CN205004303U - Lead wire seal structure of miniaturized collector - Google Patents
Lead wire seal structure of miniaturized collector Download PDFInfo
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- CN205004303U CN205004303U CN201520559419.0U CN201520559419U CN205004303U CN 205004303 U CN205004303 U CN 205004303U CN 201520559419 U CN201520559419 U CN 201520559419U CN 205004303 U CN205004303 U CN 205004303U
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Abstract
The utility model discloses a lead wire seal structure of miniaturized collector, its characterized in that: include: a pottery section of thick bamboo (1), a pottery section of thick bamboo (1) inner wall loses no time and posts collector electrode (2), the surface of a pottery section of thick bamboo (1) is provided with a plurality of recesses (3), the surface metal ization of recess (3), the center of recess (3) has been seted up and has been run through ceramic aperture (4) of a pottery section of thick bamboo (1) lateral wall, transition metal ring (5) has been placed in recess (3), the both sides of transition metal ring (5) all are provided with solder piece (6), and metal lead wire (7) passes transition metal ring (5) and ceramic aperture (4) back and collector electrode (2) contact. The utility model provides a pair of lead wire seal structure of miniaturized collector, greatly reduced to the requirement with the metallization quality of the precision of ceramic aperture, improved gas tightness and the reliability of collector pottery with the sealing -in of metal lead wire.
Description
Technical field
The utility model relates to a kind of lead-in wire sealing structure of miniaturized collector, and particularly a kind of vacuum device is as the lead-in wire sealing structure of the miniaturized collector of travelling wave tube, belongs to ceramic and metal jointing technical field.
Background technology
Due to the development of vacuum device application, in the urgent need to high-quality, highly reliable vacuum device, and in vacuum device, apply a large amount of ceramic parts, need them and metal to carry out highly reliable vacuum tight sealing-in.The sealing structure held water is the deciding factor obtaining high-quality Ceramic-to-metal seal, and it directly has influence on pottery, the fastness of metal welding seam and reliability, and therefore reasonably sealing structure design is the key point in electron tube manufacturing process.Current travelling wave tube uses collector lead-in wire generally to draw from tail end, but increasing miniaturized cast requires very tight to length dimension, so the collector lead-in wire of these casts must be drawn from the side, what adopt is pottery and the direct pin seal structure of metal lead wire, and this direct pin seal structure has very high requirement to ceramic small hole dimensional accuracy, little hole metallization and ceramic small hole and metal combination.And ceramic cold working itself has very large difficulty, especially the aperture of pottery ensures that precision is very difficult after metallization, thus is also difficult to ensure and pottery and the coordinating of metal lead wire, and have impact on air-tightness and reliability that pottery and metal lead wire seal greatly.Particularly the lead-in wire of multi-level depressurization collector generally has 3 to 4, this just means the direct pin envelope having 3 to 4 places, and the vacuum-tightness of the direct pin in everywhere envelope is all not too reliable, the reliability of so whole collector is just difficult to ensure that, therefore in the urgent need to improving the lead-in wire sealing structure of this miniaturized multi-stage depressed collector more.
Utility model content
Technical problem to be solved in the utility model is, provides a kind of and traditional collector pottery and the direct pin seal structure of metal lead wire is changed into ceramic putting down with metal and seal and the lead-in wire sealing structure of miniaturized collector that transition sealing combines; Further, the utility model provides a kind of stress of sealing little, the lead-in wire sealing structure of the miniaturized collector that sealing-in mechanical strength is large.
For solving the problems of the technologies described above, the technical solution adopted in the utility model is:
A kind of lead-in wire sealing structure of miniaturized collector, it is characterized in that: comprising: ceramic cylinder, described ceramic cylinder inwall is glued with collector electrode, the outer surface of described ceramic cylinder is provided with some grooves, the surface metalation of described groove, the center of described groove offers the ceramic small hole running through described ceramic cylinder sidewall, transition metal ring is placed with in described groove, the both sides of described transition metal ring are provided with solder sheet, metal lead wire contacts with described collector electrode through after described transition metal ring and ceramic small hole, described metal lead wire is also provided with for contact with described transition metal ring and with the step of described groove profiling, described metal lead wire through described step and with described step seamless link.
The diameter of described metal lead wire is less than the diameter of described ceramic small hole.
The shape of described groove is square platform.
Described transition metal ring by soft state, oxygen-free copper that ductility is good makes; The thickness of described transition metal ring is 0.1 ~ 0.2mm.
Large 4 ~ the 6mm of diameter of the more described metal lead wire of the length of side of described square platform; The diameter of described metal lead wire is 0.8 ~ 1mm; The diameter of described ceramic small hole is 1.1 ~ 1.2mm.
The material of described ceramic cylinder is 99-beryllium oxide ceramics.
The material of described metal lead wire is for cutting down material.
The material of described solder sheet is Pd20AgCu solder.
The utility model provides a kind of ceramic and metal jointing structure gone between for miniaturized collector, by the change of structure, reduces the requirement of precision to ceramic small hole and metallization quality, improves air-tightness and the reliability of collector pottery and metal lead wire sealing-in.Concrete technical scheme collector pottery and the direct pin seal structure of metal lead wire is changed into ceramic putting down with metal to seal and structure that transition sealing combines.
In order to realize flat seal structure, the outer surface of collector pottery (i.e. ceramic cylinder) is processed the square platform equal with metal lead wire quantity by the utility model, and the active Mo-Mn method in platform place metallizes.
In order to ensure the mechanical strength of collector pottery and metal lead wire sealing-in, it is (D+5) about mm that platform size controls in the length of side, and wherein D is metal lead wire actual diameter.The excessive then stress of sealing of platform area is too large, and the mechanical strength of too small then sealing-in is too little.
In order to alleviate the stress of sealing between metal lead wire and collector pottery, prevent Stress Release in the process of thermal shock from causing pottery cracking, described structure has added a transition metal ring to realize transition sealing in the middle of metal lead wire and pottery.Transition metal ring both sides are welded with pottery and metal lead wire respectively.Becket material is the oxygen-free copper of soft state, and the extension by self eliminates stress of sealing effectively, and the thickness of ring gets 0.1 ~ 0.2mm.
In addition by original to metal lead wire and ceramic small hole closely cooperate to change into thoroughly do not contact, to avoid the stress of sealing between metal lead wire and ceramic small hole.
Advantage of the present utility model: the utility model miniaturized collector pottery and the structure that the direct pin of metal lead wire seals is changed into ceramic putting down with metal to seal and structure that transition sealing combines, by the change of structure, avoid the shortcoming that pin seal structure stress is large, greatly reduce the requirement of precision to ceramic small hole and metallization quality, improve air-tightness and the reliability of collector pottery and metal lead wire sealing-in.
The lead-in wire sealing structure of a kind of miniaturized collector that the utility model provides, the setting of square platform, achieves the flat envelope of pottery and metal; The setting of transition metal ring, achieves the transition sealing of pottery and metal; The setting of the large 4 ~ 6mm of diameter of the more described metal lead wire of the length of side of square platform, achieve stress of sealing between pottery and metal little, sealing-in mechanical strength is large; The diameter of metal lead wire is less than the setting of the diameter of ceramic small hole, the pin changing traditional metal lead wire and ceramic small hole seals and is closely connected, be closely connected and make the stress of sealing between metal lead wire and ceramic cylinder large, pottery is easy to crack, and the utility model is thoroughly do not contact between metal lead wire with ceramic small hole, to avoid the stress of sealing between metal lead wire and ceramic small hole.The lead-in wire sealing structure of a kind of miniaturized collector that the utility model provides, avoid the shortcoming that pin seal structure stress is large, greatly reduce the requirement of precision to ceramic small hole and metallization quality, improve air-tightness and the reliability of collector pottery and metal lead wire sealing-in.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the enlarged drawing of part A in Fig. 1.
Embodiment
Below in conjunction with accompanying drawing, the utility model is further described.
As shown in Figure 1 and 2, a kind of lead-in wire sealing structure of miniaturized collector, it is characterized in that: comprising: ceramic cylinder 1, described ceramic cylinder 1 inwall is glued with collector electrode 2, the outer surface of described ceramic cylinder 1 is provided with some grooves 3, the surface metalation of described groove 3, the center of described groove 3 offers the ceramic small hole 4 running through described ceramic cylinder 1 sidewall, transition metal ring 5 is placed with in described groove 3, the both sides of described transition metal ring 5 are provided with solder sheet 6, metal lead wire 7 contacts with described collector electrode 2 through after described transition metal ring 5 and ceramic small hole 4, described metal lead wire 7 is also provided with for contact with described transition metal ring 5 and with the step 8 of described groove 3 profiling, described metal lead wire 7 through described step 8 and with the seamless link of described step 8.
The diameter of described metal lead wire 7 is less than the diameter of described ceramic small hole 4.
The shape of described groove 3 is square platform.
Described transition metal ring 5 by soft state, oxygen-free copper that ductility is good makes; The thickness of described transition metal ring 5 is 0.1 ~ 0.2mm.
Large 4 ~ the 6mm of diameter of the more described metal lead wire of the length of side 7 of described square platform; The diameter of described metal lead wire 7 is 0.8 ~ 1mm; The diameter of described ceramic small hole 4 is 1.1 ~ 1.2mm.
The material of described ceramic cylinder 1 is 99-beryllium oxide ceramics.
The material of described metal lead wire 7 is for cutting down material.
The material of described solder sheet 6 is Pd20AgCu solder.
Utilize the collector of the miniaturized CW TWT of Ka wave band below, specific description done to the utility model:
Ceramic cylinder 1 of the present utility model is cylindric, processes the groove 3 of 36 × 6mm, the plane of groove 3 is carried out active Mo-Mn method and metallize outside it.In addition, ceramic small hole 4 diameter under groove 3 is processed into 1.2mm.
Two diameter of metal lead wire 7 is 1mm, and there is the step 8 of individual diameter 6mm in place that is middle and groove 3 sealing-in, is highly 1mm, utilizes this step 8 to carry out plane sealing-in with groove 3.
Transition metal ring 5 for moving back the oxygen-free copper overdoed, diameter 6mm, thickness 0.1mm.
Solder sheet 6 is Pd20AgCu solder.
Collector electrode 2 is oxygenless copper material.
Erection welding technological process of the present utility model is as follows:
(1), collector electrode 2 is loaded ceramic cylinder 1;
(2), in transition metal ring 5 both sides all put a solder sheet 6, then put the groove 3 of ceramic cylinder 1 together;
(3), metal lead wire 7 is put into above transition metal ring 5 and solder sheet 6;
(4), send into hydrogen stove and carry out soldering.
The above is only preferred implementation of the present utility model; be noted that for those skilled in the art; under the prerequisite not departing from the utility model principle; can also make some improvements and modifications, these improvements and modifications also should be considered as protection range of the present utility model.
Claims (8)
1. the lead-in wire sealing structure of a miniaturized collector, it is characterized in that: comprising: ceramic cylinder (1), described ceramic cylinder (1) inwall is glued with collector electrode (2), the outer surface of described ceramic cylinder (1) is provided with some grooves (3), the surface metalation of described groove (3), the center of described groove (3) offers the ceramic small hole (4) running through described ceramic cylinder (1) sidewall, transition metal ring (5) is placed with in described groove (3), the both sides of described transition metal ring (5) are provided with solder sheet (6), metal lead wire (7) contacts with described collector electrode (2) afterwards through described transition metal ring (5) and ceramic small hole (4), described metal lead wire (7) is also provided with for contact with described transition metal ring (5) and with the step (8) of described groove (3) profiling, described metal lead wire (7) through described step (8) and with described step (8) seamless link.
2. the lead-in wire sealing structure of a kind of miniaturized collector according to claim 1, is characterized in that: the diameter of described metal lead wire (7) is less than the diameter of described ceramic small hole (4).
3. the lead-in wire sealing structure of a kind of miniaturized collector according to claim 1, is characterized in that: the shape of described groove (3) is square platform.
4. the lead-in wire sealing structure of a kind of miniaturized collector according to claim 1, is characterized in that: described transition metal ring (5) by soft state, oxygen-free copper that ductility is good makes; The thickness of described transition metal ring (5) is 0.1 ~ 0.2mm.
5. the lead-in wire sealing structure of a kind of miniaturized collector according to claim 3, is characterized in that: the large 4 ~ 6mm of diameter of the more described metal lead wire of the length of side (7) of described square platform; The diameter of described metal lead wire (7) is 0.8 ~ 1mm; The diameter of described ceramic small hole (4) is 1.1 ~ 1.2mm.
6. the lead-in wire sealing structure of a kind of miniaturized collector according to claim 1, is characterized in that: the material of described ceramic cylinder (1) is 99-beryllium oxide ceramics.
7. the lead-in wire sealing structure of a kind of miniaturized collector according to claim 1, is characterized in that: the material of described metal lead wire (7) is for cutting down material.
8. the lead-in wire sealing structure of a kind of miniaturized collector according to claim 1, is characterized in that: the material of described solder sheet (6) is Pd20AgCu solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520559419.0U CN205004303U (en) | 2015-07-27 | 2015-07-27 | Lead wire seal structure of miniaturized collector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520559419.0U CN205004303U (en) | 2015-07-27 | 2015-07-27 | Lead wire seal structure of miniaturized collector |
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| Publication Number | Publication Date |
|---|---|
| CN205004303U true CN205004303U (en) | 2016-01-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520559419.0U Active CN205004303U (en) | 2015-07-27 | 2015-07-27 | Lead wire seal structure of miniaturized collector |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105355526A (en) * | 2015-11-21 | 2016-02-24 | 安徽华东光电技术研究所 | Miniature collector lead wire sealing method and seal structure |
| CN108461451A (en) * | 2018-03-14 | 2018-08-28 | 清华大学 | sealing structure and preparation method thereof |
| CN114758924A (en) * | 2022-03-31 | 2022-07-15 | 施生面 | Direct-current relay sealing method |
-
2015
- 2015-07-27 CN CN201520559419.0U patent/CN205004303U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105355526A (en) * | 2015-11-21 | 2016-02-24 | 安徽华东光电技术研究所 | Miniature collector lead wire sealing method and seal structure |
| CN108461451A (en) * | 2018-03-14 | 2018-08-28 | 清华大学 | sealing structure and preparation method thereof |
| CN114758924A (en) * | 2022-03-31 | 2022-07-15 | 施生面 | Direct-current relay sealing method |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |