to this position, just mean that emery wheel needs to upgrade, the residue diamond dust on old sand wheel has just been wasted.Chinese patent literature CN204525207U, on August 5th, 2015, discloses one " the double-layer ceramic emery wheel of surface band groove ", comprises matrix and the emery wheel layer being arranged at matrix surface; It is characterized in that: emery wheel layer is made up of removable first emery wheel and the second emery wheel, the emery wheel that user can be high to different abrasive concentration, granularity, hardness, ring width and ring as required carries out replacing and regulates; Be provided with annular groove between first emery wheel and the second emery wheel, be conducive to chip removal and cooling down.This technical scheme have employed double-deck emery wheel, is combined by the emery wheel of different roughness, to use.But the program still cannot solve may wear to the limit emery wheel on remain the problem that diamond dust is wasted.
Summary of the invention
The utility model technical issues that need to address are, when existing emery wheel is scrapped, remaining diamond dust is by serious waste, thus provide a kind of emery wheel not wasting diamond dust.
To achieve these goals, the utility model adopts following technical scheme: a kind of skive of diamond outer arc straight line grinding machine, comprise emery wheel body and the bolt hole being used for being fixed on by emery wheel body on grinding wheel stand, emery wheel body comprises axially base layer arranged side by side and silicon carbide layer, base layer is near grinding wheel stand, silicon carbide layer is fixed on outside base layer, and spiro keyhole position is in base layer.
Because traditional emery wheel is all use diamond dust integrated, fixture directly gos deep into being fixed in diamond dust, just cause fixture deeply diamond dust partly cannot be utilized.The structure of emery wheel body is divided into 2 layers by this programme, realize different work objects respectively: internal layer is base layer, be used for being fixed with grinding wheel stand being connected, the fixed structures such as screw are just located in this layer, the materials such as King, POM, nylon can be adopted to make, both keep enough intensity, have again relatively cheap cost; Skin is working lining, makes with diamond dust, directly contacts workpiece, realizes the grinding function of emery wheel; Couple together in the mode be fixedly connected with between two-layer.When outer field silicon carbide layer weares and teares totally, when the base layer of internal layer is about to expose, when changing emery wheel exactly.The emery wheel of such design, can save the consumption of diamond dust on the one hand in a large number, achieves the lightweight of emery wheel on the one hand, contributes to reducing energy consumption.
As preferably, described silicon carbide layer is provided with some projections, and projection is distributed in on the silicon carbide layer axis of rotation circle that is the center of circle, base layer is provided with accordingly some shrinkage pools adaptive with it.Silicon carbide layer arranges projection, and base layer arranges adaptive shrinkage pool accordingly, and both are plugged in together, and can strengthen the annexation of silicon carbide layer and base layer.
As preferably, the angle between the axis of described projection and emery wheel body running rotation direction is acute angle.Emery wheel velocity of rotation is operationally very high, and in order to resist powerful centrifugal force, projection is designed to by this programme, and the direction of inclination is met to rotation direction, makes the connection of silicon carbide layer and base layer more firm.
As preferably, between described base layer and silicon carbide layer, be provided with the bonding coat of adhesive effect.This programme adopts the method for binding to connect the two-layer of emery wheel body, makes the utilization rate of silicon carbide layer reach the highest.
As preferably, the thickness of described silicon carbide layer and the Thickness Ratio of base layer, between 1:4 ~ 1:8.This is that inventor tests the interval at intensity, optimum balance between life-span and cost of confirmation.
In sum, the beneficial effects of the utility model are: do not waste diamond dust.
Accompanying drawing explanation
Fig. 1 is a kind of structural representation of the present utility model,
Fig. 2 is the A-A sectional view of Fig. 1,
Fig. 3 is the B-B sectional view of Fig. 1.
Wherein: 1 base layer, 2 silicon carbide layer, 3 bonding coats, 11 bolts hole, 21 projections.
Detailed description of the invention
Below in conjunction with accompanying drawing and detailed description of the invention, the utility model is further described.
Embodiment as shown in Figure 1, Figure 2, Figure 3 shows, be a kind of skive of diamond outer arc straight line grinding machine, shape is circular ring type, and external diameter is 455mm, and internal diameter is 355mm, and thickness is 35mm, and it comprises the base layer 1 of nylon material, and silicon carbide layer 2.The thickness of base layer is 30mm, base layer is evenly equipped with 4 bolts hole 11, is blind hole, is used for realizing with grinding wheel stand fixing.The thickness of silicon carbide layer is 5mm, and its end face outside is the working lining directly contacting workpiece, sticks together between inner side end and base layer with bonding coat 3.Silicon carbide layer inner side end is provided with 4 projections 21, and projection is distributed in on the silicon carbide layer axis of rotation circle that is the center of circle, base layer is provided with accordingly 4 shrinkage pools adaptive chimeric with it.Angle between the axis of projection and emery wheel body running rotation direction is acute angle.
The skive of a kind of diamond outer arc straight line grinding machine of this example, operationally High Rotation Speed is that working face carries out grinding to workpiece with silicon carbide layer, when silicon carbide layer weares and teares totally, the base layer of internal layer is about to expose, when changing emery wheel exactly.This skive, not only can save the consumption of diamond dust in a large number, also achieve the lightweight of emery wheel, contributes to reducing energy consumption.

Claims (5)

1. the skive of a diamond outer arc straight line grinding machine, comprise emery wheel body and the bolt hole (11) being used for being fixed on by emery wheel body on grinding wheel stand, it is characterized in that, emery wheel body comprises axially base layer (1) arranged side by side and silicon carbide layer (2), base layer is near grinding wheel stand, silicon carbide layer is fixed on outside base layer, and spiro keyhole position is in base layer.
2. the skive of a kind of diamond outer arc straight line grinding machine according to claim 1, it is characterized in that, described silicon carbide layer is provided with some projections (21), and projection is distributed in on the silicon carbide layer axis of rotation circle that is the center of circle, base layer is provided with accordingly some shrinkage pools adaptive with it.
3. the skive of a kind of diamond outer arc straight line grinding machine according to claim 2, it is characterized in that, the angle between the axis of described projection and emery wheel body running rotation direction is acute angle.
4. the skive of a kind of diamond outer arc straight line grinding machine according to claim 1 or 2 or 3, is characterized in that, be provided with the bonding coat (3) of adhesive effect between described base layer and silicon carbide layer.
5. the skive of a kind of diamond outer arc straight line grinding machine according to claim 1, it is characterized in that, the thickness of described silicon carbide layer and the Thickness Ratio of base layer, between 1:4 ~ 1:8.
CN201520763661.XU 2015-09-29 2015-09-29 Diamond grinding wheel of diamond outer arc straight line grinding machine Active CN205009071U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520763661.XU CN205009071U (en) 2015-09-29 2015-09-29 Diamond grinding wheel of diamond outer arc straight line grinding machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520763661.XU CN205009071U (en) 2015-09-29 2015-09-29 Diamond grinding wheel of diamond outer arc straight line grinding machine

Publications (1)

Publication Number Publication Date
CN205009071U true CN205009071U (en) 2016-02-03

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108801683A (en) * 2018-07-13 2018-11-13 华东理工大学 A kind of micro metal sample sampling cutting tool

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108801683A (en) * 2018-07-13 2018-11-13 华东理工大学 A kind of micro metal sample sampling cutting tool
CN108801683B (en) * 2018-07-13 2021-07-06 华东理工大学 Miniature metal sample cutting tool that takes a sample

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